JP2008006586A - Lamination type fine processing apparatus and lamination unit - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a lamination type fine processing apparatus for transfering precisely a pattern, and a lamination unit used therein. <P>SOLUTION: The lamination type fine processing apparatus is constituted so that a plurality of molds 100 having predetermined patterns and processing targets 200 are stacked in series in a pressing direction to be pressed and the patterns of the molds 100 are transferred to the surfaces 200a to be molded of the processing targets 200 and equipped with pressure dispersing plates 12 set to 0.9-1.1α in the coefficient of thermal expansion when the coefficient of thermal expansion of the molds 100 is set to α and arranged on the surface on the side reverse to the surfaces 200a to be molded of the processing targets 200 to disperse the pressure applied to the processing targets 200. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a fine processing apparatus that performs precise pattern transfer and a laminated unit used therefor.

  In order to form a fine circuit pattern typified by an LSI (Large Scale Integrated Circuit) on a semiconductor substrate (hereinafter simply referred to as a substrate), a technique called photolithography is generally used. However, this method has led to an increase in the size and cost of the apparatus as the pattern to be formed is miniaturized.

  In addition, in order to obtain a fine molded product, a resin melted by heating is poured into a mold heated to a temperature lower than the glass transition temperature of the resin at high speed and high pressure, and solidified while controlling the pressure. Molding is also used. However, in this method, since the supplied resin is solidified while taking heat away from the mold, it is difficult for the resin to enter the fine pattern of the mold, and it is difficult to form a fine shape. . It is also conceivable to heat the mold and wait for the resin to enter the fine pattern, and then cool and mold the mold. However, in injection molding, it is necessary to pour the resin into the mold at a high pressure, so a large mold that can withstand the high pressure is required, and as a result, the heat capacity of the mold increases, and heating and cooling take time. there were.

  In recent years, nanoimprint lithography technology that transfers a pattern by pressing a mold having an ultrafine pattern onto a workpiece such as a substrate or a film has attracted attention as a means for solving the above problems (for example, patents). Reference 1).

  According to this method, an expensive electron beam light source or optical system is not required, and a simple structure based on a press apparatus can be used.

  Here, in order to improve the throughput of the apparatus, a method of laminating a plurality of molds, a workpiece and a pressure dispersion plate, and transferring a pattern to the plurality of workpieces in one process is disclosed (for example, , See Patent Document 2). In this method, molding is performed at a high pressure and a low temperature of a pressure of 30 MPa or more and a molding temperature of 80 ° C. or less. However, when molding is performed at such a high pressure and low temperature, there is a problem in terms of mold life, such as breakage of a fine pattern of the mold.

US Pat. No. 5,772,905 (4th paragraph, lines 46-47) JP 2006-48881 (paragraph 0052, FIG. 1)

  In order to solve this, there is a method in which the molding temperature is set to a high temperature equal to or higher than the glass transition temperature or softening temperature of the workpiece, and transfer is performed at a low pressure.

  However, as the temperature difference between the molding temperature and the mold release temperature increases, different forces are applied on the mold side of the workpiece and the pressure dispersion plate due to the difference in thermal shrinkage between the mold and the pressure dispersion plate, and the transferred pattern is applied to the transferred pattern. There was a problem that deformation occurred or resin residue was generated in the mold. This problem becomes more prominent as the thickness of the workpiece becomes smaller.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a fine processing apparatus capable of accurately transferring a pattern even by molding at a low pressure and a high temperature, and a laminated unit used therefor.

  In order to achieve the above object, the micromachining apparatus of the present invention presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and the pattern of the mold is pressed on the workpiece. In a fine processing apparatus for transferring to a molding surface, if the thermal expansion coefficient of the mold is α, the thermal expansion coefficient is 0.9α or more and 1.1α or less, and the molding surface of the workpiece is A pressure dispersion plate is disposed on the opposite surface to disperse the pressure applied to the workpiece. In this case, the pressure dispersion plate is preferably formed of the same material as the mold.

  Further, another micromachining apparatus of the present invention presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and the pattern of the mold is applied to the molding surface of the workpiece. In the fine processing apparatus to be transferred, the processing target has a surface treatment layer made of a material whose surface energy is lower than the surface energy of Si, and is disposed on the surface opposite to the molding target surface of the processing target. A pressure dispersion plate that disperses the applied pressure is provided.

  Further, another micromachining apparatus of the present invention presses a mold having a predetermined pattern and a workpiece to be processed in series in a pressing direction, and the pattern of the mold is pressed on the molding target surface of the workpiece. In the microfabrication apparatus that transfers to the surface, the pressure having a surface treatment layer made of a release agent and disposed on the surface opposite to the surface to be molded of the workpiece to disperse the pressure applied to the workpiece A dispersion plate is provided.

  Further, another micromachining apparatus of the present invention presses a mold having a predetermined pattern and a workpiece to be processed in series in a pressing direction, and the pattern of the mold is pressed on the molding target surface of the workpiece. In the microfabrication apparatus that transfers to the surface, the surface has a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment, and is disposed on a surface opposite to the molding target surface of the workpiece. A pressure dispersion plate for dispersing the pressure applied to the workpiece is provided.

  In these cases, the pressure dispersion plate is preferably formed so that the flatness of the surface on the workpiece side is 1 μm or less. The pressure dispersion plate is preferably formed to have a thickness of less than 0.5 mm. Further, these microfabrication apparatuses include a heating unit that heats at least one of the mold and the workpiece.

  Further, the laminated unit of the present invention is a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece. A laminated unit in which a plurality of objects are arranged in series in the pressing direction, where the coefficient of thermal expansion of the mold is α, the coefficient of thermal expansion is 0.9α or more and 1.1α or less, The pressure distribution plate is disposed on a surface opposite to the surface to be molded of the workpiece and disperses pressure applied to the workpiece. In this case, the pressure dispersion plate is preferably formed of the same material as the mold.

  Another lamination unit of the present invention is a micro-machining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece. A multi-layer unit in which a plurality of workpieces are arranged in series in the pressing direction, and has a surface treatment layer made of a material whose surface energy is lower than the surface energy of Si, and a surface to be molded of the workpiece And a pressure dispersion plate that is disposed on the opposite surface to disperse the pressure applied to the workpiece.

  Still another lamination unit of the present invention is a micro-machining apparatus that presses a mold having a predetermined pattern and an object to be processed, and transfers the pattern of the mold onto a surface to be processed of the object to be processed. A multi-layer unit in which a plurality of the workpieces are arranged in series in the pressing direction, the laminate unit having a surface treatment layer made of a release agent, and a surface opposite to the molding surface of the workpiece. And a pressure dispersion plate that disperses the pressure applied to the workpiece.

  Still another lamination unit of the present invention is a micro-machining apparatus that presses a mold having a predetermined pattern and an object to be processed, and transfers the pattern of the mold onto a surface to be processed of the object to be processed. A multi-layer unit in which a plurality of the workpieces are arranged in series in the pressing direction and has a surface treatment layer formed by at least one of an oxide film treatment and a nitride film treatment, and the processing A laminated unit comprising: a pressure dispersion plate that is disposed on a surface opposite to a surface to be molded of an object and disperses pressure applied to the object to be processed.

  In these cases, the pressure dispersion plate is preferably formed so that the flatness of the surface on the workpiece side is 1 μm or less. The pressure dispersion plate is preferably formed to have a thickness of less than 0.5 mm.

  According to invention of Claim 1, 2, 8, 9, 10, By making the coefficient of thermal expansion of a type | mold and a workpiece holding tool into the same value or the value close | similar to it, the type | mold side and workpiece of a workpiece Since the difference in thermal expansion from the holder side can be reduced, an excessive force is not applied to the object to be processed, and uneven release can be reduced.

  According to the third and eleventh aspects of the present invention, since the workpiece is difficult to adhere to the workpiece holder, the workpiece can be thermally contracted according to the thermal contraction of the mold, and the workpiece No unreasonable force is applied to the mold, and the mold release unevenness can be reduced.

  According to invention of Claim 4, 12, a surface treatment layer can be easily formed using a mold release agent.

  According to the inventions of claims 5 and 13, since the surface treatment layer is formed by at least one of the oxide film treatment and the nitride film treatment, it is longer than the case where the surface treatment layer is formed by the release agent. The duration effect can be sustained.

  According to the invention described in claims 6 and 14, since the flatness of the surface of the workpiece holder on which the workpiece is placed is formed to be 1 μm or less, the workpiece is further processed as the workpiece holder. Can be prevented from being adhered to each other, and the releasability can be improved.

  According to the inventions of claims 7 and 15, since the thickness of the pressure dispersion plate is less than 0.5 mm, the pressure dispersion plate can be deformed in accordance with the undulation or unevenness of the mold 100 or the workpiece 200, The pattern of the mold can be reliably transferred to the workpiece.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  As shown in FIGS. 1 and 2, the microfabrication apparatus 1 of the present invention presses a mold 100 having a predetermined pattern and a workpiece 200 in series in the pressing direction, and presses the pattern of the mold 100. A micromachining apparatus for transferring to a molding surface 200a of a workpiece 200, a stack unit 2 in which a plurality of molds 100 and workpieces 200 are arranged in series in the pressing direction, a mold 100, and a workpiece. Pressing means 5 for pressing the object 200, position detecting means for detecting the relative position of the mold 100 with respect to the workpiece 200, pressure detecting means for detecting the pressure between the mold 100 and the workpiece 200, Heating means for heating at least one of the mold 100 and the workpiece 200, cooling means for cooling at least one of the mold 100 and the workpiece 200, and the stacking unit 2 Control for controlling the operation of the pressing means 5, the heating means, and the cooling means based on the temperature detection means for detecting the temperature of the mold 100 and the workpiece 200, and the detection information of the position detection means, the pressure detection means, and the temperature detection means. And mainly composed of means.

  As shown in FIG. 2, the lamination unit 2 of the present invention sandwiches and laminates a workpiece 200 between a mold 100 and a pressure dispersion plate 12, and between a press top plate 58 and a press bottom plate 59 of the pressing means 5. Are arranged on the surface opposite to the molding surface 200a of each processing object 200 and the mold 100 for transferring a predetermined pattern to the processing surface 200a of the processing object 200. And a pressure dispersion plate 12 for dispersing the pressure applied to the main body.

  The laminated unit 2 may further include a positioning mechanism that positions the workpiece 200 and the mold 100 and an alignment mechanism that arranges the pressure dispersion plates 12 in parallel directions.

  The mold 100 is formed of, for example, “metal such as nickel”, “ceramics”, “carbon material such as glassy carbon”, “silicon”, and the like, and a predetermined pattern is formed on one end surface (molded surface 100a). Has been. This pattern can be formed by subjecting the molding surface 100a to precision machining. In addition, after a predetermined pattern is formed on a silicon substrate or the like used as a master disk of the mold 100 by a semiconductor micromachining technique such as etching, the surface of the silicon substrate or the like is metal-plated by an electroforming method, for example, a nickel plating method. The metal plating layer can be peeled off to form a pattern. Of course, the material and manufacturing method of the mold 100 are not particularly limited as long as a fine pattern can be formed. The width of the pattern (the dimension in the planar direction of the molding surface 100a) varies depending on the type of the workpiece 200 used, but various sizes such as 100 μm or less, 10 μm or less, 2 μm or less, 1 μm or less, 100 nm or less, 10 nm or less. Formed. Furthermore, the depth of this pattern (dimension in the direction orthogonal to the molding surface 100a) is formed in various sizes such as 10 nm or more, 100 nm or more, 200 nm or more, 500 nm or more, 1 μm or more, 10 μm or more, 100 μm or more. The aspect ratio of this pattern includes various patterns such as 0.2 or more, 0.5 or more, 1 or more, 2 or more.

  In addition, the mold 100 is formed to have a thickness that can be deformed in accordance with the undulation or unevenness of the mold 100 or the workpiece 200 when the mold 100 and the workpiece 200 are pressed, for example, 1 μm to 2 mm. Further, since the mold 100 is heated and cooled during the imprint process, it is preferable to make the mold 100 as thin as possible and reduce its heat capacity.

  The pressure dispersion plate 12 minimizes the force imbalance in the planar direction generated on the workpiece 200 due to the difference in thermal expansion between the mold 100 and the pressure dispersion plate 12. Specifically, the pressure dispersion plate 12 is characterized in that the thermal expansion coefficient is 0.9α or more and 1.1α or less, where α is the thermal expansion coefficient of the mold 100. In this case, the thermal expansion coefficient is preferably 0.95α or more and 1.05α or less, and more preferably the thermal expansion coefficient is the same as that of the mold 100. For example, when the mold 100 is made of nickel, the mold 100 and the pressure dispersion plate 12 are made of the same material, for example, the pressure dispersion plate 12 is made of nickel.

  As a result, the difference in thermal expansion between the mold 100 side and the pressure dispersion plate 12 side of the workpiece 200 can be reduced, so that excessive force is not applied to the workpiece 200 and the unevenness of mold release is reduced. can do.

  In addition, as another method of reducing the force imbalance in the planar direction of the workpiece 200 caused by the difference in thermal expansion between the mold 100 and the pressure dispersion plate 12, as shown in FIG. The layer 122 may be formed. Specifically, a surface treatment layer 122 that prevents adhesion between the workpiece 200 and the pressure dispersion plate 12 is formed on the side of the pressure dispersion plate 12 that holds the workpiece 200. As a result, the pressure dispersion plate 12 and the workpiece 200 are difficult to adhere to each other, so that the workpiece 200 slides with respect to the pressure dispersion plate 12 and the mold 100 and the workpiece 200 are thermally contracted together. Can do. Therefore, an excessive force is not applied to the workpiece 200, and the mold release unevenness can be reduced.

  In this case, it is preferable to form the surface treatment layer 122 made of a material lower than the surface energy of Si. The surface treatment layer 122 may be formed by, for example, applying a release agent applied between the mold 100 and the workpiece 200 to the surface of the pressure dispersion plate 12. Any release agent may be used. For example, a fluorine-based release agent or an organic release agent may be used. Fluorine release agents include Zonyl TC Coat (DuPont), OPTOOL DSX (Daikin), Durasurf HD-2101Z (Daikin), Cytop CTL-107M (Asahi Glass), Novec EGC -1720 (manufactured by 3M) can be used. Further, as the organic release agent, an alkane resin, for example, SAMLAY (manufactured by Nippon Soda Co., Ltd.) that forms an alkyl monomolecular film can be used. Further, the surface treatment layer 122 may be formed by one or both of oxide film treatment and nitride film treatment. Of course, the surface treatment layer 122 may be formed by any other method as long as it makes it difficult to bond the workpiece 200 and the pressure dispersion plate 12. Further, the pressure dispersion plate 12 itself may be formed of a material lower than the surface energy of Si. In this case, for example, a fluorine resin or a cyclic olefin resin can be used.

  Further, the pressure dispersion plate 12 has a thickness that can be deformed in accordance with the undulation or unevenness of the mold 100 or the workpiece 200 when the mold 100 and the workpiece 200 are pressed, for example, less than 500 μm, preferably 300 μm or less. It is better to form. Thereby, a uniform pattern can be formed. Moreover, since this pressure dispersion plate 12 is heated and cooled during the imprint process, it is preferable to make it as thin as possible and to reduce its heat capacity.

  Furthermore, it is better to form the pressure dispersion plate 12 as high as possible in the flatness of the surface on which the workpiece 200 is placed, for example, 1 μm or less, preferably 100 nm or less, more preferably 10 nm or less, more preferably It is better to form it to 1 nm or less.

  The pressure dispersion plate 12 may be any material as long as it is heat resistant to the processing process by the microfabrication apparatus 1, for example, a metal such as nickel, copper, steel, tungsten, platinum, titanium, ceramic An inorganic substance such as (silicon or alumina) or an organic substance such as a fluorine-based resin can be used.

  Further, the pressure dispersion plate includes a thermal expansion difference relaxation plate for minimizing an imbalance of force in the planar direction generated on the workpiece 200 due to the difference in thermal expansion between the mold 100 and the pressure dispersion plate, and the workpiece 200. It is also possible to use it separately from a pressure dispersion substrate that disperses the pressure applied to the substrate. In this case, similarly to the above-described pressure dispersion plate 12, the thermal expansion difference relaxation plate has a thermal expansion coefficient of 0.9α to 1.1α, preferably 0.95α or more, where α is the thermal expansion coefficient of the mold 100. 1.05α or less, and more preferably, the thermal expansion coefficient is the same as that of the mold 100. For example, when the mold 100 is made of nickel, the mold 100 and the thermal expansion difference relaxation plate are formed of the same material, for example, the thermal expansion difference relaxation plate is formed of nickel.

  The thermal expansion difference mitigating plate may be formed with a surface treatment layer for preventing adhesion between the workpiece 200 and the thermal expansion difference mitigating plate on the side of the thermal expansion difference mitigating plate that holds the workpiece 200. . In this case, it is preferable to form a surface treatment layer made of a material lower than the surface energy of Si. The surface treatment layer may be formed by, for example, applying a release agent applied between the mold 100 and the workpiece 200 to the surface of the thermal expansion difference relaxation plate. Any release agent may be used. For example, a fluorine-based release agent or an organic release agent may be used. Fluorine release agents include Zonyl TC Coat (DuPont), OPTOOL DSX (Daikin), Durasurf HD-2101Z (Daikin), Cytop CTL-107M (Asahi Glass), Novec EGC -1720 (manufactured by 3M) can be used. Further, as the organic release agent, an alkane resin, for example, SAMLAY (manufactured by Nippon Soda Co., Ltd.) that forms an alkyl monomolecular film can be used. Further, the surface treatment layer may be formed by one or both of oxide film treatment and nitride film treatment. Of course, the surface treatment layer may be formed by any other method as long as it is difficult to bond the workpiece 200 and the thermal expansion difference reducing plate. Further, the thermal expansion difference relaxation plate itself may be formed of a material lower than the surface energy of Si. In this case, for example, a fluorine resin or a cyclic olefin resin can be used.

  The pressure dispersion substrate may be any material as long as it disperses the pressure applied to the workpiece 200. For example, an elastic body such as a graphite sheet or silicon rubber can be used.

  Various objects can be used as the processing object 200, for example, polycarbonate, polyimide, polytetrafluoroethylene (PTFE), polyethylene, polystyrene, polypropylene, paraffin, cyclic olefin-based thermoplastic resin, aluminum, and the like. A material in which a material such as glass, quartz glass, silicon, gallium arsenide, sapphire, magnesium oxide, or the like forms a sheet or a film can be used. In this case, the effects of the present invention become more prominent as the thickness decreases to 1 mm or less, 500 μm or less, 100 μm or less, 50 μm or less, or 40 μm or less. In this case, the surface energy of the workpiece 200 should be low so as not to adhere to the pressure dispersion plate 12. For example, the surface energy is 30 mN / m or less, preferably 25 mN / m or less, more preferably 20 mN / m. good.

  Further, a surface treatment layer made of a material whose surface energy is at least lower than the surface energy of the material constituting the workpiece 200 is formed on at least the surface opposite to the molding surface 200a of the workpiece 200. good. For example, a material having a surface energy of 30 mN / m or less, preferably 25 mN / m or less, and more preferably 20 mN / m may be used. Specifically, a mold release agent applied between the mold 100 and the workpiece 200 can be formed by applying at least the surface of the workpiece 200 on the pressure dispersion plate 12 side. Further, any release agent may be used, and for example, a fluorine-based release agent can be used.

  Although not shown, any heating means may be used as long as it heats at least one of the mold 100 and the workpiece 200. For example, a highly responsive carbon heater can be used. The carbon heater is controlled by the control means to supply current from the power source, and can maintain the workpiece 200 at a predetermined constant temperature. As the heater, for example, a heat transfer heater, a ceramic heater, a halogen heater, an IH heater, or the like can be used. As shown in FIG. 3, the heating means is provided with a parallel plate 13 that holds the mold 100, the workpiece 200, and the pressure dispersion plate 12 for each set, and is arranged on the parallel plate 13. Alternatively, the workpiece 200 may be heated, or a heating furnace containing the pressing means 5 and the laminated unit 2 may be provided to heat the inside.

  The cooling means may be anything as long as it cools at least one of the mold 100 and the workpiece 200. For example, air such as air or an inert gas lower than the temperature of the workpiece 200 is used. A fan for blowing air to the laminated unit 2 can be used. Moreover, you may make it provide a cooling means in the parallel plate 13 shown in FIG. In this case, the parallel plate 13 is formed of a metal having high thermal conductivity such as aluminum or copper, and a cooling flow path for flowing a cooling liquid such as water or oil or a cooling gas such as air or inert gas into the parallel plate 13 is formed. It is only necessary to provide the mold 100 or the workpiece 200 to be cooled.

  The temperature detecting means detects the temperature of the workpiece 200 and is formed by, for example, a thermocouple. The temperature detection means is electrically connected to the control means, and is configured to transmit information on the detected temperature of the mold 100 to the control means. In this case, a plurality of temperature detecting means may be provided as appropriate.

  As shown in FIG. 1, the pressing means 5 includes, for example, a ball screw 51 arranged in the vertical direction and an electric motor 52 that rotationally drives the ball screw 51. Further, the lower end portion of the ball screw 51 and the upper surface of the press top plate 58 are connected via a pressing portion 53 and a bearing mechanism 54. Then, the ball screw 51 is rotationally driven by the electric motor 52, so that the pressing portion 53 is placed on the mold 100 and the workpiece 200 with respect to a plurality of, for example, four columns 56 provided between the base 50 and the upper base 55. It can be displaced in the direction of contact and separation. As the electric motor 52, various types such as a direct current motor, an alternating current motor, a stepping motor, and a servo motor can be used. Here, it is preferable that the pressing means 5 can adjust the position of the mold 100 with respect to the workpiece 200 by a displacement amount equal to or less than the depth of the pattern of the mold 100. Specifically, it is preferable that the amount of displacement can be adjusted to 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, more preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What you can do is good.

  The pressing means 5 is preferably one that can adjust the displacement speed of the mold 100 relative to the workpiece 200. Specifically, it can be adjusted at 100 μm / second or less, preferably 10 μm / second or less, more preferably 1 μm / second or less, further preferably 100 nm / second or less, more preferably 10 nm / second or less, and still more preferably. Those that can be adjusted at 1 nm / second or less are preferable. This is because the control means controls the operation of the pressing means 5 based on the information detected by the pressure detection means and adjusts the pressure between the mold 100 and the workpiece 200, but the pressure detection means detects it. It takes some time to feed back information to the pressing means 5. Therefore, if the displacement speed is too large, feedback of information detected by the pressure detection unit to the pressing unit 5 is delayed, and the actual pressure between the mold 100 and the workpiece 200 cannot be accurately controlled. It is.

  Although the case where the pressing means 5 is provided on the upper side of the laminated unit 2 has been described here, it is of course possible to provide the pressing means 5 on the lower side of the laminated unit 2. Further, the pressing means 5 is not limited to one constituted by a ball screw and an electric motor as long as the relative displacement amount and displacement speed between the mold 100 and the workpiece 200 can be adjusted. It is also possible to use a piezoelectric element that can change the size (dimension) by adjusting, and a magnetostrictive element that can change the size (dimension) by adjusting the magnetic field. It is of course possible to use both a ball screw and an electric motor and a piezoelectric element or a magnetostrictive element. In this case, a ball screw and an electric motor are applied when the mold 100 and the workpiece 200 are largely displaced, and a piezoelectric element or a magnetostrictive element is used when the mold 100 and the workpiece 200 are displaced by a small amount. be able to. Further, it is of course possible to use a hydraulic type or a pneumatic type.

  By configuring the pressing means 5 in this way, it is possible to press a plurality of pairs of molds 100 and the workpiece 200 held by the laminated unit 2 and transfer the pattern of the mold 100 to the workpiece 200.

  The position detecting means is formed by, for example, a linear scale disposed on the press top plate 58. Using this linear scale, the distance between the press top plate 58 and the press bottom plate 59 can be measured, and the relative position and displacement speed of the mold 100 with respect to the workpiece 200 can be calculated and detected from the measured value. The position detection means is electrically connected to the control means, and is formed to transmit information on the detected position and displacement speed of the mold 100. The position detecting means is not limited to the linear scale, and various types can be used. For example, whether the position of the press bottom plate 59 is measured using a laser length measuring device provided on the press top plate 58 side. The position of the press top plate 58 may be measured using a laser length measuring device provided on the press bottom plate 59 side. Alternatively, an encoder provided in the electric motor may be used to measure the amount of displacement of the pressing means 5 by calculation. The resolution of the position detection means is preferably one that can be detected with a value that is at least the size of the pattern of the mold 100 in the depth direction (Z direction) or a displacement that is adjustable by the pressing means 5. Specifically, it can be detected at 100 μm or less, preferably 10 μm or less, more preferably 1 μm or less, further preferably 100 nm or less, more preferably 10 nm or less, more preferably 1 nm or less. What can be done is preferred.

  By configuring the position detection means in this way, the position of the molding surface 100a of the mold 100 with respect to the workpiece 200 is precisely adjusted according to the size of the pattern and the pressure between the mold 100 and the workpiece 200. Therefore, the pattern transfer property can be improved.

  The pressure detection means detects the pressure between the mold 100 and the workpiece 200, and for example, a load cell that measures the load between the press top plate 58 and the press bottom plate 59 can be used. Thus, if the load is measured and divided by the area of the molding surface 100a of the mold 100, the pressure between the mold 100 and the workpiece 200 can be detected. The pressure detection means is electrically connected to the control means, and is configured to transmit information regarding the detected pressure.

  The control means controls the operation of the heating means, the cooling means, and the pressing means 5 based on the detection information of the position detection means, the pressure detection means, and the temperature detection means. For example, a computer can be used.

  EXAMPLES Hereinafter, although an Example demonstrates this invention, this invention is not limited to an Example.

  A film made of cycloolefin polymer (COP) was used as the object to be processed, and an imprint apparatus (VX-2000N-US) manufactured by SCIVAX was used for pattern formation on the film. As the mold, a 30 mm × 30 mm nickel (Ni) mold was used. The shape of the pattern is a continuous rectangle with a side of 2 μm (the length of the side including the line width is 2.5 μm), the line width is 250 nm, and the height of the line is 380 nm (with an aspect ratio of about 1.). 5) was used.

As the pressure dispersion plate 12, a plate having a thickness of 0.3 mm and made of the following materials was used.
(1) silicon (Si),
(2) The one made of nickel (Ni), which is the same material as the mold,
(3) Using a release agent (NOVEC: registered trademark) as the surface treatment layer 122 on the surface of the silicon substrate,
The surface treatment layer 122 of (3) was formed by immersing a silicon substrate in a release agent and rinsing, followed by heat treatment at 90 ° C. in a furnace.

  The above film was placed on these pressure dispersion plates, and after pressing the mold 100 heated above the glass transition temperature of this film, the experiment was conducted by cooling to the glass transition temperature or lower and releasing. Photographs of the film on which the pattern is formed are shown in FIGS.

  When the pressure dispersion plate of (1) was used, peeling or the like occurred on the film surface, particularly on the end of the transferred pattern (see FIG. 5). On the other hand, when the pressure dispersion plates (2) and (3) were used, the film surface did not peel off and could be released cleanly (see FIGS. 6 and 7).

  Further, when the pressure dispersion plates (1) to (3) were observed with a laser microscope (Lasertec Corporation: HD100), the pressure dispersion plates (2) and (3) were used. Resin residue was not seen in the mold pattern, but when the pressure dispersion plate of (1) was used, as shown in FIG. 8, there was resin residue in the used mold.

  From the above results, according to the present invention, the pattern can be accurately transferred without being affected by the difference in thermal expansion between the mold and the workpiece.

It is a front view which shows the microfabrication apparatus of this invention. It is a cross-sectional schematic diagram which shows the lamination | stacking unit of this invention. It is a cross-sectional schematic diagram which shows another lamination | stacking unit of this invention. It is a principal part cross-sectional schematic diagram which shows the pressure distribution board of this invention. It is a photograph at the time of transferring a pattern to a film with the conventional workpiece holder. It is a photograph at the time of transferring a pattern to a film using the processing object holder of the present invention. It is a photograph at the time of transferring a pattern to a film using another processing object holder of the present invention. It is the photograph (magnification 80 times) of the metal mold | die surface after using the conventional pressure distribution board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Fine processing apparatus 2 Lamination | stacking unit 12 Pressure distribution board 122 Surface treatment layer 100 type | mold 200 Processing target object 200a Molding surface 212 Surface treatment layer

Claims (15)

In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and transfers the pattern of the mold to the molding surface of the workpiece.
When the coefficient of thermal expansion of the mold is α, the coefficient of thermal expansion is 0.9α or more and 1.1α or less, and the processing object is disposed on the surface opposite to the molding surface, A fine processing apparatus comprising a pressure dispersion plate for dispersing pressure applied to an object.   2. The microfabrication apparatus according to claim 1, wherein the pressure dispersion plate is made of the same material as the mold. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and transfers the pattern of the mold to the molding surface of the workpiece.
Pressure dispersion that has a surface treatment layer made of a material whose surface energy is lower than the surface energy of Si, and is disposed on a surface opposite to the surface to be molded of the workpiece to disperse the pressure applied to the workpiece. A microfabrication apparatus comprising a plate. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and transfers the pattern of the mold to the molding surface of the workpiece.
It has a surface treatment layer made of a mold release agent, and is provided on a surface opposite to the molding target surface of the workpiece, and includes a pressure dispersion plate that disperses the pressure applied to the workpiece. A fine processing device. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece to be processed in series in the pressing direction, and transfers the pattern of the mold to the molding surface of the workpiece.
A pressure applied to the object to be processed that has a surface treatment layer formed by at least one of an oxide film process and a nitride film process and is disposed on a surface opposite to the surface to be processed of the object to be processed A fine processing apparatus comprising a pressure dispersion plate for dispersing the particles.   6. The microfabrication apparatus according to claim 1, wherein the pressure dispersion plate is formed to have a flatness of a surface on the workpiece side of 1 [mu] m or less.   7. The microfabrication apparatus according to claim 1, wherein the pressure dispersion plate is formed with a thickness of less than 0.5 mm.   The micromachining apparatus according to any one of claims 1 to 7, further comprising a heating unit that heats at least one of the mold and the workpiece. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece, a plurality of the mold and the workpiece are serially arranged in the pressing direction. A laminated unit arranged in a line,
When the coefficient of thermal expansion of the mold is α, the coefficient of thermal expansion is 0.9α or more and 1.1α or less, and the processing object is disposed on the surface opposite to the molding surface, A laminated unit comprising a pressure dispersion plate for dispersing pressure applied to an object.   The laminated unit according to claim 9, wherein the pressure dispersion plate is made of the same material as the mold. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece, a plurality of the mold and the workpiece are serially arranged in the pressing direction. A laminated unit arranged in a line,
Pressure dispersion that has a surface treatment layer made of a material whose surface energy is lower than the surface energy of Si, and is disposed on a surface opposite to the surface to be molded of the workpiece to disperse the pressure applied to the workpiece. A laminated unit comprising a plate. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece, a plurality of the mold and the workpiece are serially arranged in the pressing direction. A laminated unit arranged in a line,
It has a surface treatment layer made of a mold release agent, and is provided on a surface opposite to the molding target surface of the workpiece, and includes a pressure dispersion plate that disperses the pressure applied to the workpiece. A laminated unit. In a micromachining apparatus that presses a mold having a predetermined pattern and a workpiece, and transfers the pattern of the mold to a molding surface of the workpiece, a plurality of the mold and the workpiece are serially arranged in the pressing direction. A laminated unit arranged in a line,
A pressure applied to the object to be processed that has a surface treatment layer formed by at least one of an oxide film process and a nitride film process and is disposed on a surface opposite to the surface to be processed of the object to be processed A laminated unit comprising a pressure dispersion plate for dispersing the particles.   The laminated unit according to any one of claims 9 to 13, wherein the pressure dispersion plate has a flatness of a surface on the workpiece side of 1 µm or less. The laminated unit according to any one of claims 9 to 14, wherein the pressure dispersion plate has a thickness of less than 0.5 mm.

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