Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/25—Arrangements for cooling characterised by their materials
  • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
  • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
  • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W74/00—Encapsulations, e.g. protective coatings
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W90/00—Package configurations
  • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
  • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
  • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Definitions

• Thermal conductive sheet Method for producing the same, and power module using the thermal conductive sheet
• the present invention relates to a heat conductive sheet that emits heat generated by a heat generating body such as a power semiconductor element, a manufacturing method thereof, and a power module using the heat conductive sheet.
• insulation such as Al 2 O, A1N or BeO that also has a material force with excellent insulation and thermal conductivity
• Patent Document 1 JP 2001-156253 A (page 3)
• the ceramic plate is made thin, the strength is inferior, so that cracks due to the stress are likely to occur. If the ceramic plate is made thick, the crack can be prevented, but the thermal conductivity of the heat conductive sheet is lowered.
• the present invention has been made in order to solve a problem to be solved, and has excellent thermal conductivity and is a crack in a material having thermal conductivity typified by ceramics in a thermal conductive sheet. It aims at obtaining the heat conductive sheet by which generation
• a heat conductive sheet according to the present invention is provided adjacent to each other, and is interposed between a plurality of thin body pieces having heat conductivity and side surfaces of the plurality of thin body pieces, and bonds the side surfaces to each other. And a resin composition as a sheet.
• the thermal conductivity is excellent and cracks in the thermal conductive sheet are prevented. .
• FIG. 1 is a top view and a cross-sectional view showing a schematic configuration of a heat conductive sheet in Embodiment 1 of the present invention.
• FIG. 2 is a characteristic diagram showing the relationship between the size in the surface direction of the thin piece of the heat conductive sheet and the thermal resistance of the heat conductive sheet in Embodiment 1 of the present invention.
• FIG. 3 is a characteristic diagram showing the relationship between the size in the surface direction of the thin piece of the heat conductive sheet and the withstand voltage of the heat conductive sheet in the first embodiment of the present invention.
• FIG. 4 is a characteristic diagram showing the relationship between the size in the surface direction of the thin piece of the heat conductive sheet and the defect rate of the heat conductive sheet in Embodiment 1 of the present invention.
• FIG. 5 is a cross-sectional view showing a schematic configuration of a thin piece of another heat conductive sheet in Embodiment 1 of the present invention.
• FIG. 6 is a process diagram showing an outline of a method for producing a heat conductive sheet in the second embodiment of the present invention.
• FIG. 7 is a cross-sectional view schematically showing a thin body used in another method for producing a heat conductive sheet in Embodiment 2 of the present invention.
• FIG. 8 is a characteristic showing the relationship between the V-shaped apex angle of the V-shaped groove and the pressure required to divide the thin body piece and the withstand voltage of the heat conductive sheet in Embodiment 2 of the present invention.
• FIG. 9 is a process diagram showing an outline of a method for producing a heat conductive sheet in the third embodiment of the present invention.
• FIG. 10 is a top view showing a schematic configuration of a heat conductive sheet and a layout diagram of a heating element (heated conductor) mounted thereon in Embodiment 5 of the present invention.
• FIG. 11 is a top view showing a schematic configuration of a heat conductive sheet and a layout diagram of a heating element (heated conductor) mounted thereon in Embodiment 6 of the present invention.
• FIG. 12 is a cross-sectional view showing a schematic configuration of a power module in a seventh embodiment of the present invention.
• thermal conductive sheet 2 resin composition, 20 resin layer, 21 surface resin layer, 3 thin body, 31 thin body piece, 32 side surface (split section), 33 groove, 34 surface, 5 holding sheet (Adhesive sheet), 6 heat generator (heated conductor), 7 power module.
• FIG. 1 is a top view and a cross-sectional view showing a schematic configuration of a heat conductive sheet in Embodiment 1 of the present invention, and (a) is a surface view provided on the surface of the heat conductive sheet 1 of the present embodiment.
• a plurality of thin pieces 31 having heat conductivity are adjacent to each other in the plane direction, and between the side faces 32 of the thin pieces 31.
• the thermal conductivity is not limited to the use of a single thermal conductive material, such as a ceramic plate, in which the resin composition 2 is interposed and the side surface 32 is bonded to the resin composition 2 to form a sheet.
• the resin composition 2 is continuously provided on the surface 34 of the thin piece 31 to form a surface resin layer 21.
• Table 1 shows the size and interval in the surface direction of the thin body piece 31 in the heat conductive sheet 1 of the present embodiment, and the characteristics of the heat conductive sheet 1.
• the resin composition 2 is an epoxy resin
• the thin piece 31 also has a 0.61 mm thick A1N (aluminum nitride) ceramic plate force, as shown in Table 1.
• the square in the direction of the surface is a square of lmm square to 30mm square, and the distance between them is 0.05m! Thermal resistance, dielectric strength, and defect rate were measured for a thermal conductive sheet 1 (0.7 mm thickness) of ⁇ 5 mm.
• the defect rate refers to the heat conduction sheet 1 after performing a 300-cycle heat cycle test with "-30 ° C hold for 30 minutes and 125 ° C hold for 30 minutes" as one cycle. It is the ratio of the thin piece 31 with cracks to the total thin piece 31 of the heat conductive sheet 1, and the heat conductive sheet 1 is provided with the surface resin layer 21 on the surface 34 of the thin piece 31. It is 0.7mm thick.
• Fig. 2 is a characteristic diagram showing the relationship between the thermal resistance of the thin piece 31
• Fig. 3 is a characteristic diagram showing the relationship between the size of the thin piece 31 in the surface direction and the dielectric strength of the heat conducting sheet 1.
• Fig. 4 shows a characteristic diagram showing the relationship between the size of the direction and the defect rate of the thermal conductive sheet 1. 2 to 4, a is a characteristic when the interval between the thin pieces 31 is 0.05 mm, b is a characteristic when the interval between the thin pieces 31 is 0.1 mm, and c is a thin piece. The characteristic when the interval of 31 is 3 mm, and d is the characteristic when the interval between the thin pieces 31 is 5 mm.
• the withstand voltage of the heat conducting sheet 1 is not affected by the size of the thin piece 31 and is constant. If the size of the thin piece 31 is less than 3 mm square, the thermal resistance of the heat conductive sheet 1 is increased if the size is less than 3 mm square. Tend to be prominent.
• the thin piece 31 exceeds 25 mm square, the possibility of cracks in the thin piece increased due to impact stress during the manufacturing process or during use. From the above, when the force in the surface direction of the thin piece 31 relating to the heat conductive sheet 1 of the present embodiment is 3 mm square or more and 25 mm square or less, the stress can be relaxed and the heat conduction It can be seen that cracks in the gate can be prevented, and that dielectric strength and thermal conductivity can be secured.
• the size of the thin piece 31 relating to the heat conductive sheet 1 of the present embodiment is 5 mm square or more and 15 mm square or less, cracking of the heat conductive sheet can be further prevented. As a result, it is possible to ensure thermal conductivity.
• the thin piece 31 is made of a ceramic plate such as Al 2 O (alumina) or BN (boron nitride).
• the same result as in the present embodiment was obtained.
• the same result as in the present embodiment was obtained even when the thickness of the thin piece 31 was in the range of 0.1 mm or more and 2 mm or less.
• the surface direction force side of the thin piece 31 relating to the heat conductive sheet 1 is a square of 3 mm or more and 25 mm or less.
• the longest diagonal length of the thin piece 31 is a square diagonal length of 3 mm on a side (3 2 + 3 2 ) 1/2 mm or more, and a diagonal length of a square with a side of 25 mm. If it is less than (25 2 + 25 2 ) 1/2 mm, the shape in the surface direction of the thin piece 31 is not limited to a square, and even if it is a polygon or a circle, the same effect as this embodiment Can be obtained.
• the interval between the thin body pieces 31 in the heat conductive sheet 1 is narrow, because the thermal resistance is low. However, if the distance is too small, the resin composition 2 enters between the thin body pieces 31.
• the gap is 0.1 mm or more. Preferably there is. However, since the thermal resistance tends to increase when the thickness exceeds 3 mm, the interval is preferably 0.1 mm or more and 3 mm or less.
• FIGS. 5 (a) to 5 (d) are cross-sectional views showing a schematic configuration of a thin piece of another heat conductive sheet in the first embodiment of the present invention, and the thin piece in the present embodiment.
• the sectional shape of 31 (side surface) 3 2 is oblique with respect to the sheet surface of the heat conducting sheet 1, and (c) is the case where the sectional shape is part of an arc.
• the sectional shape (side surface) 32 of the thin piece 31 is not vertical to the heat conductive sheet 1 surface.
• electric field concentration is prevented from occurring at the corners of the thin piece 31 and dielectric breakdown is unlikely to occur.
• the creepage distance in the thickness direction of the heat conductive sheet 1 of the divided section (side surface) 32 of the thin piece 31 is The insulation withstand voltage improves as the length increases.
• the resin composition 2 related to the heat conductive sheet 1 of the present embodiment is for adhering between the divided sections (side surfaces) 32 of the thin piece 31 to form a sheet.
• the thin piece 31 is not necessarily required on the surface 34, but considering the thermal resistance and adhesiveness that are preferable from the viewpoint of adhesion to the adhesive member, the thin piece
• the thickness of the surface resin layer 21 on the surface 31 is preferably 1 ⁇ m or more and 100 ⁇ m or less, more preferably 5 ⁇ m or more and 40 ⁇ m or less. If the thickness of the surface resin layer 21 is less than l / z m, adhesion is difficult to obtain. If it exceeds 100 / z m, the thermal resistance becomes very large.
• the resin composition 2 contains particles for thermal conductivity.
• a metal filler or an inorganic powder filler having excellent thermal conductivity can be used, and the insulating property is excellent.
• An inorganic powder filler such as aluminum halide
• the particle size of the above particles is 0. Ol / zm or more, 100 m or less, 0. or more, and 20 m or less. improves.
• the sheet-like or plate-like thin body 3 having thermal conductivity related to the thermal conductive sheet 1 of the present embodiment one having a high thermal conductivity of 1 OWZmK or more and a thermal conductivity is used.
• a thermal conductivity for example, Al O (aluminum) with a thermal conductivity of 30 WZmK or more is preferred.
• the divided section 32 of the thin piece 31 is not flat, so that the adhesion is improved by the anchor effect and the withstand voltage is improved.
• the thickness of the thin body 3 is more preferably 0.1 mm or more, 2 mm or less, 0.1 mm or more, or 0.8 mm or less, as the thermal resistance is reduced. If the thickness of the thin body 3 is less than 0.1 mm, the strength of the sheet becomes weak and warpage may occur, and if it exceeds 2 mm, the thermal resistance may increase.
• FIG. 6 is a process diagram showing an outline of a method for producing a heat conductive sheet in the second embodiment of the present invention.
• grooves 33 are formed on the surface of the sheet-like or plate-like thin body 3 having thermal conductivity, and as shown in FIG. 6 (b), the thin body 3
• the resin layer 20 comprising the resin composition 2 is provided on both surfaces of the thin film 3 and the thin film 3 is coated with a pressure 30 by applying pressure 30 to the resin layer 20 from at least one surface of the thin film 3.
• the resin composition 2 is interposed between the divided sections 32 of the thin piece 31 and the thin piece 31 is cut. To form a sheet.
• the thin body 3 is formed into the thin piece 31 by providing the groove 33 on the surface of the thin body 3 as described above so as to be easily divided.
• a first step of dividing, and a second step of interposing the resin composition 2 between the divided sections (side surfaces) 32 of the thin piece 31 and bonding the side surfaces to form a sheet. Can be applied at the same time.
• the thin groove 3 is provided with a dividing groove 33, the thin body 3 is divided easily and in a controlled manner by the pressure applied to the side surface of the groove 33.
• the groove 33 in addition to the groove 33 having a cross-sectional shape in the width direction as shown in FIG. 6 (a), in the second embodiment of the present invention of FIG.
• the same effect can be obtained by using a groove 33 having a semicircular cross-sectional shape in the width direction.
• the thin body 3 having the cross-sectional shape shown in FIG. 6 (a) when used, the thin body 3 having the cross-sectional shape shown in FIG. 7 is used for the thin piece 31 having the cross-sectional shape shown in FIG. 5 (a). Is the cross-sectional shape shown in Fig. 5 (c) It is divided into thin thin pieces 31.
• Fig. 6 (a) if grooves 33 are formed on both sides of thin body 3, it will be easier to divide. Even if it is formed on at least one surface of thin body 3, it can be divided. In this case, the thin piece 31 having a cross-sectional shape shown in FIG.
• the groove 33 is formed only on one surface of the thin body 3, when the heat conductive sheet 1 is used, by forming the groove 33 on the side on which the heating element is mounted, the thin body piece 31 can efficiently generate the heating element force. Can spread the transmitted heat.
• the thickness of the heat conductive sheet 1 can be controlled by the thickness of the thin body 3 and the amount of the resin composition 2.
• the heat conductive sheet 1 can be easily manufactured with a thin and high thermal conductivity.
• Table 2 shows the material, thickness, and thickness of the sheet-like or plate-like thin body 3 having thermal conductivity used in the method for manufacturing the heat conductive sheet 1 of the present embodiment.
• V-shaped apex angle (V-groove angle) in the groove 33 having a V-shaped cross section in the width direction and the pressure required to divide the thin body 3, the composition of the resin composition 2, and the surface on the thin piece 31
• the thickness (surface thickness) of the resin layer 21 and the withstand voltage of the heat conductive sheet 1 are shown.
• epoxy resin filled with Al 2 O (alumina) filler as the resin composition 2 epoxy resin filled with Al 2 O (alumina) filler as the resin composition 2
• a 0.635 mm thick A1N (aluminum nitride) ceramic plate was used as the thin body 3. As shown in Table 2, V-shaped grooves 33 with apex angles of 10 ° to 160 ° were formed at a depth of 0.2 mm.
• the heat conduction sheet 1 of Embodiment 2-1 to Embodiment 2-6 was manufactured as described above by providing and dividing by applying the pressure shown in Table 2, and the dielectric strength voltage was measured.
• the resin composition 2 is interposed between each thin piece 31 and also across the surface of the thin piece 31 to become a surface fat layer 21 (surface thickness) and used as an adhesive layer.
• the final thickness of the surface resin layer 21 is determined by the pressure 30 applied to the resin layer 20 and the particle size of the filler filled in the resin composition 2, for example, the surface resin layer When 21 is set to 200 m or less, the maximum particle size distribution of 200 m is not taken into consideration in consideration of the particle size distribution of the filler.
• the adhesive layer when the adhesive layer is to be thinned to 100 m or less, it is filled with a flake-form boron nitride filler, the force to make the pressure 30 above lOMPa, and the maximum particle size distribution of the filler is 100 m. Fill something.
• the thin piece 31 The size is 10 mm square, and the interval between each thin piece 31 is 0.5 mm.
• FIG. 8 is obtained based on Table 2.
• p is the V-shape provided in the thin body 3 in the method for manufacturing the heat conductive sheet 1 of the present embodiment.
• the relationship between the V-shaped apex angle of the groove 33 and the pressure required to divide the thin body 3 into the thin piece 31 is shown, and q indicates the relationship between the apex angle and the dielectric strength of the heat conductive sheet 1.
• the apex angle is preferably 20 ° or more and 160 ° or less. Furthermore, when the V-shaped apex angle is 60 ° or more, the dielectric strength is excellent. When the V-shaped apex angle is 120 ° or less, the pressure required for cutting is small. Therefore, the V-shaped apex angle of the V-shaped groove 33 is 60 ° or more, 120 It is more preferable that the temperature is not more than °.
• a ceramic plate such as Al 2 O 3 (alumina) or BN (boron nitride) is used.
• the present embodiment can be applied even when the thickness of the thin body 3 is in the range of 0.1 mm or more and 2 mm or less and the depth of the groove 33 is in the range of 0.05 mm or more and 0.4 mm or less. Similar results were obtained.
• Table 3 shows, in another heat conductive sheet according to the present embodiment, the occupation ratio of the thin piece 31 in the material and thickness of the thin piece 31 and the surface area of the heat conductive sheet 1, and the resin composition.
• the composition of the product 2 and the thickness (surface thickness) of the surface resin layer 21 on the thin piece 31 and the thermal conductivity of the thermal conductive sheet 1 are shown.
• the thin body 3 with thermal conductivity is made of A1N (aluminum nitride) or Al 2 O (alumina).
• Ceramic plate as the resin composition 2 with Al 2 O (alumina) filler or BN (boron nitride).
• the thermal conductive sheet 1 according to the present embodiment is excellent in thermal conductivity.
• the thermal conductive sheet 1 can be subjected to a 300-cycle heat cycle test during the manufacturing process and “holding at -40 ° C for 30 minutes and holding at 125 ° C for 30 minutes” as one cycle. The ceramic plate was not cracked.
• FIGS. 9 (a) and 9 (f) are process diagrams showing an outline of the manufacturing method of the heat conductive sheet in Embodiment 3 of the present invention.
• the thin body 3 in the first process is shown in FIG. This is a case where the division is performed using the holding sheet 5.
• the thin body 3 is divided by the force 40 that pulls the holding sheet 5 in the surface direction to obtain the thin body piece 31.
• the thin body 3 is made fragile like a ceramics plate, a groove 33 is provided on the surface of the thin body 3, or the thin body 3 is thinned to a thickness of, for example, about 100 m. It can be done easily.
• the resin layer 20 made of the resin composition 2 is provided on the thin piece 31, and the pressure 30 is applied to the resin layer 20 to perform the second step.
• the resin composition 2 is interposed between the split sections 32 of the thin piece 31, and thereafter the holding sheet 5 is removed as shown in FIG. 9 (e).
• the heat conductive sheet 1 is to have adhesiveness
• the resin is coated or pressed on the surface from which the holding sheet 5 is removed, and the resin is left in a semi-cured state.
• the heat conductive sheet is obtained by the presence of the copper foil 4 on one side, which may be adhered to the copper foil 4 by the resin composition 2 on the surface from which the holding sheet 5 is removed.
• the moisture resistance of 1 is improved.
• the manufacturing method of the heat conductive sheet 1 according to Embodiment 4 of the present invention is the same as that in Embodiment 2, except that the thin body 3 is divided, and at least one surface of the thin body 3 is made of the resin composition 2 made of the resin composition 2. Is bonded in a semi-cured state, and heating and cooling are alternately applied to divide by utilizing the difference in thermal expansion coefficient between the thin body 3 and the resin layer 20 made of the resin composition 2. Other than that, the heat conductive sheet 1 is manufactured in the same manner as in the second embodiment.
• the groove 33 on at least one surface of the thin body 3, it can be easily divided with good control.
• FIG. 10 is a top view showing a schematic configuration of a heat conductive sheet and a layout diagram of a heating element (heated conductor) mounted thereon in Embodiment 5 of the present invention.
• the heat conductive sheet 1 is a heat conductor to be radiated and released from the heat. That is, as shown in FIG. 10 (a) with the surface resin layer 21 seen through, the heat conductive sheet 1 of the present embodiment is directly below the heating element 6 mounted so that the thin pieces 31 are spaced at equal intervals. Part (mounting area Embodiment 1 except that the intervals between the thin pieces 31 in the region (1) are concentrated more narrowly than the intervals between the thin pieces 31 in the place where the direct force of the heating element 6 is also separated (the non-mounting region). This is the same as the heat conduction sheet 1.
• the thin pieces 31 are arranged as described above, so that the intervals between the thin pieces 31 are uniform throughout the heat conductive sheet 1 and the heating element. Compared with the case where the heat conductive sheet 1 is narrow and densely packed as in the portion immediately below 6, stress due to the difference in thermal expansion coefficient between the heat conductive sheet 1 and the member to be bonded to the heat conductive sheet 1 can be further relaxed.
• the interval between the thin pieces 31 is 0.1 mm or more and lm m or less. Even in the part where the spacing is wider, the spacing between the thin body pieces 31 is preferably 0.5 mm or more and 3 mm or less.
• the heat generating sheet 6 is not limited to being directly mounted on the heat conductive sheet 1, and a metal or ceramic plate may be interposed between the heat generating element 6 and the heat conductive sheet 1.
• FIG. 11 is a top view showing a schematic configuration of the heat conductive sheet and a layout diagram of a heating element (heated conductor) mounted thereon according to Embodiment 6 of the present invention.
• the heat conductive sheet 1 of the present embodiment has the thin body pieces 31 at equal intervals, but the mounted heating element.
• the size of the thin piece 31 in the portion directly under 6 (mounting area) is set larger than the size of the thin piece 31 in the position where the partial force directly under the heating element 6 is separated (non-mounting area).
• the rest is the same as the heat conductive sheet 1 of the first embodiment, which reduces the thermal resistance and can efficiently dissipate the heat of the heating element.
• the shape of the thin body piece 31 is not limited to the shape shown in the above embodiment, and the groove 33 is provided so as to be a triangle or a hexagon when viewed from the top surface of the heat conduction sheet 1. Thus, the size and shape of the thin piece 31 are adjusted.
• FIG. 12 is a cross-sectional view showing a schematic configuration of the power module in the seventh embodiment of the present invention, and uses the heat conductive sheet 1 in any of the first to sixth embodiments.
• the power module 7 of the present embodiment is mounted on a heat sink 9 in which the power semiconductor element 6 is connected to the lead frame 8, and the heat conductive sheet 1 of the first to sixth embodiments is composed of the heat sink 9 and the heat spreader 11.
• the above components are sealed with a mold resin 10.
• the heat conductive sheet 1 of Embodiments 1 to 6 is disposed between the heat sink 9 and the heat spreader 11 as a semi-cured solid sheet and is heat-cured, it can be bonded with high productivity. Further, the bonding process between the heat sink 9 and the heat spreader 11 by the curing reaction of the heat conductive sheet 1 may be performed simultaneously in the sealing step with the mold resin 10.
• the power module 7 of the present embodiment was subjected to a heat cycle test with 300 cycles, with one cycle of “holding at 40 ° C for 30 minutes and holding at 125 ° C for 30 minutes” as one cycle.
• the thin piece 31 in the heat conductive sheet 1 to which the heat sink 9 and the heat spreader 11 are bonded is not cracked and heat dissipation can be maintained, and high capacity can be achieved.
• the heat conductive sheet 1 according to the present invention can be used, for example, in a semiconductor device such as a power module on which a heating element such as a power semiconductor element is mounted.

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• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Laminated Bodies (AREA)

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Cited By (8)

Citations (2)

• 2005
  • 2005-07-22 JP JP2007525482A patent/JP4582144B2/ja not_active Expired - Fee Related
  • 2005-07-22 WO PCT/JP2005/013461 patent/WO2007010615A1/ja not_active Ceased
  • 2005-09-13 TW TW094131420A patent/TW200705627A/zh not_active IP Right Cessation

Patent Citations (2)

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