WO2007032222A1 - スルーホールを有するプリント配線基板への無電解めっき用触媒、及びその触媒を用いて処理されたスルーホールを有するプリント配線基板 - Google Patents

スルーホールを有するプリント配線基板への無電解めっき用触媒、及びその触媒を用いて処理されたスルーホールを有するプリント配線基板 Download PDF

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Publication number
WO2007032222A1
WO2007032222A1 PCT/JP2006/317461 JP2006317461W WO2007032222A1 WO 2007032222 A1 WO2007032222 A1 WO 2007032222A1 JP 2006317461 W JP2006317461 W JP 2006317461W WO 2007032222 A1 WO2007032222 A1 WO 2007032222A1
Authority
WO
WIPO (PCT)
Prior art keywords
compound
hole
catalyst
printed wiring
electroless plating
Prior art date
Application number
PCT/JP2006/317461
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Toshifumi Kawamura
Toru Imori
Original Assignee
Nippon Mining & Metals Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mining & Metals Co., Ltd. filed Critical Nippon Mining & Metals Co., Ltd.
Priority to JP2007535424A priority Critical patent/JP4889045B2/ja
Publication of WO2007032222A1 publication Critical patent/WO2007032222A1/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
    • C23C18/18—Pretreatment of the material to be coated
    • C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
    • C23C18/28—Sensitising or activating
    • C23C18/30—Activating or accelerating or sensitising with palladium or other noble metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/02—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides
    • B01J31/12—Catalysts comprising hydrides, coordination complexes or organic compounds containing organic compounds or metal hydrides containing organo-metallic compounds or metal hydrides
    • B01J31/123—Organometallic polymers, e.g. comprising C-Si bonds in the main chain or in subunits grafted to the main chain
    • B01J31/124—Silicones or siloxanes or comprising such units
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J31/00—Catalysts comprising hydrides, coordination complexes or organic compounds
    • B01J31/16—Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes
    • B01J31/18—Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes containing nitrogen, phosphorus, arsenic or antimony as complexing atoms, e.g. in pyridine ligands, or in resonance therewith, e.g. in isocyanide ligands C=N-R or as complexed central atoms
    • B01J31/1805—Catalysts comprising hydrides, coordination complexes or organic compounds containing coordination complexes containing nitrogen, phosphorus, arsenic or antimony as complexing atoms, e.g. in pyridine ligands, or in resonance therewith, e.g. in isocyanide ligands C=N-R or as complexed central atoms the ligands containing nitrogen
    • B01J31/181—Cyclic ligands, including e.g. non-condensed polycyclic ligands, comprising at least one complexing nitrogen atom as ring member, e.g. pyridine
    • B01J31/1815—Cyclic ligands, including e.g. non-condensed polycyclic ligands, comprising at least one complexing nitrogen atom as ring member, e.g. pyridine with more than one complexing nitrogen atom, e.g. bipyridyl, 2-aminopyridine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/422—Plated through-holes or plated via connections characterised by electroless plating method; pretreatment therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J2531/00—Additional information regarding catalytic systems classified in B01J31/00
    • B01J2531/80—Complexes comprising metals of Group VIII as the central metal
    • B01J2531/82—Metals of the platinum group
    • B01J2531/824—Palladium
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0716—Metallic plating catalysts, e.g. for direct electroplating of through holes; Sensitising or activating metallic plating catalysts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane
PCT/JP2006/317461 2005-09-15 2006-09-04 スルーホールを有するプリント配線基板への無電解めっき用触媒、及びその触媒を用いて処理されたスルーホールを有するプリント配線基板 WO2007032222A1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007535424A JP4889045B2 (ja) 2005-09-15 2006-09-04 スルーホールを有するプリント配線基板への無電解めっき用触媒、及びその触媒を用いて処理されたスルーホールを有するプリント配線基板

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005268167 2005-09-15
JP2005-268167 2005-09-15

Publications (1)

Publication Number Publication Date
WO2007032222A1 true WO2007032222A1 (ja) 2007-03-22

Family

ID=37864821

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/317461 WO2007032222A1 (ja) 2005-09-15 2006-09-04 スルーホールを有するプリント配線基板への無電解めっき用触媒、及びその触媒を用いて処理されたスルーホールを有するプリント配線基板

Country Status (4)

Country Link
JP (2) JP4889045B2 (ko)
KR (1) KR100970067B1 (ko)
TW (1) TWI331173B (ko)
WO (1) WO2007032222A1 (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010029635A1 (ja) * 2008-09-11 2012-02-02 パイオニア株式会社 金属配線の形成方法、及び金属配線を備えた電子部品

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11189880A (ja) * 1997-10-21 1999-07-13 Nippon Techno Kk めっき方法
JPH11204943A (ja) * 1998-01-08 1999-07-30 Hitachi Ltd 電子回路基板およびその製造方法
JP2000212754A (ja) * 1999-01-22 2000-08-02 Sony Corp めっき方法及びその装置、並びにめっき構造
JP2001073157A (ja) * 1999-09-08 2001-03-21 Sony Corp 無電解めっき方法及びその装置
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
JP2005213576A (ja) * 2004-01-29 2005-08-11 Nikko Materials Co Ltd 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2513270B2 (ja) * 1988-05-06 1996-07-03 日立化成工業株式会社 無電解めっき用触媒溶液
WO2001049898A1 (fr) * 2000-01-07 2001-07-12 Nikko Materials Co., Ltd. Procede de galvanoplastie, agent de pretraitement et tranche de semi-conducteurs et dispositif semi-conducteur utilisant cette derniere

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11189880A (ja) * 1997-10-21 1999-07-13 Nippon Techno Kk めっき方法
JPH11204943A (ja) * 1998-01-08 1999-07-30 Hitachi Ltd 電子回路基板およびその製造方法
JP2000212754A (ja) * 1999-01-22 2000-08-02 Sony Corp めっき方法及びその装置、並びにめっき構造
JP2001073157A (ja) * 1999-09-08 2001-03-21 Sony Corp 無電解めっき方法及びその装置
WO2001081652A1 (fr) * 2000-04-25 2001-11-01 Nikko Materials Co., Ltd. Agent de pretraitement pour revetement metallique
JP2005213576A (ja) * 2004-01-29 2005-08-11 Nikko Materials Co Ltd 無電解めっき前処理剤、それを用いる無電解めっき方法、及び無電解めっき物

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2010029635A1 (ja) * 2008-09-11 2012-02-02 パイオニア株式会社 金属配線の形成方法、及び金属配線を備えた電子部品

Also Published As

Publication number Publication date
JP2011091427A (ja) 2011-05-06
JP4889045B2 (ja) 2012-02-29
TW200714745A (en) 2007-04-16
KR20080048043A (ko) 2008-05-30
TWI331173B (en) 2010-10-01
KR100970067B1 (ko) 2010-07-16
JPWO2007032222A1 (ja) 2009-03-19

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