TWI554408B - Glue film sticking device with a function of removing bubbles - Google Patents

Glue film sticking device with a function of removing bubbles Download PDF

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Publication number
TWI554408B
TWI554408B TW103110596A TW103110596A TWI554408B TW I554408 B TWI554408 B TW I554408B TW 103110596 A TW103110596 A TW 103110596A TW 103110596 A TW103110596 A TW 103110596A TW I554408 B TWI554408 B TW I554408B
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Taiwan
Prior art keywords
film
airbag
state
target
air bag
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TW103110596A
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Chinese (zh)
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TW201536551A (en
Inventor
徐玉權
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鴻積科機股份有限公司
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Priority to TW103110596A priority Critical patent/TWI554408B/en
Priority to CN201410548717.XA priority patent/CN104934314B/en
Priority to CN201420599882.3U priority patent/CN204230206U/en
Publication of TW201536551A publication Critical patent/TW201536551A/en
Application granted granted Critical
Publication of TWI554408B publication Critical patent/TWI554408B/en

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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67011Apparatus for manufacture or treatment
    • H01L21/67132Apparatus for placing on an insulating substrate, e.g. tape

Description

可去除氣泡之膠膜貼黏裝置 Film-adhesive device capable of removing bubbles

本發明係關於一種膠膜貼黏裝置,尤指一種可以去除氣泡之膠膜貼黏裝置。 The invention relates to a film sticking device, in particular to a film sticking device capable of removing air bubbles.

現有晶粒若黏貼於膠膜上後,若晶粒需要翻面轉移至一新的膠膜時,往往係利用自動挑揀裝置將晶粒自原膠膜轉移至新的膠膜,此步驟非常耗時。 If the existing crystal grain is adhered to the film, if the grain needs to be turned over to a new film, the automatic picking device is used to transfer the grain from the original film to the new film. This step is very expensive. Time.

但傳統的膠膜貼黏裝置在將膠膜黏貼於晶粒的過程中,其晶粒與膠膜之間容易有氣泡殘留,故當晶粒需要翻面轉移至一新的膠膜時,因氣泡的關係使晶粒與膠膜的結合度太差,故晶粒翻面轉移過程中仍然會有晶粒殘留於舊的膠膜上,故氣泡殘留是必需解決的問題。 However, in the process of sticking the film to the die, the conventional film sticking device is prone to bubble residue between the die and the film, so when the grain needs to be turned over to a new film, The relationship of the bubbles makes the bonding degree between the crystal grains and the film too poor, so that there are still crystal grains remaining on the old film during the transfer process of the grain turning, so the bubble residue is a problem that must be solved.

本發明之目的之一,是在提供一種可去除氣泡之膠膜貼黏裝置,可去除膠膜與目標物之間的氣泡。 One of the objects of the present invention is to provide a film sticking device capable of removing bubbles, which can remove bubbles between the film and the target.

本發明提供一種可去除氣泡之膠膜貼黏裝置,裝置包含一基座,用以置放一目標物;以及氣囊,設置於基座上方,氣囊接觸目標物時具有一第一狀態與一第 二狀態。 The invention provides a film sticking device capable of removing bubbles, wherein the device comprises a base for placing a target object; and an air bag is disposed above the base, the air bag having a first state and a first state when contacting the target object Two states.

100‧‧‧可去除氣泡之膠膜貼黏裝置 100‧‧‧Voice film sticking device capable of removing air bubbles

101‧‧‧基座 101‧‧‧Base

102‧‧‧氣囊 102‧‧‧Airbag

102a‧‧‧彈性墊 102a‧‧‧Elastic pad

103‧‧‧升降機構 103‧‧‧ Lifting mechanism

10、11‧‧‧膠膜 10, 11‧‧ ‧ film

K‧‧‧隔離元件 K‧‧‧Isolation components

W‧‧‧晶粒 W‧‧‧ grain

G‧‧‧中心點 G‧‧‧ Center Point

O‧‧‧孔洞 O‧‧‧ Hole

第1圖為本發明可去除氣泡之膠膜貼黏裝置之立體示意圖。 Fig. 1 is a perspective view showing the adhesive film sticking device for removing bubbles in the present invention.

第2圖為本發明可去除氣泡之膠膜貼黏裝置之側面透視示意圖。 Fig. 2 is a perspective view showing the side of the film sticking device for removing bubbles.

第3圖為本發明之基座與氣囊於初始狀態時之側面示意圖。 Fig. 3 is a side view showing the susceptor and the airbag of the present invention in an initial state.

第4圖為本發明之氣囊接觸膠膜之側面示意圖。 Figure 4 is a schematic side view of the airbag contact adhesive film of the present invention.

第5圖為本發明可去除氣泡之膠膜貼黏裝置於第一狀態之示意圖。 Fig. 5 is a schematic view showing the film sticking device for removing bubbles in the first state of the present invention.

第6圖為本發明可去除氣泡之膠膜貼黏裝置於第二狀態之示意圖。 Fig. 6 is a schematic view showing the film sticking device for removing bubbles in the second state of the present invention.

請參閱第1圖,第1圖為本發明可去除氣泡之膠膜貼黏裝置之立體示意圖,在本實施例中,可去除氣泡之膠膜貼黏裝置100包含基座101與氣囊102。 Please refer to FIG. 1 . FIG. 1 is a schematic perspective view of a film sticking device capable of removing air bubbles according to the present invention. In the embodiment, the film sticking device 100 for removing air bubbles comprises a base 101 and an air bag 102 .

基座101係用以置放一目標物,可去除氣泡之膠膜貼黏裝置100係可貼黏膠膜在目標物表面;以及, 氣囊102設置於基座101之上方,換言之,氣囊102設置於晶粒之上方,當氣囊102接觸目標物時具有一第一狀態與一第二狀態。 The pedestal 101 is used for placing a target object, and the film-adhesive device 100 capable of removing air bubbles can be attached to the surface of the target by the adhesive film; The airbag 102 is disposed above the base 101. In other words, the airbag 102 is disposed above the die, and has a first state and a second state when the airbag 102 contacts the target.

請注意,本發明之目標物係可為晶粒、玻璃 板、平板、陶瓷板所時實現,為簡化說明,以下係以晶粒為範例,但本發明不應以此為限。 Please note that the target of the present invention may be a crystal grain or a glass. The plate, the flat plate and the ceramic plate are realized at the time. For the sake of simplification of the description, the following is a exemplification of the die, but the invention should not be limited thereto.

請同時參考第2圖,第2圖為本發明可去除 氣泡之膠膜貼黏裝置之側面透視示意圖,在本實施例中,氣囊102為一中空結構,而氣囊102內部具有一彈性墊102a,其彈性墊102a設置並固定於於氣囊102內部之上緣。在另一實施例中,彈性墊102a可由具有彈性的生膠墊所實現。 Please also refer to Figure 2, Figure 2 is a removable In the present embodiment, the airbag 102 has a hollow structure, and the airbag 102 has an elastic pad 102a inside, and the elastic pad 102a is disposed and fixed on the inner edge of the airbag 102. . In another embodiment, the resilient pad 102a can be realized by a resilient rubber pad.

另外,可去除氣泡之膠膜貼黏裝置100包含: 一壓力控制器,其壓力控制器連結至氣囊102,係用以控制氣囊102之內部壓力處於一定值,如此一來可避免氣囊102在黏膠膜在晶粒表面過程中,因氣囊102擠壓膠膜之表面,而使膠膜與晶粒之間殘留氣泡,以致於膠膜之表面產生不規則變形而不平整。 In addition, the film-adhesive device 100 capable of removing bubbles comprises: A pressure controller is coupled to the airbag 102 for controlling the internal pressure of the airbag 102 to a certain value, so as to prevent the airbag 102 from being squeezed by the airbag 102 during the process of the adhesive film on the surface of the die. The surface of the film is such that bubbles remain between the film and the crystal grains, so that the surface of the film is irregularly deformed and not flat.

在一實施例中,可去除氣泡之膠膜貼黏裝置 100具有一孔洞O,壓力控制器係連結孔洞O並進行充氣或放氣,由充氣與放氣之轉換使氣囊102內部壓力維持一定值。 In an embodiment, the bubble sticking device capable of removing bubbles The 100 has a hole O, and the pressure controller connects the hole O and inflates or deflates, and the internal pressure of the air bag 102 is maintained at a constant value by the conversion of inflation and deflation.

請同時參考第3圖,第3圖為本發明之基座 與氣囊於初始狀態時之側面示意圖,在本實施例中,裝置100係尚未於操作中,此時氣囊102仍處於初始狀態。氣囊102下方為晶粒W,晶粒W置放基座101上,晶粒W上表面有一隔離元件K,隔離元件K設置於晶粒W之上表面與膠膜10之間,而隔離元件K係用以隔離晶粒W與膠膜10直接接觸,避免可去除氣泡之膠膜貼黏裝置100在未啟用時晶粒W與膠膜10沾黏。在一實施例中,隔離元件K可由離型膜或不鏽鋼片所實現。 Please also refer to Figure 3, which is the base of the present invention. In the present embodiment, the device 100 is not yet in operation, and the airbag 102 is still in an initial state. Below the airbag 102 is a die W. The die W is placed on the susceptor 101. The upper surface of the die W has an isolation member K. The spacer member K is disposed between the upper surface of the die W and the adhesive film 10, and the spacer member K It is used to isolate the die W from direct contact with the film 10, and to prevent the film-adhesive device 100 capable of removing bubbles from sticking to the film 10 when not activated. In an embodiment, the spacer element K can be realized by a release film or a stainless steel sheet.

另外,為方便說明元件其相對位置,晶粒W 與膠膜10、11、隔離元件K均不依比例繪示。 In addition, in order to facilitate the relative position of the components, the grain W The film 10, 11 and the spacer element K are not shown to scale.

在此請注意,在本實例中,其第3圖由上而 下依序為膠膜10、隔離元件K、晶粒W、膠膜11、以及基座101。晶粒W之下表面係黏貼於膠膜11上,晶粒W若需要被膠膜10黏貼時,此時隔離元件K只需挖除所需要黏貼的區域,裝置100利用氣囊102在下壓的過程中,使膠膜10黏貼所需要的晶粒W。 Please note here that in this example, the third picture is from above. The film is sequentially followed by the film 10, the spacer member K, the die W, the film 11, and the susceptor 101. The surface under the grain W is adhered to the film 11, and if the grain W needs to be adhered by the film 10, the spacer K only needs to be removed from the area to be pasted, and the device 100 uses the air bag 102 to be pressed down. In the middle, the film 10 is adhered to the desired crystal grains W.

另外,氣囊102可設置於一升降機構103上, 升降機構103下降時係可使氣囊102進入第一狀態與第二狀態。在一實施例中,升降機構103係沿方向D1並垂直於基座101進行升降。 In addition, the airbag 102 can be disposed on a lifting mechanism 103. When the lifting mechanism 103 is lowered, the airbag 102 can be brought into the first state and the second state. In one embodiment, the lifting mechanism 103 is raised and lowered in the direction D1 and perpendicular to the base 101.

請參考第4圖,第4圖為本發明之氣囊接觸 膠膜之側面示意圖。升降機構103沿方向D1下降,此時氣囊102表面開始接觸膠膜10,請注意,在本實施例中,氣囊為一半圓形氣囊所實現。由於氣囊10為半圓形表面,故升降機構103沿方向D1下降時,氣囊10係由中心點G接觸膠膜10之表面。 Please refer to Figure 4, Figure 4 is the airbag contact of the present invention. A schematic view of the side of the film. The elevating mechanism 103 is lowered in the direction D1, at which time the surface of the airbag 102 starts to contact the film 10, and it is noted that in the present embodiment, the air bag is realized by a semicircular airbag. Since the airbag 10 has a semicircular surface, when the elevating mechanism 103 descends in the direction D1, the airbag 10 contacts the surface of the adhesive film 10 from the center point G.

請同時參考第5圖,第5圖為本發明可去除 氣泡之膠膜貼黏裝置於第一狀態之示意圖。在第一狀態下,氣囊102中心點接觸膠膜10之表面,此時氣囊102接觸膠膜10,因氣囊102內部壓力為定值,故氣囊102利用內部壓力而產生表面變形進而擠壓出膠膜10與晶粒W之間的空氣,此時氣囊內102氣體沿箭號向外擠壓,並順勢將膠膜10與晶粒W之間的空氣一併擠出,以避免膠膜10與晶粒W之間有氣泡存在。 Please also refer to Figure 5, which is removable for the present invention. Schematic diagram of the bubble film sticking device in the first state. In the first state, the center point of the airbag 102 contacts the surface of the film 10, and at this time, the airbag 102 contacts the film 10. Since the internal pressure of the airbag 102 is constant, the airbag 102 generates surface deformation by using internal pressure and then extrudes the glue. The air between the membrane 10 and the crystal grain W, at this time, the gas in the airbag 102 is pressed outward along the arrow, and the air between the film 10 and the crystal grain W is extruded together to avoid the adhesive film 10 and There are bubbles between the grains W.

接著請參考第6圖,第6圖為本發明可去除 氣泡之膠膜貼黏裝置於第二狀態之示意圖。氣囊102在第一狀態轉換至第二狀態時,氣囊102與膠膜10之表面之接觸係由中心點G轉換至氣囊102之表面,換言之,此時係氣囊102由點接觸調整為與膠膜10之面接觸。 Please refer to FIG. 6 again, and FIG. 6 can be removed according to the present invention. A schematic diagram of the bubble film sticking device in the second state. When the airbag 102 is switched to the second state in the first state, the contact between the airbag 102 and the surface of the film 10 is switched from the center point G to the surface of the airbag 102, in other words, the airbag 102 is adjusted by the point contact to the film. Contact on the 10th.

在此請注意,基座101具有一加熱器(圖未 示),加熱器係可以提升基座101之溫度,故膠膜10會透過加熱器加熱而軟化以提升黏合度,當軟化後的膠膜10被氣囊102壓黏至晶粒W的過程中,其黏合度增加,意 即,膠膜10於第二狀態下時,晶粒W與膠膜10更能緊密黏結。 Please note here that the base 101 has a heater (Fig. The heater system can raise the temperature of the susceptor 101, so the film 10 is softened by heating by the heater to increase the adhesion. When the softened film 10 is pressed by the airbag 102 to the grain W, Its adhesion increases, meaning That is, when the film 10 is in the second state, the crystal grains W are more closely bonded to the film 10.

另外,當氣囊102處於第二狀態下時,彈性 墊102a透過氣囊102間接接觸膠膜10與晶粒W,彈性墊102a施加壓力於膠膜10與晶粒W上,故可加強些晶粒W與膠膜10結合度,並維持氣囊102與膠膜10之接觸面之平整。 In addition, when the airbag 102 is in the second state, the elasticity The pad 102a indirectly contacts the film 10 and the die W through the air bag 102, and the elastic pad 102a applies pressure to the film 10 and the die W, so that the degree of bonding between the die W and the film 10 can be enhanced, and the airbag 102 and the glue are maintained. The contact surface of the film 10 is flat.

綜上所述,可去除氣泡之膠膜貼黏裝置100 利用一具有固定壓力之氣囊進行膠膜壓黏至晶粒,使膠膜與晶粒之間的氣泡去除,再透過氣囊內部之彈性墊使黏貼完晶粒之膠膜上表面平整。 In summary, the bubble sticking device 100 capable of removing air bubbles The adhesive film is pressed into the crystal grain by a balloon with a fixed pressure to remove the air bubbles between the film and the crystal grain, and then the elastic pad inside the air bag is used to flatten the upper surface of the film adhered to the die.

100‧‧‧可去除氣泡之膠膜貼黏裝置 100‧‧‧Voice film sticking device capable of removing air bubbles

101‧‧‧基座 101‧‧‧Base

102‧‧‧氣囊 102‧‧‧Airbag

103‧‧‧升降機構 103‧‧‧ Lifting mechanism

O‧‧‧孔洞 O‧‧‧ Hole

Claims (8)

一種可去除氣泡之膠膜貼黏裝置,該裝置包含:一基座,用以置放一目標物;一氣囊,設置於該基座上方,該氣囊接觸該目標物時具有一第一狀態與一第二狀態;一隔離元件,設置於該目標物之上表面與一膠膜之間;該氣囊用以壓黏該膠膜,使該膠膜與該目標物貼黏;在該第一狀態下時,該氣囊接觸該膠膜,該氣囊利用內部壓力而產生變形並擠壓出該膠膜與該目標物之間的空氣,以避免該膠膜與該目標物之間有氣泡存在;以及一彈性墊,當該氣囊處於該第二狀態下時,該彈性墊施加壓力於該膠膜與該目標物上時,可加強該目標物與該膠膜結合度,並維持該氣囊與該膠膜之接觸面之平整。 A film-adhesive device capable of removing air bubbles, the device comprising: a base for placing a target; an air bag disposed above the base, the air bag having a first state when contacting the target a second state; an isolating member disposed between the upper surface of the target and a film; the air bag for pressing the film to adhere the film to the target; in the first state When the airbag is in contact with the film, the airbag is deformed by internal pressure and squeezes air between the film and the target to prevent air bubbles from being present between the film and the target; An elastic mat, when the airbag is in the second state, when the elastic pad applies pressure to the adhesive film and the target, the degree of bonding of the target to the adhesive film is enhanced, and the airbag and the adhesive are maintained. The contact surface of the film is flat. 如申請專利範圍第1項所述之裝置,其中,該裝置包含:一壓力控制器,用以控制該氣囊之內部壓力為一定值。 The device of claim 1, wherein the device comprises: a pressure controller for controlling the internal pressure of the airbag to a certain value. 如申請專利範圍第2項所述之裝置,其中,該彈性墊為一生膠墊。 The device of claim 2, wherein the elastic pad is a raw rubber pad. 如申請專利範圍第2項所述之裝置,其中,該基座具有一加熱器,該膠膜透過該加熱器加熱而軟化,使該膠膜於該第二狀態下時,提升該目標物與該膠膜結合度。 The device of claim 2, wherein the base has a heater, and the film is heated and softened by the heater to raise the target when the film is in the second state. The degree of film bonding. 如申請專利範圍第2項所述之裝置,其中,該氣囊設置於一升降機構上,該升降機構下降時係可使該氣囊進入該第一狀態與該第二狀態。 The device of claim 2, wherein the air bag is disposed on a lifting mechanism, and the lifting mechanism is lowered to enable the air bag to enter the first state and the second state. 如申請專利範圍第2項所述之裝置,其中,該氣囊為一半圓形氣囊。 The device of claim 2, wherein the air bag is a semi-circular air bag. 如申請專利範圍第6項所述之裝置,其中,在該第一狀態下,該氣囊之一中心點接觸該膠膜之表面。 The device of claim 6, wherein in the first state, a center point of the airbag contacts the surface of the film. 如申請專利範圍第6項所述之裝置,其中,在該第一狀態轉換至該第二狀態時,該氣囊與該膠膜之表面之接觸係由該中心點轉換至該氣囊之表面。 The device of claim 6, wherein the contact of the airbag with the surface of the film is converted from the center point to the surface of the airbag when the first state is switched to the second state.
TW103110596A 2014-03-21 2014-03-21 Glue film sticking device with a function of removing bubbles TWI554408B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
TW103110596A TWI554408B (en) 2014-03-21 2014-03-21 Glue film sticking device with a function of removing bubbles
CN201410548717.XA CN104934314B (en) 2014-03-21 2014-10-16 Adhesive film sticking device capable of removing air bubbles
CN201420599882.3U CN204230206U (en) 2014-03-21 2014-10-16 Adhesive film sticking device capable of removing air bubbles

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Application Number Priority Date Filing Date Title
TW103110596A TWI554408B (en) 2014-03-21 2014-03-21 Glue film sticking device with a function of removing bubbles

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TW201536551A TW201536551A (en) 2015-10-01
TWI554408B true TWI554408B (en) 2016-10-21

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TWI554408B (en) * 2014-03-21 2016-10-21 鴻積科機股份有限公司 Glue film sticking device with a function of removing bubbles
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