TW200705627A - Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet - Google Patents

Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet

Info

Publication number
TW200705627A
TW200705627A TW094131420A TW94131420A TW200705627A TW 200705627 A TW200705627 A TW 200705627A TW 094131420 A TW094131420 A TW 094131420A TW 94131420 A TW94131420 A TW 94131420A TW 200705627 A TW200705627 A TW 200705627A
Authority
TW
Taiwan
Prior art keywords
heat transfer
transfer sheet
ceramic board
manufacturing
power module
Prior art date
Application number
TW094131420A
Other languages
English (en)
Chinese (zh)
Other versions
TWI294175B (https=
Inventor
Kei Yamamoto
Tetsuji Sorita
Kazuhiro Tada
Seiki Hiramatsu
Naoshi Yamada
Hiromi Ito
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of TW200705627A publication Critical patent/TW200705627A/zh
Application granted granted Critical
Publication of TWI294175B publication Critical patent/TWI294175B/zh

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/257—Arrangements for cooling characterised by their materials having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
    • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
    • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/753—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between laterally-adjacent chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
TW094131420A 2005-07-22 2005-09-13 Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet TW200705627A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/013461 WO2007010615A1 (ja) 2005-07-22 2005-07-22 熱伝導シートおよびその製造方法、並びに熱伝導シートを用いたパワーモジュール

Publications (2)

Publication Number Publication Date
TW200705627A true TW200705627A (en) 2007-02-01
TWI294175B TWI294175B (https=) 2008-03-01

Family

ID=37668504

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094131420A TW200705627A (en) 2005-07-22 2005-09-13 Heat transfer sheet, and manufacturing method thereof, power module using the heat transfer sheet

Country Status (3)

Country Link
JP (1) JP4582144B2 (https=)
TW (1) TW200705627A (https=)
WO (1) WO2007010615A1 (https=)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MX2008015288A (es) * 2006-05-31 2008-12-12 Denki Kagaku Kogyo Kk Unidad de fuente de luz de diodo emisor de luz.
US20100027261A1 (en) * 2007-01-30 2010-02-04 Denki Kagaku Kogyo Kabushiki Kaisha Led light source unit
JP4854571B2 (ja) * 2007-04-06 2012-01-18 三菱電機株式会社 半導体レーザ装置
JP2010073965A (ja) * 2008-09-19 2010-04-02 Denso Corp 半導体冷却ユニット
JP5484429B2 (ja) * 2011-11-18 2014-05-07 三菱電機株式会社 電力変換装置
JP5877056B2 (ja) * 2011-12-22 2016-03-02 日本シイエムケイ株式会社 パワーモジュール用絶縁放熱基板とその製造方法
JP6813473B2 (ja) * 2017-12-26 2021-01-13 公益財団法人鉄道総合技術研究所 放熱基板及びその製造方法
JP2019176060A (ja) * 2018-03-29 2019-10-10 帝人株式会社 電気絶縁性熱伝導シート及びその製造方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0661916B1 (en) * 1993-07-06 2000-05-17 Kabushiki Kaisha Toshiba Thermal conductivity sheet
JP2004172286A (ja) * 2002-11-19 2004-06-17 Kyocera Chemical Corp 熱伝導シート

Also Published As

Publication number Publication date
WO2007010615A1 (ja) 2007-01-25
JPWO2007010615A1 (ja) 2009-01-29
JP4582144B2 (ja) 2010-11-17
TWI294175B (https=) 2008-03-01

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees