JP4246651B2 - Resin plate transfer molding equipment - Google Patents

Description

The present invention relates to a resin plate transfer molding apparatus that pressurizes while cooling a resin plate.

  For a resin plate molding apparatus that moves a resin plate sandwiched between press plates in the order of a heating press and a cooling press and heats / presses and cools / presses the resin plate via the press plate, Patent Document 1 and Patent Document 2 There is known a press device for manufacturing an IC card described in 1). In Patent Document 1, a workpiece having an IC card made of a resin plate or the like sandwiched between mirror plates corresponding to a press plate is moved in the order of hot press and cold press, and the resin plate is heated / pressurized and cooled / pressurized. To mold the IC card. Also in Patent Document 2, the card constituent base material is accommodated between hot press plates capable of maintaining the internal vacuum degree corresponding to the press plate, and the preheating press unit, the heating press unit and the cooling press unit arranged in series are arranged. The IC card is molded by sequentially moving and heating / pressing and cooling / pressing the resin plate. The hot press plate of Patent Document 2 is formed with a fitting protrusion and a fitting hole for fitting to the fitting protrusion in order to position the hot pressing plate in the horizontal direction.

  However, in the resin plate molding apparatus in which the resin plate sandwiched between the press plates as described above is moved in the order of the heating press and the cooling press, and the resin plate is heated / pressurized and cooled / pressurized via the press plate, When the resin plate held between the press plates is moved from one to the cooling press, the applied pressure is released, and the positions of the press plate and the resin plate may shift. In Patent Document 2, therefore, positioning is performed by the fitting protrusion and the fitting hole of the hot press plate. However, in Patent Document 2, since the hot plate is strongly pressed by the movable hot press machine during the hot press, even if the vacuum pressure is high enough to hold the heat plate by suction, the movable heat after the hot press process is completed. When the press plate is raised, the movable hot press plate and the heat plate may stick to each other, and a slight displacement may occur between the press plate and the resin plate. Such a slight misalignment between the press plate and the resin plate leads to a molding failure, and particularly in a case where fine unevenness is transferred by the press plate, a transfer misalignment occurs due to the misalignment. In some cases, the molding was poor. Moreover, in patent document 1 and patent document 2, since the heating press and the cooling press are separately arrange | positioned, there exists a problem that it cannot pressurize, reducing the temperature of a resin board with a desired curve at the time of press. there were.

JP 2001-239536 A (Claim 1, 0026, FIG. 1, FIG. 8) JP 2002-301600 A (Claim 3, 0029, FIG. 1, FIG. 2, FIG. 3, FIG. 10)

In view of the above problems, the present invention solves the problem that the resin plate is displaced with respect to the press plate when the press plate and the resin plate are conveyed from the heating press to the cooling press. An object of the present invention is to provide a resin plate transfer molding apparatus that prevents the positional deviation of the resin plate. It is another object of the present invention to provide a resin plate transfer molding apparatus that prevents the resin plate from being deformed by being strongly pressed during pressurization by a heating press. It is another object of the present invention to provide a resin plate transfer molding apparatus capable of performing pressurization while lowering the temperature of the resin plate with a desired curve during pressurization by a press device. It is another object of the present invention to realize a resin plate transfer molding apparatus with a relatively simple mechanism.

According to a first aspect of the present invention, there is provided a resin plate transfer molding apparatus comprising: a heat storage plate that is in contact with both front and back surfaces of a resin plate; a transfer surface that is provided on at least one of the heat storage plates and transfers fine irregularities; A heat storage plate pressing mechanism that presses and holds the resin plate against the resin plate, and the heating plate is brought into contact with the heat storage plate by a force equal to or less than the pressing force against the resin plate by the heat storage plate pressing mechanism, or infrared, heated gas, energized A heating mechanism that heats the heat storage plate above the glass transition temperature of the resin plate by heating by any of the above, a transport mechanism that transports the heat storage plate and the resin plate pressed and held by the heat storage plate pressing mechanism toward the next process, and transport It not 2MPa the resin plate while a heat storage plate that is heated above the glass transition temperature of the pressed and held the resin plate was cooled to below the glass transition temperature of the resin plate to the resin sheet by being transported heat storage plate pressing mechanism by mechanism 10 A press mechanism for pressing the Pa is characterized in that it is disposed within the vacuum chamber.

The resin plate transfer molding apparatus according to claim 2 of the present invention is characterized in that, in claim 1, the heat storage plate pressing mechanism is a clamp mechanism including a cylinder disposed on the heat storage plate.

According to a third aspect of the present invention, there is provided the resin plate transfer molding apparatus according to the first or second aspect, wherein the heat storage plate is iron having a body thickness of 3 mm to 20 mm, or heat more than the thermal conductivity of iron. It is made of a metal plate having high conductivity, and a nickel stamper is provided.

The present invention includes a heat storage plate that is in contact with both the front and back surfaces of a resin plate, a transfer surface that is provided on at least one of the heat storage plates and that transfers fine irregularities, and a heat storage plate press that holds the heat storage plate against the resin plate. The glass transition temperature of the resin plate by contacting the heating plate against the heat storage plate with a force equal to or less than the pressing force on the resin plate by the mechanism and the heat storage plate pressing mechanism, or by heating by infrared, heated gas, or energization The heating mechanism for heating the heat storage plate, the transport mechanism for transporting the heat storage plate and the resin plate pressed and held by the heat storage plate pressing mechanism to the next process, and the resin plate transported by the transport mechanism to the resin plate by the heat storage plate pressing mechanism 2MPa to pressurize the press mechanism and the vacuum chamber to 10MPa resin plate while a heat storage plate that is heated above the glass transition temperature of the pressed and held the resin plate was cooled to below the glass transition temperature of the resin plate for Is disposed in, it carries the press mechanism heat storage plate and a resin plate after heating while pressing and holding the accompanying molding failure to the occurrence of positional deviation between the heated heat storage plate and a resin plate Can be prevented.

  Embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a side view of the resin plate molding apparatus of the present invention. FIG. 2 is an enlarged view of a main part of the heat storage plate and its pressing mechanism in the resin plate molding apparatus of the present invention.

  The resin plate molding apparatus 11 integrates the resin plate A and the upper and lower heat storage plates 17a and 17b that are in contact with the front and back surfaces thereof and sends them to the heating mechanism 13 by the transport mechanism 15 to heat the upper and lower heat storage plates 17a and 17b. Then, the upper and lower heat storage plates 17a and 17b and the resin plate A are transferred to the press mechanism 14 by the transfer mechanism 15, and the resin plate A is pressurized while being cooled through the upper and lower heat storage plates 17a and 17b. As shown in FIG. 1, the resin plate molding apparatus 11 is disposed in a vacuum chamber 41, and includes a loading / unloading mechanism 12, a heating mechanism 13, a press mechanism 14, and upper and lower heat storage plates 17a, 17b and the resin plate A (or the upper and lower heat storage plates 17a and 17b and the resin plate (molded product)) are arranged so as to circulate, the upper and lower heat storage plates 17a and 17b conveyed by the transfer mechanism 15, and It comprises a heat storage plate pressing mechanism 16 that presses the upper and lower heat storage plates 17a and 17b during conveyance.

  Explaining each mechanism, the loading / unloading mechanism 12 unloads and unloads a resin plate (molded product) transferred by a transfer device (not shown) from between the upper and lower heat storage plates 17a and 17b. This is for loading the molded resin plate A between the upper and lower heat storage plates 17a and 17b. The loading / unloading mechanism 12 includes a loading / unloading stage 18 on which a lower heat storage plate 17 a is positioned and placed on a base 19, and above the loading / unloading stage 18. An upper heat storage plate holding mechanism 20 capable of gripping only the upper heat storage plate 17b and an upper heat storage plate elevating mechanism 21 for moving the upper heat storage plate 17b up and down are provided. A transfer robot 22 used for loading / unloading the resin plate A is disposed on one side of the loading / unloading stage 18 so as to be movable in the horizontal direction and the up-and-down direction. Further, on the side of the transfer robot 22, a mounting table 23 on which an unmolded resin plate A and a resin plate (molded product) on which transfer molding has been completed are stacked and placed.

  The heating mechanism 13 is for heating the upper and lower heat storage plates 17 a and 17 b held integrally with the resin plate A, and is disposed in the next step of the loading / unloading mechanism 12. In the heating mechanism 13, a lower heating plate 24 for heating the lower heat storage plate 17a is disposed on the base 19, and an upper heating plate 25 for heating the upper heat storage plate 17b is disposed opposite to the lower heating plate 24. It is installed. The lower heating plate 24 and the upper heating plate 25 are made of members having a larger heat capacity than the upper and lower heat storage plates 17a and 17b, respectively, and a flow path through which a heating medium is circulated is disposed. Further, the contact surfaces 24a and 25a that are in contact with the upper and lower heat storage plates 17a and 17b in the lower heating plate 24 and the upper heating plate 25 are flat surfaces in order to improve heat transfer. The upper heating plate 25 is fixed with a rod 26 a of an elevating cylinder 26 which is a moving mechanism, and the upper heating plate 25 can be raised and lowered with respect to the lower heating plate 24. In the present embodiment, the elevating cylinder 26 of the upper heating plate 25 may be any as long as the heating plates 24, 25 have a pressing force that can transfer heat to the upper and lower heat storage plates 17a, 17b. The plates 17a and 17b do not have a pressing force for performing transfer molding on the resin plate A. Further, the heating mechanism is not limited to the above-described mechanism, and may be one that can heat and store the upper and lower heat storage plates by infrared rays, heated gas, energization, or the like.

  The press mechanism 14 is for pressurizing and cooling the resin plate A via the upper and lower heat storage plates 17a and 17b heated and stored by the heating mechanism 13 and performing transfer molding on the resin plate A. The heating mechanism 13 in the next process. In the press mechanism 14, a lower cooling plate 27 for cooling the lower heat storage plate 17a is disposed on the base 19, and an upper cooling plate 28 for cooling the upper heat storage plate 17b is disposed opposite to the lower cooling plate 27. Has been. The lower cooling plate 27 and the upper cooling plate 28 are each made of a member having a larger heat capacity than the upper and lower heat storage plates 17a and 17b, and a flow path through which a cooling medium flows is disposed. Further, the contact surfaces 27a and 28a that are in contact with the upper and lower heat storage plates 17a and 17b of the lower cooling plate 27 and the upper cooling plate 28 are flat surfaces in order to improve heat transfer. The upper cooling plate 28 is fixed to a movable plate 29, and the movable plate 29 is fixed to a ram 30a of a pressure cylinder 30 as a pressure mechanism. Therefore, in the press mechanism 14, the movable plate 29 and the upper cooling plate 28 are provided so as to be movable up and down by the pressure cylinder 30, and the resin plate A is pressurized through the upper and lower heat storage plates 17a and 17b.

  Also, a transport mechanism 15 that transports the upper and lower heat storage plates 17a and 17b pressed and held integrally with the resin plate A to the next process between the loading / unloading mechanism 12, the heating mechanism 13, and the press mechanism 14. Is arranged. In the present embodiment, a roller conveyor is used as the transport mechanism 15, but a chain conveyor may be used, and a slat plate of the slat conveyor may be a heat storage plate. Further, the upper and lower heat storage plates and the like may be transferred by a chuck device used for a transfer press or a multi-axis transfer robot. Further, the upper and lower heat storage plates or the like may be placed on the rotary table and conveyed by rotating the rotary table, or the lower heat storage plate itself may be self-propelled.

  Next, the upper and lower heat storage plates 17a and 17b will be described. The upper and lower heat storage plates 17a and 17b are composed of a lower heat storage plate 17a on which the resin plate A is placed and an upper heat storage plate 17b on the resin plate A. At least one of the pressurizing surface in contact with the resin plate A in the lower heat storage plate 17a and the pressurizing surface in contact with the resin plate A of the upper heat storage plate 17b is a transfer surface 31a, 31b for transferring fine irregularities. It has become. In this embodiment, the transfer plates constituting the transfer surfaces 31a and 31b are made of nickel stampers 32a and 32b, and the main body portions 33a and 33b of the upper and lower heat storage plates 17a and 17b to which the stampers 32a and 32b are attached are made of iron. Made of brass, a metal with high thermal conductivity. And the contact surfaces 34a and 34b which are the back surfaces of the main body portions 33a and 33b of the lower heat storage plate 17a and the upper heat storage plate 17b are the contact surfaces 24a and 25a of the heating plates 24 and 25 of the heating mechanism 13 and the press mechanism 14, respectively. The cooling plates 27 and 28 are flat so as to come into surface contact with the contact surfaces 27a and 28a of the cooling plates 27 and 28, respectively. Moreover, in this embodiment, the plate | board thickness of the main-body parts 33a and 33b of the upper and lower heat storage plates 17a and 17b is 5 mm, respectively. The plate thickness of the main body portions 33a and 33b of the upper and lower heat storage plates 17a and 17b is preferably 3 mm to 20 mm from the relationship between strength and heat capacity. Moreover, as a material of the upper and lower heat storage plates 17a and 17b, iron or a metal having a higher thermal conductivity than that of iron is desirable. Alternatively, the upper and lower heat storage plates 17a and 17b may be iron plates and a copper plate or the like may be attached to the contact surfaces 34a and 34b. Further, in order to prevent the upper cooling plate 28 and the upper heat storage plate 17b from sticking when the upper cooling plate 28 is raised, at least one of the contact surfaces 28a, 34b may be satin-finished. Further, the pressurizing surfaces of the main body portions 33a and 33b may be flat surfaces, or portions where the resin plate A is placed may be concave portions.

  A heat storage plate pressing mechanism 16 is disposed on both sides of the main body portion 33a of the lower heat storage plate 17a. The heat storage plate pressing mechanism 16 is for pressing and holding the upper and lower heat storage plates 17 a and 17 b against the resin plate A. Explaining each part of the heat storage plate pressing mechanism 16, L-shaped members 35 made of steel having a predetermined length and having a substantially L-shaped cross section are fixed to both side portions of the main body portion 33a of the lower heat storage plate 17a. Of the L-shaped member 35, a rotating shaft 36 is pivotally supported in a horizontal direction on a short side portion 35a provided continuously to the main body portion 33a, and the rotating shaft 36 is substantially U-shaped. One end side 37a of the clamp member 37 formed in a shape is fixed. The clamp members 37 are attached such that the side that opens in a substantially U-shape is directed inward. And the inner side part opened on the other end side 37b of the said clamp member 37 in the substantially U shape becomes the press surface 37c. Further, the long side portion 35b of the L-shaped member 35 that is separated from the main body portion 33a is one step lower than the main body portion 33a, and another rotating shaft 38 is provided near the end of the long side portion 35b. A pivot is supported in the horizontal direction, and one end of an air cylinder 39 is fixed to the pivot shaft 38. The air cylinder 39 is connected to a pressure source (not shown), and is operated at least during clamping. However, a force may be applied to the clamp member 37 by the air cylinder 39 even after clamping. The end of the rod 39a of the air cylinder 39 is rotatably attached to a shaft 37d fixed to the other end side 37b of the clamp member 37. Further, the upper surface of both end portions of the upper heat storage plate 17b is formed with an inclined surface that becomes thinner toward both ends, and the inclined surface is in contact with the pressed surface 40 against which the pressing surface 37c of the clamp member 37 abuts. It has become. Therefore, with the above configuration, when the rod 39a of the air cylinder 39 is operated in the extending direction, the pressing surface 37c of the clamp member 37 disposed on the lower heat storage plate 17a presses the pressed surface 40 of the upper heat storage plate 17b. The resin plate A is pressed and held by the lower heat storage plate 17a and the upper heat storage plate 17b. When the rod 39a of the air cylinder 39 is operated in a contracting direction, the pressing and holding of the resin plate A by the lower heat storage plate 17a and the upper heat storage plate 17b is released. In this embodiment, the lower heat storage plate 17a is provided with four clamp members 37 and four air cylinders 39 for operating the clamp members 37. Therefore, the heat storage plate pressing mechanism 16 presses the upper and lower heat storage plates 17a and 17b in the direction orthogonal to the surface of the resin plate A, thereby preventing the resin plate A from being displaced in the horizontal direction.

  The heat storage plate pressing mechanism disposed on the lower heat storage plate or the upper heat storage plate is not limited to the one provided with the clamp mechanism as described above. For example, a clamp mechanism other than the above may be used, and the clamp member may be moved by a spring, a magnet, or an electric motor to press the upper and lower heat storage plates. Moreover, you may press one heat storage board toward the other heat storage board with a spring, without using a clamp mechanism. Furthermore, a heat storage plate pressing mechanism including a ball screw and a ball screw nut that are rotated by an electric motor may be disposed on the upper and lower heat storage plates.

  Further, the heat storage plate pressing mechanism is not provided on the upper and lower heat storage plate sides but may be provided on the transport mechanism side. For example, pressing conveyors made of rubber plates or cloth are arranged above and below the transport path of the upper and lower heat storage plates, and the upper and lower heat storage plates are pressed while conveying the upper and lower heat storage plates between them, or at least one of the upper and lower heat storage plates is a guide It may be guided by a bar, and one heat storage plate may be pressed toward the other heat storage plate by changing the height of the guide bar as the conveyor moves. Needless to say, the structure of the transport mechanism, loading / unloading mechanism and the like is changed according to the structure of the heat storage plate pressing mechanism.

  Next, transfer molding of the resin plate A by the resin plate molding apparatus 11 of the present invention will be described. What is used in the present embodiment is an acrylic plate that is suitably used for forming a large light guide plate, and the acrylic plate is obtained by cutting an extrusion formed by an extruder. The resin used in the present invention is not limited to acrylic, and thermoplastic resins such as polycarbonate and cycloolefin polymer are generally used. Moreover, about the resin board A, the board thickness may differ. The molded product to be molded may be an IC card or a circuit board that performs lamination molding, in addition to those that perform transfer molding such as a light diffusing plate, a lens, a disk, and a fuel cell separator. In the present embodiment, transfer molding of the resin plate A is performed in a vacuum state in the vacuum chamber 41, but is not limited to molding in a vacuum state.

  When the resin plate (molded product) sandwiched between the upper and lower heat storage plates 17a and 17b from the press mechanism 14 is transported to the loading / unloading mechanism 12 by a transport device (not shown), the air of the heat storage plate pressing mechanism 16 The cylinder 39 is operated to release the pressing and holding of the upper and lower heat storage plates 17a and 17b against the resin plate (molded product). Next, the upper heat storage plate holding mechanism 20 and the upper heat storage plate elevating mechanism 21 are sequentially operated to hold and raise the upper heat storage plate 17b. The resin plate (molded product) transferred and molded by the transfer robot 22 is taken out from the lower heat storage plate 17a. The upper and lower heat storage plates 17a and 17b and the resin plate (molded product) conveyed from the press mechanism 14 to the loading / unloading mechanism 12 are cooled, and the upper and lower heat storage plates 17a and 17b and the resin plate (molded product) are relatively cooled. However, when the resin plate (molded product) is released from the upper and lower heat storage plates 17a and 17b, air is supplied or at least one of the upper and lower heat storage plates 17a and 17b or the resin plate (molding). Product) may be bent. Next, when the resin plate (molded product) is taken out, the unshaped resin plate A is positioned and placed on the lower heat storage plate 17 a by the transfer robot 22. When only the transfer robot 22 moves backward, the upper heat storage plate elevating mechanism 21 and the upper heat storage plate holding mechanism 20 are activated again, and the upper heat storage plate 17b is placed on the lower heat storage plate 17a. Next, the air cylinder 39 of the heat storage plate pressing mechanism 16 disposed on the lower heat storage plate 17a is actuated again, and the pressing surface 37c of the clamp member 37 disposed on the lower heat storage plate 17a becomes the pressed surface of the upper heat storage plate 17b. The resin plate A is pressed and held between the lower heat storage plate 17a and the upper heat storage plate 17b.

  Next, the upper and lower heat storage plates 17 a and 17 b and the resin plate A sandwiched between them are transported by the transport mechanism 15 to the heating mechanism 13 in the next step. When the concave portion on the back surface of the lower heat storage plate 17a is fitted onto and placed on the lower heating plate 24 of the heating mechanism 13, the lifting cylinder 26, which is the moving mechanism of the upper heating plate 25, is activated, and the upper heat storage is performed. The contact surface 25a of the upper heating plate 25 is brought into contact with the contact surface 34b of the plate 17b. At this time, the temperature of the heating plates 24 and 25 is at least equal to or higher than the glass transition temperature of the resin plate A, and more desirably, is maintained at a temperature higher by about 40 ° C. to 130 ° C. than the glass transition temperature. The pressing force exerted on the resin plate A by the heating mechanism 13 via the upper and lower heat storage plates 17a and 17b is exerted on the resin plate A by the clamp member 37 of the heat storage plate pressing mechanism 16 via the upper and lower heat storage plates 17a and 17b. It is desirable that the pressure is not more than the pressing force. This is because when the heating mechanism 13 applies excessive pressure more than necessary during heating and heat storage to the upper and lower heat storage plates 17a, 17b, excessive transfer is performed on the surface of the resin plate A by the stampers 32a, 32b, or the resin plate A This is to prevent the side surface of the tube from bulging and causing a change in the shape of the side surface. Further, if the pressing force is weakened after a strong pressing by the heating mechanism 13 and a strong pressing is performed again by the pressing mechanism 14, there is a possibility that a transfer shift with respect to the resin plate A may occur. Therefore, in this embodiment, the pressing force to the resin plate A by the heating mechanism 13 is 0.4 MPa or less. In particular, the pressing force on the resin plate A by the clamp member 37 is made stronger than the pressing force on the resin plate A by the heating mechanism 13, so that the contact surface 25a of the upper heating plate 25 and the upper heat storage plate when the upper heating plate 25 is raised. The sticking of 17b can be reliably prevented, and the effect of preventing the transfer deviation is great. Further, since the heating mechanism 13 does not require a large-scale device or a pressure cylinder as in the conventional heating press, manufacturing cost and running cost can be saved.

  When the heating mechanism 13 heats the upper and lower heat storage plates 17a and 17b and the resin plate A sandwiched between them, the resin plate A and the upper and lower heat storage plates 17a and 17b in contact with both front and back surfaces are integrated. The material is transported toward the press mechanism 14 in the next process by the transport mechanism 15, and the recess on the back surface of the lower heat storage plate 17 a is fitted onto the lower cooling plate 27 and positioned. Then, the pressurizing cylinder 30 of the press mechanism 14 is operated, the movable plate 29 and the upper cooling plate 28 are lowered, the contact surface 28a of the upper cooling plate 28 is brought into contact with the contact surface 34b of the upper heat storage plate 17b, and The resin plate A is pressurized through the heat storage plates 17a and 17b. In the initial pressurization of the resin plate A by the press mechanism 14, the upper and lower heat storage plates 17a and 17b are kept heated to the glass transition temperature or higher by the heating mechanism 13, and therefore the stampers 32a of the upper and lower heat storage plates 17a and 17b. 32b, transfer molding is performed on the resin plate A. The temperatures of the upper and lower heat storage plates 17a and 17b are cooled by the cooling plates 27 and 28 during pressurization in the press mechanism 14 and gradually lowered, so that they fall below the glass transition temperature in the latter half of pressurization. In the present invention, the pressure applied to the resin plate A when pressure is applied by the press mechanism 14 is required to be higher as the unevenness is transferred deeper, but generally 2 MPa to 10 MPa is desirable. The pressure time is preferably 5 to 40 seconds. The pressure applied to the resin plate A may be changed during pressurization. In the present invention, the press mechanism 14 is pressurized by controlling the temperature of the upper and lower heat storage plates 17a and 17b or changing the heat capacity by exchanging the upper and lower heat storage plates 17a and 17b and controlling the temperature of the cooling plates 27 and 28. Sometimes a desired temperature drop curve can be set.

  In the press mechanism 14, when the pressurizing time has elapsed, the pressurizing cylinder 30 is actuated again, and the movable platen 29 and the upper cooling plate 28 are raised. In the present embodiment, the press mechanism 14 requires the most pressurizing time, so that the other processing steps are set to the same processing time in accordance with this step. The resin plate (molded product) and the upper and lower heat storage plates 17a and 17b that are pressurized while being cooled by the press mechanism 14 pass through a transport mechanism (not shown) disposed behind the base 19 and are loaded and loaded. It is conveyed to the lowering mechanism 12. Then, the heat storage plate pressing mechanism 16 is released again, and the resin plate (molded product) is taken out. The release of the heat storage plate pressing mechanism 16 may be performed after the pressurization is started by the pressing mechanism 14, but in consideration of problems such as vibration at the time of conveyance and a certain period of molding cycle time, It is preferable to carry out at the position of the unloading mechanism 12.

  The present invention is not enumerated one by one, but is not limited to the above-described embodiment, and it goes without saying that the present invention can be applied to those modified by a person skilled in the art based on the gist of the present invention. For example, the resin plate molding apparatus may be one in which the upper and lower heat storage plates are heated by a heating mechanism before the upper and lower heat storage plates are brought into contact with the resin plate A. Therefore, in the said form, the loading mechanism is arrange | positioned after a heating mechanism. In the above embodiment, it is preferable that the upper and lower heat storage plates are brought into contact with the resin plate A at the same timing as possible. Further, at least one of the upper and lower heat storage plates and the resin plate A may be preheated by the preheating unit and brought into contact with the loading mechanism and then heated by the heating mechanism. In addition, regarding the heating mechanism and press mechanism of the resin plate molding apparatus, the upper heating plate and the lower heating plate, or the upper cooling plate and the lower cooling plate may be brought into contact with the contact surfaces of the upper and lower heat storage plates substantially simultaneously. Good. Furthermore, the upper and lower heat storage plates themselves may have at least one ability of heating or cooling. Furthermore, the resin plate molding apparatus may batch-process a plurality of resin plates A at the same time, or may press the resin plate A in the vertical direction.

It is a side view of the resin plate molding apparatus of this invention. It is a principal part enlarged view of the thermal storage board and its press mechanism in the resin plate shaping | molding apparatus of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Resin plate forming apparatus 12 Loading / unloading mechanism 13 Heating mechanism 14 Press mechanism 15 Conveyance mechanism 16 Heat storage plate press mechanism 17a Lower heat storage plate 17b Upper heat storage plate 18 Loading / unloading stage 19 Base 20 Upper heat storage plate narrower Holding mechanism 21 Upper heat storage plate elevating mechanism 22 Transfer robot 23 Mounting table 24 Lower heating plate 24a, 25a, 27a, 28a, 34a, 34b Abutting surface 25 Upper heating plate 26 Elevating cylinder 26a, 39a Rod 27 Lower cooling plate 28 Upper cooling plate 29 Movable plate 30 Pressure cylinder 30a Ram 31a, 31b Transfer surface
32a, 32b Stamper 33a, 33b Body portion 35 L-shaped member 35a Short side portion 35b Long side portion 36, 38 Rotating shaft 37 Clamp member 37a One end side 37b The other end side 37c Pressing surface 37d Shaft 39 Air cylinder 40 Pressed surface 41 Vacuum chamber A Resin plate

Claims (3)

In the resin plate transfer molding device that pressurizes the resin plate,
A heat storage plate in contact with both the front and back surfaces of the resin plate;
A transfer surface provided on at least one of the heat storage plates and transferring fine irregularities;
A heat storage plate pressing mechanism for pressing and holding the heat storage plate against the resin plate;
The heating plate is brought into contact with the heat storage plate by a force equal to or less than the pressing force against the resin plate by the heat storage plate pressing mechanism, or heated by any one of infrared rays, heating gas, and energization, so that the glass transition temperature is exceeded. A heating mechanism for heating the heat storage plate;
A transport mechanism that transports the heat storage plate and the resin plate pressed and held by the heat storage plate pressing mechanism toward the next process;
The resin plate while being cooled below the glass transition temperature of the resin plate by cooling the heat storage plate conveyed by the transport mechanism and pressed against the resin plate by the heat storage plate pressing mechanism and heated above the glass transition temperature of the resin plate resin plate transfer molding apparatus to no 2MPa and a pressing mechanism for pressing the 10MPa, characterized in that it is disposed in a vacuum chamber. The resin plate transfer molding apparatus according to claim 1, wherein the heat storage plate pressing mechanism is a clamp mechanism including a cylinder disposed on the heat storage plate. The heat storage plate is made of iron having a body thickness of 3 mm to 20 mm, or a metal plate having a higher thermal conductivity than iron, and a nickel stamper is provided. The resin plate transfer molding apparatus described in 1.

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