CN100368184C - Resin plate forming device - Google Patents

Resin plate forming device Download PDF

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Publication number
CN100368184C
CN100368184C CNB2004100963212A CN200410096321A CN100368184C CN 100368184 C CN100368184 C CN 100368184C CN B2004100963212 A CNB2004100963212 A CN B2004100963212A CN 200410096321 A CN200410096321 A CN 200410096321A CN 100368184 C CN100368184 C CN 100368184C
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CN
China
Prior art keywords
plate
heat accumulation
resin
accumulation plate
aforementioned
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Expired - Fee Related
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CNB2004100963212A
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Chinese (zh)
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CN1657265A (en
Inventor
浅井郁夫
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Meiki Seisakusho KK
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Meiki Seisakusho KK
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Publication of CN1657265A publication Critical patent/CN1657265A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/14—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles in several steps
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/04—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles using movable moulds
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/52—Heating or cooling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00—Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/32—Component parts, details or accessories; Auxiliary operations
    • B29C43/36—Moulds for making articles of definite length, i.e. discrete articles
    • B29C2043/3602—Moulds for making articles of definite length, i.e. discrete articles with means for positioning, fastening or clamping the material to be formed or preforms inside the mould

Abstract

The invention aims to solve the problem that in a pressing device which moves a pressing plate and a resin plate according to a heating pressing and cooling pressing sequence and presses the resin plate through the pressing plate, the pressing force is opened when the pressing plate and the resin plate are conveyed from the heating pressing to the cooling pressing, so that the positions of the pressing plate and the resin plate are displaced, and the forming is poor. In terms of solution, the present invention is provided with: upper and lower heat storage plates (17a, 17b) contacting both the inner and outer surfaces of the resin plate (A); a heating mechanism (13) for heating the upper and lower heat storage plates (17a, 17 b); a heat storage plate press-fixing mechanism (16) for press-fixing and holding the upper and lower heat storage plates (17a, 17b) to the resin plate (A); a conveying mechanism (15) for conveying the upper and lower heat storage plates (17a, 17b) and the resin plate (A) to the next step; and a press mechanism (14) for pressing the upper and lower heat storage plates (17a, 17b) and the resin plate (A) while cooling them, which are conveyed by the conveying mechanism (15).

Description

Resin board forming device
Technical field
The invention relates to a kind of resin board forming device of lasting cooling pressurization resin plate.
Background technology
About according to adding hot pressing, cooling punching press order, move the resin plate that is held between the pressing plate, to see through the resin board forming device of pressing plate heating, pressurization and cooling, pressurization resin plate, then the IC-card manufacturing of being put down in writing with patent documentation 1, patent documentation 2 is widely known by the people with decompressor most.Patent documentation 1 is displaced between the mirror board that is equivalent to pressing plate according to hot pressing, the order of colding pressing with machining object clamping the IC-card that resin plate etc. constituted, and reshapes out IC-card after allowing resin plate through heating, pressurization and cooling, pressurization.In addition, patent documentation 2 be will card the formation mother metal be accommodated in and can keep the hot pressing that is equivalent to the pressing plate internal vacuum with between the metallic plate (plate), preheating splenium, heating splenium and cooling pressing part according to array configuration moved in proper order again, and IC-card then is shaped after allowing resin plate through heating, pressurization and cooling, pressurization.The hot pressing metallic plate of this patent documentation 2 is to use the metallic plate horizontal direction for hot pressing and locate thereby form mosaic process, reach the embedded hole of chimeric this mosaic process.
But according to adding hot pressing, cooling punching press order, move the resin plate that is held between the aforementioned platens, see through the resin board forming device aspect that pressing plate heats resin plate, pressurize and cools off, pressurizes again, adding hot pressing toward between the pressing plate of cooling punching press, open sometimes plus-pressure during the resin plate of mobile clamping, and cause pressing plate and resin plate off normal.For this reason, patent documentation 2 is just located with row with the mosaic process and the embedded hole of metallic plate through hot pressing.But patent documentation 2 is when adding hot pressing, can strengthen the pressurized heat metallic plate because of movable hot pressing dish, even the vacuum between for example adsorbable support thermometal plate is pressed, also can be when adding the rising of the back movably hot pressing dish of hot pressing engineering end, and paste aforementioned movable hot pressing dish and thermometal plate, just a little off normal can take place thus between the pressing plate resin plate.Off normal slightly between this pressing plate and the resin plate can be bad closely bound up with shaping, especially carries out trickle concavo-convex duplicating by pressing plate, will cause the duplicating displacement because of off normal, and it is bad that significant shaping takes place.In addition, aspect patent documentation 1, patent documentation 2, add hot pressing and cooling punching press because of setting individually, so can run into during punching press and can't reduce the problem of resin plate temperature gradually with the curve (curve) of expecting to pressurize.
Patent documentation 1: TOHKEMY 2001-239536 communique (claim 1,0026, Fig. 1, Fig. 8)
Patent documentation 2: the spy opens 2002-301600 communique (claim 3,0029, Fig. 1, Fig. 2, Fig. 3, Figure 10)
Summary of the invention
The present invention is because the problems referred to above, and its purpose is to provide a kind of solution from adding hot pressing pressing plate and resin plate to be transported to when cooling off punching press, the resin plate pressing plate cause off normal problem, prevent resin board forming device to pressing plate generation resin plate off normal; And when seeing through heating and compressing into the row pressurization, also by powerful pressurization resin plate, in case the resin board forming device of resin plate distortion; And when pressurizeing by decompressor, available expecting curve reduces the resin board forming device of resin plate temperature to pressurize gradually; And with simpler mechanism realization resin board forming device.
Technological means of the present invention comprises:
The first, resin board forming device is characterized in that: be provided with: the heat accumulation plate on the inside and outside two sides of contact pressure resin plate as described in the present invention; Heat the heating arrangements of aforementioned heat accumulation plate; Aforementioned heat accumulation plate is pressed solidly the heat accumulation plate that remains in resin plate press solidly mechanism; To press solidly the heat accumulation plate of maintenance that mechanism presses solidly and the carrying mechanism that resin plate is transported to next engineering by heat accumulation plate; Heat accumulation plate and the resin plate that to carry by aforementioned carrying mechanism, the punching mechanism of pressurization while cooling off.
The second, according to above-mentioned resin board forming device, its feature is that also it is the clamp mechanism that is equipped on aforementioned heat accumulation plate that aforementioned heat accumulation plate presses solidly mechanism.
According to the above-mentioned first or second described resin board forming device, its feature also is, aforementioned heat accumulation plate is made of the metallic plate that the iron of main part thickness of slab 3mm to 20mm and thermal conductivity are higher than the iron thermal conductivity.
According to above-mentioned each described resin board forming device, its feature also is, allows the adjusting temperature of heating plate of aforementioned heating arrangements at the aforementioned heat accumulation plate of the contact back side, is higher than the glass transition temperature of resin plate; Allow the adjusting temperature of coldplate of aforementioned punching mechanism at the contact aforementioned heat accumulation plate back side, be lower than the glass transition temperature of resin plate.
Effect of the present invention: the present invention is provided with: the heat accumulation plate on the inside and outside two sides of contact pressure resin plate; The heating arrangements of heating heat accumulation plate; Heat accumulation plate is pressed solidly the heat accumulation plate that remains in resin plate press solidly mechanism; To press solidly the heat accumulation plate of maintenance that mechanism presses solidly and the carrying mechanism that resin plate is transported to next engineering by heat accumulation plate; Heat accumulation plate and the resin plate that to carry by carrying mechanism, the punching mechanism of pressurization while cooling off.And pressing solidly under the hold mode, heat accumulation plate and resin plate after the heating are transported to punching mechanism, therefore can prevent to heat and between heat accumulation plate and the resin plate off normal take place and cause being shaped bad.
Description of drawings
Fig. 1: the side view of resin board forming device.
Fig. 2: the heat accumulation plate on the resin board forming device, press solidly mechanism's significant points enlarged drawing with this.
The specific embodiment
Below based on shown in the drawing, describe the invention process form in detail.Fig. 1 is a resin board forming device side view of the present invention.Fig. 2 presses solidly mechanism's significant points enlarged drawing for the heat accumulation plate on the resin board forming device of the present invention and this.
Disclose resin board forming device 11 among the figure and be to allow and be contacted with after resin plate A is one with the 17a of heat accumulation plate up and down, 17b that should inside and outside two sides, see through carrying mechanism 15 and deliver to heating arrangements 13, after the heating with heat accumulation plate 17a, 17b about carrying out, see through again carrying mechanism 15 up and down heat accumulation plate 17a, 17b be transported to punching mechanism 14 with resin plate A, continue the cooling resin plate A that pressurizes by heat accumulation plate 17a, 17b up and down again.Resin board forming device 11 as shown in Figure 1 be by, be equipped on the loading in the vacuum chamber 41. charging crane 12, heating arrangements 13, punching mechanism 14, allow aforementioned each inter-agency circulation up and down heat accumulation plate 17a, 17b and resin plate A (with heat accumulation plate 17a, 17b and resin plate (formed products) up and down) carrying mechanism 15 that mode set and in carrying, pressing solidly see through the 17a of heat accumulation plate up and down, 17b that aforementioned carrying mechanism 15 carries reach about the heat accumulation plate of heat accumulation plate 17a, 17b press solidly mechanism 16 etc. and constitute.
Explanation about each mechanism, loading. charging crane 12 is to be carried by the Handling device that is not shown on the drawing, again from up and down between heat accumulation plate 17a, the 17b loading and unloading finished duplicate the resin plate (formed products) that is shaped after, with unfashioned resin plate A, be loaded into up and down between heat accumulation plate 17a, the 17b.To load. charging crane 12 is at the loading that sets heat accumulation plate 17a under the loading of location on the pedestal 19. loading and unloading objective table (stage) 18; Aforementioned loading. loading and unloading have then set the last heat accumulation plate clamping device 20 that only can support heat accumulation plate 17b, the last heat accumulation plate elevating mechanism 21 that reaches heat accumulation plate 17b in the lifting with the top of objective table 18.In addition, aforementioned loading. loading and unloading then will be used for loading with an end of objective table 18. and the shifting mechanical arm arm 22 of loading and unloading resin plate A is adapted to and can moves towards horizontal direction and lifting direction.In addition, the side of aforementioned shifting mechanical arm arm 22 has then set, and overlapping loading unshaped resin plate A, finishes the loading stage 23 that duplicates shaping resin plate (formed products) etc.
Heating arrangements 13 is the 17a of heat accumulation plate up and down, the 17b that one supports in order to heating with resin plate A, and is equipped on loading. the next engineering of charging crane 12.Heating arrangements 13 is at the following heating plate 24 that has then set heat accumulation plate 17a under the heating on the pedestal 19, and opposed and set the last heating plate 25 that heat accumulation plate 17b is gone up in heating with aforementioned heating plate down 24.Compared to each up and down heat accumulation plate 17a, 17b, aforementioned heating plate 24 down is made of the bigger member of thermal capacity with last heating plate 25, and is inner then set the distribution channel that adds hot media.In addition, in order to be lifted at down on heating plate 24 and the last heating plate 25, the contact-making surface 24a, the 25a conductivity of heat that contact with heat accumulation plate 17a, 17b up and down, and present each tabular surface.Fixedly lifting cylinder 26 connecting rods (rod) 26a of travel mechanism is then arranged on the last heating plate 25, and 25 of last heating plates can carry out lifting to following heating plate 24.Last heating plate 25 liftings of this example cylinder 26, possess can allow heating plate 24,25 transfer heat to heat up and down the power of pressing solidly of heat accumulation plate 17a, 17b gets final product, rather than possess and see through heat accumulation plate 17a, 17b up and down, on resin plate A, carry out and duplicate the plus-pressure that is shaped.In addition, heating arrangements is not defined as said mechanism, can see through heating such as infrared ray, heated air, energising and accumulation of heat heat accumulation plate up and down yet.
Punching mechanism 14 is to see through heating arrangements 13 to heat. the 17a of heat accumulation plate up and down, the 17b of accumulation of heat, behind the lasting cooling pressurization resin plate A, then duplicate shaping, and be equipped on the next engineering of heating arrangements 13 on this resin plate A.14 of punching mechanisms are setting the following coldplate 27 of heat accumulation plate 17a under the cooling on the pedestal 19, and opposed with aforementioned coldplate down 27 be to be provided in the last coldplate 28 that heat accumulation plate 17b is gone up in cooling.Aforementionedly go up coldplate 27, go up coldplate 28 and heat accumulation plate 17a, 17b up and down in comparison, aforementioned coldplate 27 down is made of the bigger member of thermal capacity with last coldplate 28, and is inner then set the distribution channel that cools off medium.In addition, on following coldplate 27 and last coldplate 28, the contact-making surface 27a, the 28a that contact with heat accumulation plate 17a, 17b up and down are each tabular surface because of conductivity of heat is good.28 of last coldplates are fixed in movable plate 29, and 29 of aforementioned movable plates are fixed in adding on air cylinder 30 pistons (ram) 30a of pressing mechanism.Therefore punching mechanism 14 is configured to, and can add air cylinder 30, lifting movable plate 29 and go up coldplate 28 by aforementioned, sees through heat accumulation plate 17a, 17b pressurization resin plate A up and down again.
In addition, at aforementioned loading. between charging crane 12, heating arrangements 13 and the punching mechanism 14, then set resin plate A pressed solidly and kept being the 17a of heat accumulation plate up and down of one, the carrying mechanism 15 that 17b is transported to next engineering.The carrying mechanism 15 of this example except using roller type conveyer (roller conveyer), also can use chain conveyor (chain conveyer), also shelf conveyer (slat conveyer) shelf can be considered as heat accumulation plate.In addition, also can carry out transfer by chuck (chunk) device, the multiaxis shifting mechanical arm arm that heat accumulation plate up and down etc. is used to move (transfer) punching press.In addition, also heat accumulation plate up and down etc. can be equipped on the turntable, rotate turntable again carrying, and can will descend heat accumulation plate to make the free oscillation formula from body.
Next, will be at heat accumulation plate 17a, 17b describe up and down.Up and down heat accumulation plate 17a, 17b be by, following heat accumulation plate 17a that resin plate A is loaded and the last heat accumulation plate 17b that is loaded on the resin plate A constitute.And, aspect aforementioned down heat accumulation plate 17a, have at least side's contact pressure resin plate A add pressure surface, with the pressure surface that adds that is same as heat accumulation plate 17b contact pressure resin plate A, form duplicating trickle concavo-convex duplicating face 31a, 31b.On this example; constitute the Copying plate of duplicating face 31a, 31b; be made of nickel system molding press (stamper) 32a, 32b, the 17a of heat accumulation plate up and down, 17b main part 33a, the 33b that molding press 32a, 32b can be installed is made of metal～brass that thermal conductivity is higher than iron.And, following heat accumulation plate 17a reaches and goes up contact-making surface 34a, 34b in heat accumulation plate 17b main part 33a, the 33b, for each faces of contact-making surface 27a, 28a of the contact-making surface 24a, the 25a that are contacted each heating arrangements 13 heating plate 24,25 or punching mechanism 14 coldplates 27,28 and constitute out-of-plane.In addition, the main part 33a of the 17a of heat accumulation plate up and down, the 17b on this example, 33b thickness of slab respectively are 5mm.Moreover, from intensity and thermal capacity relation, the main part 33a of heat accumulation plate 17a, 17b, 33b thickness of slab 3mm to 20mm preferably up and down.In addition, the material of heat accumulation plate 17a, 17b preferably adopts thermal conductivity to be higher than the metal of iron up and down.In addition, also up and down heat accumulation plate 17a, 17b iron plate be can be considered as, contact-making surface 34a, 34b copper coin etc. posted up again.In addition, on when going up coldplate 28, bind in order to prevent coldplate 28 and last heat accumulation plate 17b, also can implement dry etching (dry etching) to contact-making surface 28a, a 34b at least.In addition, main part 33a, 33b add pressure surface also can make the plane, and the part of loading resin plate A also can form concavity.
The both sides of following heat accumulation plate 17a main part 33a have then set heat accumulation plate and have pressed solidly mechanism 16.Heat accumulation plate presses solidly mechanism 16 and is used for up and down heat accumulation plate 17a, 17b pressed solidly and remains in resin plate A.Press solidly at heat accumulation plate and can learn after mechanism 16 each position describe, the main part 33a two side portions of following heat accumulation plate 17a, each has been fixed by section and slightly has been the L type member 35 that L font institute measured length steel are constituted.Among the aforementioned L type member 35, on the short leg 35a that is arranged at the 33a of aforementioned body portion continuously, then support rotating turning cylinder 36, then fixed an end 37a of the clamper component 37 of ㄈ font on the such rotation axle 36 with horizontal direction.Moreover 37 of aforementioned clamper components have respectively been installed ㄈ font open side inwardly.And the inside part in the ㄈ font upper shed of aforementioned clamper component 37 other distolateral 37b then forms and presses solidly face 37C.In addition, among the aforementioned L type member 35, the long leg 35b that departs from from main part 33a, then from the lower one deck of the 33a of aforementioned body portion, near aforementioned long leg 35b end, rotating other turning cylinder 38 of horizontal support has then then been fixed an end of cylinder 39 on the such rotation axle 38.And aforementioned cylinder 39 is connected on the pressure source that is not disclosed in drawing, carries out start at least when clamping.But after clamping, also can allow strength spread all over clamper component 37 by cylinder 39.In addition, the connecting rod 39a end of aforementioned cylinder 39 then is installed on the axle 37d of other the distolateral 37b that is fixed on aforementioned clamper component 37 with rotary way.In addition, the both side ends of last heat accumulation plate 17b top then forms thin inclined plane towards both end sides, and aforementioned inclined plane then forms the quilt that allows aforementioned clamper component 37 press solidly face 37C contact and presses solidly face 40.Therefore by aforementioned formation, after giving start towards the direction of elongation cylinder 39 connecting rod 39a, the clamper component 37 that is equipped on down heat accumulation plate 17a presses solidly face 37C, the mode that presses solidly face 40 with the quilt that presses solidly heat accumulation plate 17b moves, and pass through heat accumulation plate 17a and last heat accumulation plate 17b down, press solidly maintenance resin plate A.In addition, behind the connecting rod 39a of shrinkage direction start cylinder 39, then see through heat accumulation plate 17a and last heat accumulation plate 17b down, remove the maintenance that presses solidly of resin plate A.Moreover, then set four cylinders 39 of four clamper components of start 37 and this clamper component 37 on the following heat accumulation plate 17a of this example.Therefore can press solidly mechanism 16 by heat accumulation plate, and, press solidly heat accumulation plate 17a, 17b up and down, in case resin plate A is towards the horizontal direction off normal towards the orthogonal direction to resin plate A surface.
Moreover, press solidly mechanism about the heat accumulation plate that is equipped on down heat accumulation plate and last heat accumulation plate, not limiting needs to set with aforesaid clamp mechanism.Also can adopt for example non-aforesaid clamp mechanism, and see through spring, magnet, motor, press solidly heat accumulation plate up and down again with mobile clamper component.In addition, also can under the situation of not using clamp mechanism, see through spring one end heat accumulation plate is pressed solidly towards other end heat accumulation plate.And, also can set on the heat accumulation plate up and down, utilize ball screw that motor rotates, and the heat accumulation plate that ball screw, nut constituted press solidly mechanism.
In addition, heat accumulation plate presses solidly mechanism also can not be equipped on heat accumulation plate up and down, and is equipped on the carrying mechanism.Also can adopt and for example to use conveyer belt by pressing solidly of being constituted of rubber-metal plate, cloth, the carrying path of heat accumulation plate is located up and down about being equipped on, so that continue carrying up and down heat accumulation plate, press solidly up and down heat accumulation plate or by the guide rod guiding wherein side of heat accumulation plate up and down, change the guide rod height in the time of mobile conveyer belt, so that a side heat accumulation plate is pressed solidly towards the opposing party's heat accumulation plate.Moreover, also can press solidly the structure of mechanism according to these heat accumulation plates, change carrying mechanism, loading. structures such as charging crane.
Next will illustrate, duplicate shaping resin plate A by resin board forming device 11 of the present invention.What this example was used is that acryl (acryl) plate of suitable molding large LGP, this acrylic plate are to see through to carry out severing again after extruder extrudes shaping.Moreover the used resin of the present invention is not defined in acryl, and general used all is thermoplastic resins such as Merlon, cyclenes hydroxyl polymer.In addition, the thickness of slab of resin plate A also can be different.And formed products except duplicate shaping light diffusing sheet, lens, disk, and fuel cell special separator etc., also can make IC-card or circuit board that lamination is shaped.Duplicating shaping resin plate A on this example is to carry out under the vacuum state of 41 li of vacuum chambers, must not be shaped under vacuum state but limit.
Load. on the charging crane 12, be by from the 17a of heat accumulation plate up and down, the 17b of punching mechanism 14, and in the middle of after clamping resin plate (formed products) and the Handling device that is not disclosed in drawing carry, then the start heat accumulation plate presses solidly the cylinder 39 of mechanism 16, so that resin plate (formed products) is removed the maintenance that presses solidly of heat accumulation plate 17a, 17b up and down.Next, then start is in regular turn loaded. the last heat accumulation plate clamping device 20 and the last heat accumulation plate elevating mechanism 21 of charging crane 12, with support and on go up heat accumulation plate 17b.Next, then by shifting mechanical arm arm 22, go up taking-up from following heat accumulation plate 17a and duplicated the resin plate (formed products) of shaping.Moreover, be transported to loading from punching mechanism 14. after the 17a of heat accumulation plate up and down, the 17b of charging crane 12 and resin plate (formed products) cooling, than being easier to heat accumulation plate 17a, 17b and resin plate (formed products) carry out demoulding up and down, but during from up and down heat accumulation plate 17a, 17b demoulding resin plate (formed products), also can supply air, crooked at least one side of heat accumulation plate 17a, 17b and resin plate (formed products) up and down.Next, behind the taking-up resin plate (formed products),, unfashioned resin plate A location is loaded into down on the heat accumulation plate 17a then by identical shifting mechanical arm arm 22.Next then only retreat shifting mechanical arm arm 22, and aforementioned heat accumulation plate elevating mechanism 21 and the last heat accumulation plate clamping device 20 gone up of start once again, will go up heat accumulation plate 17b again and be loaded into down on the heat accumulation plate 17a.Next, the heat accumulation plate that start once again is equipped on down heat accumulation plate 17a presses solidly the cylinder 39 of mechanism 16, again to press solidly heat accumulation plate 17b by the mode of the face of pressing solidly 40, move the face that the presses solidly 37C that is equipped on down heat accumulation plate 17a clamper component 37, between following heat accumulation plate 17a and the last heat accumulation plate 17b, then press solidly maintenance resin plate A.
Next, be held in the resin plate A between heat accumulation plate 17a, the 17b up and down, see through the heating arrangements 13 that carrying mechanism 15 is transported to next engineering.To descend heat accumulation plate 17a inner fovea part, chimeric loading. after being positioned the following heating plate 24 of heating arrangements 13, just the lifting of heating plate 25 travel mechanisms allows heating plate 25 contact-making surface 25a with cylinder 26 in the start, heat accumulation plate 17b contact-making surface 34b in the contact.At this moment, heating plate 24,25 temperature are higher than the glass transition temperature of resin plate A at least, preferably can do support exceeding under about 40 ℃ to 130 ℃ temperature than glass transition temperature.And, according to heating arrangements 13, see through the power of pressing solidly that heat accumulation plate 17a, 17b up and down spread all over resin plate A and be preferably lower than, press solidly the clamper component 37 of mechanism 16 according to aforementioned heat accumulation plate, and see through the power that presses solidly that heat accumulation plate 17a, 17b up and down spread all over resin plate A.Aspect heating arrangements 13; up and down heat accumulation plate 17a, 17b applied surpass heating. accumulation of heat is required press solidly strongly after; can prevent to cause the problem of the variation of side view because of molding press 32a, 32b carry out excessive duplicating on resin plate A surface, resin plate A lateral expansion is outstanding.In addition, this is can weaken the power of pressing solidly because of carrying out with heating arrangements 13 after pressing solidly strongly, utilize punching mechanism 14 to pressurize strongly once again after, may cause the situation of duplicating displacement to resin plate A.So this example, the power that presses solidly that applies by 13 couples of resin plate A of heating arrangements then is lower than 0.4MPa.Especially, compared to the power that presses solidly by 13 couples of resin plate A of heating arrangements, the power that presses solidly that is applied through 37 couples of resin plate A of clamper component is stronger, when therefore going up heating plate 25 risings, can prevent really that heating plate 25 contact-making surface 25a and last heat accumulation plate 17b from fitting, and can effectively prevent aforementioned duplicating displacement.In addition, therefore the device of heating arrangements 13 or add air cylinder and do not need to add hot pressing as huge as the tradition can save manufacturing cost and operation costs.
By heating arrangements 13, heating is held in heat accumulation plate 17a up and down, behind the resin plate A between the 17b, with this resin plate A and contact the 17a of heat accumulation plate up and down on two sides inside and outside this, after 17b is one, then see through the punching mechanism 14 that carrying mechanism 15 is transported to next engineering, the inner face recess of following heat accumulation plate 17a, then by behind the coldplate 27 under chimeric and the location loading, what remake moving punching mechanism 14 adds air cylinder 30, decline movable plate 29 reaches goes up coldplate 28, allow coldplate 28 contact-making surface 28a, the contact-making surface 34b of heat accumulation plate 17b in the contact sees through heat accumulation plate 17a up and down again, 17b carries out the pressurization of resin plate A.Aspect tentatively pressurizeing through 14 couples of resin plate A of this punching mechanism; because heat accumulation plate 17a, 17b maintain up and down; seeing through heating arrangements 13 is heated to above under the state of glass transition temperature; therefore be by molding press 32a, the 32b of heat accumulation plate 17a, 17b up and down, on resin plate A, duplicate shaping.Heat accumulation plate 17a, 17b temperature in the pressurization of punching mechanism 14, are by descending gradually after coldplate 27,28 coolings again, therefore aspect the pressurization later stage, can dropping to below the glass transition temperature up and down.The present invention is when utilizing punching mechanism 14 to pressurize, and to resin plate A institute applied pressure aspect, the required pressure of concavo-convex dark more duplicating is just high more, but generally is preferably in 2MPa and even 10Mpa, preferably 5 seconds to 40 seconds pressing time.Moreover, change resin plate A institute applied pressure in also can pressurizeing.The present invention can be by up and down heat accumulation plate 17a, 17b temperature control, with the exchange of heat accumulation plate 17a, 17b up and down with change thermal capacity, and by control coldplate 27,28 temperature, set the temperature decline curve when seeing through punching mechanism 14 and pressurizeing.
Punching mechanism 14 is through after aforementioned pressing time, and then start once again adds air cylinder 30, allows movable plate 29 reach and goes up coldplate 28 risings.Moreover, because punching mechanism 14 engineerings on this example need most pressing time, therefore be to cooperate this engineering, set the processing time that is same as other engineering.Next, continue the resin plate (formed products) of cooling pressurization and heat accumulation plate 17a, 17b up and down, then see through the carrying mechanism that is equipped on pedestal 19 rears and is not disclosed in drawing, carry in aforementioned loading by punching mechanism 14. charging crane 12.Take out heat accumulation plate then once again and press solidly the resin plate (formed products) that mechanism 16 is removed.Moreover, after seeing through punching mechanism 14 and beginning pressurization, remove heat accumulation plate again and press solidly mechanism 16 and get final product, but because problems such as vibration, forming period time when carrying be preferably on loading-charging crane 12 positions and carried out.
In addition, though do not enumerate embodiment one by one at the present invention, be not defined in above-mentioned example, this dealer also can follow purport of the present invention and be changed and be suitable for.For example, with resin board forming device, when heat accumulation plate up and down with before resin plate A contact, heat accumulation plate about also can heating by heating arrangements.Therefore aforementioned form has then set loader mechanism behind heating arrangements.Moreover aforementioned form preferably can be to resin plate A, as far as possible with heat accumulation plate about the identical contact on opportunity.In addition, use preheating part preheating heat accumulation plate, at least one end of resin plate A up and down, after contacting through loader mechanism, also available heating arrangements heats.In addition, about the heating arrangements and the punching mechanism aspect of resin board forming device, also can allow heating plate and play heating plate, go up coldplate and following coldplate, the contact-making surface of heat accumulation plate contacts about the court simultaneously.And heat accumulation plate itself up and down, also can have at least a ability of heating or cooling.In addition, resin board forming device, an also batch process number resin plate A simultaneously, and towards vertical pressurization resin plate A.

Claims (5)

1. resin board forming device is characterized in that: be provided with:
The heat accumulation plate on the inside and outside two sides of contact pressure resin plate;
Heat the heating arrangements of aforementioned heat accumulation plate;
Aforementioned heat accumulation plate is pressed solidly the heat accumulation plate that remains in resin plate press solidly mechanism;
To press solidly the heat accumulation plate of maintenance that mechanism presses solidly and the carrying mechanism that resin plate is transported to next engineering by aforementioned heat accumulation plate;
Heat accumulation plate and the resin plate that to carry by aforementioned carrying mechanism, the punching mechanism of pressurization while cooling off.
2. resin board forming device as claimed in claim 1 is characterized in that: aforementioned heat accumulation plate presses solidly mechanism, is the clamp mechanism that is equipped on aforementioned heat accumulation plate.
3. resin board forming device as claimed in claim 1 or 2 is characterized in that: aforementioned heat accumulation plate is made of by the metallic plate that iron and the thermal conductivity of 3mm to 20mm is higher than the iron thermal conductivity the main part thickness of slab.
4. resin board forming device as claimed in claim 1 or 2 is characterized in that: allow the adjusting temperature of heating plate of aforementioned heating arrangements at the contact aforementioned heat accumulation plate back side, be higher than the glass transition temperature of resin plate; Allow the adjusting temperature of coldplate of aforementioned punching mechanism at the contact aforementioned heat accumulation plate back side, be lower than the glass transition temperature of resin plate.
5. resin board forming device as claimed in claim 3 is characterized in that: allow the adjusting temperature of heating plate of aforementioned heating arrangements at the contact aforementioned heat accumulation plate back side, be higher than the glass transition temperature of resin plate; Allow the adjusting temperature of coldplate of aforementioned punching mechanism at the contact aforementioned heat accumulation plate back side, be lower than the glass transition temperature of resin plate.
CNB2004100963212A 2004-02-20 2004-11-30 Resin plate forming device Expired - Fee Related CN100368184C (en)

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JP2004044190A JP4246651B2 (en) 2004-02-20 2004-02-20 Resin plate transfer molding equipment
JP2004044190 2004-02-20

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KR100974822B1 (en) * 2009-12-15 2010-08-09 주식회사 광성테크 Method and apparatus for pressing nickel base thin film for forming melamine sheet
CN102717510A (en) * 2012-07-03 2012-10-10 刘月乡 Resin template forming equipment
CN106113338B (en) * 2016-06-21 2018-08-24 欧宝聚合物江苏有限公司 The surface-brightening processing method of non-injection grade thermoplastic plastic injecting part
CN105965710B (en) * 2016-06-28 2019-03-22 常州大学 A kind of preparation method and application of silicon rod gold steel wire cutting resin plate
CN106938514A (en) * 2017-04-27 2017-07-11 浙江林境新材料科技有限公司 A kind of laminator
TWI821668B (en) * 2021-05-14 2023-11-11 溢泰實業股份有限公司 Molding modules for manufacturing compressible materials (filter media)
JP6986802B1 (en) * 2021-07-14 2021-12-22 株式会社浅野研究所 Heating part structure of resin heat molding equipment and resin heat molding equipment
CN116653333B (en) * 2022-12-05 2024-01-23 徐州云天高分子材料技术研究院有限公司 Material compression molding device for new material development

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JP2005231226A (en) 2005-09-02
CN1657265A (en) 2005-08-24
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TW200528256A (en) 2005-09-01
KR100647515B1 (en) 2006-11-23
TWI255764B (en) 2006-06-01

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