JP2006015709A - Transfer printing plate retaining structure - Google Patents

Transfer printing plate retaining structure Download PDF

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JP2006015709A
JP2006015709A JP2004198430A JP2004198430A JP2006015709A JP 2006015709 A JP2006015709 A JP 2006015709A JP 2004198430 A JP2004198430 A JP 2004198430A JP 2004198430 A JP2004198430 A JP 2004198430A JP 2006015709 A JP2006015709 A JP 2006015709A
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transfer printing
printing plate
mold
frame
shock absorbing
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JP4542382B2 (en
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Tsutomu Hayashida
Nobuaki Kitano
Masahiko Ogino
Hideto Onuki
Hiroto Onuki
Hideki Sasaki
Kinichi Usami
英樹 佐々木
延明 北野
啓人 大貫
英仁 大貫
欽一 宇佐美
勉 林田
雅彦 荻野
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Hitachi Cable Ltd
Hitachi Ltd
Kawamura Seisakusho:Kk
Onuki Kogyosho:Kk
日立電線株式会社
株式会社大貫工業所
株式会社日立製作所
株式会社河村製作所
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<P>PROBLEM TO BE SOLVED: To extend the life span of a die by keeping the die and the body to be printed parallel and inhibiting failure of the die. <P>SOLUTION: A transfer printing plate 1 which consists of materials such as quartz, silicon or a resin and in which rugged grooves are formed is retained by an outer frame member 7. The transfer printing surface 1 is made to be retained by the outer frame member 7 through a stress impact-absorbing material 9 in a transfer printing plate retaining structure 5 for pressing the transfer printing plate 1 to a body 3 to be printed 3 to print. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、石英、シリコンまたは樹脂などの材料からなり凹凸の溝を形成した転写印刷版を外枠部材で保持し、その転写印刷版を被印刷体に押圧して印刷するための転写印刷版保持構造に関するものである。   The present invention relates to a transfer printing plate for holding a transfer printing plate made of a material such as quartz, silicon or resin and having grooves formed thereon by an outer frame member and pressing the transfer printing plate against a printing medium for printing. It relates to a holding structure.
CD−ROMやDVD−ROMなどの光ディスクは、現在フォトリソグラフィ法で作製した金属製の樹脂成型用金型(転写印刷版)を用いた、ドットパターンの樹脂成型法によって作られている。これら光ディスクには、映像、音楽などのデータがドットパターンとして記録されており、これをレーザ光で読み取ることで、映像や音楽などが再生される。   Optical disks such as CD-ROMs and DVD-ROMs are currently produced by a dot pattern resin molding method using a metal resin molding die (transfer printing plate) produced by a photolithography method. Data such as video and music are recorded as dot patterns on these optical discs, and video and music are reproduced by reading the data with a laser beam.
また、MOなどの光ディスクでは、同じく金属金型によるドットパターンの形成後に、磁性体薄膜が記録薄膜として形成されている。MOでは、この記録薄膜のデータをレーザ光で読み出したりできる他、消去、書込なども可能で、繰り返し記録(消去、書込)が可能な記録媒体として市販されている。最近、これらの記録媒体は、小型軽量化、携帯性、保管性、管理性、大容量化などの高い市場要求から、年々記録密度の向上が求められている。このため、高密度ドットパターン形成法の技術開発競争が盛んに行われている。   In addition, in an optical disk such as MO, a magnetic thin film is formed as a recording thin film after forming a dot pattern using a metal mold. The MO is commercially available as a recording medium that can read out data of the recording thin film with a laser beam, and also can be erased and written, and can be repeatedly recorded (erased and written). Recently, these recording media have been required to improve recording density year by year due to high market demands such as reduction in size and weight, portability, storability, manageability, and increase in capacity. For this reason, there is an active competition for technological development of high-density dot pattern formation methods.
この中で、光ナノインプリント法と呼ばれる方法は、パターン形成用樹脂に光硬化型の感光性の樹脂を用いる方法である。パターン形成用の金型には主にシリコン、石英などの基板を用い、この基板にEB法(電子ビーム法)で微細なパターンを形成する。なお、インプリントでは、金型の材質は金属ではない場合でも、慣例的に金型と呼んでいる。EB法では100nm以下のドットパターンの形成が容易であり、これを金型として用いることにより、高密度記録媒体の形成が可能になる。また、記録媒体用樹脂に光硬化型のものを用いると、熱可塑性樹脂を用いる場合と比較して、低温でのドットパターンの形成が可能になり、熱によるパターンの歪みなどを考慮することなく、高密度な記録が可能となるという特長がある。   Among them, a method called an optical nanoimprint method is a method using a photo-curable photosensitive resin as a pattern forming resin. A substrate such as silicon or quartz is mainly used as a pattern forming mold, and a fine pattern is formed on the substrate by an EB method (electron beam method). In the imprint, even if the material of the mold is not metal, it is conventionally called a mold. In the EB method, it is easy to form a dot pattern of 100 nm or less, and by using this as a mold, a high-density recording medium can be formed. In addition, if a photocurable resin is used as the recording medium resin, dot patterns can be formed at a lower temperature than when a thermoplastic resin is used, and the distortion of the pattern due to heat is not considered. The high density recording is possible.
従来のCD−ROM、MOなどの場合、通常のドットパターンの形状は、幅0.4μm、深さ0.4μm、長さ0.9〜3.3μmである。これに対して、光ナノインプリント法では、この1/10サイズのドットパターンの形成が可能であり、10倍の記録密度が達成できる。この光ナノインプリント技術の開発によって将来の100GBの記録媒体が可能になると期待されている。   In the case of a conventional CD-ROM, MO, etc., the normal dot pattern has a width of 0.4 μm, a depth of 0.4 μm, and a length of 0.9 to 3.3 μm. On the other hand, in the optical nanoimprint method, this 1/10 size dot pattern can be formed, and a recording density of 10 times can be achieved. The development of this optical nanoimprint technology is expected to enable a future 100 GB recording medium.
この光ナノインプリントの技術は、1995年、Chouによって初めて紹介され、まだ日が浅いため、学術論文はまだ少ないが、非特許文献1にナノインプリントの技術の現状として紹介されている。   This optical nanoimprint technology was first introduced by Chou in 1995, and since it is still young, there are few academic papers, but it is introduced in Non-Patent Document 1 as the current state of nanoimprint technology.
光ナノインプリントのプロセスは、基板上に光硬化樹脂を塗布して、これを金型(モールド)で押さえて変形させて、その後に紫外線を照射して樹脂を硬化させ、金型を離すことによりパターンを得るものである。そして、この光硬化樹脂のパターンをマスクとして、基板のエッチングを行う。   The process of optical nanoimprinting involves applying a photo-curing resin on a substrate, pressing it with a mold (mold), deforming it, then irradiating it with ultraviolet rays to cure the resin, and then releasing the mold. Is what you get. Then, the substrate is etched using the pattern of the photocurable resin as a mask.
光ナノインプリントでは、例えば、金型にはEB法でパターン形成したサファイアや人工石英板などを用い、金型の上方から紫外線を照射して樹脂を硬化させる。このサファイア金型は、非特許文献1の中ではモールドと称している。このモールドの保持方法は、非特許文献1中、詳しくは記述されていないが、光ナノインプリントリソグラフィ装置の図面が記述されている。   In optical nanoimprinting, for example, sapphire or artificial quartz plate patterned by the EB method is used as a mold, and the resin is cured by irradiating ultraviolet rays from above the mold. This sapphire mold is called a mold in Non-Patent Document 1. Although this mold holding method is not described in detail in Non-Patent Document 1, a drawing of an optical nanoimprint lithography apparatus is described.
光ナノインプリントリソグラフィ装置の一例を図8に示すと共に、光ナノインプリントリソグラフィ装置の金型保持部を図9に断面図で示す。図示するように、サファイア製の金型(転写印刷版)1は、支持枠2で保持されている。光ナノインプリントでは、金型1の上方から紫外線11を照射するために、支持枠2は、金型1の端部(周縁部)のみを保持するようになっている。金型1の上方には、紫外線11を照射するための、照射レンズ21が設けられている。照射レンズ21には、光ファイバ22が接続されている。   An example of the optical nanoimprint lithography apparatus is shown in FIG. 8, and a mold holding portion of the optical nanoimprint lithography apparatus is shown in a sectional view in FIG. As illustrated, a sapphire mold (transfer printing plate) 1 is held by a support frame 2. In the optical nanoimprint, the support frame 2 holds only the end portion (periphery portion) of the mold 1 in order to irradiate the ultraviolet rays 11 from above the mold 1. An irradiation lens 21 for irradiating the ultraviolet rays 11 is provided above the mold 1. An optical fiber 22 is connected to the irradiation lens 21.
金型1の下方には、被印刷体3を載置・保持するステージ4が設けられている。ステージ4は、その下部に設けられた昇降装置23を駆動させることで、上下方向に延出したガイドパイプ24に沿って昇降する。ステージ4を上昇させることで、被印刷体3がサファイア金型1に押圧されるようになっている。   Below the mold 1, a stage 4 for placing and holding the printing medium 3 is provided. The stage 4 is moved up and down along the guide pipe 24 extending in the vertical direction by driving a lifting device 23 provided in the lower part thereof. The substrate 3 is pressed against the sapphire mold 1 by raising the stage 4.
ところで、上記光ナノインプリントリソグラフィ装置では、ステージ4を上昇させることで被印刷体3がサファイア金型1に押圧されるときの圧力の力学的な設計の良否が、金型1の寿命に大きく関係する。   By the way, in the optical nanoimprint lithography apparatus, whether or not the mechanical design of the pressure when the printing medium 3 is pressed against the sapphire mold 1 by raising the stage 4 is greatly related to the life of the mold 1. .
紫外線に限らず、光硬化型の樹脂を用いた光ナノインプリントにおける金型1の要求特性としては、その機能から以下のことが挙げられる。
(1)被印刷体3に押し当てて加圧するときの金型1の応力を分散し、金型1周辺への局地的な応力の集中を防ぐこと。
(2)照射面積をできる限り大きくするため、金型1の端部の保持部分はできる限り小さくすること。
(3)振動などによる金型1の損傷・破損が起こらないこと。
(4)金型1を被印刷体3に押し当てるときに、被印刷体3に対して常に平衡に均一な加圧力分布で押し当てられること。
(5)金型1を被印刷体3から離す離型動作でも、金型1に局地的な応力の集中が起こらないこと。
(6)離型動作での離型力低減のため、金型1の剥離が周辺からスムーズに開始されること。
(7)離型動作のとき金型1が、周辺からむら無く剥離されること。
(8)これら一連の動作の繰り返しでの金型1の応力疲労破壊や損傷などが起こらないこと。
The required characteristics of the mold 1 in optical nanoimprinting using a photocurable resin, not limited to ultraviolet rays, include the following because of its function.
(1) Dispersing the stress of the mold 1 when pressed against the substrate 3 and applying pressure to prevent local stress concentration around the mold 1.
(2) In order to increase the irradiation area as much as possible, the holding portion at the end of the mold 1 should be as small as possible.
(3) The mold 1 is not damaged or broken due to vibration or the like.
(4) When the mold 1 is pressed against the substrate 3, the mold 1 is always pressed against the substrate 3 with a uniform and uniform pressure distribution.
(5) Local stress concentration does not occur in the mold 1 even in the mold release operation in which the mold 1 is separated from the substrate 3.
(6) In order to reduce the mold release force in the mold release operation, the mold 1 should be smoothly peeled off from the periphery.
(7) The mold 1 is peeled off uniformly from the periphery during the mold release operation.
(8) No stress fatigue failure or damage of the mold 1 is caused by repeating these series of operations.
これらの要求を満たし、金型1の寿命を延長するためには、金型1を保持するハンドリング部材に対する応力吸収機能付与などの構造上の工夫が必要であるが、従来技術では、その工夫がまだ見出されていない。   In order to satisfy these requirements and extend the life of the mold 1, structural measures such as imparting a stress absorbing function to the handling member that holds the mold 1 are necessary. It has not been found yet.
特に、EB法でドットパターンを形成した石英やシリコン、サファイアなどの金型は非常に高価であるので、金型1の寿命延長が重要な課題である。また、印刷製品歩留まりの低下はそのまま、金型1の消耗に繋がるので、印刷歩留まりの向上も重要な課題である。   In particular, since a metal mold such as quartz, silicon, or sapphire having a dot pattern formed by the EB method is very expensive, extending the life of the metal mold 1 is an important issue. Further, since the decrease in the printed product yield leads to the consumption of the mold 1, the improvement of the printing yield is also an important issue.
通常、金型1に対してステージ4上に配置された被印刷体3は、外径が大きく、金型1には印刷圧力(以下印圧と称する)がかかる。そのため、印刷が繰り返されるたびに金型1には歪み応力が加わる。この応力は金型1の端部でより大きくなって応力が大きい場合には、金型1の破壊に至る。また、被印刷体3と、金型1とは常に平行であることが、印刷有無などの印刷バラツキを防ぐために重要である。特に、数10nmのサイズのドットパターンが要求されるナノ印刷にあっては、被印刷体3と金型1の平行度は非常に重要で、印刷面に均一な印圧の負荷によって、初めてnmパターンサイズの印刷が可能となる。   Usually, the printing medium 3 disposed on the stage 4 with respect to the mold 1 has a large outer diameter, and a printing pressure (hereinafter referred to as printing pressure) is applied to the mold 1. Therefore, strain stress is applied to the mold 1 every time printing is repeated. This stress becomes larger at the end of the mold 1, and when the stress is large, the mold 1 is broken. Further, it is important for the printing medium 3 and the mold 1 to be always parallel to prevent printing variations such as the presence or absence of printing. In particular, in nano printing where a dot pattern with a size of several tens of nanometers is required, the parallelism between the printing medium 3 and the mold 1 is very important, and for the first time due to the load of uniform printing pressure on the printing surface. Pattern size printing is possible.
そこで、本発明は、上記課題を解決するために案出されたものであって、その目的は、金型と被印刷体とを平行に保ち、金型の破損を防止しつつ、その寿命を延長することができる転写印刷版保持構造を提供することにある。   Therefore, the present invention has been devised to solve the above-mentioned problems, and its purpose is to keep the mold and the substrate to be printed in parallel to prevent the mold from being damaged and to increase its service life. It is an object of the present invention to provide a transfer printing plate holding structure that can be extended.
上記目的を達成するために、本発明は、石英、シリコンまたは樹脂などの材料からなり凹凸の溝を形成した転写印刷版を外枠部材で保持し、その転写印刷版を被印刷体に押圧して印刷するための転写印刷版保持構造において、上記外枠部材に、応力衝撃緩衝材を介して上記転写印刷版を保持させたものである。   In order to achieve the above-mentioned object, the present invention holds a transfer printing plate made of a material such as quartz, silicon, or resin and having an uneven groove formed on an outer frame member, and presses the transfer printing plate against a substrate. In the transfer printing plate holding structure for printing, the transfer printing plate is held on the outer frame member via a stress shock absorbing material.
そして、上記外枠部材に上記応力衝撃緩衝材を取り付けると共に、その応力衝撃緩衝材を上記転写印刷版の周縁部の表裏両面またはいずれか一方の面或いは周縁部側面に接するように設けて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   Then, the stress shock absorbing material is attached to the outer frame member, and the stress shock absorbing material is provided so as to be in contact with both the front and back surfaces of the peripheral portion of the transfer printing plate, or either one surface or the peripheral portion side surface, It is preferable to hold the transfer printing plate on the outer frame member.
また、上記応力衝撃緩衝材は、バネやゴムなどの弾性体にて形成されたものが好ましい。   The stress shock absorbing material is preferably formed of an elastic body such as a spring or rubber.
さらに、上記応力衝撃緩衝材は、シリコーンゴム弾性体にて形成されたOリングからなり、上記転写印刷版の周縁部の表裏両面に配置され、上記外枠部材に形成された溝内に上記転写印刷版と共に嵌装させて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   Further, the stress shock absorbing material is made of an O-ring formed of a silicone rubber elastic body, and is disposed on both front and back surfaces of the peripheral portion of the transfer printing plate, and the transfer material is inserted into a groove formed in the outer frame member. It is preferable to fit the printing plate together with the printing plate and hold the transfer printing plate on the outer frame member.
また、上記応力衝撃緩衝材は、断面U字状の金属製板バネからなり、上記転写印刷版の表裏両面に配置され、上記外枠部材に形成された溝内に上記転写印刷版と共に嵌装させて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   The stress shock absorbing material is made of a metal leaf spring having a U-shaped cross section, and is disposed on both the front and back surfaces of the transfer printing plate, and is fitted together with the transfer printing plate in a groove formed in the outer frame member. It is preferable that the transfer printing plate is held by the outer frame member.
さらに、上記応力衝撃緩衝材は、シリコーンゴム弾性体にて形成され内周面に溝を備えた緩衝リングからなり、上記溝に上記転写印刷版の周縁部を嵌装させて固定すると共に、上記緩衝リングの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   Further, the stress shock absorbing material comprises a buffer ring formed of a silicone rubber elastic body and provided with a groove on the inner peripheral surface, and the peripheral edge of the transfer printing plate is fitted and fixed in the groove. It is preferable that the buffer ring is fitted in the groove formed in the outer frame member and the transfer printing plate is held by the outer frame member.
また、上記応力衝撃緩衝材は、ポリカーボネート樹脂等の紫外線透過可能な材料で円盤状に形成された緩衝シートからなり、この緩衝シートの下面に上記転写印刷版を取り付け、緩衝シートの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   Further, the stress shock absorbing material is composed of a buffer sheet formed in a disk shape with an ultraviolet light transmissive material such as polycarbonate resin, and the transfer printing plate is attached to the lower surface of the buffer sheet, and the periphery of the buffer sheet is attached to the periphery of the buffer sheet. It is preferable that the transfer printing plate is held in the outer frame member by being fitted in a groove formed in the outer frame member.
さらに、上記応力衝撃緩衝材は、人工石英板にて形成された薄板状の緩衝シートからなり、この緩衝シートの下面に上記転写印刷版を取り付け、緩衝シートの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させたものが好ましい。   Further, the stress shock absorbing material is made of a thin plate-like buffer sheet formed of an artificial quartz plate, the transfer printing plate is attached to the lower surface of the buffer sheet, and the periphery of the buffer sheet is formed on the outer frame member. It is preferable that the transfer printing plate is held in the outer frame member by being fitted in the groove.
本発明によれば、金型と被印刷体とを平行に保ち、金型の破損を防止しつつ、その寿命を延長することができるといった優れた効果を発揮する。   According to the present invention, an excellent effect is exhibited in that the mold and the substrate to be printed are kept in parallel, and the life of the mold can be extended while preventing the mold from being damaged.
以下、本発明の好適な実施の形態を添付図面に基づいて詳述する。   Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings.
図1は本発明に係る転写印刷版保持構造の好適な実施の形態を示した側面図である。   FIG. 1 is a side view showing a preferred embodiment of a transfer printing plate holding structure according to the present invention.
本実施の形態においては、図8に示した光ナノインプリントリソグラフィ装置の金型(転写印刷版)1を保持する構造を例に挙げて説明する。   In the present embodiment, a structure for holding a mold (transfer printing plate) 1 of the optical nanoimprint lithography apparatus shown in FIG. 8 will be described as an example.
図1に示すように、転写印刷版保持構造5は、石英、シリコンまたは樹脂などの材料からなり、凹凸の溝(図示せず)を形成した金型(転写印刷版)1を外枠部材7で保持し、その金型1に被印刷体3を押圧して印刷するための構造において、外枠部材7に、応力衝撃緩衝材9を介して金型1を保持させたことを特徴とする。応力衝撃緩衝材9は、金型1への機械的応力や衝撃を緩和するためのものである。   As shown in FIG. 1, the transfer printing plate holding structure 5 is made of a material such as quartz, silicon, or resin, and a mold (transfer printing plate) 1 having an uneven groove (not shown) is formed on an outer frame member 7. In the structure for holding and printing the printed material 3 against the mold 1, the outer frame member 7 is configured to hold the mold 1 via the stress shock absorbing material 9. . The stress shock absorbing material 9 is for relaxing mechanical stress and impact on the mold 1.
外枠部材7には、応力衝撃緩衝材9が取り付けられている。その応力衝撃緩衝材9は、金型1の周縁部6の表裏両面またはいずれか一方の面或いは周縁部側面に接するように(本実施の形態では、周縁部6の表面から裏面にかけて側面を覆うように)設けられている。   A stress shock absorbing material 9 is attached to the outer frame member 7. The stress shock absorbing material 9 covers the front and back surfaces of the peripheral portion 6 of the mold 1 or either one of the surfaces or the side surface of the peripheral portion (in this embodiment, covers the side surface from the front surface to the back surface of the peripheral portion 6. As provided).
外枠部材7は、金属或いは樹脂にてリング状に形成されている。外枠部材7の内周面12には、金型1の周縁部6を保持するための断面コ字状の溝14が形成されている。外枠部材7は、複数に分割して形成されており、図8に示した金型固定アーム15に径方向に移動可能にそれぞれ取り付けられている。   The outer frame member 7 is formed in a ring shape from metal or resin. A groove 14 having a U-shaped cross section for holding the peripheral edge 6 of the mold 1 is formed on the inner peripheral surface 12 of the outer frame member 7. The outer frame member 7 is divided into a plurality of parts, and is attached to the mold fixing arm 15 shown in FIG. 8 so as to be movable in the radial direction.
応力衝撃緩衝材9は、バネやゴムなどの弾性体(本実施の形態ではゴム)にてリング状に形成され、その周縁部16が外枠部材7の溝14に嵌装されて固定されている。応力衝撃緩衝材9の内周面17には、金型1の周縁部6を保持するための金型保持溝18が形成されており、この金型保持溝18に、金型1の周縁部6を嵌装して固定するようになっている。応力衝撃緩衝材9は、外枠部材7と同様に複数に分割して形成されており、径方向に移動することで、金型1の装着を行う。   The stress shock absorbing material 9 is formed in a ring shape by an elastic body such as a spring or rubber (in this embodiment, rubber), and its peripheral edge portion 16 is fitted into the groove 14 of the outer frame member 7 and fixed. Yes. A mold holding groove 18 for holding the peripheral edge 6 of the mold 1 is formed on the inner peripheral surface 17 of the stress shock absorbing material 9, and the peripheral edge of the mold 1 is formed in the mold holding groove 18. 6 is fitted and fixed. Like the outer frame member 7, the stress shock absorbing material 9 is divided into a plurality of parts, and the mold 1 is attached by moving in the radial direction.
金型1の下方部分には、被印刷体3を載置・保持するステージ4が設けられている。ステージ4は、その下部に設けられた昇降装置23(図8参照)を駆動させることで、昇降する。ステージ4を上昇させることで、被印刷体3が金型1に押圧されるようになっている。   A stage 4 for placing and holding the printing medium 3 is provided in a lower part of the mold 1. The stage 4 moves up and down by driving a lifting device 23 (see FIG. 8) provided in the lower part thereof. The substrate 3 is pressed against the mold 1 by raising the stage 4.
上記構成によれば、外枠部材7に、応力衝撃緩衝材9を介して金型1を取り付けたことによって、ステージ4を上昇させて被印刷体3を金型1に押圧する際に、被印刷体3から金型1にかかる応力を分散し、金型1周辺への局地的な応力の集中を防ぐことができる。また、金型1が傾いて固定されていても、被印刷体3が金型1に押圧されたときに応力衝撃緩衝材9が変形して、金型1を被印刷体3に平行に移動させることができるので、金型1を被印刷体3に対して平行に保つことができ、金型1に被印刷体3を平衡で均一な加圧力分布で押し当てることができる。さらに、作業時に光ナノインプリントリソグラフィ装置本体に発生する振動などは、応力衝撃緩衝材9で吸収され、金型1には伝わらないので、金型1の損傷・破損を防止することができる。   According to the above configuration, when the mold 1 is attached to the outer frame member 7 via the stress shock absorbing material 9, the stage 4 is lifted to press the printed material 3 against the mold 1. The stress applied to the mold 1 from the printed body 3 can be dispersed to prevent local stress concentration around the mold 1. Even if the mold 1 is tilted and fixed, the stress shock absorbing material 9 is deformed when the printing body 3 is pressed against the mold 1, and the mold 1 is moved in parallel with the printing body 3. Therefore, the mold 1 can be kept parallel to the printing body 3, and the printing body 3 can be pressed against the mold 1 with a uniform and uniform pressure distribution. Furthermore, vibrations generated in the main body of the optical nanoimprint lithography apparatus during work are absorbed by the stress shock absorbing material 9 and are not transmitted to the mold 1, so that the mold 1 can be prevented from being damaged or broken.
また、金型1の周縁部6を全周に亘って、応力衝撃緩衝材9で保持しているので、金型1の端部の保持部分はできる限り小さくすることができ、中央部分が遮られることなく、照射面積をできる限り大きくすることができる。よって、確実に被印刷体3にパターンを形成することができ、歩留まりの向上が達成できる。   Further, since the peripheral edge portion 6 of the mold 1 is held by the stress shock absorbing material 9 over the entire circumference, the holding portion of the end portion of the mold 1 can be made as small as possible, and the central portion is blocked. The irradiation area can be increased as much as possible. Therefore, it is possible to reliably form a pattern on the printing medium 3 and to improve the yield.
さらに、金型1を被印刷体3から離す離型動作においても、金型1に局地的な応力の集中が起こらず、また、離型力は、応力衝撃緩衝材9を介して金型1へと徐々に伝わるので、一気にまとめて伝わらない。よって、離型動作での離型力低減を達成できる。そして、金型1の剥離が周縁部6からスムーズに開始され、周辺からむら無く剥離することができる。   Further, even in the mold release operation for separating the mold 1 from the substrate 3, local stress concentration does not occur in the mold 1, and the mold release force is transmitted through the stress shock absorbing material 9. Since it is gradually transmitted to 1, it is not transmitted all at once. Therefore, it is possible to achieve a reduction in the release force in the release operation. And the peeling of the metal mold | die 1 is started smoothly from the peripheral part 6, and it can peel evenly from the periphery.
そして、これら一連の動作の繰り返しでの金型1の応力疲労破壊や損傷などが起こらない。   Further, stress fatigue failure or damage of the mold 1 does not occur by repeating these series of operations.
以上のように、かかる転写印刷版保持構造5によれば、照射面積を大きく確保できると共に、金型1の破損を防止しつつ、その寿命を延長することができる。   As described above, according to the transfer printing plate holding structure 5, a large irradiation area can be secured, and the life of the mold 1 can be extended while preventing damage to the mold 1.
図2は本発明に係る転写印刷版保持構造の好適な他の実施の形態を示した側面図である。   FIG. 2 is a side view showing another preferred embodiment of the transfer printing plate holding structure according to the present invention.
本実施の形態は、図1に示した実施の形態において、外枠部材7を図8に示した装置のガイドパイプ24に直接取り付けることができるように、ガイドパイプ24を通す孔72を有するアーム71を、外枠部材7の外周面に設けたものである。   This embodiment is an arm having a hole 72 through which the guide pipe 24 passes so that the outer frame member 7 can be directly attached to the guide pipe 24 of the apparatus shown in FIG. 8 in the embodiment shown in FIG. 71 is provided on the outer peripheral surface of the outer frame member 7.
(実施例1)
図3は本発明に係る転写印刷版保持構造の実施例1を示した側面図である。
Example 1
FIG. 3 is a side view showing Example 1 of the transfer printing plate holding structure according to the present invention.
図示するように、本実施例1では、金型1は石英にて形成されており、幅50nm、長さ50〜100nmの凸型のドットパターンが形成されている。金型1の製造には、直径4インチ(100mm)で厚さが1.0mmの人工石英板を用いた。   As shown in the figure, in the first embodiment, the mold 1 is made of quartz, and a convex dot pattern having a width of 50 nm and a length of 50 to 100 nm is formed. For manufacturing the mold 1, an artificial quartz plate having a diameter of 4 inches (100 mm) and a thickness of 1.0 mm was used.
一方、応力衝撃緩衝材9は、シリコーンゴム弾性体にて形成されたOリング25から構成されている。シリコーンゴムの硬さはショア硬度で70である。Oリング25は、金型1の周縁部6の表裏両面に配置されるように、金型1の直径(100mm)よりも若干小さい径(90mm)に形成され、同心円上に配置されている。Oリング25は、断面円形に形成され、断面厚さは、直径で5.0mmである。   On the other hand, the stress shock absorbing material 9 is composed of an O-ring 25 formed of a silicone rubber elastic body. The silicone rubber has a Shore hardness of 70. The O-ring 25 is formed to have a diameter (90 mm) slightly smaller than the diameter (100 mm) of the mold 1 so as to be disposed on both the front and back surfaces of the peripheral edge 6 of the mold 1 and is disposed on a concentric circle. The O-ring 25 is formed in a circular cross section, and the cross-sectional thickness is 5.0 mm in diameter.
金型1の表裏両面に設けられたOリング25は、外枠部材7に形成された溝14内に金型1と共に嵌装される。このとき、Oリング25は、若干圧縮され、溝14内で、金型1を外枠部材7に狭持させる。   The O-rings 25 provided on both the front and back surfaces of the mold 1 are fitted together with the mold 1 in the groove 14 formed in the outer frame member 7. At this time, the O-ring 25 is slightly compressed, and the mold 1 is held between the outer frame member 7 in the groove 14.
この転写印刷版保持構造5によって、金型1を保持し、図8に示した光ナノインプリントリソグラフィ装置を用いて、被印刷体3にナノ印刷を行った。被印刷体3は、厚さ1.0mm、直径3インチ(75mm)のナノガラスである。   The mold 1 is held by the transfer printing plate holding structure 5, and nano-printing is performed on the substrate 3 using the optical nanoimprint lithography apparatus shown in FIG. 8. The substrate 3 is nanoglass having a thickness of 1.0 mm and a diameter of 3 inches (75 mm).
PMMA(ポリメチルメタクリレート)系の溶剤希釈型感光性樹脂(光硬化樹脂)を、被印刷体3上に10μmの厚さで塗布し、溶剤を乾燥させてから、被印刷体3を金型1に押圧させる。そして、波長365nmのUVランプを用いて、紫外線を感光性樹脂に5秒間照射した。紫外線の照射後、ステージ4を降下させて印刷を終了した。   A PMMA (polymethyl methacrylate) -based solvent-diluted photosensitive resin (photo-curing resin) is applied on the substrate 3 to a thickness of 10 μm, and the solvent is dried. To press. Then, using a UV lamp having a wavelength of 365 nm, the photosensitive resin was irradiated with ultraviolet rays for 5 seconds. After the ultraviolet irradiation, the stage 4 was lowered to finish printing.
紫外線を照射しているナノ印刷時のステージ4の上昇圧力は、常時加圧で0.01MPaである。この圧力は大気圧の略1/10に等しく、略0.10Kgf(0.98N)/cm2であるが、金型1は、ナノガラス(被印刷体3)に対して、平行に保たれ、均一な圧力で密着されていることが、紫外線照射前の目視によって確認できた。また、ナノガラスと金型1とが平行でない場合や圧力不均一の際に発生する感光性樹脂への気泡の混入は発生していなかった。また、金型1の破損は発生しなかった。 The rising pressure of the stage 4 at the time of nano printing which irradiates ultraviolet rays is 0.01 MPa by constant pressure. This pressure is equal to about 1/10 of the atmospheric pressure and is about 0.10 Kgf (0.98 N) / cm 2 , but the mold 1 is kept parallel to the nanoglass (printed body 3), It was confirmed by visual observation before ultraviolet irradiation that the contact was made with uniform pressure. In addition, bubbles were not mixed into the photosensitive resin when the nanoglass and the mold 1 were not parallel or when the pressure was not uniform. Further, the mold 1 was not damaged.
(実施例2)
図4は本発明に係る転写印刷版保持構造の実施例2を示した側面図である。
(Example 2)
FIG. 4 is a side view showing Example 2 of the transfer printing plate holding structure according to the present invention.
図示するように、本実施例2では、応力衝撃緩衝材9は、断面U字状の金属製板バネ26から構成されている。金属製板バネ26は、厚さ0.15mmのSUS316の板材を折り曲げ加工して形成されている。金属製板バネ26は、バネ材高さが5.0mm、バネの幅寸法が7.0mmである。金属製板バネ26は、金型1の周縁部6の表裏両面に配置されるように、金型1の直径(100mm)よりも若干小さい径(90mm)のリング状に折り曲げて形成され、同心円上に配置されている。   As shown in the figure, in Example 2, the stress shock absorbing material 9 is composed of a metal leaf spring 26 having a U-shaped cross section. The metal leaf spring 26 is formed by bending a SUS316 plate material having a thickness of 0.15 mm. The metal leaf spring 26 has a spring material height of 5.0 mm and a spring width dimension of 7.0 mm. The metal leaf spring 26 is formed by being bent into a ring shape having a diameter (90 mm) slightly smaller than the diameter (100 mm) of the mold 1 so as to be disposed on both the front and back surfaces of the peripheral edge 6 of the mold 1. Is placed on top.
金型1の表裏両面に設けられた金属製板バネ26は、外枠部材7に形成された溝14内に金型1と共に嵌装される。このとき、金属製板バネ26は、若干圧縮され、溝14内で、金型1を外枠部材7に狭持させる。   Metal plate springs 26 provided on both the front and back surfaces of the mold 1 are fitted together with the mold 1 in the groove 14 formed in the outer frame member 7. At this time, the metal leaf spring 26 is slightly compressed, and the mold 1 is held between the outer frame member 7 in the groove 14.
本実施例2においても、実施例1と同様に、被印刷体3と金型1との間には、気泡の発生もなく、均一な印刷ができるといった作用効果が得られた。   Also in the second embodiment, as in the first embodiment, there is an effect that uniform printing can be performed without generation of bubbles between the printing medium 3 and the mold 1.
(実施例3)
図5は本発明に係る転写印刷版保持構造の実施例3を示した側面図である。
Example 3
FIG. 5 is a side view showing Embodiment 3 of the transfer printing plate holding structure according to the present invention.
図示するように、本実施例3では、応力衝撃緩衝材9は、シリコーンゴム弾性体にて形成され内周面に溝28を備えた緩衝リング27から構成されている。シリコーンゴムの硬さはショア硬度で70である。緩衝リング27の厚さは5mmである。   As shown in the figure, in Example 3, the stress shock absorbing material 9 is composed of a buffer ring 27 formed of a silicone rubber elastic body and having a groove 28 on the inner peripheral surface. The silicone rubber has a Shore hardness of 70. The thickness of the buffer ring 27 is 5 mm.
溝28に金型1の周縁部6を嵌装させて固定すると共に、緩衝リング27の周縁部29を外枠部材7に形成された溝14内に嵌装させて、金型1を外枠部材7に保持させるようになっている。   The peripheral edge 6 of the mold 1 is fitted and fixed in the groove 28, and the peripheral edge 29 of the buffer ring 27 is fitted in the groove 14 formed in the outer frame member 7, so that the mold 1 is attached to the outer frame. The member 7 is made to hold.
緩衝リング27の幅寸法(金型1の周縁部6と外枠部材7の内周面31との距離)は、5mmである。この幅寸法を変えることで、緩衝機能を調節することができる。すなわち、幅寸法を長くすると緩衝機能を高くでき、幅寸法を短くすると緩衝機能を低くできる。   The width dimension of the buffer ring 27 (the distance between the peripheral edge 6 of the mold 1 and the inner peripheral surface 31 of the outer frame member 7) is 5 mm. The buffer function can be adjusted by changing the width dimension. That is, if the width dimension is increased, the buffer function can be increased, and if the width dimension is decreased, the buffer function can be decreased.
本実施例3によれば、実施例1と同様に、被印刷体3と金型1との間には、気泡の発生もなく、均一な印刷ができるといった作用効果が得られる他に、緩衝リング27の厚さを薄くできることで、転写印刷版保持構造5の薄型化を達成できる。   According to the third embodiment, in the same way as the first embodiment, there is no air bubbles between the printing medium 3 and the mold 1, and the effect of uniform printing can be obtained. Since the thickness of the ring 27 can be reduced, the transfer printing plate holding structure 5 can be thinned.
(実施例4)
図6は本発明に係る転写印刷版保持構造の実施例4を示した側面図である。
Example 4
FIG. 6 is a side view showing Embodiment 4 of the transfer printing plate holding structure according to the present invention.
図示するように、本実施例4では、応力衝撃緩衝材9は、ポリカーボネート樹脂等の紫外線透過可能な材料で円盤状に形成された緩衝シート32から構成されている。ポリカーボネート樹脂は、厚さ0.15mmの板材が用いられている。緩衝シート32は、厚さが薄いので柔軟性を有している。この緩衝シート32の下面には、フッ素系の接着剤で金型1が接着されている。そして、緩衝シート32の周縁部33を外枠部材7に形成された溝14内に嵌装させて、金型1を外枠部材7に保持させている。   As shown in the figure, in the present Example 4, the stress shock absorbing material 9 is composed of a buffer sheet 32 formed in a disk shape with an ultraviolet ray transmissive material such as polycarbonate resin. As the polycarbonate resin, a plate material having a thickness of 0.15 mm is used. Since the buffer sheet 32 is thin, it has flexibility. The mold 1 is bonded to the lower surface of the buffer sheet 32 with a fluorine-based adhesive. Then, the peripheral edge 33 of the buffer sheet 32 is fitted into the groove 14 formed in the outer frame member 7, and the mold 1 is held by the outer frame member 7.
ポリカーボネート樹脂は、波長365nm付近では、紫外線透過率は30%程度であるが、波長400nm付近では90%の透過率を持っているので、紫外線ランプの波長を変えることによって、十分に応力衝撃緩衝材9として使用することが可能となる。   The polycarbonate resin has an ultraviolet transmittance of about 30% near the wavelength of 365 nm, but has a transmittance of 90% near the wavelength of 400 nm. Therefore, by changing the wavelength of the ultraviolet lamp, a sufficient stress shock absorbing material can be obtained. 9 can be used.
上記構成によれば、実施例1と同様に、被印刷体3と金型1との間には、気泡の発生もなく、均一な印刷ができるといった作用効果が得られる他に、緩衝シート32の厚さを薄くできることで、転写印刷版保持構造5の薄型化を達成できる。   According to the above configuration, in the same manner as in the first embodiment, the buffer sheet 32 can be obtained in addition to the effect that uniform printing can be performed without generation of bubbles between the printing medium 3 and the mold 1. Since the thickness of the transfer printing plate holding structure 5 can be reduced, the thickness of the transfer printing plate holding structure 5 can be reduced.
(実施例5)
本実施例5では、実施例4で用いた緩衝シート32を、金型1と同じ材料の人工石英板を用いて形成している。人工石英板の厚さは0.1mmである。人工石英板は通常硬いが、0.1mmの厚さであるので、緩衝材として十分な柔軟性を有し、緩衝作用を得ることができる。
(Example 5)
In the fifth embodiment, the buffer sheet 32 used in the fourth embodiment is formed using an artificial quartz plate made of the same material as the mold 1. The thickness of the artificial quartz plate is 0.1 mm. The artificial quartz plate is usually hard, but has a thickness of 0.1 mm, so that it has sufficient flexibility as a buffer material and can provide a buffering action.
人工石英の紫外線透過率は92%であるので、緩衝シート32として用いる場合に、紫外線の減衰が起こらないといった利点がある。   Since the artificial quartz has an ultraviolet transmittance of 92%, when it is used as the buffer sheet 32, there is an advantage that no ultraviolet attenuation occurs.
ここで、金型1そのものを薄くして緩衝機能を持たせることも考えられるが、金型1を薄くすると、金型1自体の反りが大きくなるばかりではなく、被印刷体3であるナノガラスを金型1に押し当てたときに湾曲し、平坦性が維持できないという欠点があるため、不可能である。   Here, it is conceivable that the mold 1 itself is thinned to have a buffering function. However, when the mold 1 is thinned, not only the warpage of the mold 1 itself is increased, but also the nano glass that is the substrate 3 is printed. This is impossible because it has a drawback that it is curved when pressed against the mold 1 and the flatness cannot be maintained.
金型1の平坦度を確保するには、人工石英板の厚さは0.5mm以上が必要である。   In order to secure the flatness of the mold 1, the thickness of the artificial quartz plate needs to be 0.5 mm or more.
上記構成によれば、紫外線ランプの波長を調節することなく、実施例4と同様の作用効果を得ることができる。   According to the said structure, the effect similar to Example 4 can be acquired, without adjusting the wavelength of an ultraviolet lamp.
(実施例6)
本実施例6では、実施例1におけるOリング25を、フッ素ゴムにて形成している。フッ素ゴムは紫外線耐久性が、有機材料の中では最も優れており、紫外線を用いる光ナノインプリントリソグラフィ装置の構成材料としては、非常に適している。
(Example 6)
In the sixth embodiment, the O-ring 25 in the first embodiment is made of fluororubber. Fluororubber has the highest ultraviolet durability among organic materials, and is very suitable as a constituent material of an optical nanoimprint lithography apparatus using ultraviolet rays.
本実施例6においても、実施例1と同様の作用効果を得ることができる。   Also in the sixth embodiment, the same effect as that of the first embodiment can be obtained.
(実施例7)
図7は本発明に係る転写印刷版保持構造の実施例7を示した側面図である。
(Example 7)
FIG. 7 is a side view showing a seventh embodiment of the transfer printing plate holding structure according to the present invention.
図示するように、本実施例7では、実施例4における緩衝シート32を、フッ素樹脂(PTFE)の繊維で加工したメッシュ状の布で構成した。フッ素樹脂製のメッシュ加工品としては、ジャパンゴア社から市販されているゴアテックス(登録商標)を採用している。ゴアテックスは、フッ素樹脂の繊維を三次元網目構造に加工したものであり、網目を通して紫外線が透過できる他、フッ素樹脂自体が紫外線をある程度透過させることができる。また、ゴアテックスは紫外線に対する耐久性が非常に高い。さらに、三次元網目構造なので弾力性に富んでおり、緩衝材としては、非常に適している。このゴアテックスからなる緩衝シート32への金型1の取付は、実施例4と同様にフッ素系接着剤を用いて接着している。   As shown in the figure, in Example 7, the buffer sheet 32 in Example 4 was configured with a mesh-like cloth processed with a fiber of fluororesin (PTFE). As a fluororesin mesh processed product, Gore-Tex (registered trademark) commercially available from Japan Gore is adopted. Gore-Tex is made by processing fluororesin fibers into a three-dimensional network structure. In addition to being able to transmit ultraviolet rays through the mesh, the fluororesin itself can transmit ultraviolet rays to some extent. In addition, Gore-Tex is extremely durable against ultraviolet rays. Furthermore, since it has a three-dimensional network structure, it is rich in elasticity and is very suitable as a cushioning material. The die 1 is attached to the buffer sheet 32 made of Gore-Tex as in Example 4 using a fluorine-based adhesive.
上記構成によれは、実施例1と同様の作用効果を得ることができると共に、紫外線耐久性を向上することができる。   According to the above configuration, it is possible to obtain the same effects as those of the first embodiment and improve the ultraviolet durability.
本発明に係る転写印刷版保持構造の好適な実施の形態を示した側面図である。It is the side view which showed suitable embodiment of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の好適な他の実施の形態を示した側面図である。It is the side view which showed other suitable embodiment of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の実施例1を示した側面図である。It is the side view which showed Example 1 of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の実施例2を示した側面図である。It is the side view which showed Example 2 of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の実施例3を示した側面図である。It is the side view which showed Example 3 of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の実施例4を示した側面図である。It is the side view which showed Example 4 of the transfer printing plate holding structure which concerns on this invention. 本発明に係る転写印刷版保持構造の実施例7を示した側面図である。It is the side view which showed Example 7 of the transfer printing plate holding structure which concerns on this invention. 光ナノインプリントリソグラフィ装置を示した側面図である。It is the side view which showed the optical nanoimprint lithography apparatus. 従来の転写印刷版保持構造を示した側面図である。It is the side view which showed the conventional transfer printing plate holding structure.
符号の説明Explanation of symbols
1 金型(転写印刷版)
3 被印刷体
5 転写印刷版保持構造
6 (金型の)周縁部
7 外枠部材
9 応力衝撃緩衝材
14 (外枠部材の)溝
25 Oリング
26 金属製板バネ
27 緩衝リング
28 (緩衝リングの)溝
32 緩衝シート
33 (緩衝シートの)周縁部

1 Mold (transfer printing plate)
DESCRIPTION OF SYMBOLS 3 To-be-printed body 5 Transfer printing plate holding structure 6 Peripheral part (of mold) 7 Outer frame member 9 Stress shock absorbing material 14 Groove (outer frame member) Groove 25 O ring 26 Metal leaf spring 27 Buffer ring 28 (Buffer ring) Groove 32 Buffer sheet 33 Perimeter of buffer sheet

Claims (8)

  1. 石英、シリコンまたは樹脂などの材料からなり凹凸の溝を形成した転写印刷版を外枠部材で保持し、その転写印刷版を被印刷体に押圧して印刷するための転写印刷版保持構造において、上記外枠部材に、応力衝撃緩衝材を介して上記転写印刷版を保持させたことを特徴とする転写印刷版保持構造。   In a transfer printing plate holding structure for holding a transfer printing plate made of a material such as quartz, silicon, or resin and forming a concave and convex groove with an outer frame member and pressing the transfer printing plate against a substrate to be printed, A transfer printing plate holding structure, wherein the outer frame member holds the transfer printing plate via a stress shock absorbing material.
  2. 上記外枠部材に上記応力衝撃緩衝材を取り付けると共に、その応力衝撃緩衝材を上記転写印刷版の周縁部の表裏両面またはいずれか一方の面或いは周縁部側面に接するように設けて、上記転写印刷版を上記外枠部材に保持させた請求項1記載の転写印刷版保持構造。   The stress shock absorbing material is attached to the outer frame member, and the stress shock absorbing material is provided so as to be in contact with both the front and back surfaces of the peripheral portion of the transfer printing plate, or either one surface or the peripheral surface, and the transfer printing. The transfer printing plate holding structure according to claim 1, wherein the plate is held on the outer frame member.
  3. 上記応力衝撃緩衝材は、バネやゴムなどの弾性体にて形成された請求項1または2記載の転写印刷版保持構造。   3. The transfer printing plate holding structure according to claim 1, wherein the stress shock absorbing material is formed of an elastic body such as a spring or rubber.
  4. 上記応力衝撃緩衝材は、シリコーンゴム弾性体にて形成されたOリングからなり、上記転写印刷版の周縁部の表裏両面に配置され、上記外枠部材に形成された溝内に上記転写印刷版と共に嵌装させて、上記転写印刷版を上記外枠部材に保持させた請求項1〜3いずれかに記載の転写印刷版保持構造。   The stress shock absorbing material is formed of an O-ring formed of a silicone rubber elastic body, and is disposed on both front and back surfaces of the peripheral portion of the transfer printing plate, and the transfer printing plate is placed in a groove formed in the outer frame member. The transfer printing plate holding structure according to any one of claims 1 to 3, wherein the transfer printing plate is held together with the outer frame member.
  5. 上記応力衝撃緩衝材は、断面U字状の金属製板バネからなり、上記転写印刷版の表裏両面に配置され、上記外枠部材に形成された溝内に上記転写印刷版と共に嵌装させて、上記転写印刷版を上記外枠部材に保持させた請求項1〜3いずれかに記載の転写印刷版保持構造。   The stress shock absorbing material is made of a metal leaf spring having a U-shaped cross section, arranged on both the front and back surfaces of the transfer printing plate, and fitted together with the transfer printing plate in grooves formed in the outer frame member. The transfer printing plate holding structure according to claim 1, wherein the transfer printing plate is held by the outer frame member.
  6. 上記応力衝撃緩衝材は、シリコーンゴム弾性体にて形成され内周面に溝を備えた緩衝リングからなり、上記溝に上記転写印刷版の周縁部を嵌装させて固定すると共に、上記緩衝リングの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させた請求項1〜3いずれかに記載の転写印刷版保持構造。   The stress shock absorbing material comprises a buffer ring formed of a silicone rubber elastic body and provided with a groove on the inner peripheral surface, and the peripheral edge portion of the transfer printing plate is fitted and fixed in the groove. The transfer printing plate holding structure according to any one of claims 1 to 3, wherein the transfer printing plate is held by the outer frame member by fitting a peripheral edge portion of the transfer printing plate into a groove formed in the outer frame member.
  7. 上記応力衝撃緩衝材は、ポリカーボネート樹脂等の紫外線透過可能な材料で円盤状に形成された緩衝シートからなり、この緩衝シートの下面に上記転写印刷版を取り付け、緩衝シートの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させた請求項1〜3いずれかに記載の転写印刷版保持構造。   The stress shock absorbing material is made of a buffer sheet formed in a disk shape with a material capable of transmitting ultraviolet light such as polycarbonate resin, the transfer printing plate is attached to the lower surface of the buffer sheet, and the periphery of the buffer sheet is attached to the outer frame. The transfer printing plate holding structure according to any one of claims 1 to 3, wherein the transfer printing plate is held in the outer frame member by being fitted into a groove formed in the member.
  8. 上記応力衝撃緩衝材は、人工石英板にて形成された薄板状の緩衝シートからなり、この緩衝シートの下面に上記転写印刷版を取り付け、緩衝シートの周縁部を上記外枠部材に形成された溝内に嵌装させて、上記転写印刷版を上記外枠部材に保持させた請求項1〜3いずれかに記載の転写印刷版保持構造。

    The stress shock absorbing material is made of a thin plate-like buffer sheet formed of an artificial quartz plate, the transfer printing plate is attached to the lower surface of the buffer sheet, and the peripheral portion of the buffer sheet is formed on the outer frame member. The transfer printing plate holding structure according to claim 1, wherein the transfer printing plate is fitted in a groove and held by the outer frame member.

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JP2008023868A (en) * 2006-07-21 2008-02-07 Hitachi High-Technologies Corp Transfer method and transfer apparatus for energy ray-hardening resin, and disk or semiconductor device
JP2008073902A (en) * 2006-09-20 2008-04-03 Dainippon Printing Co Ltd Mold and method for producing mold
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