CN111516251B

CN111516251B - Pattern forming method and imprinting apparatus

Info

Publication number: CN111516251B
Application number: CN202010075973.7A
Authority: CN
Inventors: 黑宫未散
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2019-02-04
Filing date: 2020-01-22
Publication date: 2023-05-09
Anticipated expiration: 2040-01-22
Also published as: JP7245973B2; JP2020126905A; CN111516251A

Abstract

The invention provides a pattern forming method and an imprinting apparatus capable of obtaining good transfer accuracy. The method for forming the pattern comprises the following steps: a filling step of pressing a transfer object against a mold coated with a transfer material from above, and filling the transfer material between the transfer object and the mold; a curing step of curing the filled transfer material on a transfer object by UV irradiation; and a demolding step of demolding the transfer-target body, on which the transfer material is cured, from the mold, wherein in the curing step, a switching portion, which is a terminal portion of a portion of the mold, which is a portion of the pattern having a smaller size, from a portion of the mold, which is a portion of the pattern having a smaller size, is cooled, and in the demolding step, the switching portion is heated.

Description

Pattern forming method and imprinting apparatus

Technical Field

The present disclosure relates to a method of forming a pattern using an imprinting technique and an imprinting apparatus.

Background

(background, applicable field of imprint technology)

In recent years, in optical components for commodities for display, illumination, and the like, it is desired to realize the following devices: by forming a fine pattern of a order of nanometers (nm) to micrometers (μm) that exhibits special optical characteristics, a novel function that has not been conventionally achieved to control light reflection and diffraction is exhibited. Further, in a semiconductor such as a system LSI, miniaturization of wiring accompanied by high integration is also desired. As a method for forming such a fine structure, in addition to a photolithography technique and an electron beam exposure technique, an imprint technique has been attracting attention in recent years.

The imprint technique is a method of forming a microstructure by pressing a mold having a fine shape previously formed on the surface thereof against a resin applied to the surface of a substrate.

As the imprint method, a thermal imprint method for transferring a shape by pressing a thermoplastic resin applied to a surface of a substrate against a mold heated to a glass transition temperature or higher, and a UV imprint method for transferring a shape by irradiating UV light in a state of pressing against a mold with a UV curable resin are generally employed. The hot stamping method has a characteristic of a wide selectivity of materials, but has a problem of low productivity because it is necessary to heat and cool a mold at the time of transferring a shape. On the other hand, the UV imprinting method is limited to a material cured by ultraviolet rays, and thus has a narrower selectivity than hot stamping, but is very high in productivity because curing can be completed in several seconds to several tens of seconds. The use of either the hot stamping method or the UV stamping method differs depending on the device used, but in the case where there is no problem caused by the material, the UV stamping method is considered to be suitable as a mass production method.

(embossing mode of UV embossing)

Next, as an imprint method for forming a pattern by a UV imprint method, a flat plate imprint method is generally used.

In addition, when the target substrate is a film such as PET, there is also the following roll-to-roll imprinting method: using a roll with a mold having a fine shape formed on the surface, the fine structure is transferred onto the film while the film is being conveyed, and it is expected that the productivity will be further improved.

(Flat plate type imprinting method)

A general process flow when patterning by the flat plate imprinting method will be described below with reference to fig. 2.

Fig. 2 is a schematic diagram of a general flat plate imprinting process.

First, as shown in step (a) of fig. 2, a work substrate 204 is prepared on a table 201, and a transfer material 203 is applied using a dispenser, ink jet, or the like.

Next, as shown in step (b) of fig. 2, the concave-convex pattern of the mold 202 having the pattern to be transferred is brought into contact with the transfer material 203 on the work substrate 204 and pressed by the roller 205. Further, as shown in step (c) of fig. 2, UV is irradiated from a UV irradiator 206 in a state where the mold 202 is pressed, and the photo-curable resin is cured to become a cured transfer material 203.

Next, as shown in step (d) of fig. 2, the mold 202 is moved obliquely upward or vertically with respect to the work substrate 204, and thereby released from the cured transfer material 203. After the demolding, a transfer pattern formed of the transfer material 203 is formed on the work substrate 204.

(roll-to-roll embossing method)

Next, a general method for forming a pattern by the roll-to-roll imprinting method will be described below with reference to fig. 3.

Fig. 3 is a schematic diagram of a general roll-to-roll imprinting method.

First, the transfer material 303 is extruded and coated from a die (die) 307 onto the continuously advancing film 304. Next, the film 304 passes between a roller 305 provided with a mold 302 having a fine shape on the surface thereof and a pressing roller 309 pressed against the roller 305 by a predetermined pressing force, and the transfer material 303 is filled in the fine shape of the mold 302. Next, the mold 302 is irradiated with UV light from the UV irradiator 306, whereby the transfer material 303 is cured in a state of being filled into the fine shape of the mold 302. Finally, the film 304 passes between the mold release roller 308 and the roller 305, and travels along the mold release roller 308, thereby being released from the mold 302, forming a fine shape on the film 304.

The above-described method is a method in which a fine shape is formed on a single side of a film base material. In the case where the other surface is required to be formed into a fine shape as well, for example, a method of preparing two steps having the same configuration as described above and reversing the thin film between the steps is considered. In this case, the relative positional accuracy of the fine shapes formed on the two surfaces of the film base is required.

In each imprint method as described above, as shown in fig. 2 (d) and 3, when the mold is released from the cured transfer material, a pattern defect in which the surface corner of the transfer pattern is defective occurs at the end portion of the pattern-size-smaller region where the pattern-size is switched from the smaller region to the flat portion or the region where the pattern-size is larger, as shown in fig. 4 (a) and (b), and a phenomenon in which the transfer accuracy is deteriorated occurs. This pattern defect frequently occurs in a mold, particularly when a metal mold typified by Ni or the like is used.

As one of the main causes thereof, the following are known: when the mold is released from the region of the mold having a small pattern size to the flat portion or the region having a large pattern size, the release speed is rapidly increased in the vicinity of the boundary thereof, and a large release resistance is rapidly applied to the terminal portion of the region having a small pattern size, thereby generating pattern defects.

In order to solve the above-mentioned problems, for example, a method of adjusting the exposure amount of UV light for each pattern described in patent document 1 is known. In patent document 1, the UV exposure amount is made smaller for the region having a small pattern size and a high release resistance than for the flat portion or the region having a large pattern size and a small release resistance, so that the curing degree of the transfer material is reduced, whereby the region having a small pattern size is made easy to release, and the release speed can be suppressed from being rapidly increased in the vicinity of the boundary thereof and a large release resistance can be rapidly applied to the terminal portion of the region having a small pattern size. As a result, occurrence of pattern defects in the terminal portion of the region having a small pattern size can be suppressed, and good transfer accuracy can be obtained.

Prior art literature

Patent literature

Patent document 1: japanese patent laid-open No. 2011-181548

Disclosure of Invention

Problems to be solved by the invention

As described above, as a conventional imprint method, there has been proposed a method of suppressing occurrence of pattern defects in a terminal portion of a pattern-size-smaller region at a position switched from a pattern-size-smaller region to a flat portion or a pattern-size-larger region by adjusting the exposure amount of UV light for each pattern. This method is applicable because, as in the flat plate imprint method, when the mold is fixed during UV irradiation, the exposure amount of UV light can be adjusted for each pattern region.

However, in the method shown in the conventional example, in the case of the roll-to-roll imprinting method, the UV light source is a bar type, and the roller with the mold performs the transfer while rotating at a high speed, so it is difficult to vary the exposure amount of the UV light for each pattern area.

The present disclosure has been made in view of the above-described conventional problems, and an object thereof is to provide a pattern forming method and an imprint apparatus capable of obtaining good transfer accuracy.

Means for solving the problems

In order to achieve the above object, a pattern forming method of the present disclosure includes: a filling step of pressing a transfer object against a mold coated with a transfer material from above, and filling the transfer material between the transfer object and the mold; a curing step of curing the filled transfer material on a transfer object by UV irradiation; and a demolding step of demolding the transfer-target body, on which the transfer material is cured, from the mold, wherein in the curing step, a switching portion, which is a terminal portion of a portion of the mold, which is a portion of the pattern having a smaller size, from a portion of the mold, which is a portion of the pattern having a smaller size, is cooled, and in the demolding step, the switching portion is heated.

Effects of the invention

As described above, according to the pattern forming method and the imprint apparatus of the present disclosure, good transfer accuracy can be obtained.

Drawings

Fig. 1 (a) to (c) are schematic diagrams of the imprinting step in the present embodiment.

Fig. 2 (a) to (d) are schematic views of a general flat plate imprinting process.

Fig. 3 is a schematic diagram of a general roll-to-roll imprinting process.

Fig. 4 (a) is a photomicrograph showing an SEM image of the upper surface of the transfer defect, and (b) is a photomicrograph showing a SEM image of the cross section of the transfer defect.

Reference numerals illustrate:

101. first coating roller

102. First die

103. 203, 303 transfer material

104. 304 film

105. First roller

106. First UV irradiator

107. First die head

108. First demolding roller

109. First pressure roller

110. First roller control part

111. First temperature control part

112. Second coating roller

113. Second die

114. Second roller

115. Second demolding roller

116. Second pressure roller

117. Second die head

118. Second UV irradiator

119. Second roller control part

120. Second temperature control part

201. Working table

202. 302 mould

204. Processed substrate

205. 305 roller

206. 306 UV irradiator

307. Die head

308. Demolding roller

309. And a pressing roller.

Detailed Description

(embodiment)

The present embodiment will be described below with reference to the drawings.

Fig. 1 is a schematic diagram for explaining a pattern forming method in the present embodiment.

First, a device configuration for roll-to-roll embossing in the present embodiment will be described with reference to fig. 1 (a).

First, in order to form a pattern on one side, a first application roller 101 is provided at a place where the transfer material 103 is supplied onto the film 104. In addition, there is provided: a first roller 105 mounted with a first mold 102 having a surface patterned thereon; and a first pressing roller 109 and a first mold release roller 108, which are in contact with the first roller 105.

Next, in order to form a pattern on the back surface as well as on the one surface, a second application roller 112 is provided at a place where the transfer material 103 is supplied onto the film 104, similarly to the one surface. In addition, there is provided: a second roller 114 mounted with a second mold 113 having a pattern formed on a surface thereof; and a second pressing roller 116 and a second mold release roller 115, which are in contact with the second roller 114.

In this roll configuration, the film 104 is wound up through the upper side of the first application roll 101 so as to contact the first pressing roll 109 from the upper side of the first pressing roll 109, and contacts the first die 102, and contacts the first release roll 108 at the lower side of the drawing. Then, the film 104 is wound so as to contact the second pressing roller 116 and the second die 113 via the lower part of the second application roller 112, and finally is wound so as to contact the second release roller 115, and is conveyed from the left to the right in the figure by the rotation of the rollers.

A first die 107 is disposed on the first coating roller 101, and the transfer material 103 is coated on the film 104. A second die 117 is disposed on the second coating roller 112, and the transfer material 103 is coated on the film 104. After the film 104 passes between the first pressing roller 109 and the first mold 102, the transfer material 103 is cured by irradiation of UV light by a first UV irradiator 106 disposed below the first roller 105. Then, the transfer material 103 is applied onto the film 104 from the second die 117 disposed below the second application roller 112, the film 104 passes between the second pressing roller 116 and the second die 113, and then UV light is irradiated from the second UV irradiator 118 disposed above the second roller 114, and after the transfer material 103 is cured, the film 104 is released from the second release roller 115.

The first mold 102 and the second mold 113 have a pattern region and a flat portion, respectively. The pattern region is a region having a concave-convex shape on the surface of the mold, and the larger the interval between the concave-convex is, the larger the pattern size is, and the smaller the interval between the concave-convex is, the smaller the pattern size is. The flat portion is a region having no concave-convex shape on the mold surface.

The first roller 105 includes a first temperature control unit 111. A second temperature control unit 120 is provided inside the second roller 114. The first temperature control unit 111 and the second temperature control unit 120 are, for example, a heater for heating and an electric power operator for controlling the heater, a cooling path for flowing cooling water and cooling gas, a flow rate operator for controlling the cooling path, and the like, respectively.

Preferably, the first temperature control unit 111 is disposed at a lower portion of the switching unit on the first mold 102. Further, the second temperature control unit 120 is preferably disposed below the switching unit on the second mold 113. Here, the switching portion means a terminal portion of a pattern region in a switching portion of a pattern region and a flat portion or a terminal portion of a pattern region in a switching portion of a smaller pattern region and a larger pattern region in a pattern of a mold.

The first roller 105 and the second roller 114 are provided with a first roller control unit 110 and a second roller control unit 119, and the first roller control unit 110 and the second roller control unit 119 detect the rotation speed of the rollers, calculate the timing of UV irradiation and demolding from the information, and output instructions of temperature control of the rollers to the first temperature control unit 111 and the second temperature control unit 120.

The first roller control unit 110 and the second roller control unit 119 are configured to have a calculation function such as a CPU, for example, and detect the rotation speed of the roller from the rotation speed of the roller set in advance. For example, the first roller control unit 110 and the second roller control unit 119 may include a sensor that detects the rotation of the roller, and output the rotation speed of the roller based on the rotation of the roller detected by the sensor. For example, the first roller control unit 110 and the second roller control unit 119 may be provided with sensors for detecting marks provided in advance on the rollers, and output the rotational speed of the rollers based on the detection time of the marks.

The first roller control unit 110 and the second roller control unit 119 output the timing of the roller temperature control to the first temperature control unit 111 and the second temperature control unit 120 as instructions. The first roller control unit 110 and the second roller control unit 119 may output the temperature controlled by the temperature of the roller as an instruction.

The first roller control unit 110 and the second roller control unit 119 output temperature control instructions to the first temperature control unit 111 and the second temperature control unit 120 disposed below the switching units on the first mold 102 and the second mold 113 when the switching units on the first mold 102 and the second mold 113 reach the UV irradiation range. The transfer material is temperature-controlled using the first temperature control unit 111 and the second temperature control unit 120. Therefore, the temperature of the transfer material at the time of UV irradiation can be controlled based on the roller rotation speed. Thus, the transfer material to be described later is cooled.

Further, the first roller control unit 110 and the second roller control unit 119 output temperature control instructions to the first temperature control unit 111 and the second temperature control unit 120 disposed below the switching units on the first mold 102 and the second mold 113 at the timing when the first mold 102 and the second mold 113 are rotated and the switching units on the first mold 102 and the second mold 113 pass through the UV irradiation range. The transfer material is temperature-controlled using the first temperature control unit 111 and the second temperature control unit 120. Therefore, the temperature of the transfer material at the time of releasing can be controlled based on the roller rotation speed. In this way, heating of the transfer material described later is performed.

Here, the range in which the temperature control is performed at the time of UV irradiation is desirably a region of 50 μm to 1000 μm before from the end of the region where the pattern size is small at the switching portion on the first mold 102 and the second mold 113.

When the temperature is controlled within 50 μm or less, even if the curing rate of the transfer material is reduced and the elastic modulus is reduced, the contact area with the region of the mold having a small pattern size is small, and thus the flat portion starts to be stressed and the mold release starts in a state where the mold release resistance cannot be sufficiently reduced. As a result, the mold release speed is rapidly increased near the boundary of the pattern, and pattern defects are generated.

When the temperature is controlled to be 1000 μm or more, it is difficult to reduce the temperature of the mold heated at the time of demolding to the ambient temperature in advance before the next UV irradiation. As a result, the coating film thickness of the transfer material is not uniform, and the pattern on the mold thermally contracts, thereby deteriorating the transfer accuracy.

Next, a pattern forming method in the present embodiment will be described with reference to fig. 1.

First, as shown in step (a) of fig. 1, when the area on the first mold 102 opposed to the UV irradiation section of the first UV irradiator 106 is not a switching section, or when the area on the second mold 113 opposed to the UV irradiation section of the second UV irradiator 118 is not a switching section, the surface temperatures of the first roller 105 and the second roller 114 are not controlled, and imprinting is performed.

The transfer material 103 includes various UV curable resins such as urethane acrylate resin, epoxy acrylate resin, polyester acrylate resin, and acrylic acrylate resin, but may be appropriately selected according to the shape of the transfer object, the amount of UV light required for curing, and the like.

The materials of the first mold 102 and the second mold 113 are not particularly limited as long as they have rigidity, hardness, and the like required as the molds, but particularly in the case of a metal material, the effects of the present disclosure can be made obvious. The metal material is desirably a material having high releasability from the transfer material, for example, ni.

In order to improve releasability from the transfer material, a release layer may be formed on the surfaces of the fine patterns of the first mold 102 and the second mold 113 so as to cover the fine patterns. The release layer is formed by bonding a coupling agent to the upper surface of the fine pattern. By forming the release layer using the coupling agent, an extremely thin film such as a monomolecular film can be formed, and the influence on the transfer shape is extremely small.

As the coupling agent, for example, various metal alkoxides having Ti, li, si, na, K, mg, ca, st, ba, al, in, ge, bi, fe, cu, Y, zr, ta and the like can be used, but among them, a metal alkoxide having Si, that is, a silane coupling agent is particularly desirable.

Finally, as a method of applying the transfer material 103 to the entire surfaces of the first mold 102 and the second mold 113, various methods such as dispensing, roll coating, gravure coating, screen coating, and the like can be cited, but it is preferable to appropriately select the transfer material according to the nature of the transfer material and the shape of the transferred body.

Next, as shown in step (b), the surface of the first roller 105 is cooled to 20 degrees celsius or more and 25 degrees celsius or less at the timing when the switching section on the first mold 102 rotates to the region opposed to the UV irradiation section of the first UV irradiator 106, that is, at the timing of UV irradiation calculated from the rotational speed information of the first roller 105, whereby the terminal end portion of the region of the first mold 102, which is the region where the pattern size is switched from the region where the pattern size is small to the region where the pattern size is large, is cooled to 20 degrees celsius or more and 25 degrees celsius or less.

Similarly, at the timing when the switching portion on the second mold 113 rotates to the region opposed to the UV irradiation portion of the second UV irradiator 118, that is, the timing of UV irradiation calculated from the rotation speed information of the second roller 114, the surface of the second roller 114 is cooled to 20 degrees celsius or more and 25 degrees celsius or less, whereby the switching portion on the second mold 113 is cooled to 20 degrees celsius or more and 25 degrees celsius or less.

As described above, the switching portion is cooled during UV curing, and thus a decrease in viscosity due to heating by UV irradiation can be suppressed. That is, since the polymerization process of the transfer material 103 is difficult to proceed, the double bond reaction rate, that is, the curing rate gradually decreases.

As a result, since the curing rate of the switching portion decreases and the elastic rate decreases, the mold release resistance decreases, and the mold release speed can be suppressed from rapidly increasing in the vicinity of the boundary between the flat portion and the region having a large pattern size at the position where the pattern size is switched from the region having a small pattern size, and the large mold release resistance can be suppressed from rapidly applying to the terminal portion of the region having a small pattern size, and the occurrence of pattern defects can be suppressed.

Here, at the timing of UV irradiation, when the cooling temperature of the switching portion on the first mold 102 and the second mold 113 becomes lower than 20 degrees celsius, the curing rate becomes too small, and the desired hardness cannot be obtained in the subsequent process and the product. In addition, when the temperature becomes higher than 25 degrees celsius, the curing rate cannot be sufficiently reduced, and pattern defects occur.

Next, as shown in step (c), the switching portion on the first mold 102 is heated to 35 degrees celsius or more and 45 degrees celsius or less at the timing when the switching portion on the first mold 102 rotates to the demolding portion of the first demolding roller 108, that is, at the timing of demolding calculated from the rotational speed information of the first roller 105.

Similarly, the switching portion on the first mold 102 is heated to 35 degrees celsius or more and 45 degrees celsius or less at the timing when the switching portion on the second mold 113 rotates to the demolding portion of the second demolding roller 115, that is, at the timing of demolding calculated from the rotational speed information of the second roller 114.

Here, in the timing of UV irradiation, when the heating temperature of the switching portion on the first mold 102 and the second mold 113 is lower than 35 degrees celsius, the elastic modulus of the transfer material cannot be sufficiently reduced, and pattern defects are generated. In addition, when the temperature is higher than 45 degrees celsius, deformation of the pattern is easily caused by thermal expansion of the transfer material.

As described above, by heating the switching portion at the time of releasing, the elastic modulus of the cured transfer material 103 decreases, and the amount of increase in release resistance in the portion switching from the region having a smaller pattern size to the flat portion or the region having a larger pattern size decreases, so that the occurrence of pattern defects can be suppressed.

It is desirable that the first mold 102 on the first roller 105 and the second mold 113 on the second roller 114 heated in the step (c) be reduced to a temperature of not less than 20 degrees celsius and not more than 25 degrees celsius by rotating the rollers and heating the rollers to a temperature of not less than 35 degrees celsius and not more than 45 degrees celsius before the rollers pass through the step (a) and reach the step (b). This suppresses expansion of the coating film thickness of the transfer material and the pattern on the roll form, and thus ensures transfer accuracy.

By repeating the above steps, it is possible to perform imprinting with high transfer accuracy without burr defects.

Industrial applicability

The present disclosure is useful for an imprint method, an imprint apparatus, and the like that can form a pattern with high accuracy and transfer the pattern onto a transferred body.

Claims

1. A method for forming a pattern, wherein,

the method for forming the pattern comprises the following steps:

a filling step of pressing a transfer object against a mold coated with a transfer material from above, and filling the transfer material between the transfer object and the mold;

a curing step of curing the filled transfer material on a transfer object by UV irradiation; and

a releasing step of releasing the transfer-target body, on which the transfer material is cured, from the mold,

in the solidification step, a switching part, which is a terminal part of a part of the mold having a smaller pattern size, is cooled at a part of the mold having a smaller pattern size, which is a part of the mold having a smaller pattern size,

in the demolding step, the switching portion is heated.

2. The method for forming a pattern according to claim 1, wherein,

in the solidifying step, the cooling is performed based on the rotational speed of the mold that rotates.

3. The method for forming a pattern according to claim 1 or 2, wherein,

in the solidifying step, cooling is performed from the mold side toward the switching portion.

4. The method for forming a pattern according to claim 3, wherein,

in the solidifying step, the cooling is performed from a direction opposite to the UV irradiation toward the switching portion.

5. The method for forming a pattern according to claim 1 or 2, wherein,

in the solidifying step, a region of at least 50 μm including the switching portion is cooled.

6. The method for forming a pattern as claimed in claim 5, wherein,

in the solidification step, a region including both the switching portion and a region of approximately the first 50 μm from the switching portion is cooled.

7. The method for forming a pattern as claimed in claim 5, wherein,

in the solidifying step, the region is cooled to 20 degrees celsius or more and 25 degrees celsius or less.

8. The method for forming a pattern according to claim 1 or 2, wherein,

in the demolding step, the heating is performed based on the rotational speed of the mold that is rotated.

9. The method for forming a pattern according to claim 1 or 2, wherein,

in the demolding step, heating is performed from the mold side toward the switching portion.

10. The method for forming a pattern according to claim 9, wherein,

in the demolding step, heating is performed from a direction opposite to the UV irradiation toward the switching portion.

11. The method for forming a pattern according to claim 1 or 2, wherein,

in the demolding step, a region of at least 50 μm including the switching portion is heated.

12. The method for forming a pattern as claimed in claim 11, wherein,

in the demolding step, a region including both the switching portion and a region of approximately the first 50 μm from the switching portion is heated.

13. The method for forming a pattern as claimed in claim 11, wherein,

in the curing step, the region is heated to 35 degrees celsius or more and 40 degrees celsius or less.

14. An embossing apparatus, wherein,

the imprinting device is provided with:

a roller;

a mold which is disposed on the surface of the roller and has a pattern filled with a transfer material;

a curing device that cures the transfer material filled into the mold on a transfer object by UV irradiation;

a temperature control device which is arranged at the lower part of a switching part and controls the temperature, wherein the switching part is a terminal part of a part with smaller pattern size in a part which is switched from a region with smaller pattern size to a flat part of the die or a part which is switched from the region with smaller pattern size to a region with larger pattern size; and

and a roller control device that outputs a timing of temperature control of the roller as an instruction to the temperature control device.

15. The embossing apparatus of claim 14, wherein,

the temperature control device is disposed inside the roller.

16. The embossing apparatus of claim 14, wherein,

the temperature control means controls the temperature based on the rotational speed of the roller.

17. The embossing apparatus of claim 16, wherein,

the temperature control device cools the transfer material at a timing when the switching portion enters the UV irradiation range of the curing device.

18. The embossing apparatus of claim 17, wherein,

the temperature control device cools the switching part to 20 ℃ or more and 25 ℃ or less at a timing when the switching part enters the UV irradiation range of the curing device.

19. The embossing apparatus of any one of claims 16 to 18, wherein,

the temperature control device heats the transfer material at a timing when the switching section passes through the UV irradiation range.

20. The embossing apparatus of claim 19, wherein,

the temperature control device heats the switching part to a temperature of 35 ℃ to 40 ℃ at a timing when the switching part passes through the UV irradiation range.