WO2007029474A1 - Processus de fabrication de panneau electroluminescent organique - Google Patents

Processus de fabrication de panneau electroluminescent organique Download PDF

Info

Publication number
WO2007029474A1
WO2007029474A1 PCT/JP2006/316291 JP2006316291W WO2007029474A1 WO 2007029474 A1 WO2007029474 A1 WO 2007029474A1 JP 2006316291 W JP2006316291 W JP 2006316291W WO 2007029474 A1 WO2007029474 A1 WO 2007029474A1
Authority
WO
WIPO (PCT)
Prior art keywords
organic
sealing member
layer
flexible sealing
light emitting
Prior art date
Application number
PCT/JP2006/316291
Other languages
English (en)
Japanese (ja)
Inventor
Masaaki Murayama
Nobuhiko Takashima
Original Assignee
Konica Minolta Holdings, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Konica Minolta Holdings, Inc. filed Critical Konica Minolta Holdings, Inc.
Priority to JP2007534307A priority Critical patent/JPWO2007029474A1/ja
Publication of WO2007029474A1 publication Critical patent/WO2007029474A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/311—Flexible OLED
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/871—Self-supporting sealing arrangements
    • H10K59/872—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour

Definitions

  • the present invention relates to a method for producing an organic electoluminescence panel (hereinafter also referred to as an organic EL panel).
  • organic-electric-luminescence devices that use organic materials are promising for use as solid light-emitting inexpensive large-area full-color display devices and writing light source arrays. Active research and development is underway.
  • the organic EL element includes a first electrode (anode or cathode) formed on a substrate, an organic compound layer (single layer portion or multilayer portion) containing an organic light emitting material laminated thereon, that is, a light emitting layer, This is a thin film element having a second electrode (cathode or anode) laminated on the light emitting layer.
  • the organic EL element is a thin film type element
  • a surface light source such as a backlight.
  • the liquid crystal display device has high visibility and no viewing angle dependency. There are advantages that cannot be obtained.
  • the structure of the organic EL panel is explained in Fig. 10.
  • FIG. 10 is a schematic cross-sectional view showing an example of the layer configuration of an organic EL panel.
  • the organic EL panel 1 indicates an organic EL panel.
  • the organic EL panel 1 includes an anode (first electrode) 102, a hole transport layer (hole injection layer) 103, an organic compound layer (light emitting layer) 104, an electron injection layer 105, and a substrate 101.
  • the cathode (second electrode) 106, the adhesive layer 107, and the flexible sealing member 108 are provided in this order.
  • anode 102 and hole transport A hole injection layer may be provided between the layers 103.
  • an electron transport layer (not shown) may be provided between the cathode 106, the organic compound layer (light emitting layer) 104, and the electron injection layer 105.
  • a gas noria film (not shown) may be provided between the anode 102 and the substrate 101.
  • the layer configuration of the organic EL panel shown in this figure is an example.
  • the other typical configurations of organic EL panels include the following configurations.
  • the state in which at least the first electrode layer, the organic compound layer including the light emitting layer, and the second electrode layer are sequentially laminated on the substrate is referred to as an organic EL element, and is covered with a sealing member. Is called an OLED panel.
  • the first electrode (anode) 102 side is usually the observation side, and the first electrode (anode) 102 includes ITO (a mixture of tin oxide and indium oxide), IZO (with zinc oxide). Indium oxide mixture), ZnO, SnO, InO and the like are known. Above all, ITO electrode is 90% or more
  • the above high light transmittance and low sheet resistance of 10 ⁇ or less are possible, and it is also used as a transparent electrode for liquid crystal displays and solar cells.
  • the IZO electrode has an advantage that a predetermined low resistance value can be obtained without heating the substrate during formation, and the film surface is smoother than the ITO electrode.
  • JP-A-5-182759 and JP-A-5-36475 disclose an EL element in a dry nitrogen atmosphere by using a metal or glass sealing can. Is described. However, since glass or metal sealing cans are used, there was a limit to making the organic EL panel thin and light.
  • a step of encapsulating a desiccant inside the airtight case, a step of applying a photocurable resin to the airtight case, a step of bonding the translucent substrate and the airtight case, a photocurable case There was a problem in terms of productivity and manufacturing cost because there was a process to cure the fat.
  • the thin and light weight is excellent by sealing with a film having a high noria property such as a metal foil.
  • Methods for obtaining organic EL panels have been studied. For example, at least a transparent anode layer, a light emitting medium layer, and a cathode layer are sequentially laminated on a translucent substrate, and this is covered with a moisture-resistant film composed of a barrier layer and a sealant layer made of a thermoplastic adhesive resin.
  • An electroluminescent element (corresponding to the organic EL panel of the present invention) is known (for example, see Patent Document 1).
  • Patent Document 1 has the following drawbacks. 1) Since a moisture resistant film is bonded to each organic EL element, it is difficult to align the moisture resistant film. 2) The moisture-resistant film becomes smaller because it matches the size of the organic EL element, and it becomes difficult to apply a stable tension to the moisture-resistant film when attaching the moisture-resistant film. U, difficult to prevent the occurrence of wrinkles. 3) Productivity is low because a moisture-resistant film is bonded to each organic EL element.
  • a transfer material (sealing member) having a transferable metal foil having an adhesive layer patterned in a predetermined shape on a base material is used. Many pieces are made A method of coating the organic EL element with a metal foil is known (see, for example, Patent Document 2).
  • Patent Document 1 JP 2001-307871 A
  • Patent Document 2 Japanese Patent Application Laid-Open No. 2004-303528
  • the present invention has been made in view of the above situation, and an object of the present invention is to prevent the occurrence of a secondary failure due to the provision of a flexible sealing member for suppressing the occurrence of dark spots, thereby increasing the cost. No measures or production capacity measures are required, and the lifetime of the light-emitting layer can be extended, and a thin and light-weight organic EL panel manufacturing method can be provided.
  • a manufacturing apparatus including a step of sequentially forming at least a first electrode layer, an organic compound layer including a light emitting layer, a second electrode layer, and a sealing layer on a substrate.
  • Organic electroluminescence by bonding a flexible sealing member on the organic electroluminescence device formed by sequentially stacking at least the first electrode layer, the organic compound layer, and the second electrode layer.
  • the sealing layer forming step for forming the sealing layer includes a bonding step of a flexible sealing member and a cutting step, and the flexible sealing member is formed in the bonding step.
  • the flexible sealing member is supplied as a sheet-like flexible sealing member, and at least one of the sheet-like flexible sealing members is replaced with at least one organic sealing member.
  • the flexible sealing member is supplied as a strip-shaped flexible sealing member, and the strip-shaped flexible sealing member is bonded onto at least one organic electoluminescence device.
  • the sealing layer forming step includes a sealing agent curing step before or after the cutting step, according to any one of (1) to (3), Manufacturing method of organic-elect mouth luminescence panel.
  • the flexible sealing member has a multilayer structure having a flexible resin film as a support and a barrier layer, (1) to (7) ) A method for producing a recto-luminescence panel. The invention's effect
  • FIG. 1 is a schematic view showing an example of a process for producing an organic EL panel in the case where a belt-like film is used as a base material.
  • FIG. 2 is a schematic view of a method for producing an organic EL panel using a single-wafer sheet substrate.
  • FIG. 3 is a schematic view showing a state of an organic EL element formed on a support.
  • ⁇ 4 It is a schematic diagram showing a state in which a sealant is coated on the organic EL element side in order to bond a flexible sealing member on the organic EL element without having a sealant layer (sealant).
  • FIG. 5 is an enlarged schematic view of a portion indicated by Q in FIG.
  • FIG. 6 is a schematic enlarged perspective view of a portion indicated by R in FIG. 1.
  • FIG. 7 is a schematic view of a punching blade of the punching and cutting apparatus shown in FIG.
  • FIG. 8 is an enlarged schematic view of a portion indicated by S in FIG.
  • FIG. 9 is a schematic view of a bonding / punching cutting device in which a bonding device and a punching cutting device are combined.
  • FIG. 10 is a schematic cross-sectional view showing an example of the layer structure of an organic EL panel.
  • FIG. 1 is a schematic view showing an example of a process for producing an organic EL panel in the case where a belt-like film is used as a base material.
  • This figure shows what is called roll-to-roll, in which excess portions of the bonded flexible sealing member are punched and removed in a roll shape, and the organic EL panel is also wound up and collected in a roll shape. Show the case of the production method.
  • the manufacturing apparatus 2 indicates a manufacturing apparatus for producing an organic EL panel.
  • the manufacturing apparatus 2 includes an organic compound layer forming step 3, a cathode layer forming step 4, a flexible sealing member bonding step 5, a punching and cutting step 6, and a recovery step 7.
  • the organic compound layer forming step 3 includes a strip-shaped flexible support supply section 301, a strip-shaped flexible support cleaning surface modification processing section 302, a first coating / drying section 303, 1 has a heat treatment section 304, a second charge removal processing section 305, and a second application / drying section 306.
  • a strip-shaped flexible support A301b in which a gas barrier film and an anode layer including a first electrode are already formed in this order is wound around a winding core, and a roll-shaped flexible support 301a is formed.
  • a strip-shaped flexible support A301b in which a gas barrier film and an anode layer including a first electrode are already formed in this order is wound around a winding core, and a roll-shaped flexible support 301a is formed.
  • the cleaning surface modification processing unit 302 cleans and improves the surface of the anode layer (not shown) of the strip-shaped flexible support A301b sent from the supply unit 301 before applying the organic compound layer forming coating solution.
  • the first coating and drying unit 303 includes a knock-up roll 303a that holds the strip-shaped flexible support A301b, and a first organic compound layer formed on the strip-shaped flexible support A301b that is held by the knock-up roll 303a.
  • First wet coater 303b that coats the coating liquid excluding a part that becomes an external extraction electrode, and a first organic compound layer 301c formed on an anode layer (not shown) on the strip-shaped flexible support A301b
  • 304 is The 1st heat processing part is shown.
  • Reference numeral 305 denotes second neutralization processing means for neutralizing the formed first organic compound layer 301c.
  • the first organic compound layer forming coating solution refers to the hole transport layer forming coating solution
  • the first organic compound layer 301c refers to the hole transport layer
  • the second coating and drying unit 306 includes a first accumulator unit 306a, a pattern coating unit 306b,
  • the first accumulator unit 306a is configured such that the roll 306ala moves in the vertical direction (in the direction of the arrow in the figure), so that the difference in conveying speed between the first application 'drying unit 303 and the second application' drying unit 306 is achieved.
  • the roll 306al can be added according to the speed difference.
  • the pattern application part 306b has a holding base 306b2 for the belt-like flexible support on which the hole transport layer 301c is formed, and a coating liquid for forming a light emitting layer on the hole transport layer 301c in accordance with the pattern of the first electrode. And a wet pattern formation coating apparatus 306bl for pattern coating under atmospheric pressure conditions.
  • the light emitting layer drying unit 306c has a function of removing the solvent in the light emitting layer under atmospheric pressure conditions, and has the same configuration as the first drying device 303c.
  • the holding base 306b2 is not particularly limited as long as the belt-like flexible support can be fixed while maintaining flatness, and is preferably fixed by, for example, an adsorption method.
  • the pattern coating unit 306b is provided on the belt-like flexible support A on which the hole transport layer transported from the previous process is formed.
  • Alignment mark 10c (see Fig. 3) is detected by the detector of the alignment detection means disposed in the pattern application unit 306b, and the belt-like flexible support A on which the hole transport layer is formed is held on the holding base.
  • the wet pattern forming coating device 306bl is aligned according to the alignment mark, and is aligned with the pattern of the first electrode except for a part of the end of the first electrode formed by patterning. Then, a light emitting layer forming coating solution is applied onto the electrode.
  • the neutralization processing unit 306e has a function of performing static neutralization on the belt-like flexible support on which the light emitting layer is formed and preventing a failure due to static electricity in the next step, and is disposed as necessary. Becomes possible It is. It is preferable that the charge removal processing unit 306e uses the same charge removal processing unit as the charge removal processing unit used in the first coating / drying unit 303.
  • the second accumulator unit 306f adjusts the difference in conveyance speed between the pattern coating / drying unit 306 and the collection unit 306g by moving the roll 306fl in the vertical direction (the direction of the arrow in the figure).
  • the roll 306fl can be added according to the speed difference.
  • the second accumulator unit 306f has the same configuration as the first accumulator unit 306a.
  • the belt-like flexible support B301f on which the light emitting layer is formed is cooled to room temperature with a cooling device (not shown) and then wound up.
  • the cathode layer formation step 4 includes a material supply unit 401, a first cathode layer formation unit 402, a second cathode layer formation unit 403, and a second winding unit 404, and the supply unit From 401 to the recovery unit 404 is carried out continuously under reduced pressure conditions.
  • an anode, a hole transport layer, and an organic compound layer (light emitting layer) are formed on the belt-like flexible support manufactured by the manufacturing apparatus 3, and wound around the winding core.
  • the roll-shaped strip-shaped flexible support B301f thus taken is supplied.
  • the electron injection layer 301g is formed in the first cathode layer forming unit 402. It is formed.
  • 402a represents a vapor deposition apparatus, and 402b represents an evaporation source container.
  • the cathode layer 301h of the second electrode is formed on the electron injection layer 301g formed in the first cathode layer forming unit 402.
  • Reference numeral 403a denotes a vapor deposition apparatus
  • reference numeral 403b denotes an evaporation source container.
  • the strip-shaped flexible support C301i formed by the second cathode layer forming unit 403 in a state where the cathode layer 301h of the second electrode is orthogonal to the first electrode is wound around the winding core by the recovery unit 404 and can be rolled.
  • a flexible support C301j is obtained.
  • the flexible sealing member bonding step 5 includes a supply unit 501 for a roll-shaped strip-shaped flexible support C301j in which up to 30 lh of the cathode layer of the second electrode is formed, and a sealant coating unit 502. And a flexible sealing member supply portion 503 and a flexible sealing member bonding portion 504.
  • the sealant layer silane
  • the sealant coating part 502 can be used to apply a sealant to the organic EL element side or Used when painting on the side.
  • a sealant layer (sealant) is provided on the flexible sealing member It is possible to select a bonding method (for example, pressurization, heating, ultraviolet irradiation, etc.) according to the properties of the sealant layer (sealant) obtained.
  • the flexible sealing member bonding step 5 preferably has a curing agent (not shown) for the sealant or sealant layer.
  • the curing agent (not shown) is a cutting step. It is preferable to arrange before or after the cutting process.
  • the curing method of the curing unit can be appropriately selected according to the type of sealant (sealant layer) to be used (for example, thermosetting sealant, ultraviolet curable sealant, etc.).
  • the flexible sealing member bonding step 5 a plurality of organic EL panels are formed by bonding the flexible sealing member to each organic EL element formed on the strip-shaped flexible support C301 ⁇ . A belt-like flexible support D301k having the same is produced.
  • the flexible sealing member bonding step 5 will be described with reference to FIG.
  • the flexible sealing member used at a flexible sealing member bonding process does not have limitation in particular, For example, a strip
  • the punching and cutting step 6 includes an alignment mark detection unit 602 for detecting an alignment mark disposed on the strip-shaped flexible support D301k, and an organic EL element formed on the strip-shaped flexible support.
  • the punching / cutting device 601 is provided to punch out and remove unnecessary portions of the bonded flexible sealing member in accordance with the positions. The punching and cutting process 6 will be described with reference to FIGS.
  • This figure shows a case where the flexible sealing member bonding step 5 and the punching and cutting step 6 are performed continuously.
  • a method may be used in which a unit is cut into a sheet and supplied to the punching and cutting process 6.
  • the flexible sealing member bonding process 5 and the punching and cutting process 6 are separate processes has been described.
  • the sealing function of the sealing agent is added to the flexible sealing member bonding process 5.
  • the flexible sealing member bonding process 5 and the cutting process 6 may be combined so that cutting can be performed in accordance with the curing of the sealant (when the bonding apparatus and the cutting apparatus are combined). (See Figure 9).
  • a winding device (not shown) that forms a winding roll around a strip-shaped flexible support having at least one organic EL panel in a state where an unnecessary flexible sealing member is removed. )have. 701 leaves the pasted part, and is collected as a roll. 1 shows a flexible sealing member.
  • 702 is a strip-shaped flexible substrate that is removed from an unnecessary strip-shaped flexible support, which is not related to bonding, and is collected in a winding-up shape with a strip-shaped flexible support having at least one organic EL panel as a winding core.
  • the sex support is shown.
  • the strip-shaped flexible support having at least one organic EL panel collected in a roll form is cut into individual units and collected in a separate process.
  • the force shown in the case of scratching may be collected continuously by cutting into organic EL panel units.
  • FIG. 2 is a schematic view of a method for producing an organic EL panel using a single-wafer sheet-like substrate.
  • the manufacturing apparatus 8 supplies a single-wafer sheet-like substrate a to a process, a supply process 8a, a first electrode forming process 8b, and a hole transport layer forming process 8c for forming a hole transport layer on the first electrode;
  • the flexible sealing member a single sheet flexible sealing member is used according to the size of the single sheet substrate. However, it is preferable that the size of the alignment mark provided in advance on the single-wafer sheet-like substrate can be detected.
  • the supply step 8a includes a supply device (not shown) for supplying the single-wafer sheet-like substrate a to the next step, and the first electrode is deposited on the surface of the single-wafer sheet-like substrate a supplied from the supply step 8a. Before, it has a substrate cleaning processing device 8al for cleaning the surface of the single-wafer sheet-like substrate a in order to improve the adhesiveness!
  • the first electrode forming step 8b includes a vapor deposition apparatus 8bl having an evaporation source container 8b2, and forms the first electrode on the single-wafer sheet substrate a under reduced pressure conditions.
  • the hole transport layer forming step 8c includes a vapor deposition apparatus 8cl having an evaporation source container 8c2, and an external electrode of the first electrode of the single-wafer sheet-like substrate b on which the first electrode is formed under reduced pressure conditions A hole transport layer is formed in the region of the first electrode except for the part that becomes!
  • the light-emitting layer forming step 8d includes a vapor deposition apparatus 8dl having an evaporation source container 8d2, and has a reduced pressure condition.
  • a light emitting layer is formed on the hole transport layer of the single-wafer sheet-like substrate c on which the hole transport layer is formed.
  • the electron injection layer forming step 8e includes a vapor deposition apparatus 8el having an evaporation source container 8e2, and the electron injection layer is formed on the light emitting layer of the single wafer sheet substrate c on which the hole transport layer is formed under reduced pressure. It is supposed to form.
  • the second electrode forming step 8f includes a vapor deposition apparatus 8fl having an evaporation source container 8f2, and the first electrode is formed on the electron injection layer of the single-wafer sheet-like substrate e on which the electron injection layer is formed under reduced pressure conditions.
  • the second electrode is formed so as to be orthogonal to.
  • the sealant coating process 8g includes an alignment mark detection unit 8gl (see Fig. 8) for detecting an alignment mark al (see Fig. 8) attached on a single sheet substrate, and a single sheet.
  • a sealant is applied to the light emitting region or the periphery of the light emitting region of at least one organic EL element f 1 (see FIG. 8) formed by sequentially laminating the first electrode to the second electrode on the substrate f. It has a sealant coating portion 8g2 and a mounting table 8g23 on which the single-wafer sheet-like substrate f is mounted. 8g21 indicates a sealant coating device.
  • the sealant application part 8g2 may be applied to the organic EL element side or may be a single wafer sheet. Used when coated on the flexible sealing member side.
  • a bonding method for example, pressurization
  • Heating, ultraviolet irradiation, etc. can be selected.
  • the flexible sealing member laminating apparatus 8h is a flexible sealing member laminating device that stacks and bonds the single-wafer sheet-like substrate g and the single-wafer sheet-like flexible sealing member 9 8hl and a flexible sealing member supply device 8h2 (see FIG. 8) for supplying the sheet-like sheet-like flexible sealing member 9 onto the sheet-like sheet-like substrate g.
  • a curing processing device (not shown) that cures the sealant.
  • the curing unit should be placed before the cutting process or after the cutting process. Preferred.
  • the curing method of the curing unit can be appropriately selected according to the type of sealant used (eg, thermosetting sealant, ultraviolet curable sealant, etc.).
  • the punching and cutting step 8i is a sheet-fed sheet-like flexible sealing member 9 bonded to remove unnecessary portions. It has a punching and cutting device 8il for removal.
  • the flexible sealing member bonding step 8h and the punching and cutting device 8il are separated is shown as a separate process, but the flexible sealing member bonding step 8h is sealed.
  • the flexible sealing member bonding process 8h and the punching and cutting device 8il may be combined to add a curing function for the agent and enable cutting according to the curing of the sealant (the bonding device and cutting). (See Figure 9 for the merged equipment).
  • the cleaning surface modification treatment performed before applying the organic compound layer forming coating liquid in the process of manufacturing the organic EL panel shown in FIGS. 1 and 2 includes a low-pressure mercury lamp, an excimer lamp, and plasma.
  • Examples include a cleaning device.
  • Conditions for the cleaning surface modification treatment using a low-pressure mercury lamp include, for example, conditions for performing a cleaning surface modification treatment by irradiating a low pressure mercury lamp with a wavelength of 184.2 nm at an irradiation intensity of 5 to 20 mW Zcm 2 and a distance of 5 to 15 mm. Is mentioned.
  • atmospheric pressure plasma is preferably used as a condition for the cleaning surface modification treatment by the plasma cleaning apparatus.
  • the washing conditions have use oxygen 1-5 vol 0/0 containing gas to argon gas, frequency 100KHz ⁇ 150MHz, Voltage 10V ⁇ : LOKV, conditions for cleaning a surface modification treatment and the like in the irradiation distance 5 to 20 mm.
  • Examples of the static elimination treatment means performed in the process of manufacturing the organic EL panel shown in FIG. 1 include a light irradiation method and a corona discharge method, and these may be appropriately selected and used as necessary. Is possible.
  • the light irradiation method generates weak ions and the corona discharge method generates air ions by corona discharge. These air ions are attracted to the charged object to compensate for the opposite polarity charge and neutralize the static electricity.
  • a static eliminator using corona discharge and a static eliminator using soft X-rays can be used. Since the first static elimination processing means removes the charge of the base material, it prevents dust from adhering to each other and prevents dielectric breakdown, thereby improving the device yield.
  • the vapor deposition apparatus shown in FIGS. 1 and 2 is not particularly limited, for example, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma.
  • a polymerization method, a plasma CVD method, a laser-one CVD method, a thermal CVD method, a coating method, etc. can be used, and it can be selected and used as necessary.
  • FIG. 3 is a schematic diagram showing a state of the organic EL element formed on the support.
  • FIG. 3 (a) is a schematic diagram showing the state of the organic EL element formed on the belt-like flexible support manufactured by the manufacturing apparatus shown in FIG.
  • FIG. 3B is a schematic view showing the state of the organic EL element formed on the sheet-like substrate manufactured by the manufacturing apparatus shown in FIG.
  • reference numeral 10 denotes a strip-shaped flexible support having a plurality of organic EL elements 10b formed up to the second electrode on the strip-shaped flexible support 10a (formation of the second cathode layer shown in FIG. 1). part 403 second electrode of the cathode layer 301h in corresponding to the first electrode in a state of forming the perpendicular to the strip-friendly ⁇ support C301i.) the 0 this diagram, the organic EL element 10b is continuously formed Show the case.
  • Reference numeral 10c denotes an alignment mark attached to the position of the organic EL element 10b on the belt-like flexible support 10a.
  • the arrangement position of the alignment mark 10c is not particularly limited as long as it can be detected when an unnecessary portion of the bonded sealing member is removed, and can be changed as needed.
  • the sealing member to be used is made narrower than the strip-shaped flexible support 10a so that the alignment mark 10c can be detected, and attached to each stage of the organic EL element 1 Ob. This figure shows the case where it is attached to each stage of the organic EL element 10b.
  • FIG. 3 The state of the organic EL element formed on the single wafer sheet substrate shown in Fig. 3 (b) will be described.
  • 11 indicates a single-wafer sheet-like substrate having one organic EL element l ib in which up to the second electrode is formed on the single-wafer sheet-like substrate 11a (in the second electrode forming portion 8f shown in FIG. 2).
  • O The organic EL element 10b and the organic EL element l ib have the same configuration.
  • 11c shows an alignment mark attached to the position of the organic EL element l ib on the single-wafer sheet substrate 11a.
  • the arrangement position of the alignment mark 1 lc is not particularly limited as long as it can be detected when an unnecessary portion of the bonded sealing member is removed, and can be changed as necessary.
  • the sealing member used may be narrower than the single-wafer sheet substrate 10a so that the alignment mark 11c can be detected.
  • a plurality of organic EL elements l ib are formed on the single-wafer sheet substrate 11a, it can be appropriately changed according to the position of the organic EL elements as in FIG. 3 (a).
  • FIG. 4 is a schematic diagram showing a state in which a sealant is not provided on the organic EL element side in order to paste the flexible sealing member on the organic EL element without having a sealant layer (sealant). It is.
  • Fig. 4 (a) is an enlarged schematic view of the part indicated by P in Fig. 3.
  • 10c represents a first electrode formed on the strip-shaped flexible support 10a
  • 10d represents a second electrode formed on an organic compound layer (not shown) including a light emitting layer
  • 10e indicates the light emitting region of the organic EL device 10b (the range enclosed by the thick line in the figure)
  • 10f indicates a sealant applied to the light emitting region 10e.
  • 10g shows a sealant coated around the light emitting region, excluding the part of the first electrode that becomes the external extraction electrode and the part of the second electrode that becomes the external extraction electrode.
  • FIG. 5 is an enlarged schematic view of a portion indicated by Q in FIG.
  • FIG. 5 (a) is an enlarged schematic perspective view of the portion indicated by Q in FIG.
  • FIG. 5 (b) is a schematic sectional view of FIG. 5 (a).
  • the flexible sealing member bonding step 5 includes an alignment mark detection unit that detects an alignment mark 3011 arranged in alignment with the position of the organic EL element 30 lil formed on the strip-shaped flexible support C301i. 505, a sealant coating portion 502 for coating a sealant in accordance with the position of the organic EL element 301il, a supply portion 503 of a roll-shaped flexible sealing member 503a, and a strip-shaped flexible sealing member And a bonding portion 504 for bonding 503b.
  • the alignment mark detection unit 505 includes an alignment mark detection device 505a and a casing 505b in which the alignment mark detection device 505a is disposed.
  • the alignment mark detection device 505a is arranged in accordance with the position of the alignment mark 3011 previously arranged on the belt-like flexible support C301i.
  • the information detected by the alignment mark detection device 505a is input to a control unit (not shown) to control the sealant coating device 502a of the sealant coating unit 502.
  • the alignment mark detection device 505 is not particularly limited. For example, image recognition using a CCD camera can be used.
  • Sealant application part 50 2 shows a sealant coating device 502a for applying a sealant to the organic EL element according to the information from the alignment mark detection unit 505 as shown in (b) or (c) of FIG. It has a housing 502b in which the device 502a is disposed.
  • the number of sealant coating devices 502a to be disposed is not particularly limited, but it is preferable to dispose the sealant coating devices 502a according to the number of organic EL elements disposed in the width direction of the strip-shaped flexible support C301i.
  • This figure shows a case where three sealant coating devices 502a are arranged in accordance with the number of organic EL elements arranged in the width direction.
  • the case 502b can be moved in the x-y direction (arrow direction in the figure) by a driving device (not shown).
  • the bonding section 504 has a roll 504b that contacts the main body 504c and the strip-shaped flexible support, and a roll 504a that contacts the strip-shaped flexible sealing member 503b side, and the roll 504b and the roll 504a are organic.
  • the belt-like flexible sealing member is bonded by pressing and sandwiching the belt-like flexible support 301k on which the EL element is formed and the belt-like flexible sealing member 503b.
  • the function of the curing process according to the properties of the sealant used in the bonding part 504 for example, if the sealant is an ultraviolet ray curable type, an ultraviolet irradiation device is provided, and if it is a thermosetting type, the roll is provided with a heating function. ) Is preferred!
  • the width of the flexible sealing member 503b is preferably detectable by the alignment mark 3011 attached to the strip-shaped flexible support 30lk.
  • the supply system of the sealant to the sealant coating apparatus 502a is omitted.
  • belt-shaped flexible sealing member is used is shown in this figure, of course, it is also possible to use a sheet-like sheet-like flexible sealing member. However, it is necessary to change the supply device according to the sheet-like flexible sealing member.
  • the method of applying the sealant is not particularly limited, and examples thereof include a method used for applying an ordinary adhesive, such as a spray method, an extrusion nozzle method, and a screen printing method.
  • the viscosity of the sealant used is preferably 40 Pa-s to 40 Pa ⁇ s in consideration of coating uniformity, spread prevention, and the like!
  • liquid sealing agent examples include photocuring and thermosetting sealing agents having a reactive vinyl group of acrylic acid oligomers and methacrylic acid oligomers, and moisture curable types such as 2-cyanacrylic acid esters.
  • Sealing agent epoxy-based thermal and chemical-curing type (two-component mixed) sealing agent, cationic curing type UV-curing epoxy grease
  • a filler is added to the liquid sealant as necessary.
  • the amount of filler added is preferably 5 to 70% by volume in consideration of adhesive strength.
  • the size of the filler to be added is preferably 1 m to 100 ⁇ m in consideration of the adhesive strength, the thickness of the sealant after bonding and bonding, and the like.
  • the type of filler added is not particularly limited. Examples include soda glass, alkali-free glass or silica, metal oxides such as titanium dioxide, antimony oxide, titanium, alumina, zirconium oxide, and tungsten oxide. It is possible.
  • Bonding section 504 is a strip-shaped flexible member in which a strip-shaped flexible sealing member 503b fed from roll-shaped strip flexible sealing member 503a supplied to supply section 503 and a sealant are applied.
  • the crimping roll 504a on the strip-shaped flexible support member C301i side, and the crimping roll 504b on the strip-shaped flexible support C301i side are accommodated. It has a main body 504c!
  • bonding unit 504 bonding stability, bubbly prevention to lamination portion, considering a flat surface of the holding and the like of the flexible sealing member, vacuum conditions between 1:10 X 10- 5 Pa It is preferable to carry out with.
  • this figure shows a case where a band-shaped flexible sealing member is used to cope with at least one organic EL element continuously formed on the band-shaped flexible support
  • the same method can be used when a sheet-like sheet-like flexible sealing member is used instead of the belt-like flexible sealing member.
  • the sheet-like sheet-like flexible sealing member has a band-like flexibility so that alignment marks provided on the band-like flexible support can be detected in order to facilitate alignment. It is preferable to make it narrower than the support.
  • a sealant layer provided in advance on the side of the flexible sealing member to be bonded to the organic EL element.
  • the adhesive agent include a sheet-like sealant and thermoplastic resin.
  • a sheet-like sealant it exhibits non-fluidity at room temperature (about 25 ° C), and when heated it exhibits fluidity in the range of 50 ° C to 100 ° C and is formed into a sheet-like shape.
  • the sealant examples include a photocurable resin mainly composed of a compound having an ethylenic double bond at the end or side chain of a molecule and a photopolymerization initiator. In use, for example, it is bonded in advance to a flexible sealing member (a belt-like flexible sealing member, a sheet-like sheet-like flexible sealing member) and brought to room temperature (about 25 ° C) or lower. It is preferable to use it.
  • thermoplastic resin a thermoplastic resin having a melt flow rate specified in JIS K 7210 of 5 to 20 gZlOmin is preferred, more preferably 6 to 15 gZlOmin or less. Is preferred. This is because if a resin with a melt flow rate of 5 (g / 10min) or less is used, the gap caused by the step of the extraction electrode of each electrode cannot be completely filled, and a resin with a melt flow rate of 20 (gZlOmin) or more can be used. This is because if the tensile strength is used, the stress cracking resistance and workability will decrease.
  • thermoplastic resins are preferably formed into a film and bonded to a flexible sealing member (a strip-like flexible sealing member or a sheet-like flexible sealing member).
  • the laminating method can be made by using various generally known methods such as a wet laminating method, a dry laminating method, a hot melt laminating method, an extrusion laminating method, and a thermal laminating method.
  • the thermoplastic resin is not particularly limited as long as it satisfies the above numerical values.
  • the thermoplastic resin is a polymer film described in a new development of functional packaging materials (Toray Research Center, Inc.).
  • LDPE Low Density Polyethylene
  • HDPE High Density Polyethylene
  • L LDPE Linear Low Density Polyethylene
  • CPP Unstretched Polypropylene
  • OPP OPP
  • ONy PET
  • thermoplastic resins it is particularly preferable to use LDPE, LLDPE produced by using LDPE, LLDPE, and a meta-catacene catalyst, or thermoplastic resins using a mixture of LDPE, LLDPE and HDPE films. ⁇ .
  • FIG. 6 is a schematic enlarged perspective view of a portion indicated by R in FIG.
  • reference numeral 602a denotes an alignment mark detection device that detects the alignment mark 3011 previously disposed on the belt-like flexible support D301k.
  • the alignment mark detection device 602a is not particularly limited. For example, image recognition using a CCD camera can be used.
  • Reference numeral 602b denotes a housing in which the alignment mark detection device 602a is disposed.
  • the information detected by the alignment mark detection device 602a is input to a control unit (not shown), and the punching and cutting device 601 is controlled.
  • the punching and cutting device 601 is an unnecessary portion of the flexible sealing member 503b bonded on the belt-shaped flexible support D301k (the light emitting region of the organic EL element or a portion not bonded to the periphery of the light emitting region).
  • the upper die 601b provided with a punching blade 601a, four guide posts 601c that enable the upper die 601b to operate in the vertical direction (arrow direction in the figure), and strip-like flexibility
  • a lower die 601d having a placement surface 601e (also serving as a receiving portion of the punching blade 601a) on which the support D301k is placed.
  • 601f indicates a drive source for operating the upper die 601b in the vertical direction (in the direction of the arrow in the figure) along the guide post 601c
  • 601g indicates a drive shaft.
  • the number of punching blades 601a is appropriately selected from the number of organic EL elements formed on the strip-shaped flexible support D301k, the number of punching at a time, the size of the punching cutting device 601 and the like. Is possible. This figure shows the case where the number of punches at one time is six.
  • the punch cutting device 601 is a half-cut method because it punches out only unnecessary portions of the flexible sealing member 503b.
  • the half-cut method is a method of cutting while leaving the thickness direction of the workpiece to be cut, and it is possible by adjusting the minimum distance (bottom dead center) between the punching blade and the receiving portion of the punching blade. .
  • a block (not shown) is installed in the upper mold or the lower mold or both, and when the upper mold is lowered, the lowered position is restricted by the block.
  • the bottom dead center can be adjusted by adjusting the height of the block.
  • 301m is a strip-shaped flexible support body in which at least one organic EL panel is formed by removing an unnecessary flexible sealing member that is not bonded to the light emitting region or the periphery of the light emitting region of the organic EL element. E is shown. The punched flexible sealing member is scraped off and removed. After this, The strip-shaped flexible support E301m with multiple organic EL panels is cut into each OLED panel to make one OLED panel.
  • the punching and cutting device 8il used in the punching and cutting step 8i shown in FIG. 2 can also be dealt with by changing the transport system of the belt-like flexible support shown in this figure to a single-wafer sheet-like substrate. It is possible. If a single organic EL element is formed on the single-wafer sheet substrate shown in Fig. 3 (b), the punching blade should be adjusted to match the size and shape of the organic EL element. Correspondence is possible by arranging in the mold.
  • the method of the punching and cutting apparatus shown in the figure is not particularly limited, and for example, a rotary method using a rotary blade in which the punching blade shown in Fig. 7 is arranged on the peripheral surface of the roll may be used.
  • FIG. 7 is a schematic view of a punching blade of the punching and cutting apparatus shown in FIG. Figure 7 (a) is a diagram.
  • FIG. 6 is an enlarged schematic plan view of a punching blade of the punching and cutting apparatus shown in FIG.
  • FIG. 7 (b) is an enlarged schematic perspective view of the punching blade shown in FIG. 7 (a).
  • Fig. 7 (c) shows A-A in Fig. 7 (b).
  • 601al indicates a jig for attaching the punching blade 601a to the upper mold 601b.
  • the punching blade 601a shown in this figure is composed of four linear punching blades a to d, and is attached to the upper die 601b so as to abut at right angles to each other.
  • ⁇ 1 indicates the angle of the cutting edge of the punching blade 601a, and the angle ⁇ 1 is preferably 7 to 60 ° in consideration of cutting quality, durability of the cutting edge, and the like.
  • General blade materials such as SKH and SKD can be used for the punching blade.
  • FIG. 8 is an enlarged schematic view of the portion indicated by S in FIG.
  • FIG. 8 (a) is an enlarged schematic perspective view of a portion indicated by S in FIG.
  • FIG. 8B is a schematic cross-sectional view of FIG.
  • Sealing agent coating process 8g is applied to alignment mark detector 8gl that detects alignment mark al formed on single-wafer sheet-like substrate a and to the position of organic EL element fl. It has a sealant coating part 8g2.
  • the alignment mark detection unit 8gl includes an alignment mark detection device 8gl and a housing 8gl2 in which the alignment mark detection device 8gl is disposed.
  • Alignment mark detection device 8 gl l is aligned with the position of alignment mark al, which is preliminarily arranged on the sheet-like substrate a. It is arranged.
  • the information detected by the alignment mark detection device 8gl is input to a control unit (not shown) to control the sealant coating device 8g21 of the sealant coating unit 8g2.
  • image recognition using a CCD camera can be used as the alignment mark detection device 8gl.
  • the sealant coating portion 8g2 includes a sealant coating device 8g21, a housing 8g22, and a mounting table 8g23 (see FIG. 2).
  • the sealant coating unit 8g2 applies a sealant to the organic EL device as shown in Fig. 4 (b) or (c) according to the information from the alignment mark detection unit 8gl. 8g21 and a casing 8g22 in which a sealant coating device 8g21 is disposed.
  • the number of sealant coating devices 8g21 is not particularly limited, but it is preferable that the sealant coating device 8g21 is disposed according to the number of organic EL elements fl disposed in the width direction of the sheet-like substrate a.
  • This figure shows a case where two sealant coating devices 8g21 are arranged in accordance with the number of organic EL elements arranged in the width direction of the sheet-like substrate a.
  • the housing 8g22 can be moved in the x-y direction (arrow direction in the figure) by a driving device (not shown).
  • the sealant supply system to the sealant coating device 8g21 is omitted.
  • the method of applying the sealant is the same as that of the sealant application apparatus shown in Fig. 5, and the same sealant is used.
  • the same filler may be added as the sealing agent used in the sealing agent coating apparatus.
  • the flexible sealing member laminating step 8h includes a single-wafer sheet-like flexible sealing member supply device 8h2 for supplying the single-wafer sheet-like substrate a on which a sealing agent is disposed and disposed, A sheet-like sheet-like flexible sealing member laminating device 8hl for laminating the sheet-like sheet-like flexible sealing member 9 supplied onto the sheet-like substrate a.
  • the sheet-fed sheet-like flexible sealing member supply device 8h2 includes a mounting table 8h21 on which the sheet-fed sheet-like flexible sealing member 9 is placed, and a sheet-fed sheet-like flexible sealing member 9 for each sheet.
  • a robot arm 8h23 having holding means 8h22 for sucking and holding.
  • the robot arm 8h23 rotates so as to be rotatable (in the direction of the arrow in the figure), and the sheet-like flexible sealing member 9 can be supplied onto the sheet-like substrate a.
  • the size of the sheet-like flexible sealing member 9 is preferably such that the alignment mark al provided on the sheet-like substrate can be detected.
  • Flexible sealing member laminating apparatus 8hl is an organic EL element f formed on a sheet-fed substrate a A first pressure-bonding member 8hl l for laminating the sheet-like sheet-like flexible sealing member 9 on the light-emitting region 1 or the sealing agent coated around the light-emitting region, a second pressure-bonding member 8hl2, Upper guide 8hl 3 with first crimping member 8hl 1 and second crimping member 8hl 2 attached, and four guide posts 8hl4 that allow upper die 8hl 3 to operate in the vertical direction (arrow direction in the figure) Lower mold with 8hl 5!
  • the first crimping member 8hl l is attached to four linear guides 8hl6 attached to the upper die 8hl3.
  • 8hl7 is a panel of an elastic member that is pressure-bonded and held in order to prevent the sealant from being spread on the first pressure-bonding member 8hl1 when the sheet-like sheet-like flexible sealing member 9 is bonded. Indicates.
  • the lower mold 8hl5 has a plurality of suction holes (not shown) for sucking and fixing the single-wafer sheet-like substrate a and a suction pump (not shown) when the single-wafer sheet-like flexible sealing member 9 is bonded. It is preferable to have a suction pipe (not shown) connected to the figure.
  • 8hl8 indicates a drive source for operating the upper die 8hl3 in the vertical direction (arrow direction in the figure) along the guide post 8hl4, and 8hl9 indicates a drive shaft.
  • the flexible sealing member laminating apparatus 8hl is used to clean the periphery of the light emitting area with the first pressure bonding member 8hl l.
  • the flexible sealing member is preferably bonded by pressing the light emitting region with the second pressure bonding member 8hl2.
  • FIG. 4 (c) when a sealant is applied around the light emitting area, after the light emitting area is pressure-bonded with the first pressure-bonding member 8hl1, the light-emitting area is pressed with the second pressure-bonding member 8hl2. It is preferable to bond the single-wafer sub-sheet-like flexible sealing member by crimping the periphery. In this figure, the supply system of the sealant to the sealant coating device 8g21 is omitted.
  • FIG. 9 is a schematic view of a bonding / punching cutting apparatus in which a bonding apparatus and a punching cutting apparatus are combined.
  • A) of FIG. 9 is a schematic perspective view of the apparatus in which the bonding process and the cutting process are merged.
  • FIG. 9 (b) is a schematic cross-sectional view along B- in FIG. 9 (a).
  • reference numeral 12 denotes a bonding 'punching and cutting apparatus.
  • Bonding 'Punching and cutting device 12 is formed on a flexible support (not shown) by a flexible sealing member (not shown) stacked on a flexible support (not shown).
  • a pressing member 12a that is bonded only to the light emitting region of an organic EL element (not shown) or the periphery of the light emitting region, and a punched unnecessary portion that is not involved in the bonding of the light emitting region or the periphery of the light emitting region.
  • An upper die 12c provided with a punching blade 12b, four guide posts 12d that enable the upper die 12c to be operated in the vertical direction (the arrow direction in the figure), and a flexible sealing member (not shown) )
  • a lower mold 12f having a mounting surface 12e (also serving as a receiving portion for the punching blade 12b) on which a flexible support (not shown) is mounted.
  • 12g indicates a fixing member for fixing the punching blade 12b to the upper die 12c, and the punching blade 12b is fixed to the upper die 12c by four fixing members 12g.
  • Reference numeral 12h denotes a guide post that enables the pressing member 12a to be operated in the vertical direction (the arrow direction in the figure).
  • the pressing member 12a is attached to the upper die 12c via the panel member 12hl with four guide posts 12h.
  • 12i indicates a drive source for operating the upper die 12c in the vertical direction (in the direction of the arrow in the figure) along the guide post 12d
  • 13 ⁇ 4 indicates a drive shaft
  • 12k indicates a mounting member for the drive shaft 13 ⁇ 4.
  • the pressing member 12a has a curing function for curing the sealing agent in accordance with the bonding of the flexible sealing members (not shown) stacked on the flexible support (not shown). Have it.
  • the curing function for example, when the sealing agent used is a thermosetting type, it has a heating function, and when the sealing agent is an ultraviolet curing type, it has an ultraviolet irradiation function.
  • the curing process can be performed at the same time as the bonding of the flexible sealing member. Unnecessary parts involved in bonding around the light emitting area can be punched out. Since the bonding and punching and cutting device 12 punches only unnecessary portions of the flexible sealing member, the same cutting and cutting method as the punching and cutting device 601 shown in FIG.
  • the size of the pressing member 12a is preferably the same as the size including the light emitting region of the organic EL element (not shown) or the periphery of the light emitting region.
  • the punching blade 12b is the circumference of the pressing member 12a. It is possible to move up and down along the side.
  • the shape of the punching blade 12b is the same as that of the punching blade shown in FIG.
  • the bonding member 12a and the punching blade 12b form a pair
  • the bonding member is disposed in a punching and cutting apparatus in accordance with the number of organic EL elements formed on the flexible support. It is possible. For example, there is a method in which lattice-shaped punching blades are produced according to the number and size of the organic EL elements, and a pressing member is provided for each lattice.
  • the laminating / cutting apparatus shown in this figure has a function in which the laminating portion 504 of the flexible sealing member and the punching / cutting apparatus 601 shown in FIG.
  • the sealing member bonding device 8 hi and the punching and cutting device 8il have a combined function.
  • the bonding apparatus 12 shown in this figure can be replaced by the flexible sealing member bonding section 504 and the punching and cutting apparatus 601 shown in FIG.
  • the flexible sealing member used in the present invention is a material in which a barrier layer is formed by a vapor deposition method or a coating method on a flexible resin film support such as polyethylene terephthalate or nylon, or a noble layer.
  • a barrier layer is formed by a vapor deposition method or a coating method on a flexible resin film support such as polyethylene terephthalate or nylon, or a noble layer.
  • Examples include materials using metal foil.
  • Examples of the noria layer include metals such as In, Sn, Pb, Au, Cu, Ag, Al, Ti, Ni, MgO, SiO, SiO, AlO,
  • Examples include materials deposited with metal oxides such as GeO, NiO, CaO, BaO, FeO, YO, and TiO.
  • a material of the metal foil for example, a metal material such as aluminum, copper, or nickel, or an alloy material such as stainless steel or an aluminum alloy can be used.
  • Aluminum is preferable in terms of workability and cost.
  • the film thickness is 1 to about L00 m, preferably about 10 to 50 m.
  • a film of polyethylene terephthalate, nylon or the like may be laminated in advance.
  • the water vapor permeability of the flexible sealing member used in the present invention is preferably 0.01 gZm 2 'day or less, and the oxygen permeability is 0.01 mlZm 2 ' day 'atm or less. Preferably it is.
  • Moisture permeability ⁇ O This is a value measured mainly by the MO CON method in accordance with the IS K7129B method (1992), and the oxygen permeability is compliant with the IS K7126B method (1987). This is the value measured mainly by the MOCON method.
  • Young's modulus of the flexible sealing member is flexible sealing member and the first pressure-bonding member, a second wet wide force of adhesion and sealing agent between the crimping member ⁇ prevention consideration, 1 X 10- 3 It is preferably GPa to 80 GPa and the thickness is preferably 10 ⁇ m to 500 ⁇ m.
  • Examples of the substrate according to the present invention include a single-wafer sheet-like substrate and a strip-like flexible substrate.
  • Examples of the single-wafer sheet-like substrate include a transparent glass plate and a sheet-like transparent resin film.
  • the resin film include polyesters such as polyethylene terephthalate (PET) and polyethylene naphtharate (PEN), polyethylene, polypropylene, cellophane, cellose diacetate, cenorelose triacetate, cenorelose acetate butyrate, cenolate acetoacetate pro.
  • Cellulose esters such as Pionate (CAP), Cellulose Acetate Phthalate (TAC), Cellulose Nitrate or Derivatives thereof, Polyvinyl chloride-Ridene, Polyvinyl alcohol, Polyethylene vinyl alcohol, Syndiotactic polystyrene, Polycarbonate , Norbornene resin, polymethylpentene, polyetherketone, polyimide, polyethersulfone (PES), polyphenylene sulfide, polysulfones, polyether imine , Polyether ketone imide, polyamide, fluorine resin, nylon, polymethyl methacrylate, acrylic or polyarylate, Arton (trade name, manufactured by JSR) or Abel (trade name, manufactured by Mitsui Chemicals) Examples include cycloolefin-based rosin.
  • a transparent resin film is mentioned as a strip
  • the gas noria film is formed on the surface of the resin film, if necessary.
  • the gas noble film include an inorganic film, an organic film, or a hybrid film of both.
  • the water vapor permeability is preferably 0.01 gZm 2 ′ dayatm or less.
  • the oxygen permeability 10- 3 ml / m 2 / day or less is preferably less high Noria of fill-time water vapor permeability 10- 5 g / m 2 / day .
  • any material may be used as long as it has a function of suppressing intrusion of elements that cause deterioration of elements such as moisture and oxygen.
  • silicon oxide, silicon dioxide, silicon nitride, or the like may be used. I can do it.
  • the method for forming the noria film is not particularly limited, for example, vacuum deposition method, sputtering method, reactive sputtering method, molecular beam epitaxy method, cluster ion beam method, ion plating method, plasma polymerization method, atmospheric pressure plasma polymerization method.
  • a method using an atmospheric pressure plasma polymerization method as described in JP-A No. 2004-68143 is particularly preferred.
  • an electrode material made of a metal, an alloy, an electrically conductive compound, or a mixture thereof having a high work function (4 eV or more) is preferably used.
  • electrode materials include metals such as Au, Cul, indium tin oxide (ITO), SnO, ZnO, etc.
  • these electrode materials can be formed into a thin film by a method such as vapor deposition or sputtering, and a pattern of a desired shape can be formed by a single photolithography method. As described above, a pattern may be formed through a mask having a desired shape when the electrode material is deposited or sputtered. When light emission is extracted from this anode, the transmittance should be greater than 10%. It is desirable that the sheet resistance as an anode is several hundred ⁇ or less. Further, although the film thickness depends on the material, it is usually selected in the range of 10 to: LOOOnm, preferably 10 to 200 nm.
  • a hole injection layer may exist between the first electrode and the light emitting layer or the hole transport layer.
  • the hole injection layer is a layer provided between the electrode and the organic layer in order to lower the driving voltage and improve the luminance of the light emission.
  • the organic EL element and its industrial front line June 30, 1998) The details are described in Volume 2, Chapter 2, “Electrode Materials” (pages 123-166) of “T.S.”.
  • Examples of the material used for the anode buffer layer (hole injection layer) include materials described in JP-A No. 2000-160328.
  • the hole transport layer is made of a hole transport material having a function of transporting holes, and in a broad sense, a hole injection layer and an electron blocking layer are also included in the hole transport layer.
  • the hole transport layer can be provided as a single layer or a plurality of layers.
  • the hole transport material has any of hole injection or transport and electron barrier properties, and may be either organic or inorganic.
  • triazole derivatives for example, triazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives and pyrazolone derivatives, phenylenediamine derivatives, arylamine derivatives, amino-substituted chalcone derivatives, oxazole derivatives, styrylanthracene derivatives, fluorenone derivatives, Examples thereof include hydrazone derivatives, stilbene derivatives, silazane derivatives, terrin copolymers, and conductive polymer oligomers, particularly thiophene oligomers.
  • aromatic tertiary amine compounds and styrylamine compounds include N, N, N ', N' —tetraphenyl 4,4 ′ —daminophenol; N, N′—diphenyl N, — Bis (3-methylphenol) 1 [1, 1 '— Biphenyl] 1, 4, 4 ′ — Diamine (TPD); 2, 2 Bis (4 di-p-triaminophenol) propane; 1, 1 — Bis (4-di-p-tolylaminophenol) cyclohexane; N, N, N ', N' — Tetra-p-tolyl 4, 4 '— Diaminobiphenyl; 1, 1-bis (4-di-p-tolylaminophenol- ) -4-phenolcyclohexane; bis (4-dimethylamino 2-methylphenol) phenol Bis (4-di-p-triaminophenol) phenol methane; N, N '—Diphenyl — N, N ′ —Diphen
  • a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used.
  • Inorganic compounds such as P-type Si and p-type SiC can also be used as a hole injection material and a hole transport material.
  • a so-called p-type hole transport material as described in Letters 80 (2002), p. 139) can also be used. In the present invention, it is preferable to use these materials because a light emitting element with higher efficiency can be obtained.
  • the thickness of the hole transport layer is not particularly limited, but is usually about 5 ⁇ to 5 / ⁇ m, preferably 5 to 200nm.
  • the hole transport layer may have a single layer structure composed of one or more of the above materials. It is also possible to use a hole transport layer having a high p property doped with impurities. Examples thereof include those described in JP-A-4-297076, JP-A-2000-196140, JP-A-2001-102175, J. Appl. Phys., 95, 5773 (2004), etc. It is done. It is preferable to use a hole transport layer having such a high p property because an organic EL element with lower power consumption can be produced.
  • the light emitting layer refers to a blue light emitting layer, a green light emitting layer, and a red light emitting layer.
  • the stacking order of the light emitting layers is not particularly limited, and there is no non-light emitting property between the light emitting layers.
  • An intermediate layer may be included.
  • a white element can be manufactured by forming a light emitting layer in multiple layers.
  • the total film thickness of the light emitting layer is not particularly limited, but is usually in the range of 211111 to 5111, preferably in the range of 2 to 200 nm in consideration of the film uniformity, the voltage required for light emission, and the like. Further, it is preferably in the range of 10 to 20 nm. A film thickness of 20 nm or less is preferable because it has the effect of improving the stability of the emission color with respect to the driving current as well as the voltage aspect.
  • the thickness of each light emitting layer is preferably selected in the range of 2 to 100 nm, and more preferably in the range of 2 to 20 nm. There are no particular restrictions on the relationship between the thickness of the blue, green, and red light-emitting layers, but among the three light-emitting layers, the blue light-emitting layer (the sum of multiple layers) is preferred.
  • the light emitting layer includes at least three layers having different emission spectra in the range of luminescence maximum wavelength power S of 430 to 480 nm, 510 to 550, and 600 to 640, respectively. If there are three or more layers, there is no particular limitation. When there are more than four layers, there may be a plurality of layers having the same emission spectrum.
  • a layer having an emission maximum wavelength in the range of 430 to 480 nm is referred to as a blue light emitting layer
  • a layer in the range of 510 to 550 nm is referred to as a green light emitting layer
  • a layer in the range of 600 to 640 nm is referred to as a red light emitting layer.
  • a plurality of light emitting compounds may be mixed in each light emitting layer within the range in which the maximum wavelength is maintained.
  • a blue light emitting layer may be used by mixing a blue light emitting compound having a maximum wavelength of 430 to 480 nm and a green light emitting compound having a wavelength of 10 to 550 nm.
  • the organic light emitting material used as the material of the light emitting layer is: (a) the charge injection function, that is, the anode or hole injection layer force can be injected when an electric field is applied, from the cathode or the electron injection layer. A function capable of injecting electrons, (b) a transport function, i.e. a function of moving injected holes and electrons by the force of an electric field, and (c) a light emission function, i.e. a recycle of electrons and holes. Combines these three functions: providing a coupling field and connecting them to light emission. There is no particular limitation as long as it is one.
  • fluorescent brighteners such as benzothiazole, benzimidazole, and benzoxazole, and styrylbenzene compounds can be used.
  • Specific examples of the above-described optical brightener include 2,5 bis (5,7 di-t-pentyl-2-benzoxazolyl) —1, 3, 4 thiadiazole, 4, -bis (5,7-t-pentyl-2-benzoxazolyl) stilbene, 4,
  • styrylbenzene compound examples include 1,4 bis (2-methylstyryl) benzene, 1,4 bis (3-methylstyryl) benzene, 1,4 bis (4 methylstyryl).
  • optical brightener and styrylbenzene compound for example, 12-peritone perinone, 1,4 diphenolinol 1,3 butadiene, 1,1,4,4-tetraphenyl Nole-1,3-butadiene, naphthalimide derivatives, perylene derivatives, oxadiazole derivatives, aldazine derivatives, pyrazirine derivatives, cyclopentagen derivatives, pyropyro Derivatives, styrylamine derivatives, coumarin compounds, International Publications WO90Z1314 8 and Appl. Phys. Lett., Vol 58, 18, ⁇ 1982 (1991) [This is described!
  • aromatic dimethylidin System compounds Such high molecular compounds, aromatic dimethylidin System compounds.
  • aromatic dimethylidin compounds include 1, 4 phenylene range methylidin, 4, 4, 1-range dimethylidin, 2, 5 xylylene dimethylidin, 2, 6 naphthylenedimethylidin, 1 , 4-biphenylene dimethylidin, 1, 4— ⁇ -terephene dirange methylidin, 4, 4, one-bis (2, 2-ji t butyl ferrule), 4, 4, And bis (2,2 diphenyl) biphenyl and the like, and derivatives thereof.
  • the organic light-emitting material described above is used as a host, and a fluorescent dye having a strong blue power and green color, for example, a coumarin-based compound or a compound doped with a fluorescent dye similar to the host is also used as the organic light-emitting material. Is preferred.
  • a fluorescent dye having a strong blue power and green color for example, a coumarin-based compound or a compound doped with a fluorescent dye similar to the host is also used as the organic light-emitting material.
  • blue to green light emission (the emission color varies depending on the type of dopant) can be obtained with high efficiency.
  • Specific examples of the host that is the material of the compound include organic light emitting materials having a distyrylarylene skeleton (particularly preferably, for example, 4, 4 ′ bis (2,2 diphenylvinyl) biphenyl).
  • the light emitting layer preferably contains a known host compound and a known phosphorescent compound (also referred to as a phosphorescent compound) in order to increase the light emission efficiency of the light emitting layer.
  • a host compound is a compound contained in a light-emitting layer and has a mass ratio of 20% or more in the layer, and phosphorescence quantum yield of phosphorescence emission at room temperature (25 ° C). Defined as a compound with a power less than 0.1. The phosphorescence quantum yield is preferably less than 0.01.
  • a plurality of host compounds may be used in combination. By using multiple types of host compounds, it is possible to adjust the movement of electric charge and to make the organic EL element highly efficient. Also phosphorescent By using a plurality of compounds, it is possible to mix different luminescence, and thus any luminescent color can be obtained. White light emission is possible by adjusting the type of phosphorescent compound and the amount of doping, and it can also be applied to lighting and backlighting.
  • these host compounds compounds having a hole transporting ability and an electron transporting ability, preventing the emission of longer wavelengths, and having a high Tg (glass transition temperature) are preferable.
  • As known host compounds JP-A-2001-257076, 2002-308855, 2001-313179, 2002-319491, 2001-357977, 2002-334786, 2002-8860, 2002-334787, 2002-15871, 2002-334788, 2002-43056, 2002-334789, 2002-75645, 2002-33857 9, 2002-105445, 2002-343568, 2002-141 173, 2002-352957, 2002-203683, 2002-3 63227, 2002-231453, 2003-3165, 2002-2 34888, 2003-27048, 2002-255934, 2002-260861 2002-280183, 2002-299060, 2002-302516, 2002-305083, 2002-305084, 2 And compounds described in JP 02-308837.
  • the host compound in each layer is the same compound, since it is easy to obtain a uniform film property over the entire organic layer, and more preferably
  • the phosphorescence emission energy of the compound is more than 2.9 eV. This is more preferable because energy transfer from the dopant can be effectively suppressed and high luminance can be obtained.
  • Phosphorescence emission energy is the peak energy of the 0-0 band of phosphorescence emission measured by measuring the photoluminescence of the lOOnm deposited film on the substrate.
  • the host compound compound has a phosphorescence emission energy of 2.9 eV, taking into account the deterioration of the organic EL device over time (decrease in luminance and film properties) and the field as a light source.
  • the Tg is preferably 90 ° C or higher. That is, in order to satisfy both luminance and durability, it is preferable that the phosphorescence energy is 2.9 eV or more and Tg is 90 ° C or more. Good. Tg is more preferably 100 ° C or higher.
  • a phosphorescent compound is a compound in which emission of excited triplet force is observed, and is a compound that emits phosphorescence at room temperature (25 ° C). It is a compound having a phosphorescence quantum yield of 0.01 or more at 25 ° C. When used in combination with the host compound described above, an organic EL device with higher luminous efficiency can be obtained.
  • the phosphorescent compound according to the present invention preferably has a phosphorescence quantum yield of 0.1 or more.
  • the above phosphorescence quantum yield can be measured by the method described on page 398 (1992 edition, Maruzen) of Spectroscopic II, 4th edition, Experimental Chemistry Course 7.
  • the phosphorescence quantum yield in a solution can be measured using various solvents.
  • the phosphorescent compound used in the present invention can be obtained if the phosphorescence quantum yield is achieved in any solvent. ⁇ ⁇ .
  • the energy transfer type is to obtain light emission of phosphorescence compound force by transferring this energy to the phosphorescence compound, and the other is that the phosphorescence compound is a carrier trap.
  • This is a carrier trap type in which the recombination of the carriers on the phosphorescent compound occurs and light emission from the phosphorescent compound is obtained, but in either case, the phosphorescent compound It is a condition that the energy of the excited state of the object is lower than the energy of the excited state of the host compound.
  • the phosphorescent compound can be appropriately selected from known materials used for the light emitting layer of the organic EL device.
  • the phosphorescent compound is preferably a complex compound containing a group 8 or group 10 metal in the periodic table of elements, more preferably an iridium compound, an osmium compound, or a platinum compound (platinum complex compound). ), Rare earth complexes, and most preferred U is iridium compounds.
  • the phosphorescent maximum wavelength of the phosphorescent compound is not particularly limited.
  • a central metal, a ligand, a ligand substituent, and the like are selected. By doing so, the emission wavelength obtained can be changed.
  • the electron injection layer is made of a material having a function of transporting electrons and is included in the electron transport layer in a broad sense.
  • the electron injection layer is a layer that is provided between the electrode and the organic layer in order to lower the drive voltage and improve the light emission luminance. “The organic EL element and its forefront of industrialization (November 30, 1998, NTT) It is described in detail in Volume 2, Chapter 2, “Electrode Materials” (pages 123-166) of “issued by S Corporation”.
  • the details of the electron injection layer (one cathode buffer layer) are described in JP-A-6-325871, JP-A-9-17574, JP-A-10-74586, and the like. Specifically, strontium or aluminum is used.
  • the buffer layer is preferably a very thin film.
  • the film thickness is preferably in the range of 0.1 nm to 5 m.
  • an electron transport material also serving as a hole blocking material
  • it has a function of transmitting electrons injected from the cathode to the light emitting layer.
  • any one of conventionally known compounds can be selected and used.
  • nitro-substituted fluorene derivatives, diphenylquinone derivatives, thiobilanoxide derivatives, carpositimide, fluorenylidenemethane derivatives, Anthraquinodimethane, anthrone derivatives, oxadiazole derivatives and the like can be mentioned.
  • a thiadiazole derivative in which the oxygen atom of the oxaziazole ring is replaced with a sulfur atom, and a quinoxaline derivative having a quinoxaline ring known as an electron withdrawing group can also be used as an electron transport material. I can do it.
  • a polymer material in which these materials are introduced into a polymer chain or these materials are used as a polymer main chain can also be used.
  • metal complexes of 8-quinolinol derivatives such as tris (8-quinolinol) aluminum (Alq), tris (5,7-dichloro-1-8-quinolinol) aluminum, tris (5,7-dibu mouth Mo-quinolinol) aluminum, tris (2-methyl-8-quinolinol) aluminum, tris (5-methyl-8-quinolinol) aluminum, bis (8-quinolinol) zinc (Znq), etc.
  • the central metal of these metal complexes is In, Metal complexes replacing Mg, Cu, Ca, Sn, Ga or Pb can also be used as electron transport materials.
  • metal-free or metal phthalocyanine or those having an end substituted with an alkyl group or a sulfonic acid group can be preferably used as the electron transport material.
  • Distyrubirazine derivatives can also be used as electron transport materials, and as with hole injection layers and hole transport layers, inorganic semiconductors such as n-type Si and n-type SiC can also be used as electron transport materials. I can do it.
  • the thickness of the electron transport layer is not particularly limited, but is usually 5 ⁇ ! About 5 m, preferably 5 to 200 nm.
  • the electron transport layer may have a single layer structure that can be one or more of the above materials.
  • An electron transport layer having a high n property doped with impurities can also be used. Examples thereof include JP-A-4-297076, JP-A-10-270172, JP-A-2000-196140, JP-A-2001-102175, Appl. Phys., 95, 5773 (2004), etc. Those described in. It is preferable to use such an electron transport layer having a high ⁇ property because a device with lower power consumption can be manufactured.
  • the second electrode a material having a small work function! /, (4 eV or less) metal (referred to as an electron injecting metal), an alloy, an electrically conductive compound, and a mixture thereof is used.
  • an electron injecting metal a material having a small work function! /, (4 eV or less) metal
  • an alloy a material having a small work function! /, (4 eV or less) metal
  • an alloy a material having a small work function! /, (4 eV or less) metal
  • an alloy referred to as an electron injecting metal
  • an alloy referred to as an electron injecting metal
  • an alloy an electrically conductive compound
  • a mixture thereof is used as the second electrode.
  • Specific examples of such electrode materials include sodium, sodium-potassium alloy, magnesium, lithium, magnesium Z copper mixture, magnesium Z silver mixture, magnesium Z aluminum mixture, magnesium Z indium mixture, aluminum Z acid aluminum -UM (Al 2 O) mixture, indium, lithium Z aluminum mixture, rare earth metal, etc.
  • a mixture of an electron injectable metal and a second metal which is a stable metal having a larger work function value than this, for example, magnesium Z Silver mixture, Magnesium Z aluminum mixture, Magnesium Z indium mixture, Aluminum Z acid-aluminum (Al) mixture
  • the cathode can be produced by forming a thin film of these electrode materials by a method such as vapor deposition or sputtering. or
  • the sheet resistance as the cathode is preferably several hundred ⁇ or less, and the preferred film thickness is usually in the range of 10 ⁇ -5 / ⁇ , preferably 50-200 nm.
  • the first electrode (anode) or the second electrode (cathode) of the organic EL element is transparent or semi-transparent, it is convenient to improve the light emission luminance. .
  • the conductive transparent material mentioned in the description of the first electrode is formed on the second electrode.
  • Two electrodes (cathode) can be fabricated, and by applying this, an element in which both the first electrode (anode) and the second electrode (cathode) are transmissive can be fabricated.
  • the external extraction efficiency at room temperature of light emission of the organic EL device of the present invention is preferably 1% or more, more preferably 5% or more.
  • the external extraction quantum efficiency (%) the number of photons emitted outside the organic EL element Z the number of electrons X 100 flowing through the organic EL element.
  • a hue improvement filter such as a color filter may be used in combination, or a color conversion filter that converts the emission color of the organic EL element power into multiple colors using a phosphor may be used in combination! .
  • the maximum light emission of the organic EL element is preferably 480 nm or less.
  • the organic EL device of the present invention is preferably used in combination with the following method in order to efficiently extract light generated in the light emitting layer.
  • An organic EL device emits light inside a layer having a higher refractive index than air (refractive index is about 1.7 to 2.1), and only about 15% to 20% of the light generated in the light emitting layer is emitted. It is generally said that it cannot be taken out. This is because light incident on the interface (interface between the transparent substrate and air) at an angle ⁇ greater than the critical angle causes total reflection and cannot be taken out of the device, and is a transparent electrode! / This is because light is totally reflected between the layer and the transparent substrate, the light is guided through the transparent electrode or the light emitting layer, and as a result, the light escapes in the direction of the side surface of the element.
  • a method for improving the light extraction efficiency for example, a method of forming irregularities on the surface of the transparent substrate to prevent total reflection at the interface between the transparent substrate and the air (US Patent No. 4,774,435).
  • a method for improving efficiency by providing a substrate with a light collecting property Japanese Patent Laid-Open No. 63-314795.
  • a method of forming a reflective surface on the side surface of an element Japanese Patent Laid-Open No. 1-262094.
  • a method of forming an antireflection film by introducing a flat layer having an intermediate refractive index between the substrate and the light emitter JP-A-62-172691).
  • Japanese Patent Laid-Open No. 2001-202827 A method of introducing a flat layer having a lower refractive index than the substrate between the substrate and the light emitter. There is a method of forming a diffraction grating between any one of a substrate, a transparent electrode layer, and a light emitting layer (including between the substrate and the outside) (Japanese Patent Laid-Open No. 11-283 751).
  • these methods can be used in combination with an organic EL device.
  • a method of introducing a flat layer having a lower refractive index than the substrate between the substrate and the light emitter, or a substrate, A method of forming a diffraction grating between any layers of the transparent electrode layer and the light emitting layer (including between the substrate and the outside) can be suitably used.
  • by combining these means it is possible to obtain a device having higher luminance or durability.
  • a low refractive index medium When a low refractive index medium is formed between the transparent electrode and the transparent substrate with a thickness longer than the wavelength of light, the light emitted from the transparent electrode is extracted to the outside as the refractive index of the medium is lower. Increases efficiency.
  • the low refractive index layer include air mouth gel, porous silica, magnesium fluoride, and fluorine-based polymer. Since the refractive index of the transparent substrate is generally about 1.5 to 1.7, the low refractive index layer preferably has a refractive index of about 1.5 or less. Further, it is preferably 1.35 or less.
  • the thickness of the low refractive index medium should be at least twice the wavelength in the medium.
  • the method of introducing a diffraction grating into an interface or any medium that causes total reflection is characterized by a high effect of improving light extraction efficiency.
  • This method is generated from the light-emitting layer by utilizing the property that the diffraction grating can change the direction of light to a specific direction different from refraction by so-called Bragg diffraction such as first-order diffraction and second-order diffraction.
  • the light that cannot go out due to total reflection between layers is introduced by introducing a diffraction grating into any layer or medium (in a transparent substrate or transparent electrode).
  • the light is diffracted and light is taken out.
  • the diffraction grating to be introduced has a two-dimensional periodic refractive index. This is because light emitted from the light-emitting layer is randomly generated in all directions, so in a general one-dimensional diffraction grating having a periodic refractive index distribution only in one direction, light traveling in a specific direction It is only diffracted and the light extraction efficiency does not increase so much.
  • the refractive index distribution into a two-dimensional distribution, The light traveling in the direction is diffracted, and the light extraction efficiency increases.
  • the position where the diffraction grating is introduced may be between any force layers or in the medium (in the transparent substrate or the transparent electrode), but in the vicinity of the organic light emitting layer where light is generated. desirable.
  • the period of the diffraction grating is preferably about 1Z2 to 3 times the wavelength of light in the medium.
  • the arrangement of the diffraction gratings is preferably two-dimensionally repeated, such as a square lattice, a triangular lattice, a square, or a eucam lattice.
  • the organic EL device of the present invention can be designed to provide, for example, a structure on the microlens array on the light extraction side of the substrate in order to efficiently extract the light generated in the light emitting layer.
  • the luminance in a specific direction can be increased by condensing light in a specific direction, for example, the front direction with respect to the element light emitting surface.
  • a microlens array square pyramids with a side of 30 ⁇ m and an apex angle of 90 degrees are arranged two-dimensionally on the light extraction side of the substrate.
  • One side is preferably 10 / z m to LOO / z m. If it is smaller than this, the effect of diffraction is generated, and if the color is too large, the thickness is increased, which is not preferable.
  • the light condensing sheet for example, an LED backlight of a liquid crystal display device that is put into practical use can be used.
  • a brightness enhancement film (BEF) manufactured by Sumitomo 3EM may be used.
  • the shape of the prism sheet for example, the substrate may be formed with stripes having a vertex angle of 90 degrees and a pitch of 50 111, or the vertex angle is rounded, and the pitch is randomly changed. It may be a shape or other shapes.
  • a light diffusing plate film may be used in combination with a light collecting sheet in order to control the light emission angle of the light emitting element.
  • a diffusion film (light-up) manufactured by Kimoto Co., Ltd. can be used.

Landscapes

  • Electroluminescent Light Sources (AREA)

Abstract

Processus de fabrication de panneau EL organique mince de poids léger permettant d'éviter l’apparition d'une panne secondaire due à l’installation d’un élément d’étanchéité flexible pour supprimer l’apparition des taches noires et permettant, sans devoir augmenter les coûts de fabrication ni la capacité de production, de prolonger la durée de service de la couche électroluminescente. L’invention concerne un processus de fabrication d’un panneau EL organique par collage d’un élément d’étanchéité flexible sur un élément EL organique obtenu par superposition séquentielle sur un substrat d’au moins une première couche d’électrode, d’une couche composée organique et d’une seconde couche d’électrode, caractérisé par une opération de formation d’une couche d’étanchéité englobant les phases de collage d’un élément d’étanchéité flexible et de découpe, de sorte que l’élément d’étanchéité flexible est collé sur l’élément EL organique au moyen d’un agent d’étanchéité dans la phase de collage et ensuite, les portions indésirables de l’élément d’étanchéité flexible collé dans la phase de collage sont découpées dans la phase de découpe.
PCT/JP2006/316291 2005-09-05 2006-08-21 Processus de fabrication de panneau electroluminescent organique WO2007029474A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2007534307A JPWO2007029474A1 (ja) 2005-09-05 2006-08-21 有機エレクトロルミネッセンスパネルの製造方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005256217 2005-09-05
JP2005-256217 2005-09-05

Publications (1)

Publication Number Publication Date
WO2007029474A1 true WO2007029474A1 (fr) 2007-03-15

Family

ID=37835597

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/316291 WO2007029474A1 (fr) 2005-09-05 2006-08-21 Processus de fabrication de panneau electroluminescent organique

Country Status (2)

Country Link
JP (1) JPWO2007029474A1 (fr)
WO (1) WO2007029474A1 (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010071035A1 (fr) * 2008-12-17 2010-06-24 コニカミノルタホールディングス株式会社 Processus de production d'un dispositif électroluminescent organique
JPWO2011105141A1 (ja) * 2010-02-23 2013-06-20 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子及びその製造方法
WO2015152395A1 (fr) * 2014-04-04 2015-10-08 コニカミノルタ株式会社 Dispositif de coupe de substrat de diodes électroluminescentes organiques et substrat de diodes électroluminescentes organiques

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047381A (ja) * 2002-07-15 2004-02-12 Rohm Co Ltd フレキシブル有機エレクトロ・ルミネッセンス素子、その製造方法及び情報表示装置及び照明装置
JP2004220870A (ja) * 2003-01-10 2004-08-05 Semiconductor Energy Lab Co Ltd 発光装置の製造方法
JP2005078932A (ja) * 2003-08-29 2005-03-24 Asahi Glass Co Ltd 有機ｅｌ発光装置及びその製造方法
JP2005157141A (ja) * 2003-11-27 2005-06-16 Toshiba Matsushita Display Technology Co Ltd 表示装置及びその製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004047381A (ja) * 2002-07-15 2004-02-12 Rohm Co Ltd フレキシブル有機エレクトロ・ルミネッセンス素子、その製造方法及び情報表示装置及び照明装置
JP2004220870A (ja) * 2003-01-10 2004-08-05 Semiconductor Energy Lab Co Ltd 発光装置の製造方法
JP2005078932A (ja) * 2003-08-29 2005-03-24 Asahi Glass Co Ltd 有機ｅｌ発光装置及びその製造方法
JP2005157141A (ja) * 2003-11-27 2005-06-16 Toshiba Matsushita Display Technology Co Ltd 表示装置及びその製造方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010071035A1 (fr) * 2008-12-17 2010-06-24 コニカミノルタホールディングス株式会社 Processus de production d'un dispositif électroluminescent organique
JPWO2010071035A1 (ja) * 2008-12-17 2012-05-24 コニカミノルタホールディングス株式会社 有機エレクトロルミネッセンス素子の製造方法
JP5353898B2 (ja) * 2008-12-17 2013-11-27 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子の製造方法
JPWO2011105141A1 (ja) * 2010-02-23 2013-06-20 コニカミノルタ株式会社 有機エレクトロルミネッセンス素子及びその製造方法
WO2015152395A1 (fr) * 2014-04-04 2015-10-08 コニカミノルタ株式会社 Dispositif de coupe de substrat de diodes électroluminescentes organiques et substrat de diodes électroluminescentes organiques
JPWO2015152395A1 (ja) * 2014-04-04 2017-04-13 コニカミノルタ株式会社 Ｏｌｅｄ基材カット装置及びｏｌｅｄ基材

Also Published As

Publication number Publication date
JPWO2007029474A1 (ja) 2009-03-19

Similar Documents

Publication Publication Date Title
JP5157440B2 (ja) 有機ｅｌ素子の製造方法
WO2007034647A1 (fr) Procede pour produire un element organique electroluminescent et un dispositif d'affichage organique electroluminescent
JP2007200692A (ja) 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネル
JP5652405B2 (ja) 有機ｅｌ素子の製造方法
WO2008032526A1 (fr) processus de PRODUCtion d'UN film d'étanchéité flexible et dispositifs électroluminescents organiques réalisés à l'aide du film
JP5447244B2 (ja) 有機エレクトロルミネッセンスパネルの製造方法
JP2007073332A (ja) 有機エレクトロルミネッセンスパネル、有機エレクトロルミネッセンスパネルの製造方法
JP5104849B2 (ja) 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子
JP2011108566A (ja) 有機ｅｌパネル
JP4862578B2 (ja) 有機エレクトロルミネッセンスパネルの製造方法
JP6020339B2 (ja) プラズマｃｖｄ成膜用マスク、及びプラズマｃｖｄ成膜方法
JP5104301B2 (ja) 有機エレクトロルミネッセンスパネルの製造方法
JP2008226471A (ja) 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネル
JP2007149589A (ja) 有機エレクトロルミネッセンス素子の製造方法
JP4867821B2 (ja) 可撓性基板保持具、有機エレクトロルミネッセンスパネルの製造方法
JP2007207469A (ja) 積層体の製造方法、積層体、有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子、有機エレクトロルミネッセンス表示装置
JP2007200591A (ja) 有機エレクトロルミネッセンスパネルの製造方法及び有機エレクトロルミネッセンスパネル
JP4816357B2 (ja) 有機エレクトロルミネッセンスパネル、有機エレクトロルミネッセンスパネルの製造方法
JPWO2009025186A1 (ja) 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンスパネル
JP5092756B2 (ja) 有機エレクトロルミネッセンスパネルの製造方法、有機エレクトロルミネッセンス照明装置および有機エレクトロルミネッセンスパネルの製造装置
WO2007029474A1 (fr) Processus de fabrication de panneau electroluminescent organique
WO2014104102A1 (fr) Procédé de production d'un élément électroluminescent organique et élément électroluminescent organique
JP4957643B2 (ja) 有機化合物層形成用塗布液の塗布方法
JP5282786B2 (ja) 有機エレクトロルミネッセンス素子の製造方法、有機エレクトロルミネッセンス素子
JP4622746B2 (ja) 有機エレクトロルミネッセンス素子の製造方法

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application
ENP Entry into the national phase

Ref document number: 2007534307

Country of ref document: JP

Kind code of ref document: A

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06782846

Country of ref document: EP

Kind code of ref document: A1