JP2004074770A - Press molding apparatus and control method therefor - Google Patents

Press molding apparatus and control method therefor Download PDF

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Publication number
JP2004074770A
JP2004074770A JP2003129194A JP2003129194A JP2004074770A JP 2004074770 A JP2004074770 A JP 2004074770A JP 2003129194 A JP2003129194 A JP 2003129194A JP 2003129194 A JP2003129194 A JP 2003129194A JP 2004074770 A JP2004074770 A JP 2004074770A
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Prior art keywords
plate
resistance heating
cooling
mold
heating plate
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JP4024714B2 (en
Inventor
Ikuo Asai
浅井　郁夫
Isao Yoshikawa
吉川　功
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Meiki Seisakusho KK
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Meiki Seisakusho KK
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Priority to JP2003129194A priority Critical patent/JP4024714B2/en
Priority to TW092113313A priority patent/TWI229029B/en
Priority to KR10-2003-0034274A priority patent/KR100532649B1/en
Priority to CNA031424805A priority patent/CN1468699A/en
Publication of JP2004074770A publication Critical patent/JP2004074770A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations

Abstract

<P>PROBLEM TO BE SOLVED: To provide a press molding apparatus for applying pressurization and transfer to a thermoplastic resin plate-shaped body using a transfer plate, to shorten a molding cycle time and to apply uniform pressurization and transfer to a thermoplastic resin plate-shaped body by a relatively simple device. <P>SOLUTION: The press molding apparatus 1 for the light guide plate performing the pressing of a thermoplastic resin plate-shaped body A is equipped with first and second molds 3 and 6. A cooling plate 8 and a resistance heating plate 15 controlled in temperature rise during one molding cycle and separated from the cooling plate 8 by a separation means 13, a first insulating body 11 for insulating the resistance heating plate 15 and the cooling plate 8, a transfer plate 7 for directly pressing the thermoplastic resin plate-shaped body A to the surface of the resistance heating plate 15 and a second insulating body 21 for insulating the transfer plate 7 and the resistance heating plate 15 are provided to at least one of the first and second molds 3 and 6. Further, at least one of the first and second insulating bodies 11 and 12 comprises an elastomer. <P>COPYRIGHT: (C)2004,JPO

Description

【０００１】
【発明の属する技術分野】
本発明は１次成形された熱可塑性樹脂板状体に対し、転写板が取付けられた金型により加圧および転写を行う熱可塑性樹脂板状体のプレス成形装置およびその制御方法に関するものである。
【０００２】
【従来の技術】
従来一次成形された熱可塑性樹脂板状体に対し、パターンが形成された上金型によって加圧および転写を行い、導光板を得るプレス成形装置としては、特許文献１に記載されたものが知られている。プレス成形により導光板の表面に転写を行なう際には、加圧時には金型温度を比較的高温にして転写を行い、離型時には金型温度を比較的低温にして離型を行なうことが、良好に微細なパターンを転写するために特に重要である。ところが前記特許文献１に記載されたものは、１成形サイクル中に上金型の温度の昇降制御を行うものではないため、転写を良好にするために上金型の温度を高く設定すると、導光板の冷却が長くなり、その結果、成形サイクル時間が長くなってしまい、また成形サイクル時間を短縮させるために上金型の温度を低くすると良好な転写ができないという問題があった。
【０００３】
【特許文献１】
特開２００１−１３３７７２号公報（請求項１、図６）
【０００４】
また樹脂成形の分野において、１成形サイクル中における金型の温度を前期において上昇させ、後期において急速に下降させるものとしては、特許文献２に記載されたものが知られている。前記特許文献２に記載されたものは、積層基板の製造工程において絶縁ベースフィルムと銅箔等を加熱・加圧した後に、冷却を行い積層品の各材料を均一に温度降下させ、積層品にしわが発生するのを防止することを目的とするものである。しかし特許文献２は、熱可塑性樹脂板状体の表面に転写板によって加圧しプレス成形を行うことを目的とするものではないので転写板を有しておらず、したがって転写板の温度と加圧力を均一にするための手段等については何等記載されていない。
【０００５】
【特許文献２】
特開２００１−７９８６５号公報（請求項１、図１ないし図５）
【０００６】
また特許文献３に記載されたものは、射出成形による光ディスクの製造金型において、樹脂材料の射出時には、スタンパを温度調節部から離反させ誘導加熱によりスタンパを加熱し、その後樹脂材料の凝固時にはスタンパ支持部に温度調節部を接触させ、樹脂材料を迅速に凝固させて光ディスクの生産性を高めるものである。しかし特許文献３についても、高温・高圧の溶融樹脂を型内に射出する射出成形に用いられるものであるため、熱可塑性樹脂板状体の表面に転写板によって加圧しプレス成形を行うことを目的とするものとは技術分野が相違するものであり、したがって転写板による加圧力を均一にするための手段等については何等記載されていない。更に特許文献３は、スタンパを１成形サイクル中に直接加熱および冷却するものであるが、スタンパまたはスタンパ支持プレートを誘導加熱するための加熱装置が複雑化する上に、誘導加熱の渦電流の作用を利用するので、ディスク等の円形製品に転写を行うスタンパ等の加熱に適し、略矩形の転写板の均一な加熱には適さないという問題があった。
【０００７】
【特許文献３】
特開平８−１３２４９８号公報（請求項６、図１ないし図４）
【０００８】
【発明の解決しようとする課題】
そこで本発明は、熱可塑性樹脂板状体に対して、転写板を用いて加圧および転写を行うプレス成形装置に関して、加圧および転写を良好にするために転写板の温度を高く設定すると冷却が長くなり成形サイクル時間が長くなってしまうという問題を解決し、成形サイクル時間の短縮化を可能にするとともに、熱可塑性樹脂板状体への均一な加圧および加熱による転写を比較的簡単な装置によって行うことを目的とする。そしてまた熱可塑性樹脂板状体または金型の側のいずれかに僅かな寸法誤差があったとしても均一な転写を行なえるようにすることを目的とする。
【０００９】
【課題を解決するための手段】
本発明の請求項１のプレス成形装置は、熱可塑性樹脂板状体の加圧を行うプレス成形装置の、冷却盤と、１成形サイクル中に昇温制御されかつ冷却盤から離隔手段によって離隔される抵抗加熱板と、抵抗加熱板と冷却盤との間を絶縁する第一の絶縁体と、抵抗加熱板の表面側に熱可塑性樹脂板状体を直接加圧する転写板と、転写板と抵抗加熱板との間を絶縁する第二の絶縁体とが第一の型と第二の型の少なくとも一方の型に設けられ、第一の絶縁体と第二の絶縁体の少なくとも一方が弾性体からなることを特徴とする。
【００１０】
よって熱可塑性樹脂板状体のプレス成形に際して、成形サイクル時間の短縮化を可能にすることができる。また抵抗加熱板と転写板との間に第二の絶縁体を設けたことにより、転写板の加熱をより均一にすることができる。更に少なくとも一方の絶縁体を弾性体としたことにより、熱可塑性樹脂板状体または金型の側のいずれかに僅かな寸法誤差があったとしても弾性体により前記の誤差を吸収することができ、熱可塑性樹脂板状体全体に均一な加圧および転写を行うことができる。
【００１１】
本発明の請求項２のプレス成形装置は、下面に冷却盤が取付けられた上盤と、上面に冷却盤が取付けられ上盤に対して昇降される可動盤と、上盤と可動盤との間において昇降される他の冷却盤とを有し、可動盤を上昇させることにより冷却盤および他の冷却盤等の間で熱可塑性樹脂板状体の加圧を行なうプレス成形装置において、１成形サイクル中に昇温制御されかつ前記冷却盤および前記他の冷却盤から離隔手段によって離隔される抵抗加熱板と、該抵抗加熱板と冷却盤または該抵抗加熱板と他の冷却盤との間を絶縁する第三の絶縁体と、抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写板と、該転写板と抵抗加熱板との間を絶縁する第四の絶縁体とが設けられ、第三の絶縁体と第四の絶縁体の少なくとも一方が弾性体からなることを特徴とする。
【００１２】
よって熱可塑性樹脂板状体の多段プレス成形に際して、成形サイクル時間の短縮化を可能にすることができる。また抵抗加熱板と転写板との間に絶縁体を設けたことにより、転写板の加熱をより均一にすることができる。更に少なくとも一方の絶縁体を弾性体としたことにより、熱可塑性樹脂板状体または冷却盤および他の冷却盤等の側のいずれかに僅かな寸法誤差があったとしても弾性体により前記の誤差を吸収することができ、熱可塑性樹脂板状体全体に均一な加圧および転写を行うことができる。
【００１３】
本発明の請求項３のプレス成形装置は、熱可塑性樹脂板状体の加圧を行うプレス成形装置の、冷却盤と、１成形サイクル中に昇温制御されかつ冷却盤から離隔手段によって離隔される抵抗加熱板と、該抵抗加熱板と前記冷却盤との間を絶縁する弾性体からなる第五の絶縁体とが第一の型と第二の型の少なくとも一方に備えられ、少なくとも熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものが第一の型と第二の型の間に搬入・搬出されるように設けられたことを特徴とする。
【００１４】
よって熱可塑性樹脂板状体のプレス成形に際して、成形サイクル時間の短縮化を可能にすることができる。また抵抗加熱板と転写板との間に第五の絶縁体を設けたことにより、転写板の加熱をより均一にすることができる。更に転写板と熱可塑性樹脂板状体をプレス成形装置に搬入・搬出されるようにしたことにより、プレス成形装置へ熱可塑性樹脂板状体を搬入する際に、転写板に対する熱可塑性樹脂板状体の位置決めを行う必要がない。
【００１５】
本発明の請求項４のプレス成形装置は、請求項１または請求項３のプレス成形装置において、抵抗加熱板は厚さが１ｍｍないし４ｍｍの金属板であって、シリンダまたは弾発体からなる離隔手段によって冷却盤から離隔移動されることを特徴とする。
【００１６】
よって請求項１または請求項３のプレス成形装置の作用効果等に加え、抵抗加熱板に最適の加熱および冷却を行うことができる。
【００１７】
本発明の請求項５のプレス成形装置は、前記請求項１または請求項２に記載のプレス成形装置において、前記第一の絶縁体および前記第二の絶縁体の少なくとも一方、前記第三の絶縁体および前記第四の絶縁体の少なくとも一方は、０．１ｍｍないし２．５ｍｍの厚さを有する弾性体からなることを特徴とする。
【００１８】
よって請求項１または請求項２のプレス成形装置の作用効果等に加え、転写板により最適の加圧を行うことができる。
【００１９】
本発明の請求項６のプレス成形装置は、前記請求項１または請求項２に記載のプレス成形装置において、前記第一の絶縁体および前記第二の絶縁体の少なくとも一方、前記第三の絶縁体および前記第四の絶縁体の少なくとも一方は、フッ素ゴムまたはシリコンゴムを含有した塗料が抵抗加熱板および冷却盤の少なくとも一方に塗装された絶縁塗装層であることを特徴とする。
【００２０】
よって請求項１または請求項２のプレス成形装置の作用効果等に加え、塗装により容易に抵抗加熱板を絶縁することができる。
【００２１】
本発明の請求項７のプレス成形装置は、前記請求項３のプレス成形装置において、熱可塑性樹脂板状体を直接加圧する転写板と抵抗加熱板を当接させたものを第六の絶縁体である樹脂フィルムに載置し、樹脂フィルムを移動させることにより第一の型と第二の型の間に熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体が搬入・搬出されるように設けられていることを特徴とする。
【００２２】
よって請求項３のプレス成形装置の作用効果等に加え、転写板と熱可塑性樹脂板状体の移動を容易にすることができ、厚さのムラの少ない絶縁体を用いることにより成形品の厚さの均一化に寄与する。
【００２３】
本発明の請求項８のプレス成形装置は、前記請求項１ないし請求項３のいずれか１項のプレス成形装置において、転写板は、０．１ｍｍないし１．０ｍｍの厚さのニッケルからなる導光板製造用スタンパであることを特徴とする。
【００２４】
よって請求項１のプレス成形装置の作用効果等に加え、転写成形される導光板に応じたニッケル製スタンパに簡単に交換することができる。
【００２５】
本発明の請求項９のプレス成形装置は、前記請求項１ないし請求項３のいずれか１項のプレス成形装置において、転写板によって熱可塑性樹脂板状体が直接加圧される第一の型と第二の型の間、または上盤と可動盤の間は、減圧手段によって減圧されることを特徴とする。
【００２６】
よって請求項１ないし請求項３のいずれか１項のプレス成形装置の作用効果に加え、熱可塑性樹脂板状体を減圧しながら加圧することにより良好な転写を行うことができる。
【００２７】
本発明の請求項１０のプレス成形装置は、前記請求項１ないし請求項３のいずれか１項のプレス成形装置において、抵抗加熱板の裏面側に当接される第一の絶縁体、第三の絶縁体、および第五の絶縁体のうちのいずれかの絶縁体と、いずれかの絶縁体の裏面側に当接されかつ成形される熱可塑性樹脂板状体の外形形状以上の大きさを有する押圧板とが設けられたことを特徴とする。
【００２８】
よって請求項１ないし請求項３のいずれか１項のプレス成形装置の作用効果に加え、押圧板により加圧時における抵抗加熱板の凹凸や温度ムラを更に少なくすることができる。
【００２９】
本発明の請求項１１のプレス成形装置は、前記請求項１または請求項３において、１成形サイクル中に抵抗加熱板を冷却盤から離隔させる離隔手段が、それぞれ第一の型である下型と第二の型である上型の両方の型に設けられており、離隔手段はいずれも弾発体からなり、第一の型である下型に設けられた弾発体は第ニの型である上型に設けられた弾発体よりも弾発作用の強いものが用いられていることを特徴とする。
【００３０】
よって請求項１または請求項３のいずれか１項のプレス成形装置の作用効果に加え、下型に設けられた抵抗加熱板等の自重の影響を考慮して、下型の弾発体の弾発作用を上型の弾発体の弾発作用よりも強くすることにより、上型と下型の加圧力の均等化を図ることができる。
【００３１】
本発明の請求項１２のプレス成形装置の制御方法は、第一の型と第二の型との間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、第一の型と第二の型の少なくとも一方に、冷却盤と、冷却盤から離隔手段によって離隔移動される抵抗加熱板と、抵抗加熱板と冷却盤との間を絶縁する弾性体からなる第一の絶縁体と、抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写手段と、が備えられたプレス成形装置を用いて、抵抗加熱板および転写手段の昇温制御の開始と同時かあるいは前後して熱可塑性樹脂板状体を転写手段に当接させ、その後冷却盤に第一の絶縁体を介して抵抗加熱板を当接させるのと同時かあるいは僅かに前後して抵抗加熱板の昇温制御を停止し、第一の型と第二の型との間で転写手段に当接された熱可塑性樹脂板状体に加圧および転写を行うことを特徴とする。
【００３２】
よって請求項１２のプレス成形装置の制御方法は、熱可塑性樹脂板状体のプレス成形に際して、転写手段の温度を冷却盤によって冷却することにより、成形サイクル時間の短縮化を可能にすることができる。また熱可塑性樹脂板状体または金型の側のいずれかに僅かな寸法誤差があったとしても弾性体により前記の誤差を吸収することができ、熱可塑性樹脂板状体全体に均一な加圧および転写を行うことができる。
【００３３】
本発明の請求項１３のプレス成形装置の制御方法は、下面に冷却盤が取付けられた上盤と、上面に冷却盤が取付けられ上盤に対して昇降される可動盤と、上盤と可動盤との間において昇降される他の冷却盤とを有し、可動盤を上昇させることにより冷却盤および他の冷却盤等の間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、冷却盤および他の冷却盤等から離隔手段によって離隔移動される抵抗加熱板と、抵抗加熱板を冷却盤および他の冷却盤等に対して絶縁する弾性体からなる第三の絶縁体と、抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写手段と、が備えられたプレス成形装置を用い、抵抗加熱板および転写手段の昇温制御の開始と同時かあるいは前後して熱可塑性樹脂板状体を転写手段に当接させ、その後冷却盤および他の冷却盤等に第三の絶縁体を介して抵抗加熱板を当接させるのと同時かあるいは僅かに前後して抵抗加熱板の昇温制御を停止し、冷却盤および他の冷却盤等の間で転写手段に当接された各熱可塑性樹脂板状体に加圧および転写を行うことを特徴とする。
【００３４】
よって請求項１３のプレス成形装置の制御方法は、請求項１２のプレス成形装置の制御方法と同様の作用効果に加え、ほぼ同時に多数の熱可塑性樹脂板状体に対して転写を行うことができる。
【００３５】
本発明の請求項１４のプレス成形装置の制御方法は、第一の型と第二の型の間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、第一の型と前記第二の型の少なくとも一方に、冷却盤と、該冷却盤から離隔手段によって離隔移動される抵抗加熱板と、抵抗加熱板と冷却盤との間を絶縁する弾性体からなる第五の絶縁体とが備えられたプレス成形装置を用い、抵抗加熱板および転写手段の昇温制御の開始と同時かあるいは前後して少なくとも熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものを前記第一の型に載置し、その後冷却盤に第五の絶縁体を介して抵抗加熱板を当接させるのと同時かあるいは僅かに前後して抵抗加熱板の昇温制御を停止し、第一の型と第二の型との間で転写板に当接された熱可塑性樹脂板状体に加圧および転写を行うことを特徴とする。
【００３６】
よって請求項１４のプレス成形装置の制御方法は、請求項１２のプレス成形装置の制御方法と同様の作用効果に加え、更にプレス成形装置へ熱可塑性樹脂板状体を搬入する際に、転写板に対する位置決めを行う必要がない。
【００３７】
【発明の実施の形態】
本発明の第１の実施の形態について図１ないし図５を参照して説明する。図１は本発明のプレス成形装置の断面図である。図２は本発明のプレス成形装置による加圧成形時の断面図である。図３は本発明のプレス成形装置による成形時におけるタイムチャートである。図４と図５は本発明のプレス成形装置による成形時におけるフローチャートである。
【００３８】
図１において、本発明のプレス成形装置１には、ベッド２に載置された第一の型である下型３と、加圧手段である図示しない加圧シリンダによって昇降自在に駆動されるラム４に固着された上可動盤５に取付けられた第二の型である上型６が設けられている。プレス成形装置１は、前記した下型３と上型６の両方に転写板であるスタンパ７，７が設けられ、前記した下型３と上型６との間で、略矩形の熱可塑性樹脂板状体Ａ（以下の詳細な説明では板状体Ａと略す）の両面に前記スタンパ７，７により加圧および転写を行い、導光板の成形を行う。なおプレス成形装置１の加圧手段については、前記加圧シリンダによるものに限定されず、電動機により駆動されるクランク機構やトグル機構を用いたものでもよく、サーボモータとボールネジ等の組合わせを用いた加圧手段であってもよい。またプレス成形装置１は第一の型である下型３が加圧手段によって昇降されるものでもよい。また板状体Ａについては、略矩形のものに限定されず、ディスク基板等の他の形状のものであってもよく、スタンパ７，７の間で同時に複数の成形品の成形を行うことも可能である。
【００３９】
下型３について説明すると、下型３には平板状の冷却盤８が設けられている。冷却盤８はその内部に複数の温調用媒体通路９が形成され、図示しない温調器から温調用媒体が流通されることにより、成形時には所定の温度に制御される。平面からなる冷却盤８の表面１０には、冷却盤８と後述する抵抗加熱板１５との間を電気的に絶縁する第一の絶縁体であって弾性体であるゴムシート１１が全面に貼り付けられている。第１の実施の形態に用いられるゴムシート１１は、厚さが１．５ｍｍのフッ素ゴムシート（クレハエラストマー株式会社製）であり、電気的な絶縁性、耐熱性、強度に優れた性質のものである。ただしゴムシート１１は、前記したフッ素ゴムシートに限定されず、電気的な絶縁性、耐熱性を満たすものであれば、シリコンゴムシートや他のゴムシート、エラストマーシートであってもよく、厚さは０．２ｍｍないし２．５ｍｍ程度のものが望ましい。また前記ゴムシート１１より硬度が低く、気泡率の高いフッ素スポンジやシリコンスポンジを用いる場合は更に厚いものでもよい。また第一の絶縁体は、冷却盤８と後述する抵抗加熱板１５との間を電気的に絶縁するものであれば、抵抗加熱板１５の裏面２２および／または冷却盤８の表面１０に貼り付けられていればよく、更には両者の間に別の部材によって保持されたものでもよい。そしてゴムシート１１の抵抗加熱板１５、冷却盤８への取付けは、焼付による方法、耐熱性の接着剤により貼付ける方法、爪等により取付ける方法などいずれの取付け方法でもよい。上記の構成により冷却盤８と抵抗加熱板１５とはゴムシートを介して密着可能となっている。
【００４０】
また冷却盤８には複数の箇所（第１の実施の形態では４箇所）に凹部１２が設けられ、前記凹部１２には離隔手段である油圧シリンダ１３がロッド１４を突出可能に取付けられている。前記油圧シリンダ１３のロッド１４の先端は、支持部１６が固着されており、前記支持部１６はその表面に貼付けられた絶縁体であるゴムシート１７を介して抵抗加熱板１５の裏面２２に固着されている。また抵抗加熱板１５の冷却盤８への取付けは、抵抗加熱板１５の熱膨張が許容されるよう取付けがなされている。そして冷却盤８の一側には図示しない近接スイッチが取付けられ、抵抗加熱板１５と冷却盤８がゴムシート１１を介して当接状態にあるかどうか検出可能に設けられている。なお離隔手段は後述する抵抗加熱板１５等を冷却盤８に対して離隔移動可能にするものであって、油圧シリンダ１３に替えてエアシリンダを用いてもよく、シリンダの取付け位置は冷却盤８の側方に取付けてもよい。更に離隔手段は、バネ等の弾発体を用いたものでもよく、ステッピングモータ等の電動機や気体や液体を入れることにより膨張するゴム袋やゴム膜を設けるものであってもよい。そして離隔手段が前記したゴム袋やゴム膜の場合は、離隔手段と絶縁体が兼用されることもあり得る。
【００４１】
この第１の実施の形態では、抵抗加熱板１５は厚さが３ｍｍ、長手方向の長さ５３０ｍｍ、幅３７０ｍｍの略矩形の金属板であるステンレス板からなる鏡面板からなり、２０インチ以下の導光板を成形するのに用いられる板状体Ａの表面を加熱可能なものである。なお抵抗加熱板１５の厚さは１ｍｍないし４ｍｍが望ましい。そして抵抗加熱板１５の長手方向の一側端部と他側端部には端子部１８ａ，１８ｂがそれぞれ複数設けられ、端子部１８ａ，１８ｂには図示しない直流電源から電線１９，１９が接続され、抵抗加熱板１５に通電可能に設けられている。抵抗加熱板１５が略矩形であるのは、前記複数の端子部１８ａと複数の端子部１８ｂのうちの向い合う端子部１８ａ，１８ｂの間隔をそれぞれ略等しくすることができ、抵抗加熱板１５を均等に加熱できるためである。この第１の実施の形態では、抵抗加熱板１５へは、５．６Ｖ、４０００Ａの電流が通電されるが、この数値に限定されるものではなく、更に別の抵抗値の大きい材質や厚さの薄い抵抗加熱板１５を用いて、電流値等を小さくしてもよい。また抵抗加熱板１５の端子部１８ａ，１８ｂについては、抵抗加熱板１５の一定以上の離隔を規制する抵抗加熱板ホルダーを抵抗加熱板１５の一側と他側の側に設け、抵抗加熱板ホルダーの抵抗加熱板１５との当接部から抵抗加熱板１５に通電するようにしてもよい。
【００４２】
また抵抗加熱板１５の表面２０には抵抗加熱板１５と板状体Ａを直接加圧する転写板であるスタンパ７との間を絶縁する第二の絶縁体であるゴムシート２１が設けられている。この第１の実施の形態では抵抗加熱板１５の表面２０にゴムシート２１が貼り付けられ、ゴムシート２１の表面にスタンパ７が貼り付けられているが、抵抗加熱板１５および／またはスタンパ７にゴムシート２１が取付けられたものであればよい。またゴムシート２１およびスタンパ７は保持爪等の別の部材によって抵抗加熱板１５に取付けられたものでもよい。また第１の実施の形態では、第一の絶縁体であるゴムシート１１と、第二の絶縁体であるゴムシート２１は、同じゴムシートが用いられているが、少なくとも一方が耐熱性ゴムシート等の弾性体からなっていればよく、絶縁体を弾性体とすることにより板状体Ａに僅かな凹凸や反り等の寸法誤差があったり、金型の側に僅かな寸法誤差があったとしても、加圧時にその誤差を吸収し、均一な加圧および転写をすることが可能である。またゴムシート１１，２１についてはいずれかのゴムシートの厚さを厚くしてもよい。
【００４３】
また前記において、抵抗加熱板１５を絶縁する第一の絶縁体および第二の絶縁体であるゴムシート１１，２１は、ゴムシートを貼付けるのではなく、フッ素ゴムまたはシリコンゴムを含有しており塗装後に所定の耐熱性、電気的な絶縁性、および弾性を有するゴム系塗料により、前記抵抗加熱板１５の表裏面、冷却盤８の表面、スタンパ７の裏面等に塗装したものであってもよい。その場合、塗装の方法は、焼付塗装、静電塗装、粉体塗装、浸漬塗装など方法を問わない。そして前記塗装においては塗装後の絶縁塗装層の厚さが０．１ｍｍないし０．５ｍｍ程度とすることが望ましい。
【００４４】
そしてこの抵抗加熱板１５には温度を測定するための温度センサ２３が取付けられている。第１の実施の形態では温度センサ２３は下型３の抵抗加熱板１５に取付けられているが、センサの取付位置についてはこれに限定されない。
【００４５】
また抵抗加熱板１５の表面２０側には前記した第二の絶縁体であるゴムシート２１を介して転写板（転写手段）であるスタンパ７が交換可能に取付けられている。スタンパ７は、その表面に板状体Ａに微小なミクロンオーダーの凹凸溝（深さ１μｍないし１００μｍ、溝間隔１０μｍないし１００μｍ）やマイクロドット（深さ１μｍないし２００μｍ、ドットの幅および長さ１０μｍないし２００μｍ）を転写するためのパターン転写面２４が形成され、外形は前記した抵抗加熱板１５と同じであり、厚さが０．１ｍｍないし１．０ｍｍのニッケル製の板である。転写板であるスタンパ７は、この実施の形態においては抵抗加熱板１５と別に設けられているが、抵抗加熱板１５の表面にニッケルリンメッキが施され、前記ニッケルリンメッキに前記スタンパ７と同様のパターン転写面が形成されたような転写手段が直接設けられたものでもよい。その場合、抵抗加熱板１５にパターンが形成されたものか、或いは抵抗加熱板１５にスタンパ７が直接貼付けられたものかいずれでもよい。その場合は第二の絶縁体が必要ないことは言うまでもない。またスタンパ７の上方には、板状体Ａをスタンパ７の所定位置に位置決めするための枠体２５が形成され、前記したスタンパ７のパターン転写面２４は、枠体２５の中に位置している。前記したスタンパ７および枠体２５については、ほとんどの場合、成形される導光板に応じて変更される。また枠体２５については、図示しない板状体Ａを搬入する搬入装置の精度を向上させれば、必須のものではない。またこの実施の形態では下型３はベッド２の上に固定的に設けられているが、冷却盤８や抵抗加熱板１５を含む下型３全体を水平方向に移動可能として、プレス成形装置１の外で板状体Ａの搬入を行なうようにしてもよい。更に前記において、水平方向に移動可能なのは、抵抗加熱板１５のみとしてもよい。
【００４６】
また上型６についても下型３と同様に、所定の温度に温度制御される冷却盤８と、冷却盤８から離隔手段によって１成形サイクル中に所定の間隔に離隔され少なくとも離隔時に昇温制御される抵抗加熱板１５と、前記抵抗加熱板１５と冷却盤８との間を絶縁する第一の絶縁体であるゴムシート１１または絶縁塗装層と、前記抵抗加熱板１５の表面２０側に設けられ板状体Ａを直接加圧する転写板であるスタンパ７と、前記スタンパ７と前記抵抗加熱板１５との間を絶縁する第二の絶縁体であるゴムシート２１または絶縁塗装層とが設けられている。
ただし本発明は下型３または上型６のいずれか一方に、上記の冷却盤８や抵抗加熱板１５等を含む機構が設けられたものでもよい。そして一方の型のみに抵抗加熱板１５およびスタンパ７を含む機構が設けられ、板状体Ａの片面のみに転写板による転写を行う場合は、他方の型には、抵抗加熱板１５にスタンパ７を取付けないか、または凹凸のないブランクスタンパを取付け、板状体Ａに反りが生じないように両方の面を略同温にすることが望ましい。また他方の型に抵抗加熱板１５を設けずに、他方の型を板状体Ａが成形時に反りを生じない温度に保つようにしてもよい。
【００４７】
そしてプレス成形装置１は、第一の型である下型３と第二の型である上型６の間に前記した下型３のスタンパ７と上型６のスタンパ７とによって板状体Ａが直接加圧される成形空間２６が形成される。第１の実施の形態では前記成形空間２６は、ベッド２と上可動盤５との間に設けられたベローズ２７によって外気とは隔絶可能に設けられ、図示しない減圧手段である真空ポンプによって前記成形空間２６は減圧可能に設けられている。また成形空間２６を外部と隔絶するものとしては、ベローズ２７ではなく、真空室内にプレス成形装置１を設けてもよい。
【００４８】
次に本発明の板状体Ａのプレス成形装置１の作動について図３に示されるタイムチャート、図４，図５に示されるフローチャートにより説明する。
板状体Ａの搬入前には、前回の成形サイクルにおいて、プレス成形装置１の上型６は、図示しないシリンダによって昇降移動されるラム４により上方に移動されており、下型３と上型６の抵抗加熱板１５，１５は離隔手段である油圧シリンダ１３の伸長によって冷却盤８から離隔された位置にある。冷却盤８は図示しない温調器から送られる温調用媒体である水によって２０℃となるよう所定の温度に制御されている。なお冷却盤８の所定の温度とは、１５℃ないしは４０℃が望ましいが、水道水をそのまま冷却盤８に流して、所定の温度に温度制御しない場合も有り得る。
第１の実施の形態において成形に用いられる板状体Ａについては、１５インチ導光板用の均一な３ｍｍ厚のアクリル板を用いた成形について記載する。導光板をプレス成形するための板状体Ａとしては他にポリカーボネートや、シクロオレフィン系樹脂を用いてもよい。
【００４９】
図３によりステップ順に説明する。
ステップＳ１、図示しない搬入手段または作業者により、板状体Ａをプレス成形装置１の下型３の転写手段であるスタンパ７のパターン転写面２４上に載置・当接させる。この際板状体Ａは、枠体２５にガイドされることによって正規の加圧位置に位置決めされる。なおこの正規の加圧位置については転写板であるスタンパ７に板状体Ａが直接載置・当接される位置の他、スタンパ７と直接当接しない対向位置に図示しない保持手段によって保持され、ラム４の駆動により板状体Ａとスタンパ７が直接当接するものでもよい。
ステップＳ２、板状体Ａが正規の加圧位置に位置決めされたかどうかを図示しない光電管により検知し、正規の加圧位置に位置決めされていたら（Ｙ）、次のステップＳ３に進み、正規の加圧位置に位置決めされていない場合（Ｎ）は、再度位置決めされているかどうかを検知し、所定時間が経過しても正規の加圧位置に位置決めされていないときはプレス成形装置１を停止する（図示せず）。
ステップＳ３、ベローズ２７により成形空間２６を外気から隔絶する。
ステップＳ４、図示しない減圧手段である真空ポンプをオンにして成形空間２６の減圧を開始する。
ステップＳ５、真空ポンプにより成形空間２６の減圧を開始してから所定時間が経過すると、図示しない加圧シリンダを制御し、ラム４により抵抗加熱板１５を含めた上型６全体を下降させる。
ステップＳ６、板状体Ａと上型６のスタンパ７が当接したかどうかを図示しない光電管等により確認し、板状体Ａと上型６のスタンパ７が当接されたら（Ｙ）、次のステップＳ７に進み、当接されていない場合（Ｎ）は、加圧シリンダを制御し、上型６のスタンパ７を板状体Ａと当接させるまで下降させる。
ステップＳ７、上型６のスタンパ７と板状体Ａが当接されたことが確認されたら、図示しない加圧シリンダを制御し、ラム４の下降を一時停止する。この状態において、板状体Ａは、冷却盤８から離隔した状態のスタンパ７，７間に挟まれているので、まだ加圧手段によって本格的に加圧はされていない。
ステップＳ８、下型３と上型６の抵抗加熱板１５に通電を開始し、抵抗加熱板１５の昇温制御を開始する。このことにより同時にスタンパ７も昇温制御が開始される。
ステップＳ９、成形空間２６の気圧が２０ｈＰａに達したかどうかを図示しない気圧計により確認し、気圧が２０ｈＰａに達していたら（Ｙ）、次のステップＳ１０に進み、達していない場合（Ｎ）は、２０ｈＰａに達するまで減圧を継続する。
ステップＳ１０、下型３に設けられた抵抗加熱板１５の温度が１６０℃に達したかどうかを温度センサ２３により確認し、温度が１６０℃に達したら（Ｙ）、次のステップＳ１１に進み、温度が１６０℃に達していない場合は、１６０℃になるまで抵抗加熱板１５に通電を継続し、昇温制御する。
ステップＳ１１、下型３と上型６の抵抗加熱板１５の通電を終了する。ただし、実際には抵抗加熱板１５に通電を終了した後もオーバーシュートによりしばらくの間抵抗加熱板１５およびスタンパ７の温度は、１６０℃よりも更に上昇する。そしてスタンパ７に当接された板状体Ａの表面をガラス転移温度よりも高くし、熱変形可能な状態とする。
【００５０】
ステップＳ１２、下型３と上型６の離隔手段である油圧シリンダ１３を同時に収縮させ、
ステップＳ１３、下型３と上型６の抵抗加熱板１５に対して冷却盤８が、第一の絶縁体であるゴムシート１１を介して当接されたことが図示しない近接スイッチにより検出されたら（Ｙ）、次のステップＳ１４に進む。近接スイッチにより検出されない場合（Ｎ）は、近接スイッチにより検出されるまで油圧シリンダ１３を収縮させる。
ステップＳ１４、図示しない加圧シリンダを制御し、ラム４の再下降を開始し、前記表面のみが熱変形可能な状態となった板状体Ａに対してスタンパ７により微小な凹凸の転写を開始する。この際に抵抗加熱板１５およびスタンパ７は、抵抗加熱板１５がゴムシート１１を介して冷却盤８に当接されることによって冷却が進行する。
ステップＳ１５、板状体Ａに対する単位面積当たりの圧力が３ＭＰａに達するまで増圧し、図示しない圧力センサーにより単位面積当たりの圧力が３ＭＰａに達したことに相当する圧力が検知されたら（Ｙ）、次のステップＳ１６に進み、単位面積当たりの圧力が３ＭＰａに達したことに相当する圧力が検知されない場合（Ｎ）は、単位面積当たりの圧力が３ＭＰａに達したことに相当する圧力が検知されるまで加圧シリンダにより加圧を行う。
ステップＳ１６、板状体Ａに対する単位面積当たりの圧力が３ＭＰａになるよう図示しない加圧シリンダの加圧力の制御を継続し、
ステップＳ１７、所定時間が経過したら真空ポンプの駆動を停止させ、スロープで減圧解除を開始して成形空間２６の気圧を徐々に大気圧に近づけるよう制御する。
ステップＳ１８、下型３に設けられた抵抗加熱板１５の温度が５０℃に達したかどうかを確認し、温度が５０℃に達したら（Ｙ）、次のステップＳ１９に進み、抵抗加熱板１５の温度が５０℃に達していない場合は、そのままの状態を継続し、抵抗加熱板１５およびスタンパ７の温度を下降させる。
ステップＳ１９、図示しない加圧シリンダを制御し、ラム４を上昇させ、板状体Ａへの加圧力をスロープで減圧する。
ステップＳ２０、ラム４が上昇位置に到達したかどうかを図示しない近接スイッチにより検出し、ラム４の上昇完了が確認されたら（Ｙ）、次のステップＳ２１に進み、ラム４の上昇完了が確認されないときは更にラム４を上昇させる。
ステップＳ２１、成形空間２６が大気圧になっているかどうかを図示しない気圧計によって測定し、大気圧になっていることが確認されたら（Ｙ）、次のステップＳ２２に進み、大気圧になっていない場合（Ｎ）は、さらに減圧解除を行う。
ステップＳ２２、成形空間２６を外気に開放する。
ステップＳ２３、図示しない略矩形の熱可塑性樹脂成形品取出手段により略矩形の熱可塑性樹脂成形品である導光板をプレス成形装置１から取出す。
ステップＳ２４、油圧シリンダ１３を伸長させ、冷却盤８と抵抗加熱板１５を離隔させる。
【００５１】
本発明では上記のステップにより抵抗加熱板１５およびスタンパ７の温度を制御しつつスタンパ７に当接された板状体Ａに加圧および転写を行う。なお、上記のステップの制御は、下型３に設けられた抵抗加熱板１５の温度を検出して、加圧開始等の制御を行ったが、上型６の温度か、または両方の抵抗加熱板１５，１５の温度を検出して制御を行うものでもよい。更に抵抗加熱板１５，１５の温度の検出ではなく、スタンパ７の温度、板状体Ａの温度、成形空間２６の真空度、抵抗加熱板１５への通電時間等を検出して制御を行うものでもよい。また抵抗加熱板１５への通電による昇温制御の開始は、冷却盤８と抵抗加熱板１５とが離隔と同時か僅かに前後して（１０秒以内の範囲で）行ってもよい。また前記昇温制御の開始は、スタンパ７に板状体Ａを当接させた後に限定されず、板状体Ａをスタンパ７に当接させるのと同時か、またはその前から昇温制御を行ってもよい。抵抗加熱板１５に通電がなされ、抵抗加熱板１５およびスタンパ７が既に昇温制御されている場合は、板状体Ａをスタンパ７の上に載置したら、なるべく速く上方のスタンパ７も下降させ板状体Ａの上面に当接させた方が、板状体Ａの反りを防止することができる。そして成形空間２６を真空としない場合は、抵抗加熱板１５への通電開始を板状体Ａの載置、当接よりも前から行った方が成形サイクル時間を短縮できる。特に上型６の側にのみ抵抗加熱板１５とスタンパ７が配設される場合は、下型３に板状体Ａを載置する前から抵抗加熱板１５に通電し、昇温制御させておいても反りの影響を受けずに成形サイクル時間を短縮できる。そしてまたプレス成形装置１の図示しない加圧シリンダや油圧シリンダ１３の制御については、近接スイッチや光電管によらずに、油圧を検出して行ってもよい。更に温度センサ２３によって所定の温度を検出し、抵抗加熱板１５およびスタンパ７を所定の温度になった後は一定の温度となるように昇温制御してから抵抗加熱板１５と冷却盤８とをゴムシート１１を介して当接させ冷却させるようにしてもよい。その場合通電をＯＮ・ＯＦＦ制御してもよく、電流値を制御してもよい。更にまた抵抗加熱板１５と冷却盤８とをゴムシート１１を介して当接させた後も、抵抗加熱板１５に電源から通電される電流値を制御しつつ通電を継続し、抵抗加熱板１５の温度を所望の温度カーブで低下させてもよい。更にタイマー等によって油圧シリンダ１３が作動され、冷却盤８と抵抗加熱板１５が当接したことを検出して抵抗加熱板１５への通電を停止してもよい。しかしいずれにしても抵抗加熱板１５への通電を停止するのと同時かあるいは僅かに前後して（前後１０秒程度の範囲で）抵抗加熱板１５と冷却盤８とを当接させることが望ましい。
【００５２】
またこの実施の形態では、抵抗加熱板１５の温度は１６０℃に達したら、抵抗加熱板１５への通電を中止し加圧を開始しているが、抵抗加熱板１５への通電を中止する温度は、成形される樹脂の熱変形温度（ＡＳＴＭ　　Ｄ６４８）よりも５０℃〜９０℃、好ましくは６０℃〜８０℃高い温度に設定されることが望ましい。この実施の形態の場合、アクリルの熱変形温度（ＡＳＴＭ　　Ｄ６４８）は約９５℃であるから、抵抗加熱板１５への通電を中止し加圧を開始する温度は１４５℃〜１８５℃、更に好ましくは１５５℃〜１７５℃の間で通電を中止し加圧を開始する。また加圧を終了し、離型する際の温度は、４０℃ないし６５℃が望ましい。更にまた、板状体Ａを加圧する際の真空度は、１０ｈＰａないし５０ｈＰａ程度が望ましいが、上記よりも低い真空度や大気圧で行うことも可能である。そして板状体Ａを加圧し転写を行う際の成形品の単位面積当たりの圧力は、１ＭＰａないし５ＭＰａの範囲が望ましい。そして本発明では既に表面が熱変形可能な状態となっている板状体Ａに微小な凹凸を転写するので、プレス成形としては比較的低い加圧力を用いれば足り、絶縁体を弾性体としたことによる加圧力の均一化がより一層行える。また前記板状体Ａを加圧する圧力が低い場合は、抵抗加熱板１５の温度を高くすることが望ましい。更にプレス成形装置１に搬入される板状体Ａは常温のものを用いる以外に、プレヒートして所定の温度としたものを用いてもよく、射出成形機や押出機によって成形された樹脂板の温度が低下しないうちにプレス成形装置１に搬入してもよい。そしてこの第１の実施の形態の絶縁体にゴムシートを用いた例では、プレス成形装置の機械平行度に誤差があったとしても、弾性体により誤差を吸収することができ、板状体Ａ全体に均一な加圧および転写を行うことができる。また成形される前の板状体Ａは押出成形等によって成形されるので、反りや厚さが不均一な場合もあるが、弾性体により全体に均一な転写を行うことができる。
【００５３】
次に前記の第１の実施の形態のプレス成形装置を用いて行なったテストとその結果について記載する。図８は、本発明のプレス成形装置により第一の絶縁体の厚さを変えて成形を行なった際のテスト結果を表す説明図である。このテストでは、成形に用いられる板状体Ａは、１５インチ表示装置用の厚さ８ｍｍのアクリルからなる板状体を使用した。そして前記板状体Ａに対してスタンパ７により、深さ２５μｍ、ピッチ間隔５０μｍの溝の転写成形を試みた。このテストにおける前記転写成形時の抵抗加熱板１５の最高発熱温度は１６０℃、加圧手段による加圧力は２．７ＭＰａで、真空成形空間中において転写成形を行った。そしてこのテストでは上記の成形条件において、冷却盤８と抵抗加熱板１５の間に使用される第一の絶縁体であるシリコンゴムシート１１を厚さの異なるものに変更してテストを行なった。因みに今回のすべてのテストについて抵抗加熱板１５とスタンパ７との間の第二の絶縁体は、抵抗加熱板１５にゴム系塗料を塗装したものを使用した。その結果、図８に示されるようにシリコンゴムシート１１の厚さは１．０ｍｍ以上の場合に良好なクッション効果が得られるが、冷却時間はシリコンゴムシート１１が厚いものほど長い時間が必要であることが解った。テスト結果では厚さ２．０ｍｍのシリコンゴムシート１１を用い、６０秒の冷却時間（加圧時間に近似）の場合に転写率が１００％のものが得られた。ただしこれはこのテスト結果に限定してのことであり、成形される樹脂、樹脂板の厚さや面積、加圧力、スタンパの厚さ、転写されるパターンの深さや形状等の条件が相違すれば、テスト結果も異なるものと考えられる。
【００５４】
次に図６に示される第２の実施の形態について説明する。第２の実施の形態のプレス成形装置３１は、加圧手段である加圧シリンダ３２が取付けられたベッド３３の４隅にタイバー３４が立設されており、タイバー３４の上部には上盤３５が取付けられている。そして前記上盤３５の下面には、平板状の冷却盤３６が固着されている。また加圧シリンダ３２によって昇降されるラム３７には可動盤３８が固着され、前記可動盤３８の上面にも平板状の冷却盤３９が固着されている。
なお加圧手段は可動盤３８の移動手段と別に設けてもよい。また前記上盤３５に固着される前記冷却盤３６と、前記可動盤３８に固着される前記冷却盤３９との間においては、一以上の平板状の他の冷却盤４０が設けられている。他の冷却盤４０の枚数については、設計事項であって限定されるものではない。他の冷却盤４０は両側に載置爪４１，４１が設けられ、成形時以外は、両側に設けられた段部４２，４２の上に載置されることにより、所定の間隔を有して配設可能に設けられている。そして成形時には、他の冷却盤４０は、可動盤３８を上昇させることにより前記冷却盤３６，３９、および他の冷却盤４０等（具体的には冷却盤３６と他の冷却盤４０の間、他の冷却盤４０の同士の間、他の冷却盤４０と冷却盤３９の間の組合せがある）の間で板状体Ａの多段プレス成形が行われる。そして前記冷却盤３６，３９、および他の冷却盤４０等については第１の実施の形態と同様に温調用媒体通路４３が形成され、図示しない温調器から温調用媒体が流通されることにより、前記冷却盤３６等を所定の温度に保つように制御される。またこれらの上盤３５、冷却盤３６，３９、および他の冷却盤４０等、可動盤３８を含んで構成される多段プレス成形が行われる成形空間４４は、真空室を形成する隔壁部４５によって外気とは隔絶可能に設けられ、図示しない真空ポンプにより減圧可能に設けられている。
【００５５】
そしてこれらの冷却盤３６，３９、および他の冷却盤４０等にも第１の実施の形態とほぼ同様の抵抗加熱板４６、第三の絶縁体であるゴムシート４７または絶縁塗装層，第四の絶縁体であるゴムシート４８または絶縁塗装層、スタンパ４９等からなる機構が形成されている。すなわち前記冷却盤３６および前記冷却盤３９には、その表面５０のみにゴムシート４７が貼り付け、またはゴム系塗料が塗布されるとともに、前記冷却盤３６および前記冷却盤３９と抵抗加熱板４６とを離隔、および当接させる離隔手段が設けられている。また前記冷却盤３６と前記冷却盤３９の中間に配設される他の冷却盤４０には表面（上面）と裏面（下面）に、抵抗加熱板４６、第三の絶縁体であるゴムシート４７または絶縁塗装層，第四の絶縁体であるゴムシート４８または絶縁塗装層、スタンパ４９等からなる機構が形成されている。第２の実施の形態において離隔手段は、弾発体であるバネ５１から構成されている。そして加圧シリンダ３２のラム３７の上昇時にバネ５１は収縮され、抵抗加熱板４６と平板状の冷却盤３６等が当接される。そして前記バネ５１には絶縁体であるセラミック板５２を介して抵抗加熱板４６が取付けられ、抵抗加熱板４６の表面５３には第四の絶縁体であるゴムシート４８を介しスタンパ４９が取付けられている。また第三の絶縁体であるゴムシート４７は、前記抵抗加熱板４６の裏面５４および／または前記冷却盤３６等の表面５０に取付けられたものであってもよい。
【００５６】
図６に示される第２の実施の形態のプレス成形装置３１によるプレス制御については、第１の実施の形態のプレス成形装置１の制御と成形条件等は異なるものの基本原理についてはほぼ同じである。プレス成形装置３１の１成形サイクル中において、可動盤３８が上昇されておらず、他の冷却盤４０が所定の間隔に保たれているときは、抵抗加熱板４６は前記冷却盤３６，３９および他の冷却盤４０等に対して離隔されている。板状体Ａがスタンパ４９の上に載置、当接されると、次に可動盤３８が上昇され、冷却盤３９と他の冷却盤４０が上盤３５に固着された前記冷却盤３６に向けて移動され、板状体Ａとその上方のスタンパ４９が当接されると、可動盤３８の上昇は一時停止される。そして前記抵抗加熱板４６に通電がなされ、抵抗加熱板４６およびスタンパ４９の昇温制御を開始する。そしてスタンパ４９等が所定の温度に達すると、抵抗加熱板４６への通電は停止され、再度加圧シリンダが作動し、可動盤３８が上昇される。そして抵抗加熱板４６がゴムシート４７を介して、前記冷却盤３６，３９および他の冷却盤４０等に当接される。その後なおも加圧シリンダ３２により、冷却盤３６，３９および他の冷却盤４０等の間で、スタンパ４９により板状体Ａに対して加圧および転写が行われる。なお抵抗加熱板４６への通電の停止は、前記冷却盤３６，３９および他の冷却盤４０等に対して抵抗加熱板４６が当接するのと同時か、或いは僅かに前後であればよい。
【００５７】
次に図７に示される第３の実施の形態について説明する。第３の実施の形態のプレス成形装置６１は、平板状の冷却盤６２に対して離隔手段によって離隔移動される抵抗加熱板６３が取付けられ、冷却盤６２の表面６４に弾性体からなる第五の絶縁体であるゴムシート６５または絶縁塗装層が取付けられたものが第一の型である下型と第二の型である上型の少なくとも一方に設けられている点については、第１の実施の形態のプレス成形装置１と近似している。第３の実施の形態のプレス成形装置６１においては、抵抗加熱板６３の表面６６側に、第１の実施の形態のように転写板であるスタンパ７が設けられていない。第３の実施の形態においては、スタンパ６７は成形される板状体Ａに当接されて共にプレス成形装置６１に搬入・搬出される。この例ではスタンパ６７の裏面側にスタンパ６７と抵抗加熱板６３の間を絶縁する第六の絶縁体であるゴムシート６８が貼付けられるか、または絶縁塗装層が設けられている。そして抵抗加熱板６３との間を絶縁するゴムシート６８が貼付けられた２枚のスタンパ６７が板状体Ａの上下に当接されたものが、移載機６９によりプレス成形装置６１の下型の抵抗加熱板６３の上に載置され、また成形後には搬出されるように設けられている。また第３の実施の形態では、抵抗加熱板６３の表面６６には絶縁体であるゴムシートが貼付けられ、ゴムシート６８が貼付けられていないスタンパ６７と板状体Ａが当接されたものを、プレス成形装置６１の抵抗加熱板６３に貼付けられたゴムシートの上に搬入・搬出されるように設けてもよい。
【００５８】
また図７に示される第３の実施の形態の別の実施例として、スタンパ６７を１枚のみとし、スタンパ６７のパターン転写面７１を板状体Ａの片面のみに当接させ、板状体Ａの片面のみに転写を行うようにしてもよい。また一枚のスタンパ６７のパターン転写面７１に比較的小さい板状体Ａを複数枚当接させ、複数枚の板状体Ａを同時に加圧し、転写成形を行うことも可能である。第３の実施の形態のプレス成形装置６１は、第２の実施の形態のプレス成形装置３１のような多段成形を行うことも可能である。更に第１の実施の形態のプレス成形装置１を用い、複数枚の板状体Ａとスタンパ６７とを交互に重ねて同時に成形を行うことも可能であるが、その場合は加圧時間等の成形条件の設定を考慮する必要がある。また、プレス成形装置６１の制御方法については第１の実施の形態のプレス成形装置１の制御方法と基本原理についてはほぼ同じである。ただし下型が水平方向に移動可能な場合は、スタンパ６７と板状体Ａを当接させたものを、下型の抵抗加熱板６３の上に載置させ、下型を上型の下方に移動させることにより、下型と上型の間に搬入する。
【００５９】
また図７に示される第３の実施の形態の更に別の実施例として、抵抗加熱板６３の表面６６を絶縁する第六の絶縁体は、移動可能な帯状の樹脂フィルムからなる例であってもよい。その場合、板状体Ａに転写を行うスタンパ６７と板状体Ａが帯状の樹脂フィルムの上に載置され、図示しないロール等の樹脂フィルム搬送手段により帯状の樹脂フィルムを一方から他方へ移動させることにより前記抵抗加熱板６３により加圧される成形空間７０に対してスタンパ６７とともに板状体Ａを搬入し、プレス成形装置６１で加圧および転写した上で搬出することができる。その場合の帯状の樹脂フィルムの材質としては、ポリエチレンテレフタレート、塩化ビニール樹脂、ポリイミド、フッ素系樹脂等の比較的耐熱温度が高い樹脂からなるフィルムが用いられる。よって第六の絶縁体として樹脂フィルムを用いる場合は、帯状の樹脂フィルムがキャリアフィルムの役割をするので、移載機６９を設ける必要はない。そして板状体Ａの上面側もスタンパ６７によって転写する（凹凸のないブランクスタンパを含む）場合は、帯状の樹脂フィルムを上下に設けるようにする。また樹脂フィルムは、帯状のキャリアフィルムとしてではなく、所定の大きさに切断されたものを使用してもよい。
【００６０】
また次に図９に示される第４の実施の形態のプレス成形装置８１について説明する。第４の実施の形態のプレス成形装置８１には、加圧時における抵抗加熱板８３の凹凸や温度ムラをより一層少なくするための機構が設けられている。プレス成形装置８１は、平板状の冷却盤８２に対して離隔手段によって離隔移動される抵抗加熱板８３が、第一の型である下型と第二の型である上型の少なくとも一方に設けられている点については、第１の実施の形態のプレス成形装置１と同じである。プレス成形装置８１では、第１の実施の形態においては第一の絶縁体に相当するゴムシート８４が抵抗加熱板８３の裏面側に当接され、前記ゴムシート８４の裏面側に、前記ゴムシート８４と同じ大きさの厚さ２ｍｍのステンレス製の押圧板８５が更に当接されている。よってゴムシート８４は接着剤等を用いずに抵抗加熱板８３と前記押圧板８５との間にサンドイッチ状に配設されている。また金属製の押圧板８５は、転写手段により成形される板状体Ａの外形形状を最低限カバーする大きさに設けられている。そして前記押圧板８５は、冷却盤８２に取付けられた絶縁体押圧手段であるシリンダ８６により抵抗加熱板８３の側に押圧されており、冷却盤８２に対する抵抗加熱板８３の離隔とともに移動される。よってゴムシート８４は、その裏面側から押圧板８５により抵抗加熱板８３に向けて押圧されている。第４の実施の形態は前記構成により、加圧時に抵抗加熱板８３の表面に、接着剤の塗布ムラによる凹凸が発生することを防止している。またゴムシート８４が均一に抵抗加熱板８３に当接されるため、抵抗加熱板８３の温度ムラをなくすことができる。
【００６１】
第４の実施の形態において抵抗加熱板８３の離隔手段は、弾発体であるバネ８７からなっており、バネ８７は抵抗加熱板８３の両端側に固定された抵抗加熱板取付部８８に当接されている。そしてバネ８７は抵抗加熱板８３等の自重に対応する分だけ、下型側のバネ８７の方が上型側のバネ８７より弾発作用の強いものが用いられている。またベッドおよび上可動盤の側には、ホルダー８９が設けられている。そして抵抗加熱板８３が冷却盤８２から離隔された際には、前記ホルダー８９が前記抵抗加熱板取付部８８に当接し、抵抗加熱板８３の冷却盤８２からの一定以上の離隔が規制される。第４の実施の形態では、抵抗加熱板取付部８８のバネ８７が当接する部分や、ホルダー８９の内面は絶縁層となっている。また抵抗加熱板８３は、その表面に転写パターンが形成されており、抵抗加熱板取付部８８は直流電源に接続されている。なお、上型側の絶縁体押圧手段等の機構は、ゴムシート８４が自重で抵抗加熱板８３の裏面に当接されるために必ずしも必要はない。そして、第４の実施の形態において、絶縁体押圧手段は、シリンダ８６に替えてバネを用いてもよく、離隔手段にシリンダを用いてもよい。そして離隔手段やホルダー８９は冷却盤８２に取付けられたものでもよい。また離隔手段の変形例として絶縁体押圧手段であるシリンダ８６やバネにより、押圧板８５等を介して抵抗加熱板８３を冷却盤８２に対して離隔させるようにしてもよい。第４の実施の形態の押圧手段を含む機構は、第２、第３の実施の形態でも採用可能である。第４の実施の形態のプレス成形装置８１の制御方法は第１の実施の形態とほぼ同じであるが、離隔手段がバネ８７の場合は、図示しない加圧シリンダにより、冷却盤８２を上昇させたときに、冷却盤８２に対して抵抗加熱板８３と押圧板８５の離隔がなされる。そして加圧時に、抵抗加熱板８３は、押圧板８５とゴムシート８４を介して冷却盤８２により冷却される。
【００６２】
前記第１の実施の形態ないし第４の実施の形態においては、転写板としてスタンパ７等を用いるか、または抵抗加熱板に転写手段が直接設けられた導光板を製造するプレス成形装置１，３１，６１，８１について記載した。しかし成形される熱可塑性樹脂成形品については導光板に限定されず、レンズ、ディスク基板、メモリーカード、液晶表示装置の光拡散板等の他の光学製品の転写成形に用いてもよく、精密回路基板、パソコン用部品等や、その他の薄板状成形品に転写板により転写成形を行うものに用いてもよい。更に本発明は、熱可塑性樹脂板状体の成形について記載してきたが熱硬化性樹脂にも適用することができる。
【００６３】
【発明の効果】
本発明は、プレス成形のサイクル時間の短縮化を図ることができる。また熱可塑性樹脂板状体または金型の側のいずれかに僅かな寸法誤差があったとしても弾性体により前記の寸法誤差をある程度吸収することができ、良好に転写された成形品を成形することができる。
【図面の簡単な説明】
【図１】本発明のプレス成形装置の断面図である。
【図２】本発明のプレス成形装置による加圧成形時の断面図である。
【図３】本発明のプレス成形装置による成形時におけるタイムチャートである。
【図４】本発明のプレス成形装置による成形時におけるフローチャートである。
【図５】本発明のプレス成形装置による成形時におけるフローチャートであって図４の続きを示すものである。
【図６】本発明の第２の実施の形態のプレス成形装置の一部断面図である。
【図７】本発明の第３の実施の形態のプレス成形装置の断面図である。
【図８】本発明のプレス成形装置により第一の絶縁体の厚さを変えて成形を行なった際のテスト結果を表す説明図である。
【図９】本発明の第４の実施の形態のプレス成形装置の断面図である。
【符号の説明】
１，３１，６１，８１……　プレス成形装置
２，３３……　ベッド
３　………　下型
４，３７……　ラム
５　………　上可動盤
６　………　上型
７，４９，６７　………　スタンパ
８，３６，３９，６２，８２　……　冷却盤
９，４３……　温調用媒体通路
１０，２０，５０，５３，６４，６６　……　表面
１１，１７，２１，４７，４８，６５，６８，８４……　ゴムシート
１２　……　凹部
１３　……　油圧シリンダ
１４　……　ロッド
１５，４６，６３，８３……　抵抗加熱板
１６　……　支持部
１８ａ，１８ｂ　……　端子部
１９　……　電線
２２，５４　……　裏面
２３　……　温度センサ
２４，７１　……　パターン転写面
２５　……　枠体
２６，４４，７０　……　成形空間
２７　……　ベローズ
３２　……　加圧シリンダ
３４　……　タイバー
３５　……　上盤
３８　……　可動盤
４０　……　他の冷却盤
４１　……　載置爪
４２　……　段部
４５　……　隔壁部
５１，８７　……　バネ
５２　……　セラミック板
６９　……　移載機
８５　……　押圧板
８６　……　シリンダ
８８　……　抵抗加熱板取付部
８９　……　ホルダー
Ａ　………　略矩形の熱可塑性樹脂板状体[0001]
TECHNICAL FIELD OF THE INVENTION
TECHNICAL FIELD The present invention relates to a press forming apparatus for a thermoplastic resin plate, which presses and transfers a primary molded thermoplastic resin plate by a mold having a transfer plate attached thereto, and a method of controlling the press forming apparatus. .
[0002]
[Prior art]
Conventionally, as a press forming apparatus for obtaining a light guide plate by applying pressure and transfer to a thermoplastic resin plate formed by a pattern using an upper mold having a pattern formed thereon, a press forming apparatus described in Patent Document 1 is known. Have been. When transferring to the surface of the light guide plate by press molding, it is necessary to perform the transfer by setting the mold temperature to a relatively high temperature during pressurization, and to perform the mold release by setting the mold temperature to a relatively low temperature during release. It is particularly important for transferring a fine pattern well. However, since the method described in Patent Document 1 does not perform the control of raising and lowering the temperature of the upper mold during one molding cycle, if the temperature of the upper mold is set to be high in order to improve the transfer, there is a problem. There is a problem that cooling of the optical plate is prolonged, and as a result, a molding cycle time is prolonged. If the temperature of the upper mold is lowered to shorten the molding cycle time, good transfer cannot be performed.
[0003]
[Patent Document 1]
JP-A-2001-133772 (Claim 1, FIG. 6)
[0004]
Further, in the field of resin molding, a technique described in Patent Document 2 is known in which the temperature of a mold during one molding cycle is increased in the first half and rapidly decreased in the second half. The thing described in the above-mentioned Patent Document 2 is to heat and press the insulating base film and the copper foil in the manufacturing process of the laminated substrate, and then cool and uniformly lower the temperature of each material of the laminated product to form the laminated product. The purpose is to prevent occurrence of wrinkles. However, Patent Document 2 does not have a transfer plate because it is not intended to press-form the surface of a thermoplastic resin plate by a transfer plate, and thus does not have a transfer plate. There is no description of means for making the uniformity.
[0005]
[Patent Document 2]
Japanese Patent Application Laid-Open No. 2001-79865 (Claim 1, FIGS. 1 to 5)
[0006]
Also, the one described in Patent Document 3 discloses a mold for manufacturing an optical disk by injection molding, in which the stamper is separated from the temperature control section to heat the stamper by induction heating when injecting the resin material, and thereafter when the resin material is solidified. The temperature control section is brought into contact with the support section to rapidly solidify the resin material to increase the productivity of the optical disc. However, since Patent Document 3 is also used for injection molding in which a high-temperature and high-pressure molten resin is injected into a mold, the object is to press-press the surface of a thermoplastic resin plate with a transfer plate to perform press molding. Therefore, there is no description on means for making the pressing force of the transfer plate uniform. Further, Patent Literature 3 directly heats and cools a stamper during one molding cycle. However, the heating device for inductively heating the stamper or the stamper support plate becomes complicated, and the effect of eddy current of induction heating is increased. Therefore, there is a problem that the method is suitable for heating a stamper or the like for transferring to a circular product such as a disk, and is not suitable for uniformly heating a substantially rectangular transfer plate.
[0007]
[Patent Document 3]
JP-A-8-132498 (Claim 6, FIGS. 1 to 4)
[0008]
[Problems to be solved by the invention]
Therefore, the present invention relates to a press forming apparatus for performing pressurization and transfer on a thermoplastic resin plate using a transfer plate. Lengthens the molding cycle time, thereby reducing the molding cycle time and making it easier to transfer evenly to the thermoplastic resin plate by pressing and heating. It is intended to be performed by a device. It is another object of the present invention to perform uniform transfer even if there is a slight dimensional error on either the thermoplastic resin plate or the mold side.
[0009]
[Means for Solving the Problems]
The press forming apparatus according to claim 1 of the present invention is a press forming apparatus for pressurizing a thermoplastic resin plate-like body, which is separated from a cooling plate by a separating means, the temperature of which is controlled during one forming cycle and which is controlled by a separating means. A resistance heating plate, a first insulator that insulates between the resistance heating plate and the cooling plate, a transfer plate that directly presses a thermoplastic resin plate on the surface side of the resistance heating plate, A second insulator that insulates between the heating plate and the second mold is provided in at least one of the first mold and the second mold, and at least one of the first insulator and the second insulator is an elastic body. It is characterized by comprising.
[0010]
Therefore, it is possible to shorten the molding cycle time when press-molding the thermoplastic resin plate. Further, by providing the second insulator between the resistance heating plate and the transfer plate, the transfer plate can be heated more uniformly. Furthermore, by using at least one insulator as an elastic body, even if there is a slight dimensional error on either the thermoplastic resin plate or the mold side, the elastic body can absorb the error. In addition, uniform pressing and transfer can be performed on the entire thermoplastic resin plate.
[0011]
According to a second aspect of the present invention, there is provided a press forming apparatus comprising: an upper plate having a cooling plate attached to a lower surface; a movable plate having a cooling plate attached to an upper surface and being moved up and down with respect to the upper plate; In a press forming apparatus having a cooling plate which is moved up and down between the cooling plates and pressurizing the thermoplastic resin plate between the cooling plate and another cooling plate by raising the movable plate, A resistance heating plate, which is controlled to raise the temperature during the cycle and is separated from the cooling plate and the other cooling plate by separation means, and between the resistance heating plate and the cooling plate or between the resistance heating plate and another cooling plate; A third insulator to be insulated, a transfer plate provided on the surface side of the resistance heating plate to directly press the thermoplastic resin plate, and a fourth insulator to insulate between the transfer plate and the resistance heating plate And at least one of the third insulator and the fourth insulator is elastic. Characterized in that it consists of.
[0012]
Therefore, in the multi-stage press molding of the thermoplastic resin plate, the molding cycle time can be shortened. Also, by providing an insulator between the resistance heating plate and the transfer plate, the transfer plate can be heated more uniformly. Further, since at least one of the insulators is made of an elastic body, even if there is a slight dimensional error on either the side of the thermoplastic resin plate or the cooling board and other cooling boards, the above-mentioned error is caused by the elastic body. Can be absorbed, and uniform pressing and transfer can be performed on the entire thermoplastic resin plate.
[0013]
The press forming apparatus according to claim 3 of the present invention is a press forming apparatus for pressurizing a thermoplastic resin plate-like body, which is separated from a cooling plate by a separating means, the temperature of which is controlled during one forming cycle and which is controlled by a separating means. Resistance heating plate, and a fifth insulator made of an elastic body that insulates between the resistance heating plate and the cooling plate are provided in at least one of the first mold and the second mold, and at least one of The transfer plate that directly presses the resin plate and the thermoplastic resin plate are brought into contact with each other and are provided so as to be carried in and out between the first mold and the second mold. I do.
[0014]
Therefore, it is possible to shorten the molding cycle time when press-molding the thermoplastic resin plate. Further, by providing the fifth insulator between the resistance heating plate and the transfer plate, the transfer plate can be heated more uniformly. Furthermore, the transfer plate and the thermoplastic resin plate are brought into and out of the press molding device, so that when the thermoplastic resin plate is carried into the press molding device, the thermoplastic resin plate with respect to the transfer plate is removed. There is no need to position the body.
[0015]
According to a fourth aspect of the present invention, there is provided the press forming apparatus according to the first or third aspect, wherein the resistance heating plate is a metal plate having a thickness of 1 mm to 4 mm, and is formed of a cylinder or an elastic body. It is characterized by being moved away from the cooling board by means.
[0016]
Therefore, in addition to the functions and effects of the press forming apparatus according to claim 1 or 3, optimum heating and cooling of the resistance heating plate can be performed.
[0017]
The press-forming apparatus according to claim 5 of the present invention is the press-forming apparatus according to claim 1 or 2, wherein at least one of the first insulator and the second insulator, and the third insulator. At least one of the body and the fourth insulator is made of an elastic body having a thickness of 0.1 mm to 2.5 mm.
[0018]
Therefore, in addition to the functions and effects of the press forming apparatus according to the first or second aspect, it is possible to perform optimal pressing by the transfer plate.
[0019]
The press-forming apparatus according to claim 6 of the present invention is the press-forming apparatus according to claim 1 or 2, wherein at least one of the first insulator and the second insulator, and the third insulator. At least one of the body and the fourth insulator is an insulating paint layer in which a paint containing fluorine rubber or silicon rubber is applied to at least one of the resistance heating plate and the cooling board.
[0020]
Therefore, the resistance heating plate can be easily insulated by coating, in addition to the functions and effects of the press forming apparatus according to claim 1 or 2.
[0021]
A press forming apparatus according to a seventh aspect of the present invention is the press forming apparatus according to the third aspect, wherein a transfer plate for directly pressing the thermoplastic resin plate is brought into contact with a resistance heating plate by a sixth insulator. The transfer plate and the thermoplastic resin plate that directly press the thermoplastic resin plate between the first mold and the second mold by placing the resin film on the It is characterized by being provided so as to be carried out.
[0022]
Therefore, in addition to the functions and effects of the press forming apparatus according to claim 3, the transfer plate and the thermoplastic resin plate-like body can be easily moved, and the thickness of the molded product can be reduced by using an insulator with less unevenness in thickness. It contributes to the uniformity of the height.
[0023]
The press forming apparatus according to claim 8 of the present invention is the press forming apparatus according to any one of claims 1 to 3, wherein the transfer plate is made of nickel having a thickness of 0.1 mm to 1.0 mm. It is a stamper for manufacturing an optical plate.
[0024]
Therefore, in addition to the functions and effects of the press forming apparatus according to the first aspect, it is possible to easily replace the stamper with a nickel stamper corresponding to the light guide plate to be transferred and formed.
[0025]
A press forming apparatus according to a ninth aspect of the present invention is the press forming apparatus according to any one of the first to third aspects, wherein the thermoplastic resin plate is directly pressed by the transfer plate. The pressure is reduced by the pressure reducing means between the second mold and the second mold, or between the upper plate and the movable plate.
[0026]
Therefore, in addition to the operation and effect of the press forming apparatus according to any one of claims 1 to 3, good transfer can be performed by pressing the thermoplastic resin plate while reducing the pressure.
[0027]
A press forming apparatus according to a tenth aspect of the present invention is the press forming apparatus according to any one of the first to third aspects, wherein the first insulator contacting the back side of the resistance heating plate, Insulator, and any one of the fifth insulator, the size of the outer shape of the thermoplastic resin plate that is in contact with the back side of any insulator and molded And a pressing plate having the same.
[0028]
Therefore, in addition to the operation and effect of the press forming apparatus according to any one of claims 1 to 3, the pressing plate can further reduce unevenness and temperature unevenness of the resistance heating plate at the time of pressing.
[0029]
The press-forming apparatus according to claim 11 of the present invention is the press-forming apparatus according to claim 1 or 3, wherein the separation means for separating the resistance heating plate from the cooling plate during one molding cycle includes a lower die which is a first die. The separation means are provided on both the upper mold, which is the second mold, and the separating means are both made of a resilient body, and the resilient body provided on the lower mold, which is the first mold, is the second mold. It is characterized in that a resilient body having a stronger resilient action than a resilient body provided on a certain upper mold is used.
[0030]
Therefore, in addition to the operation and effect of the press-forming apparatus according to any one of claims 1 and 3, the impact of the self-weight of the resistance heating plate or the like provided on the lower die is taken into consideration. By making the activating action stronger than the resilient action of the upper mold resilient body, the pressing force of the upper mold and the lower mold can be equalized.
[0031]
The method for controlling a press molding apparatus according to claim 12 of the present invention is the method for controlling a press molding apparatus that presses a thermoplastic resin plate between a first mold and a second mold. At least one of the mold and the second mold, a cooling plate, a resistance heating plate separated and moved from the cooling plate by separation means, and a first insulating member made of an elastic body that insulates between the resistance heating plate and the cooling plate. Body, and a transfer unit provided on the surface side of the resistance heating plate and directly pressing the thermoplastic resin plate-shaped body, using a press molding apparatus provided with the start of the temperature increase control of the resistance heating plate and the transfer unit. Simultaneously or before and after, the thermoplastic resin plate is brought into contact with the transfer means, and then, simultaneously or slightly before and after the resistance heating plate is brought into contact with the cooling plate via the first insulator. Stop the heating control of the heating plate, and transfer the transfer between the first mold and the second mold. And performing pressurization and transfer to the thermoplastic resin plate-like body is in contact with the.
[0032]
Therefore, according to the control method of the press forming apparatus of the twelfth aspect, the press cycle of the transfer means is cooled by the cooling plate during the press forming of the thermoplastic resin plate-like body, thereby making it possible to shorten the forming cycle time. . Also, even if there is a slight dimensional error on either the thermoplastic resin plate or the mold side, the elastic body can absorb the error, and the uniform pressure can be applied to the entire thermoplastic resin plate. And transfer can be performed.
[0033]
A method for controlling a press forming apparatus according to a thirteenth aspect of the present invention is characterized in that an upper plate having a cooling plate mounted on a lower surface, a movable plate having a cooling plate mounted on an upper surface and raised and lowered with respect to the upper plate, A press forming apparatus having another cooling plate which is raised and lowered between the plate and a pressurizing thermoplastic resin plate between the cooling plate and other cooling plates by raising the movable plate. In the control method, a third insulating plate made of a resistance heating plate separated and moved by a separation means from a cooling plate and other cooling plates and the like, and an elastic body that insulates the resistance heating plate from the cooling plate and other cooling plates and the like. Using a press-forming apparatus provided with a body and a transfer means provided on the surface side of the resistance heating plate and directly pressing the thermoplastic resin plate, at the same time as the start of temperature control of the resistance heating plate and the transfer means Or before and after transfer of the thermoplastic resin plate At the same time as or slightly before or after the contact of the resistance heating plate with the cooling board and other cooling boards via the third insulator, and then stop the temperature rise control of the resistance heating plate. And pressurizing and transferring each of the thermoplastic resin plate members abutting the transfer means between the cooling plate and another cooling plate and the like.
[0034]
Therefore, the control method of the press forming apparatus according to the thirteenth aspect has the same effect as that of the control method of the press forming apparatus according to the twelfth aspect, and can perform transfer to a large number of thermoplastic resin plate bodies almost simultaneously. .
[0035]
The method for controlling a press molding apparatus according to claim 14 of the present invention is a method for controlling a press molding apparatus that presses a thermoplastic resin plate between a first mold and a second mold. And at least one of the second molds, a cooling plate, a resistance heating plate separated and moved from the cooling plate by separation means, and a fifth member formed of an elastic body that insulates between the resistance heating plate and the cooling plate. A transfer plate and a thermoplastic resin plate that directly presses at least the thermoplastic resin plate at the same time as or before or after the start of the temperature rise control of the resistance heating plate and the transfer means, using a press forming apparatus provided with an insulator. The contact body is placed on the first mold, and then the resistance heating plate is brought into contact with the cooling plate via the fifth insulator at the same time or slightly before or after the resistance heating plate. Stop the temperature rise control of the plate and apply the transfer plate between the first die and the second die. And performing pressurization and transfer to the thermoplastic resin plate body which is.
[0036]
Therefore, the control method of the press forming apparatus according to claim 14 has the same operation and effect as the control method of the press forming apparatus of claim 12, and furthermore, when the thermoplastic resin plate is carried into the press forming apparatus, the transfer plate There is no need to perform positioning with respect to.
[0037]
BEST MODE FOR CARRYING OUT THE INVENTION
A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a cross-sectional view of the press forming apparatus of the present invention. FIG. 2 is a cross-sectional view at the time of press forming by the press forming apparatus of the present invention. FIG. 3 is a time chart at the time of molding by the press molding apparatus of the present invention. 4 and 5 are flow charts at the time of molding by the press molding apparatus of the present invention.
[0038]
In FIG. 1, a press forming apparatus 1 according to the present invention includes a ram driven up and down by a lower die 3 as a first die placed on a bed 2 and a pressure cylinder (not shown) as a pressing means. An upper die 6, which is a second die attached to an upper movable platen 5 fixed to 4, is provided. The press molding apparatus 1 is provided with stampers 7, 7 serving as transfer plates on both the lower mold 3 and the upper mold 6, and a substantially rectangular thermoplastic resin is provided between the lower mold 3 and the upper mold 6. Pressing and transferring are performed on both surfaces of the plate-shaped body A (abbreviated as the plate-shaped body A in the following detailed description) by the stampers 7, 7 to form a light guide plate. Note that the pressurizing means of the press forming apparatus 1 is not limited to the pressurizing cylinder, but may use a crank mechanism or a toggle mechanism driven by an electric motor, and use a combination of a servomotor and a ball screw. Pressurizing means may be used. Further, the press forming apparatus 1 may be one in which the lower die 3 as the first die is raised and lowered by the pressing means. The plate-shaped member A is not limited to a substantially rectangular shape, but may be another shape such as a disk substrate. A plurality of molded products can be simultaneously formed between the stampers 7 and 7. It is possible.
[0039]
The lower mold 3 will be described. The lower mold 3 is provided with a flat cooling board 8. The cooling plate 8 has a plurality of temperature control medium passages 9 formed therein, and the temperature control medium is circulated from a temperature controller (not shown) so that the temperature is controlled to a predetermined temperature during molding. A rubber sheet 11 which is a first insulator and an elastic body, which electrically insulates between the cooling board 8 and a resistance heating plate 15 described later, is adhered to the entire surface 10 of the cooling board 8 having a flat surface. It is attached. The rubber sheet 11 used in the first embodiment is a fluorine rubber sheet (manufactured by Kureha Elastomer Co., Ltd.) having a thickness of 1.5 mm and having excellent electrical insulation, heat resistance, and strength. It is. However, the rubber sheet 11 is not limited to the above-mentioned fluorine rubber sheet, and may be a silicon rubber sheet, another rubber sheet, or an elastomer sheet as long as it satisfies electrical insulation and heat resistance. Is preferably about 0.2 mm to 2.5 mm. Further, when a fluorine sponge or a silicon sponge having a lower hardness and a higher cell rate than the rubber sheet 11 is used, it may be thicker. The first insulator may be attached to the back surface 22 of the resistance heating plate 15 and / or the front surface 10 of the cooling plate 8 as long as it electrically insulates between the cooling plate 8 and a resistance heating plate 15 described later. What is necessary is just to be attached, and what was hold | maintained by another member between both may be sufficient. The rubber sheet 11 may be attached to the resistance heating plate 15 and the cooling board 8 by any method such as a method of baking, a method of attaching with a heat-resistant adhesive, and a method of attaching with a nail or the like. With the above configuration, the cooling board 8 and the resistance heating plate 15 can be in close contact with each other via the rubber sheet.
[0040]
The cooling plate 8 is provided with concave portions 12 at a plurality of positions (four positions in the first embodiment), and a hydraulic cylinder 13 as a separating means is mounted on the concave portions 12 so that a rod 14 can protrude. . A support portion 16 is fixed to the tip of the rod 14 of the hydraulic cylinder 13, and the support portion 16 is fixed to the back surface 22 of the resistance heating plate 15 via a rubber sheet 17, which is an insulator attached to the surface. Have been. The resistance heating plate 15 is attached to the cooling board 8 such that the resistance heating plate 15 is allowed to thermally expand. A proximity switch (not shown) is attached to one side of the cooling board 8 so as to detect whether the resistance heating plate 15 and the cooling board 8 are in contact with each other via the rubber sheet 11. The separating means enables the resistance heating plate 15 and the like to be described later to be separated from the cooling board 8 and may be replaced with an air cylinder instead of the hydraulic cylinder 13. May be attached to the side of the. Further, the separating means may be a means using a resilient body such as a spring, or may be an electric motor such as a stepping motor, or a means provided with a rubber bag or a rubber film which expands by introducing gas or liquid. When the separating means is the above-mentioned rubber bag or rubber film, the separating means and the insulator may also be used.
[0041]
In the first embodiment, the resistance heating plate 15 is made of a mirror plate made of a stainless steel plate which is a substantially rectangular metal plate having a thickness of 3 mm, a length of 530 mm in the longitudinal direction, and a width of 370 mm. The surface of the plate-like body A used for forming the light plate can be heated. The thickness of the resistance heating plate 15 is desirably 1 mm to 4 mm. A plurality of terminals 18a and 18b are provided at one end and the other end in the longitudinal direction of the resistance heating plate 15, respectively. Wires 19 and 19 are connected to the terminals 18a and 18b from a DC power supply (not shown). The resistance heating plate 15 is provided so as to be able to conduct electricity. The reason why the resistance heating plate 15 is substantially rectangular is that the intervals between the terminal portions 18a and 18b facing each other among the plurality of terminal portions 18a and the plurality of terminal portions 18b can be made substantially equal. This is because heating can be performed evenly. In the first embodiment, a current of 5.6 V and 4000 A is applied to the resistance heating plate 15. However, the present invention is not limited to this numerical value. The current value or the like may be reduced by using a resistance heating plate 15 having a small thickness. As for the terminal portions 18a and 18b of the resistance heating plate 15, resistance heating plate holders are provided on one side and the other side of the resistance heating plate 15 for regulating the separation of the resistance heating plate 15 by a certain distance or more. A current may be supplied to the resistance heating plate 15 from a contact portion with the resistance heating plate 15.
[0042]
A rubber sheet 21 is provided on the surface 20 of the resistance heating plate 15 as a second insulator that insulates the resistance heating plate 15 and the stamper 7 that is a transfer plate that directly presses the plate A. . In the first embodiment, the rubber sheet 21 is stuck to the surface 20 of the resistance heating plate 15 and the stamper 7 is stuck to the surface of the rubber sheet 21. However, the resistance heating plate 15 and / or the stamper 7 What is necessary is just that the rubber sheet 21 is attached. Further, the rubber sheet 21 and the stamper 7 may be attached to the resistance heating plate 15 by another member such as a holding claw. In the first embodiment, the same rubber sheet is used for the rubber sheet 11 as the first insulator and the rubber sheet 21 as the second insulator, but at least one of them is a heat-resistant rubber sheet. It is sufficient that the plate-shaped member A has a dimensional error such as slight unevenness or warpage, or a slight dimensional error on the mold side by using an elastic member as the insulator. However, it is possible to absorb the error at the time of pressurization and perform uniform pressurization and transfer. Further, as for the rubber sheets 11 and 21, either of the rubber sheets may be made thicker.
[0043]
Further, in the above, the rubber sheets 11 and 21 as the first insulator and the second insulator that insulate the resistance heating plate 15 do not adhere a rubber sheet but contain a fluorine rubber or a silicon rubber. Even after the coating, the front and back surfaces of the resistance heating plate 15, the front surface of the cooling plate 8, the back surface of the stamper 7, and the like are coated with a rubber-based paint having predetermined heat resistance, electrical insulation, and elasticity. Good. In that case, the method of coating does not matter, such as baking coating, electrostatic coating, powder coating, and dip coating. In the above-mentioned coating, it is desirable that the thickness of the insulating coating layer after the coating be about 0.1 mm to 0.5 mm.
[0044]
A temperature sensor 23 for measuring the temperature is attached to the resistance heating plate 15. In the first embodiment, the temperature sensor 23 is attached to the resistance heating plate 15 of the lower die 3, but the attachment position of the sensor is not limited to this.
[0045]
The stamper 7 as a transfer plate (transfer means) is exchangeably mounted on the surface 20 side of the resistance heating plate 15 via the rubber sheet 21 as the second insulator. On the surface of the stamper 7, microscopic irregular grooves (depth 1 μm to 100 μm, groove interval 10 μm to 100 μm) and micro dots (depth 1 μm to 200 μm, dot width and length 10 μm to A pattern transfer surface 24 for transferring 200 μm) is formed. The outer shape is the same as the resistance heating plate 15 described above, and is a nickel plate having a thickness of 0.1 mm to 1.0 mm. In this embodiment, the stamper 7 serving as a transfer plate is provided separately from the resistance heating plate 15, but the surface of the resistance heating plate 15 is plated with nickel phosphorus, and the nickel phosphorus plating is formed in the same manner as the stamper 7. The transfer means having such a pattern transfer surface may be directly provided. In this case, either the pattern in which the pattern is formed on the resistance heating plate 15 or the pattern in which the stamper 7 is directly adhered to the resistance heating plate 15 may be used. In that case, needless to say, the second insulator is not required. Above the stamper 7, a frame 25 for positioning the plate-shaped body A at a predetermined position of the stamper 7 is formed, and the pattern transfer surface 24 of the stamper 7 is located in the frame 25. I have. In most cases, the stamper 7 and the frame 25 are changed according to the light guide plate to be formed. The frame 25 is not essential if the accuracy of the loading device for loading the plate A (not shown) is improved. Further, in this embodiment, the lower mold 3 is fixedly provided on the bed 2, but the entire lower mold 3 including the cooling board 8 and the resistance heating plate 15 can be moved in the horizontal direction, and the press molding apparatus 1 The plate-shaped body A may be carried in outside the box. Further, in the above, only the resistance heating plate 15 may be movable in the horizontal direction.
[0046]
Similarly to the lower mold 3, the upper mold 6 has a cooling plate 8 which is temperature-controlled to a predetermined temperature, and is separated from the cooling plate 8 by a separation means at a predetermined interval during one molding cycle. Resistance heating plate 15, a rubber sheet 11 or an insulating coating layer as a first insulator for insulating between the resistance heating plate 15 and the cooling plate 8, and provided on the surface 20 side of the resistance heating plate 15. And a stamper 7 as a transfer plate for directly pressing the plate-shaped body A, and a rubber sheet 21 or an insulating coating layer as a second insulator for insulating between the stamper 7 and the resistance heating plate 15. ing.
However, in the present invention, either the lower mold 3 or the upper mold 6 may be provided with a mechanism including the above-described cooling board 8 and resistance heating plate 15 and the like. A mechanism including the resistance heating plate 15 and the stamper 7 is provided only in one of the molds. When the transfer by the transfer plate is performed only on one side of the plate-like body A, the other mold has the stamper 7 on the resistance heating plate 15. Or a blank stamper having no unevenness is attached, and both surfaces are desirably kept at substantially the same temperature so that the plate-shaped body A does not warp. Alternatively, the other mold may not be provided with the resistance heating plate 15, and the other mold may be maintained at a temperature at which the plate-shaped body A does not warp during molding.
[0047]
The press forming apparatus 1 uses the stamper 7 of the lower die 3 and the stamper 7 of the upper die 6 between the lower die 3 as the first die and the upper die 6 as the second die to form the plate-shaped body A. Is formed directly in the molding space 26. In the first embodiment, the molding space 26 is provided so as to be isolated from the outside air by a bellows 27 provided between the bed 2 and the upper movable platen 5, and is formed by a vacuum pump, which is a pressure reducing means (not shown). The space 26 is provided so as to be able to reduce the pressure. In order to isolate the molding space 26 from the outside, the press molding device 1 may be provided not in the bellows 27 but in a vacuum chamber.
[0048]
Next, the operation of the press-forming apparatus 1 for the plate-shaped body A of the present invention will be described with reference to the time chart shown in FIG. 3 and the flowcharts shown in FIGS.
Before carrying in the plate-shaped body A, the upper die 6 of the press forming apparatus 1 has been moved upward by the ram 4 which is moved up and down by a cylinder (not shown) in the previous molding cycle. The resistance heating plates 15 are located at positions separated from the cooling plate 8 by extension of the hydraulic cylinder 13 serving as separation means. The cooling board 8 is controlled at a predetermined temperature to 20 ° C. by water as a temperature control medium sent from a temperature controller (not shown). The predetermined temperature of the cooling board 8 is desirably 15 ° C. to 40 ° C., but there may be a case where tap water is directly passed through the cooling board 8 and the temperature is not controlled to the predetermined temperature.
As for the plate-like body A used for molding in the first embodiment, molding using a uniform 3 mm-thick acrylic plate for a 15-inch light guide plate will be described. As the plate-shaped body A for press-molding the light guide plate, polycarbonate or a cycloolefin-based resin may be used.
[0049]
This will be described in the order of steps with reference to FIG.
In step S1, the plate-shaped body A is placed and brought into contact with the pattern transfer surface 24 of the stamper 7 which is a transfer unit of the lower die 3 of the press forming apparatus 1 by a not-shown carrying-in unit or an operator. At this time, the plate-shaped body A is positioned at the regular pressing position by being guided by the frame 25. Note that this regular pressure position is held by a holding means (not shown) at a position where the plate-shaped body A is directly placed and abutted on the stamper 7 as a transfer plate, and at an opposing position which does not directly abut the stamper 7. The plate A and the stamper 7 may be in direct contact with each other by driving the ram 4.
In step S2, it is detected by a not-shown photoelectric tube whether or not the plate-shaped body A has been positioned at the normal pressing position. If the plate A has been positioned at the normal pressing position (Y), the process proceeds to the next step S3, where the normal processing If it is not positioned at the pressure position (N), it is detected whether or not it is positioned again, and if it is not positioned at the regular pressure position even after a predetermined time has elapsed, the press forming apparatus 1 is stopped ( Not shown).
In step S3, the molding space 26 is isolated from the outside air by the bellows 27.
In step S4, the vacuum pump, which is a pressure reducing means (not shown), is turned on to start reducing the pressure in the molding space 26.
In step S5, when a predetermined time elapses after the pressure reduction of the molding space 26 is started by the vacuum pump, the pressurizing cylinder (not shown) is controlled, and the entire upper die 6 including the resistance heating plate 15 is lowered by the ram 4.
In step S6, it is confirmed whether or not the plate A and the stamper 7 of the upper die 6 are in contact with each other by a not-shown photoelectric tube or the like. If the plate A and the stamper 7 of the upper die 6 are in contact with each other (Y), the next step is performed. If the contact is not made (N), the pressurizing cylinder is controlled to lower the stamper 7 of the upper die 6 until it comes into contact with the plate-like body A (step S7).
In step S7, when it is confirmed that the stamper 7 of the upper die 6 and the plate-shaped body A are in contact with each other, a pressurizing cylinder (not shown) is controlled, and the lowering of the ram 4 is temporarily stopped. In this state, since the plate-shaped body A is sandwiched between the stampers 7 separated from the cooling board 8, the pressurizing means has not yet been fully pressed.
Step S8, energization of the resistance heating plates 15 of the lower mold 3 and the upper mold 6 is started, and the temperature rise control of the resistance heating plates 15 is started. Thereby, the temperature rise control of the stamper 7 is started at the same time.
In step S9, it is confirmed whether or not the pressure in the molding space 26 has reached 20 hPa by a barometer (not shown). If the pressure has reached 20 hPa (Y), the process proceeds to the next step S10. , Until the pressure reaches 20 hPa.
Step S10, the temperature sensor 23 checks whether the temperature of the resistance heating plate 15 provided on the lower mold 3 has reached 160 ° C., and when the temperature has reached 160 ° C. (Y), proceeds to the next step S11. When the temperature has not reached 160 ° C., the power supply to the resistance heating plate 15 is continued until the temperature reaches 160 ° C., and the temperature is increased.
Step S11, the energization of the resistance heating plates 15 of the lower mold 3 and the upper mold 6 ends. However, actually, even after the current supply to the resistance heating plate 15 is terminated, the temperature of the resistance heating plate 15 and the temperature of the stamper 7 further rises above 160 ° C. for a while due to overshoot. Then, the surface of the plate-shaped body A abutted on the stamper 7 is made higher than the glass transition temperature to be in a state capable of being thermally deformed.
[0050]
In step S12, the hydraulic cylinder 13 as the separating means for the lower mold 3 and the upper mold 6 is simultaneously contracted,
Step S13, when it is detected by a proximity switch (not shown) that the cooling platen 8 is in contact with the resistance heating plate 15 of the lower die 3 and the upper die 6 via the rubber sheet 11 as the first insulator. (Y), the process proceeds to the next step S14. If not detected by the proximity switch (N), the hydraulic cylinder 13 is contracted until it is detected by the proximity switch.
Step S14, the pressurizing cylinder (not shown) is controlled to start the re-lowering of the ram 4, and the transfer of minute irregularities is started by the stamper 7 to the plate-shaped body A in which only the surface can be thermally deformed. I do. At this time, the resistance heating plate 15 and the stamper 7 are cooled by the resistance heating plate 15 being brought into contact with the cooling plate 8 via the rubber sheet 11.
In step S15, the pressure is increased until the pressure per unit area on the plate A reaches 3 MPa, and if a pressure sensor (not shown) detects a pressure corresponding to the pressure per unit area reaching 3 MPa (Y), the next step is performed. If the pressure corresponding to the pressure per unit area reaches 3 MPa is not detected (N), the process proceeds to step S16 until the pressure corresponding to the pressure per unit area reaches 3 MPa is detected. Pressurization is performed by a pressure cylinder.
Step S16, the control of the pressing force of the pressing cylinder (not shown) is continued so that the pressure per unit area with respect to the plate-like body A becomes 3 MPa,
In step S17, after the predetermined time has elapsed, the operation of the vacuum pump is stopped, the decompression is started by the slope, and the pressure in the molding space 26 is controlled so as to gradually approach the atmospheric pressure.
Step S18, it is checked whether the temperature of the resistance heating plate 15 provided in the lower mold 3 has reached 50 ° C., and if the temperature has reached 50 ° C. (Y), the process proceeds to the next step S19, where the resistance heating plate 15 If the temperature has not reached 50 ° C., the state is continued, and the temperatures of the resistance heating plate 15 and the stamper 7 are lowered.
In step S19, a pressurizing cylinder (not shown) is controlled to raise the ram 4, and the pressure applied to the plate A is reduced by the slope.
In step S20, whether or not the ram 4 has reached the ascending position is detected by a proximity switch (not shown). If the completion of the ascent of the ram 4 is confirmed (Y), the process proceeds to the next step S21, and the completion of the ascent of the ram 4 is not confirmed. Sometimes, the ram 4 is further raised.
In step S21, whether or not the molding space 26 is at atmospheric pressure is measured by a barometer (not shown). When it is confirmed that the pressure is at atmospheric pressure (Y), the process proceeds to the next step S22, where the pressure is at atmospheric pressure. If not (N), the pressure is further released.
Step S22, the molding space 26 is opened to the outside air.
In step S23, the light guide plate, which is a substantially rectangular thermoplastic resin molded product, is removed from the press molding device 1 by a not-shown substantially rectangular thermoplastic resin molded product removal means.
In step S24, the hydraulic cylinder 13 is extended to separate the cooling board 8 from the resistance heating plate 15.
[0051]
In the present invention, pressure and transfer are performed on the plate-shaped member A in contact with the stamper 7 while controlling the temperatures of the resistance heating plate 15 and the stamper 7 by the above steps. In the control of the above steps, the temperature of the resistance heating plate 15 provided on the lower mold 3 is detected and control such as the start of pressurization is performed. The control may be performed by detecting the temperature of the plates 15 and 15. Further, instead of detecting the temperatures of the resistance heating plates 15 and 15, the control is performed by detecting the temperature of the stamper 7, the temperature of the plate-like body A, the degree of vacuum in the molding space 26, the time of energizing the resistance heating plate 15, and the like. May be. In addition, the start of the temperature rise control by energizing the resistance heating plate 15 may be performed at the same time as or slightly before or after the separation of the cooling board 8 and the resistance heating plate 15 (within a range of 10 seconds or less). The start of the temperature rise control is not limited to the time after the plate-shaped body A is brought into contact with the stamper 7, and the temperature rise control is performed at the same time as or before the time when the plate-shaped body A is brought into contact with the stamper 7. May go. When the resistance heating plate 15 is energized and the temperature of the resistance heating plate 15 and the stamper 7 has already been controlled, the plate A is placed on the stamper 7 and the upper stamper 7 is also lowered as quickly as possible. The contact with the upper surface of the plate A can prevent the warp of the plate A. If the molding space 26 is not evacuated, the energization of the resistance heating plate 15 should be started before the placement and abutment of the plate A, thereby shortening the molding cycle time. In particular, when the resistance heating plate 15 and the stamper 7 are disposed only on the upper mold 6 side, the resistance heating plate 15 is energized before the plate-shaped body A is placed on the lower mold 3 to control the temperature rise. Even in this case, the molding cycle time can be reduced without being affected by warpage. The control of the pressurizing cylinder and the hydraulic cylinder 13 (not shown) of the press forming apparatus 1 may be performed by detecting the hydraulic pressure without using the proximity switch or the photoelectric tube. Further, a predetermined temperature is detected by the temperature sensor 23, and after the resistance heating plate 15 and the stamper 7 reach the predetermined temperature, the temperature is controlled so as to be a constant temperature. May be contacted via the rubber sheet 11 to be cooled. In that case, ON / OFF control of energization may be performed, and the current value may be controlled. Further, even after the resistance heating plate 15 and the cooling plate 8 are brought into contact with each other via the rubber sheet 11, the current is continuously supplied to the resistance heating plate 15 while controlling the current supplied from the power supply, and the resistance heating plate 15 May be lowered at a desired temperature curve. Further, the hydraulic cylinder 13 may be operated by a timer or the like to detect that the cooling platen 8 and the resistance heating plate 15 are in contact with each other, and stop supplying power to the resistance heating plate 15. However, in any case, it is desirable that the resistance heating plate 15 and the cooling plate 8 be brought into contact with each other at the same time as when the energization of the resistance heating plate 15 is stopped or slightly before or after (within about 10 seconds before and after). .
[0052]
Further, in this embodiment, when the temperature of the resistance heating plate 15 reaches 160 ° C., the power supply to the resistance heating plate 15 is stopped and the pressurization is started. Is preferably set to a temperature higher by 50 ° C. to 90 ° C., preferably 60 ° C. to 80 ° C. than the thermal deformation temperature (ASTM D648) of the resin to be molded. In the case of this embodiment, since the thermal deformation temperature (ASTM D648) of acrylic is about 95 ° C., the temperature at which the energization to the resistance heating plate 15 is stopped and pressurization is started is 145 ° C. to 185 ° C., more preferably. The energization is stopped between 155 ° C and 175 ° C, and pressurization is started. The temperature at the end of pressurization and release from the mold is preferably 40 ° C to 65 ° C. Furthermore, the degree of vacuum when pressurizing the plate-shaped body A is desirably about 10 hPa to 50 hPa, but it is also possible to perform the vacuum at a lower degree of vacuum or at atmospheric pressure than the above. The pressure per unit area of the molded article when the transfer is performed by pressing the plate A is desirably in the range of 1 MPa to 5 MPa. In the present invention, since the minute irregularities are transferred to the plate-shaped body A whose surface is already in a state capable of being thermally deformed, it is sufficient to use a relatively low pressing force as the press molding, and the insulator is made an elastic body. Thus, the pressing force can be made more uniform. When the pressure for pressing the plate A is low, it is desirable to increase the temperature of the resistance heating plate 15. Further, the plate-shaped body A carried into the press forming apparatus 1 may be a pre-heated one having a predetermined temperature, instead of using a room temperature one, and may be a resin plate formed by an injection molding machine or an extruder. You may carry in to the press molding apparatus 1 before a temperature falls. In the example of the first embodiment in which a rubber sheet is used as the insulator, even if there is an error in the mechanical parallelism of the press forming apparatus, the error can be absorbed by the elastic body, and the plate-like body A Uniform pressurization and transfer can be performed throughout. Further, since the plate-shaped body A before being formed is formed by extrusion molding or the like, the warpage or the thickness may be non-uniform in some cases, but uniform transfer can be performed entirely by the elastic body.
[0053]
Next, a test performed using the press molding apparatus of the first embodiment and the results thereof will be described. FIG. 8 is an explanatory diagram showing a test result when forming is performed by changing the thickness of the first insulator by the press forming apparatus of the present invention. In this test, as the plate-shaped material A used for molding, a plate-shaped material made of acrylic and having a thickness of 8 mm for a 15-inch display device was used. Then, transfer molding of a groove having a depth of 25 μm and a pitch of 50 μm was attempted on the plate-like body A by the stamper 7. In this test, the maximum heat generation temperature of the resistance heating plate 15 at the time of the transfer molding was 160 ° C., the pressure applied by the pressing means was 2.7 MPa, and the transfer molding was performed in the vacuum molding space. In this test, the silicon rubber sheet 11 as the first insulator used between the cooling board 8 and the resistance heating plate 15 was changed to a sheet having a different thickness under the above-mentioned molding conditions. By the way, for all the tests this time, the second insulator between the resistance heating plate 15 and the stamper 7 used the rubber heating paint coated on the resistance heating plate 15. As a result, as shown in FIG. 8, a good cushioning effect is obtained when the thickness of the silicon rubber sheet 11 is 1.0 mm or more, but a longer cooling time is required as the silicon rubber sheet 11 is thicker. I understand that there is. In the test results, a silicone rubber sheet 11 having a thickness of 2.0 mm was used, and a transfer rate of 100% was obtained in the case of a cooling time of 60 seconds (approximately the pressing time). However, this is limited to this test result.If the conditions such as the resin to be molded, the thickness and area of the resin plate, the pressing force, the thickness of the stamper, and the depth and shape of the transferred pattern are different. However, the test results may be different.
[0054]
Next, a second embodiment shown in FIG. 6 will be described. In the press forming apparatus 31 of the second embodiment, tie bars 34 are erected at four corners of a bed 33 to which a pressurizing cylinder 32 as a pressurizing means is attached. Is installed. A flat cooling plate 36 is fixed to the lower surface of the upper plate 35. A movable plate 38 is fixed to the ram 37 moved up and down by the pressurizing cylinder 32, and a flat cooling plate 39 is also fixed to the upper surface of the movable plate 38.
The pressurizing means may be provided separately from the moving means of the movable platen 38. One or more other flat cooling plates 40 are provided between the cooling plate 36 fixed to the upper plate 35 and the cooling plate 39 fixed to the movable plate 38. The number of other cooling boards 40 is a design matter and is not limited. The other cooling plates 40 are provided with mounting claws 41, 41 on both sides, and are mounted on the step portions 42, 42 provided on both sides except at the time of molding, so as to have a predetermined interval. It is provided so that it can be arranged. Then, at the time of molding, the other cooling plates 40 are raised by moving the movable plate 38 to form the cooling plates 36 and 39 and the other cooling plates 40 (specifically, between the cooling plate 36 and the other cooling plates 40, The multi-stage press forming of the plate-shaped body A is performed between the other cooling plates 40 and between the other cooling plates 40 and the cooling plates 39). A cooling medium passage 43 is formed in the cooling boards 36 and 39 and the other cooling boards 40 in the same manner as in the first embodiment, and the temperature controlling medium is circulated from a temperature controller (not shown). The cooling board 36 and the like are controlled so as to be maintained at a predetermined temperature. Further, a forming space 44 including the movable plate 38 including the movable plate 38 and the upper plate 35, the cooling plates 36 and 39, and the other cooling plates 40 is formed by a partition wall portion 45 forming a vacuum chamber. It is provided so as to be separable from the outside air, and is provided so as to be able to reduce the pressure by a vacuum pump (not shown).
[0055]
The cooling plates 36 and 39, the other cooling plates 40, and the like are also provided with a resistance heating plate 46, a rubber sheet 47 or an insulating coating layer as a third insulator, substantially the same as in the first embodiment. A mechanism composed of a rubber sheet 48 or an insulating coating layer, a stamper 49, and the like, which are insulators, is formed. That is, the cooling plate 36 and the cooling plate 39 have a rubber sheet 47 attached to only the surface 50 or a rubber-based paint is applied, and the cooling plate 36 and the cooling plate 39 and the resistance heating plate 46 There is provided a separating means for separating and contacting each other. The other cooling plate 40 disposed between the cooling plate 36 and the cooling plate 39 has a resistance heating plate 46 and a rubber sheet 47 as a third insulator on its front surface (upper surface) and back surface (lower surface). Alternatively, a mechanism including an insulating coating layer, a rubber sheet 48 or an insulating coating layer as a fourth insulator, a stamper 49, and the like is formed. In the second embodiment, the separating means includes a spring 51 which is a resilient body. When the ram 37 of the pressurizing cylinder 32 rises, the spring 51 is contracted, and the resistance heating plate 46 and the flat cooling plate 36 are brought into contact. A resistance heating plate 46 is attached to the spring 51 via a ceramic plate 52 which is an insulator, and a stamper 49 is attached to a surface 53 of the resistance heating plate 46 via a rubber sheet 48 which is a fourth insulator. ing. The rubber sheet 47 as the third insulator may be attached to the back surface 54 of the resistance heating plate 46 and / or the front surface 50 of the cooling board 36 or the like.
[0056]
The press control by the press forming apparatus 31 of the second embodiment shown in FIG. 6 is substantially the same as the control of the press forming apparatus 1 of the first embodiment, but the basic principle is different, though the control conditions are different. . During one forming cycle of the press forming apparatus 31, when the movable platen 38 is not raised and another cooling platen 40 is kept at a predetermined interval, the resistance heating plate 46 is connected to the cooling plates 36, 39 and It is separated from other cooling boards 40 and the like. When the plate-shaped body A is placed on and abutted on the stamper 49, the movable platen 38 is then raised, and the cooling platen 39 and another cooling platen 40 are fixed to the cooling platen 36 fixed to the upper platen 35. The movable plate 38 is temporarily stopped when the plate member A and the stamper 49 above the plate member A contact each other. Then, power is supplied to the resistance heating plate 46, and the temperature rise control of the resistance heating plate 46 and the stamper 49 is started. When the temperature of the stamper 49 or the like reaches a predetermined temperature, the power supply to the resistance heating plate 46 is stopped, the pressurizing cylinder operates again, and the movable plate 38 is raised. Then, the resistance heating plate 46 is in contact with the cooling plates 36 and 39 and the other cooling plates 40 via the rubber sheet 47. Thereafter, the pressurizing cylinder 32 still presses and transfers the plate-shaped body A between the cooling plates 36 and 39 and the other cooling plates 40 and the like by the stamper 49. It should be noted that the current supply to the resistance heating plate 46 may be stopped at the same time as when the resistance heating plate 46 contacts the cooling plates 36 and 39 and the other cooling plates 40 or the like, or slightly before or after.
[0057]
Next, a third embodiment shown in FIG. 7 will be described. In the press forming apparatus 61 according to the third embodiment, a resistance heating plate 63 that is separated and moved by a separating means with respect to a flat cooling plate 62 is attached, and a fifth surface made of an elastic material is formed on a surface 64 of the cooling plate 62. The point that the rubber sheet 65 as the insulator or the one to which the insulating coating layer is attached is provided on at least one of the lower mold as the first mold and the upper mold as the second mold is the same as the first mold. It is similar to the press forming apparatus 1 of the embodiment. In the press forming apparatus 61 according to the third embodiment, the stamper 7 that is a transfer plate is not provided on the surface 66 side of the resistance heating plate 63 unlike the first embodiment. In the third embodiment, the stamper 67 is brought into and out of the press forming apparatus 61 while being in contact with the plate-like body A to be formed. In this example, a rubber sheet 68, which is a sixth insulator for insulating between the stamper 67 and the resistance heating plate 63, is attached to the back side of the stamper 67, or an insulating coating layer is provided. The two stampers 67 to which the rubber sheet 68 for insulating the resistance heating plate 63 is adhered are brought into contact with the upper and lower surfaces of the plate-shaped body A. Is mounted on the resistance heating plate 63 and is carried out after molding. In the third embodiment, a rubber sheet, which is an insulator, is attached to the surface 66 of the resistance heating plate 63, and the stamper 67, to which the rubber sheet 68 is not attached, comes into contact with the plate-shaped body A. Alternatively, it may be provided so as to be carried in / out on a rubber sheet adhered to the resistance heating plate 63 of the press molding device 61.
[0058]
Further, as another example of the third embodiment shown in FIG. 7, only one stamper 67 is used, and the pattern transfer surface 71 of the stamper 67 is brought into contact with only one surface of the plate-shaped member A. The transfer may be performed only on one side of A. Alternatively, a plurality of relatively small plate-shaped members A may be brought into contact with the pattern transfer surface 71 of one stamper 67, and the plurality of plate-shaped members A may be simultaneously pressed to perform transfer molding. The press forming apparatus 61 of the third embodiment can perform multi-stage forming like the press forming apparatus 31 of the second embodiment. Furthermore, it is also possible to use the press forming apparatus 1 according to the first embodiment to simultaneously form a plurality of plate-like bodies A and the stampers 67 alternately and simultaneously, but in such a case, the pressurizing time and the like are reduced. It is necessary to consider setting of molding conditions. The control method of the press forming apparatus 61 is almost the same as the control method of the press forming apparatus 1 of the first embodiment in the basic principle. However, when the lower die can be moved in the horizontal direction, the one in which the stamper 67 and the plate-shaped body A are in contact is placed on the resistance heating plate 63 of the lower die, and the lower die is placed below the upper die. By being moved, it is carried between the lower mold and the upper mold.
[0059]
Further, as still another example of the third embodiment shown in FIG. 7, the sixth insulator that insulates the surface 66 of the resistance heating plate 63 is an example in which the sixth insulator is made of a movable strip-shaped resin film. Is also good. In this case, the stamper 67 for transferring to the plate-shaped body A and the plate-shaped body A are placed on the band-shaped resin film, and the band-shaped resin film is moved from one side to the other by a resin film conveying means such as a roll (not shown). By doing so, the plate-shaped body A can be carried in together with the stamper 67 into the molding space 70 pressed by the resistance heating plate 63, and can be carried out after being pressed and transferred by the press molding device 61. In this case, as the material of the belt-shaped resin film, a film made of a resin having a relatively high heat resistance such as polyethylene terephthalate, vinyl chloride resin, polyimide, or a fluororesin is used. Therefore, when a resin film is used as the sixth insulator, the transfer device 69 does not need to be provided since the belt-shaped resin film functions as a carrier film. When the upper surface of the plate A is also transferred by the stamper 67 (including a blank stamper having no unevenness), a strip-shaped resin film is provided on the upper and lower sides. Further, the resin film may be not a strip-shaped carrier film but a cut into a predetermined size.
[0060]
Next, a press forming apparatus 81 according to a fourth embodiment shown in FIG. 9 will be described. The press forming apparatus 81 of the fourth embodiment is provided with a mechanism for further reducing unevenness and temperature unevenness of the resistance heating plate 83 during pressing. In the press forming apparatus 81, a resistance heating plate 83 separated and moved by a separating means with respect to a flat cooling board 82 is provided on at least one of a lower die as a first die and an upper die as a second die. This is the same as the press forming apparatus 1 according to the first embodiment. In the press forming apparatus 81, in the first embodiment, a rubber sheet 84 corresponding to a first insulator is brought into contact with the back side of the resistance heating plate 83, and the rubber sheet 84 is placed on the back side of the rubber sheet 84. A pressing plate 85 made of stainless steel and having the same size as 84 and having a thickness of 2 mm is further abutted. Therefore, the rubber sheet 84 is provided in a sandwich shape between the resistance heating plate 83 and the pressing plate 85 without using an adhesive or the like. The metal pressing plate 85 is provided in a size that at least covers the outer shape of the plate A formed by the transfer unit. The pressing plate 85 is pressed toward the resistance heating plate 83 by a cylinder 86 which is an insulator pressing means attached to the cooling plate 82, and moves with the separation of the resistance heating plate 83 from the cooling plate 82. Therefore, the rubber sheet 84 is pressed by the pressing plate 85 toward the resistance heating plate 83 from the back side. In the fourth embodiment, the above configuration prevents unevenness due to uneven application of the adhesive on the surface of the resistance heating plate 83 during pressurization. Further, since the rubber sheet 84 is uniformly brought into contact with the resistance heating plate 83, the temperature unevenness of the resistance heating plate 83 can be eliminated.
[0061]
In the fourth embodiment, the means for separating the resistance heating plate 83 comprises a spring 87 which is a resilient body, and the spring 87 abuts against a resistance heating plate mounting portion 88 fixed to both ends of the resistance heating plate 83. Touched. The spring 87 on the lower mold side has a higher elasticity than the spring 87 on the upper mold side by an amount corresponding to its own weight of the resistance heating plate 83 and the like. A holder 89 is provided on the side of the bed and the upper movable platen. When the resistance heating plate 83 is separated from the cooling plate 82, the holder 89 comes into contact with the resistance heating plate mounting portion 88, and the separation of the resistance heating plate 83 from the cooling plate 82 by a certain amount or more is regulated. . In the fourth embodiment, the portion of the resistance heating plate mounting portion 88 where the spring 87 abuts and the inner surface of the holder 89 are an insulating layer. The transfer pattern is formed on the surface of the resistance heating plate 83, and the resistance heating plate mounting portion 88 is connected to a DC power supply. The mechanism such as the insulator pressing means on the upper mold side is not always necessary because the rubber sheet 84 is brought into contact with the back surface of the resistance heating plate 83 by its own weight. In the fourth embodiment, the insulator pressing means may use a spring instead of the cylinder 86, and may use a cylinder as the separating means. The separating means and the holder 89 may be attached to the cooling board 82. As a modified example of the separating means, the resistance heating plate 83 may be separated from the cooling plate 82 via a pressing plate 85 or the like by a cylinder 86 or a spring which is an insulator pressing means. The mechanism including the pressing means of the fourth embodiment can be adopted in the second and third embodiments. The control method of the press forming apparatus 81 of the fourth embodiment is almost the same as that of the first embodiment, but when the separating means is a spring 87, the cooling platen 82 is raised by a pressure cylinder (not shown). Then, the resistance heating plate 83 and the pressing plate 85 are separated from the cooling board 82. Then, at the time of pressurization, the resistance heating plate 83 is cooled by the cooling plate 82 via the pressing plate 85 and the rubber sheet 84.
[0062]
In the first to fourth embodiments, the stamper 7 or the like is used as the transfer plate, or the press forming apparatus 1 or 31 for manufacturing the light guide plate in which the transfer means is directly provided on the resistance heating plate. , 61, 81. However, the molded thermoplastic resin product is not limited to a light guide plate, and may be used for transfer molding of other optical products such as a lens, a disk substrate, a memory card, a light diffusion plate of a liquid crystal display device, and a precision circuit. It may be used for a substrate, a part for a personal computer, or the like, which is to be subjected to transfer molding on a thin plate-like molded product by a transfer plate. Furthermore, although the present invention has been described with respect to molding of a thermoplastic resin plate, the present invention can also be applied to thermosetting resins.
[0063]
【The invention's effect】
ADVANTAGE OF THE INVENTION This invention can aim at shortening of the cycle time of press molding. Further, even if there is a slight dimensional error on either the thermoplastic resin plate or the mold side, the dimensional error can be absorbed to some extent by the elastic body, and a molded article with good transfer can be formed. be able to.
[Brief description of the drawings]
FIG. 1 is a sectional view of a press molding apparatus according to the present invention.
FIG. 2 is a cross-sectional view at the time of press forming by the press forming apparatus of the present invention.
FIG. 3 is a time chart at the time of molding by the press molding apparatus of the present invention.
FIG. 4 is a flowchart at the time of molding by the press molding apparatus of the present invention.
FIG. 5 is a flowchart at the time of molding by the press molding apparatus of the present invention, and shows a continuation of FIG. 4;
FIG. 6 is a partial sectional view of a press molding apparatus according to a second embodiment of the present invention.
FIG. 7 is a sectional view of a press forming apparatus according to a third embodiment of the present invention.
FIG. 8 is an explanatory view showing a test result when forming is performed by changing the thickness of the first insulator by the press forming apparatus of the present invention.
FIG. 9 is a sectional view of a press forming apparatus according to a fourth embodiment of the present invention.
[Explanation of symbols]
1,31,61,81 ... Press forming equipment
2,33 ... bed
3 ……… Lower mold
4,37 ... ram
5 Upper movable plate
6 ……… Upper mold
7,49,67 ……… Stamper
8,36,39,62,82 Cooling board
9, 43 ... Temperature control medium passage
10, 20, 50, 53, 64, 66 ... Surface
11, 17, 21, 47, 48, 65, 68, 84 ... rubber sheet
12 ... recess
13 Hydraulic cylinder
14 ...... Rod
15, 46, 63, 83 ... Resistance heating plate
16 ...... Supporting part
18a, 18b ... terminal part
19 ...... Electric wire
22, 54… back
23 ...... Temperature sensor
24, 71 ... Pattern transfer surface
25 ... Frame
26, 44, 70 ... molding space
27 …… Bellows
32 …… Pressure cylinder
34 ...... Tie bar
35 ...... Upper panel
38 Movable board
40 ... other cooling boards
41 ...... Mounting claw
42 ...... Step
45 ...... Partition wall
51,87 …… Spring
52 ...... Ceramic plate
69 ...... Transfer machine
85 …… Pressing plate
86 …… Cylinder
88 ...... Resistance heating plate mounting part
89 ...... Holder
A ……… A substantially rectangular thermoplastic resin plate

Claims (14)

第一の型と第二の型との間で熱可塑性樹脂板状体の加圧を行うプレス成形装置において、
冷却盤と、
１成形サイクル中に昇温制御されかつ前記冷却盤から離隔手段によって離隔される抵抗加熱板と、
該抵抗加熱板と前記冷却盤との間を絶縁する第一の絶縁体と、
前記抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写板と、
該転写板と前記抵抗加熱板との間を絶縁する第二の絶縁体とが前記第一の型と前記第二の型の少なくとも一方に設けられ、
前記第一の絶縁体および前記第二の絶縁体の少なくとも一方が弾性体からなることを特徴とするプレス成形装置。In a press forming apparatus for pressing the thermoplastic resin plate between the first mold and the second mold,
Cooling board,
A resistance heating plate which is heated during one molding cycle and is separated from the cooling plate by separation means;
A first insulator insulating between the resistance heating plate and the cooling board,
A transfer plate provided on the surface side of the resistance heating plate and directly pressing the thermoplastic resin plate,
A second insulator that insulates between the transfer plate and the resistance heating plate is provided on at least one of the first mold and the second mold,
A press molding device, wherein at least one of the first insulator and the second insulator is made of an elastic body. 下面に冷却盤が取付けられた上盤と、
上面に冷却盤が取付けられ前記上盤に対して昇降される可動盤と、
前記上盤と前記可動盤との間において昇降される他の冷却盤とを有し、
前記可動盤を上昇させることにより冷却盤および他の冷却盤等の間で熱可塑性樹脂板状体の加圧を行うプレス成形装置において、
１成形サイクル中に昇温制御されかつ前記冷却盤および前記他の冷却盤から離隔手段によって離隔される抵抗加熱板と、
該抵抗加熱板と前記冷却盤または該抵抗加熱板と他の冷却盤との間を絶縁する第三の絶縁体と、
前記抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写板と、
該転写板と前記抵抗加熱板との間を絶縁する第四の絶縁体とが設けられ、
前記第三の絶縁体および前記第四の絶縁体の少なくとも一方が弾性体からなることを特徴とするプレス成形装置。An upper panel with a cooling panel attached to the lower surface,
A movable platen on which a cooling plate is mounted on the upper surface and which is moved up and down with respect to the upper plate;
Having another cooling plate that is raised and lowered between the upper plate and the movable plate,
In a press molding apparatus that presses the thermoplastic resin plate between the cooling plate and other cooling plates by raising the movable plate,
A resistance heating plate which is heated during one molding cycle and is separated from the cooling plate and the other cooling plate by separation means;
A third insulator insulating between the resistance heating plate and the cooling plate or the resistance heating plate and another cooling plate;
A transfer plate provided on the surface side of the resistance heating plate and directly pressing the thermoplastic resin plate,
A fourth insulator that insulates between the transfer plate and the resistance heating plate is provided,
A press molding apparatus, wherein at least one of the third insulator and the fourth insulator is made of an elastic body. 第一の型と第二の型との間で熱可塑性樹脂板状体の加圧を行うプレス成形装置において、
冷却盤と、
１成形サイクル中に昇温制御されかつ前記冷却盤から離隔手段によって離隔される抵抗加熱板と、
該抵抗加熱板と前記冷却盤との間を絶縁する弾性体からなる第五の絶縁体とが前記第一の型と前記第二の型の少なくとも一方に備えられ、
少なくとも熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものが前記第一の型と第二の型の間に搬入・搬出されるように設けられたことを特徴とするプレス成形装置。In a press forming apparatus for pressing the thermoplastic resin plate between the first mold and the second mold,
Cooling board,
A resistance heating plate which is heated during one molding cycle and is separated from the cooling plate by separation means;
A fifth insulator made of an elastic body that insulates between the resistance heating plate and the cooling plate is provided on at least one of the first mold and the second mold,
At least a transfer plate that directly presses the thermoplastic resin plate and the thermoplastic plate in contact with the transfer plate are provided so as to be carried in and out between the first mold and the second mold. A press forming apparatus characterized by the above-mentioned. 前記抵抗加熱板は厚さが１ｍｍないし４ｍｍの金属板であって、シリンダまたは弾発体からなる離隔手段によって前記冷却盤から離隔移動されることを特徴とする請求項１または請求項３に記載のプレス成形装置。4. The resistance heating plate according to claim 1, wherein the resistance heating plate is a metal plate having a thickness of 1 mm to 4 mm, and is separated from the cooling plate by a separation means including a cylinder or an elastic body. Press forming equipment. 前記第一の絶縁体および前記第二の絶縁体の少なくとも一方、または前記第三の絶縁体および前記第四の絶縁体の少なくとも一方は、０．１ｍｍないし２．５ｍｍの厚さを有する弾性体からなることを特徴とする請求項１または請求項２に記載のプレス成形装置。At least one of the first insulator and the second insulator, or at least one of the third insulator and the fourth insulator, is an elastic body having a thickness of 0.1 mm to 2.5 mm. The press forming apparatus according to claim 1, wherein the press forming apparatus comprises: 前記第一の絶縁体および前記第二の絶縁体の少なくとも一方、または前記第三の絶縁体および前記第四の絶縁体の少なくとも一方は、フッ素ゴムまたはシリコンゴムを含有した塗料が前記抵抗加熱板および前記冷却盤の少なくとも一方に塗装された絶縁塗装層であることを特徴とする請求項１または請求項２に記載のプレス成形装置。At least one of the first insulator and the second insulator, or at least one of the third insulator and the fourth insulator is made of a paint containing fluorine rubber or silicon rubber, wherein the resistance heating plate The press-forming apparatus according to claim 1, wherein the press-forming apparatus is an insulating coating layer applied to at least one of the cooling boards. 前記熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものを第六の絶縁体である樹脂フィルムに載置し、
前記樹脂フィルムを移動させることにより第一の型と第二の型の間に前記熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものが搬入・搬出されるように設けられていることを特徴とする請求項３に記載のプレス成形装置。A transfer plate that directly presses the thermoplastic resin plate and the thermoplastic resin plate abutted thereon are placed on a resin film that is a sixth insulator,
The transfer plate that directly presses the thermoplastic resin plate between the first mold and the second die by moving the resin film and the thermoplastic plate in contact with the transfer plate are loaded and unloaded. The press-forming apparatus according to claim 3, wherein the press-forming apparatus is provided so as to be pressed. 前記転写板は、交換可能であって、厚さが０．１ｍｍないし１．０ｍｍのニッケルからなる導光板製造用スタンパであることを特徴とする請求項１ないし請求項３のいずれか１項に記載のプレス成形装置。4. The method according to claim 1, wherein the transfer plate is a replaceable stamper for manufacturing a light guide plate made of nickel having a thickness of 0.1 mm to 1.0 mm. 5. The press forming apparatus according to the above. 前記転写板によって熱可塑性樹脂板状体が直接加圧される第一の型と第二の型の間または上盤と可動盤の間は、減圧手段によって減圧されることを特徴とする請求項１ないし請求項３のいずれか１項に記載のプレス成形装置。The pressure is reduced by a pressure reducing means between a first mold and a second mold or between an upper plate and a movable plate where the thermoplastic resin plate is directly pressed by the transfer plate. The press molding device according to any one of claims 1 to 3. 抵抗加熱板の裏面側に当接される第一の絶縁体、第三の絶縁体、および第五の絶縁体のうちのいずれかの絶縁体と、
前記いずれかの絶縁体の裏面側に当接されかつ成形される熱可塑性樹脂板状体の外形形状以上の大きさを有する押圧板とが設けられたことを特徴とする請求項１ないし請求項３のいずれか１項に記載のプレス成形装置。The first insulator abutted on the back side of the resistance heating plate, the third insulator, and any one of the fifth insulator,
2. A pressing plate having a size larger than the outer shape of a thermoplastic resin plate to be abutted and formed on the back side of any one of the insulators. 4. The press molding apparatus according to any one of items 3 to 5. １成形サイクル中に抵抗加熱板を冷却盤から離隔させる離隔手段が、
それぞれ第一の型である下型と第二の型である上型の両方の型に設けられ、
前記離隔手段はいずれも弾発体からなり、
前記第一の型である下型に設けられた弾発体は前記第ニの型である上型に設けられた弾発体よりも弾発作用の強いものが用いられていることを特徴とする請求項１または請求項３に記載のプレス成形装置。Separating means for separating the resistance heating plate from the cooling plate during one molding cycle,
Each is provided in both the lower mold as the first mold and the upper mold as the second mold,
Each of the separation means is made of a resilient body,
The elastic body provided in the lower mold that is the first mold is characterized by having a stronger elasticity than the elastic body provided in the upper mold that is the second mold. The press forming apparatus according to claim 1 or 3, wherein the pressing is performed. 第一の型と第二の型との間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、
前記第一の型と前記第二の型の少なくとも一方に、
冷却盤と、
該冷却盤から離隔手段によって離隔移動される抵抗加熱板と、
該抵抗加熱板と前記冷却盤との間を絶縁する弾性体からなる第一の絶縁体と、
前記抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写手段と、が備えられたプレス成形装置を用いて、
前記抵抗加熱板および前記転写手段の昇温制御の開始と同時かあるいは前後して熱可塑性樹脂板状体を前記転写手段に当接させ、
その後前記冷却盤に前記第一の絶縁体を介して前記抵抗加熱板を当接させるのと同時かあるいは僅かに前後して前記抵抗加熱板の昇温制御を停止し、
前記第一の型と前記第二の型との間で前記転写手段に当接された熱可塑性樹脂板状体に加圧および転写を行うことを特徴とするプレス成形装置の制御方法。In a control method of a press molding apparatus that presses a thermoplastic resin plate between the first mold and the second mold,
In at least one of the first mold and the second mold,
Cooling board,
A resistance heating plate separated and moved from the cooling plate by separation means,
A first insulator made of an elastic body that insulates between the resistance heating plate and the cooling board;
Transfer means for directly pressing the thermoplastic resin plate provided on the surface side of the resistance heating plate, and, using a press molding apparatus provided with,
Simultaneously or before or after the start of the temperature increase control of the resistance heating plate and the transfer unit, a thermoplastic resin plate is brought into contact with the transfer unit,
Then, at the same time or slightly before or after contacting the resistance heating plate to the cooling board via the first insulator, stop the temperature rise control of the resistance heating plate,
A method for controlling a press molding apparatus, wherein a pressure and a transfer are applied to a thermoplastic resin plate-like member abutting on the transfer means between the first mold and the second mold. 下面に冷却盤が取付けられた上盤と、
上面に冷却盤が取付けられ前記上盤に対して昇降される可動盤と、
前記上盤と前記可動盤との間において昇降される他の冷却盤とを有し、
前記可動盤を上昇させることにより冷却盤および他の冷却盤等の間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、
前記冷却盤および他の冷却盤等から離隔手段によって離隔移動される抵抗加熱板と、
該抵抗加熱板を前記冷却盤および他の冷却盤等に対して絶縁する弾性体からなる第三の絶縁体と、
前記抵抗加熱板の表面側に設けられ熱可塑性樹脂板状体を直接加圧する転写手段と、が備えられたプレス成形装置を用いて、
前記抵抗加熱板および前記転写手段の昇温制御の開始と同時かあるいは前後して熱可塑性樹脂板状体を前記転写手段に当接させ、
その後前記冷却盤および他の冷却盤等に前記第三の絶縁体を介して前記抵抗加熱板を当接させるのと同時かあるいは僅かに前後して前記抵抗加熱板の昇温制御を停止し、
前記冷却盤および他の冷却盤等の間で前記転写手段に当接された熱可塑性樹脂板状体に加圧および転写を行うことを特徴とするプレス成形装置の制御方法。An upper panel with a cooling panel attached to the lower surface,
A movable platen on which a cooling plate is mounted on the upper surface and which is moved up and down with respect to the upper plate;
Having another cooling plate that is raised and lowered between the upper plate and the movable plate,
In the control method of the press-forming apparatus for pressurizing the thermoplastic resin plate between the cooling plate and other cooling plates by raising the movable plate,
A resistance heating plate that is moved away from the cooling plate and other cooling plates by separating means,
A third insulator made of an elastic body that insulates the resistance heating plate from the cooling board and other cooling boards and the like;
Transfer means for directly pressing the thermoplastic resin plate provided on the surface side of the resistance heating plate, and, using a press molding apparatus provided with,
Simultaneously or before or after the start of the temperature increase control of the resistance heating plate and the transfer unit, a thermoplastic resin plate is brought into contact with the transfer unit,
Then, at the same time as or slightly before or after slightly contacting the resistance heating plate with the cooling plate and another cooling plate via the third insulator, stop the temperature rise control of the resistance heating plate,
A method for controlling a press molding apparatus, wherein pressure and transfer are performed on a thermoplastic resin plate that is in contact with the transfer means between the cooling board and another cooling board or the like. 第一の型と第二の型の間で熱可塑性樹脂板状体の加圧を行うプレス成形装置の制御方法において、
前記第一の型と前記第二の型の少なくとも一方に、
冷却盤と、
該冷却盤から離隔手段によって離隔移動される抵抗加熱板と、
該抵抗加熱板と前記冷却盤との間を絶縁する弾性体からなる第五の絶縁体とが備えられたプレス成形装置を用いて、
前記抵抗加熱板および転写手段の昇温制御の開始と同時かあるいは前後して少なくとも熱可塑性樹脂板状体を直接加圧する転写板と熱可塑性樹脂板状体を当接させたものを前記第一の型に載置し、
その後前記冷却盤に前記第五の絶縁体を介して前記抵抗加熱板を当接させるのと同時かあるいは僅かに前後して前記抵抗加熱板の昇温制御を停止し、
前記第一の型と前記第二の型との間で前記転写板に当接された熱可塑性樹脂板状体に加圧および転写を行うことを特徴とするプレス成形装置の制御方法。In the control method of the press molding apparatus for pressing the thermoplastic resin plate between the first mold and the second mold,
In at least one of the first mold and the second mold,
Cooling board,
A resistance heating plate separated and moved from the cooling plate by separation means,
Using a press forming apparatus provided with a fifth insulator made of an elastic body that insulates between the resistance heating plate and the cooling board,
At the same time as or before or after the start of the temperature rise control of the resistance heating plate and the transfer means, at least the transfer plate and the thermoplastic resin plate that directly press the thermoplastic resin plate are directly contacted with each other. Placed on the mold
After that, the temperature rise control of the resistance heating plate is stopped at the same time as or slightly before or after contacting the resistance heating plate with the cooling plate via the fifth insulator,
A method for controlling a press molding apparatus, wherein a pressure and a transfer are applied to a thermoplastic resin plate abutted on the transfer plate between the first die and the second die.
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KR20040002519A (en) 2004-01-07
TW200305492A (en) 2003-11-01

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