Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
  • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
  • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
  • B26D7/26—Means for mounting or adjusting the cutting member; Means for adjusting the stroke of the cutting member
  • B26D7/2614—Means for mounting the cutting member
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • B23B—TURNING; BORING
  • B23B31/00—Chucks; Expansion mandrels; Adaptations thereof for remote control
  • B23B31/02—Chucks
  • B23B31/10—Chucks characterised by the retaining or gripping devices or their immediate operating means
  • B23B31/12—Chucks with simultaneously-acting jaws, whether or not also individually adjustable
  • B23B31/16—Chucks with simultaneously-acting jaws, whether or not also individually adjustable moving radially
  • B23B31/1627—Details of the jaws
  • B23B31/16275—Form of the jaws
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B26—HAND CUTTING TOOLS; CUTTING; SEVERING
  • B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
  • B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting

Definitions

• the present invention relates to a cutter blade holder, and more particularly, to a cutter blade holder capable of maintaining a fixed mounting position with respect to a cutting device and improving the cutting ability of the blade.
• a protective sheet for protecting a circuit surface is attached to an adherend such as a semiconductor wafer (hereinafter simply referred to as “wafer”).
• Patent Document 1 discloses a cutting device including a cutter blade for performing such cutting.
• Patent Document 1 JP-A-6-335893
• Patent Document 1 all considerations have been made for a configuration for keeping the blade mounting position constant and a means for improving the cutting ability of the blade!
• the object of the present invention is to keep the mounting position of the cutter blade constant, and when cutting a sheet or the like, it is possible to perform effective cutting according to the material, thickness, strength, etc. of the sheet. It is to provide a cutter blade holder.
• the present invention provides a blade blade holder for a cutter blade, which is detachably provided on a cutter blade holding chuck located on the free end side of a cutting device and has a blade attached to the tip.
• It has a configuration in which a chuck engaging portion that engages with the cutter blade holding chuck is provided. ing.
• an orientation determining means for maintaining the direction of the blade in a predetermined direction with respect to the stock device for the cutter blade attached to the cutting device is provided.
• the cutter blade holder may have a heating means inside.
• the cutter blade holder can be formed of a material having a heat retaining property, and ceramics can be exemplified as the material having the heat retaining property.
• the cutter blade holder may employ a configuration provided with vibration imparting means for vibrating the blade.
• the cutter blade holder has a configuration in which a blade is detachably provided.
• the cutter blade holder includes the chuck engaging portion. Therefore, the chuck blade holder chuck is engaged with the chuck pawl of the cutter blade holding chuck. Is kept constant, and the direction of the blade can always be kept constant. Therefore, when applied to a cutting device operating as a robot, there is no inconvenience that the direction of the blade is directed in a different direction with respect to the set movement trajectory of the blade.
• the blade orientation can be kept constant when the cutter blade is housed in the stock device, the blade orientation that has been set in advance when the cutting device automatically carries out the cutter blade mounting operation.
• the cutter blade can be installed with.
• the heating means is provided inside the blade holder, the cutting performance can be effectively exhibited according to the properties of the sheet to be cut.
• the blade holder is made of a material having a heat retaining property, heat dissipation can be suppressed and a high temperature state can be maintained.
• the cutting ability can be further enhanced by providing the vibration applying means.
• the blade is detachable at the tip of the blade holder, even if the blade is damaged or deteriorated over time, the blade holder can be used continuously by replacing only the blade, reducing running costs. Can be achieved.
• FIG. 1 is a schematic perspective view in which a stock apparatus is provided in addition to a cutting apparatus for cutting a sheet on a wafer.
• FIG. 2 is a side view of a table for supporting a wafer and a cutting device.
• FIG. 3 is a schematic plan view showing a state in which a chuck claw is engaged with a blade holder.
• FIG. 4 is a schematic perspective view of a cutter blade.
• FIG. 5 is an exploded perspective view of the cutter blade.
• FIG. 6 is an enlarged cross-sectional view taken along the line A—A in FIG.
• FIG. 1 shows a schematic perspective view according to the present embodiment.
• a stock device 11 of a cutter blade 21 and a table 13 for supporting a wafer W are arranged in the vicinity of the cutting device 10.
• a belt-like protective sheet S (hereinafter referred to as “sheet S”) is affixed to the upper surface (for example, the circuit surface) of the wafer W, and the sheet S extends along the outer edge of the wafer W. Cutting is performed by the cutting device 10.
• the cutting device 10 includes a robot body 20 and a cutter blade 21 supported on the free end side of the robot body 20.
• the robot body 20 includes a base portion 23, first arm 23A to sixth arm 23F arranged on the upper surface side of the base 23 portion and provided to be rotatable in the directions of arrows A to F, and tips of the sixth arm 23F. And a cutter blade holding chuck 29 attached to the side.
• the second, third, and fifth arms 23B, 23C, and 23E are rotatably provided in the YX Z plane in FIG.
• the six arms 23A, 23D, and 23F are rotatably provided around the axis.
• the cutter blade holding chuck 29 is disposed at a position approximately spaced by 120 degrees in the circumferential direction of the force cutter blade receiver 30 and the cutter blade receiver 30 having a substantially cylindrical shape, and attaches and detaches the cutter blade 21. It comprises three chuck claws 31 (see FIG. 3) that can be freely held. Each chuck claw 31 is a pointed portion 31A having an acute angle at the inner end, and is provided so as to be able to advance and retreat in the radial direction with respect to the center of the cutter blade receiver 30 by pneumatic pressure.
• the cutting device 10 is controlled by a control device (not shown). This control device controls movement when cutting the protective sheet S by the cutting device 10 and automatically controls the force utter blade 21 accommodated in the stock device 11. It is provided to control the proper attachment / detachment operation.
• the cutter blade 21 includes a blade holder 21A and a blade 21B fixed to the distal end side of the blade holder 21A.
• the blade holder 21A has a substantially cylindrical shape, and a groove 33 as a chuck engaging portion having a length extending from the base end to the intermediate portion is formed along the axial direction at a position approximately 120 degrees apart in the circumferential direction of the outer peripheral surface thereof. In this way, the position of the cutter blade 21 with respect to the cutter blade holding chuck 29 is kept constant by engaging the pointed portion 31A of the chuck claw 31 with these grooves 33 (see FIG. 3). ).
• inclined surfaces 21C and 21C as azimuth determining means are formed at relative positions on the tip side of the blade holder 21A.
• the inclined surfaces 21C and 21C in the present embodiment are provided symmetrically with respect to the virtual center plane of the blade holder 21A, but may be provided asymmetrically.
• a slot-like insertion portion 21D for fixing the blade 21B is provided at a predetermined depth on the distal end side of the blade holder 21A, and the blade 21B is inserted into the insertion portion 21D.
• the base of 21B can be inserted and fixed.
• screw holes 35, 36 are formed in the surface of the inclined surface 21C and on the side surfaces thereof, and the fixing screws 37, 36, which are screw-engaged with these screw holes 35, 36.
• heating means such as a coil heater (not shown) is provided inside the blade holder 21A, and the blade 21B is heated to a predetermined temperature by energizing the coil heater. Accordingly, the blade 21B can be heated according to the sheet S to be cut. At this time, the blade holder 21 prevents heat dissipation. Therefore, for example, it is preferable to use a material having a heat retaining property such as ceramics. Further, in the present embodiment, vibration imparting means (not shown) by ultrasonic vibration or the like is built in the blade holder 21A, and the cutting operation can be performed while vibrating the blade 21B by the vibration imparting means.
• vibration imparting means (not shown) by ultrasonic vibration or the like is built in the blade holder 21A, and the cutting operation can be performed while vibrating the blade 21B by the vibration imparting means.
• the stock apparatus 11 is formed in a case body 40 and a plurality of housings formed on the case body 40 and configured to house the cutter blades 21 independently.
• Each accommodating portion 41 has a bottomed shape with an upper end opened, and the upper portion is a blade holder accommodating portion 43, while the lower portion is a blade accommodating portion 44.
• Engagement surfaces 43A and 43A corresponding to the inclined surfaces 21C and 21C of the blade holder 21A are formed on the inner surface of the blade holder accommodating portion 43, and the inclined surfaces 21C and 21C are seated on these engagement surfaces 43A and 43A.
• the circumferential direction position of the cutter blade 21 in the accommodating portion 41 is provided at a constant position.
• the engagement surfaces 43A and 43A are provided in an asymmetric surface shape corresponding to the inclined surfaces 21C and 21C.
• each chuck claw 31 of the cutter blade holding chuck 29 open each chuck claw 31 is moved inward by air pressure.
• the pointed tip portion 31A engages with the groove 33 of the cutter blade 21 so that the cutter blade 21 is mounted in a predetermined direction.
• the cutter blade 21 of the cutting apparatus 10 moves along the outer edge of the wafer W, and the wafer W Cut the outer sheet S as an unnecessary sheet part.
• the blade 21 may be heated via a coil heater in the blade holder 21A, or may be vibrated by an ultrasonic vibration device. As a result, the sheet S can be cut in a state where the sheet S matches the outer edge of the wafer W and the cutting force is very low.
• the cutter blade 21 is accommodated in the stock device 11.
• the blade holder 21A is accommodated in a state where the inclined surface 21C coincides with the engagement surface 43A, so that the cutter blade 21 is always accommodated in a fixed orientation, and is cut in the next cutting.
• the device 10 picks up the cutter blade 21, it is mounted on the cutter blade holding chuck 29 while maintaining a certain orientation, that is, in a state where it can retain the orientation corresponding to the movement trajectory described above. It will be.
• the cutter blade 21 can be automatically attached to the cutter blade holding chuck 29 of the cutting device 10 in a fixed direction.
• the cutting ability can be improved by using the cutter blade 21 that is heated and / or vibrated as necessary.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Life Sciences & Earth Sciences (AREA)
• Forests & Forestry (AREA)
• Details Of Cutting Devices (AREA)

Applications Claiming Priority (2)

Publications (1)

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Family Applications (1)

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Citations (2)

• 2005
  • 2005-08-08 JP JP2005229225A patent/JP4777716B2/ja not_active Expired - Fee Related
• 2006
  • 2006-07-21 WO PCT/JP2006/314486 patent/WO2007018025A1/ja active Application Filing
  • 2006-08-07 TW TW095128864A patent/TW200730312A/zh unknown

Patent Citations (2)

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