WO2006134644A1 - Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques - Google Patents

Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques Download PDF

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Publication number
WO2006134644A1
WO2006134644A1 PCT/JP2005/010881 JP2005010881W WO2006134644A1 WO 2006134644 A1 WO2006134644 A1 WO 2006134644A1 JP 2005010881 W JP2005010881 W JP 2005010881W WO 2006134644 A1 WO2006134644 A1 WO 2006134644A1
Authority
WO
WIPO (PCT)
Prior art keywords
coaxial cable
press
mold
cable unit
ground
Prior art date
Application number
PCT/JP2005/010881
Other languages
English (en)
Japanese (ja)
Inventor
Masamitsu Minamiya
Seiji Hideno
Takashi Sekizuka
Akio Nieda
Hirokuni Fukuda
Kakuhei Ito
Original Assignee
Advantest Corporation
Hirakawa Hewtech Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation, Hirakawa Hewtech Corporation filed Critical Advantest Corporation
Priority to PCT/JP2005/010881 priority Critical patent/WO2006134644A1/fr
Priority to JP2007521293A priority patent/JPWO2006134901A1/ja
Priority to TW095120948A priority patent/TW200717928A/zh
Priority to PCT/JP2006/311813 priority patent/WO2006134901A1/fr
Publication of WO2006134644A1 publication Critical patent/WO2006134644A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes

Definitions

  • Coaxial cable unit Coaxial cable unit, device interface device and electronic component testing device
  • the present invention relates to a coaxial cable unit for transmitting a signal, and relates to a device interface apparatus for testing various electronic components (hereinafter also referred to as single ICs) such as semiconductor integrated circuit elements, It is preferably applied to electronic component testing equipment, etc., and relates to coaxial cable boot.
  • various electronic components hereinafter also referred to as single ICs
  • single ICs such as semiconductor integrated circuit elements
  • a test head electrically connected to a tester is set on a handler, and is transferred to a socket connected to the test head on the handler side. Tested by a tester with the IC pressed. When the test is completed, the handler also carries out the test process capability by the handler, and the IC is classified into non-defective products and defective products according to the test results.
  • a test head provided in a test process is equipped with a HiFix (device interface device) for relaying signal transmission / reception between the IC and the test head.
  • This FIX is used to electrically connect a socket board with a socket to which the IC is electrically contacted, a performance board electrically connected to the test head, and a socket board and performance board.
  • a plurality of coaxial cable units, a support structure for supporting them, and a force are configured.
  • Various types of HiFix are available depending on the IC type, and are exchanged when the IC type is changed.
  • the coaxial cable unit is connected to the electric circuit board by inserting a signal line and an attachment portion into a through hole formed in the electric circuit board. At this time, it is necessary to solder the attachment portion to the through hole on the surface on the insertion side of the electric circuit board, and to solder the signal line and the attachment portion to the through hole on the surface on the penetration side. Therefore, it is necessary to solder on both sides.
  • any of the above coaxial cable units requires a large number of mounting steps. Along with this, many man-hours are required for repairs such as replacing the coaxial cable unit.
  • Lead-free solder has a melting point of about 40 ° C higher than that of conventional solder. For this reason, the above coaxial cable unit with many soldering points inevitably increases the number of mounting steps when dealing with lead-free.
  • a coaxial cable unit 40 k as shown in FIG. 18 is known.
  • the insulating layer 412 covering the signal line 411 and the ground layer 413 are exposed and separated by a predetermined length. is doing.
  • the signal line 411 exposed from the insulating layer 412 at the tip is connected to the signal terminal 48, and the exposed ground layer 413 is attached to the ground terminal 49.
  • the signal terminal 48 and the ground terminal 4 and 9 are derived from the mold 42k in parallel!
  • Patent Document 1 Japanese Unexamined Patent Publication No. 2000-235061
  • Patent Document 2 JP 2001-357914 A
  • An object of the present invention is to provide a coaxial cable unit excellent in workability to an electric circuit board, a device interface device using the coaxial cable unit, and an electronic component testing apparatus.
  • a coaxial cable unit for transmitting a signal comprising a ground layer and a signal line surrounded by the ground layer,
  • Each of the coaxial cables having a single or a plurality of coaxial cables and a mold provided on at least one end of the single or a plurality of coaxial cables.
  • the ground layer is electrically connected to a single press-fit pin, the press-fit pin is derived from the mold, and each signal line of the single or plural coaxial cables is connected to the mold.
  • a coaxial cable unit derived from is provided (see claim 1).
  • the ground layer of the coaxial cable is connected to a press-fit pin, and the press-fit pin also derives a molding force. This eliminates the need for soldering the ground layer and the electric circuit board when connecting the coaxial cable unit and the electric circuit board, thereby reducing the number of steps.
  • a single press-fit pin derived from a mold provided at at least one end of the plurality of coaxial cables is shared by the ground layers of the plurality of coaxial cables. This reduces the number of soldering points, further reducing the number of man-hours for mounting the coaxial cable unit to the electric circuit board.
  • high-density contact mounting can be easily performed.
  • repairability can be improved and lead-free can be achieved while suppressing an increase in the number of installation steps.
  • the press-fit pins are led out from the mold in a predetermined direction, and the signal lines are led out from the mold in a direction different from the predetermined direction. I like it.
  • the coaxial structure mismatch distance can be shortened, and a coaxial cable unit suitable for high-frequency transmission can be provided.
  • the signal line is led out from the mold in a direction substantially orthogonal to the predetermined direction.
  • the predetermined direction is a direction substantially parallel to the axial direction of the coaxial cable or a direction substantially orthogonal to the axial direction of the coaxial cable. It is preferable.
  • the signal line further comprising a single or a plurality of electrode pads formed on the surface of the mold, and each of the signal lines possessed by the single or a plurality of coaxial cables, It is preferable that each of the signal pads is electrically connected to each of the electrode pads, and that each of the signal lines is led out from the mold via each of the electrode pads (see claim 2).
  • the coaxial cable unit is mounted on the electric circuit board by deriving the signal line of the coaxial cable from the mold through the electrode pad, a reflow method is adopted instead of manual soldering. Therefore, it is possible to further reduce the installation man-hours.
  • a panel member having elasticity and conductivity is provided on the surface of the mold in contact with the electronic circuit board, and one end of the panel member is electrically connected to the signal line. Each signal line is led out from the mold through the panel member, and the other end of the panel member is positively pressed against an electrode formed on the surface of the electronic circuit board. It is preferable to contact and electrically connect to the electrode (see claim 3).
  • the IC is tested in a state where a high or low temperature stress is applied to the IC in the handler chamber.
  • a gap may be formed between the press-fit pin and the inner wall surface of the through hole.
  • the cool air in the chamber may cause condensation on the electronic circuit board, the coaxial cable unit, and the like through the gap.
  • the present invention it is possible to prevent the condensation on the electric circuit board and the coaxial cable unit by closing the through hole of the electric circuit board by the closing means.
  • the closing means preferably includes a packing led out from the mold and into which the press-fit pin is press-fitted.
  • the closing means preferably includes a convex portion formed by raising a part of the mold (see claim 6).
  • the closing means includes a diameter-expanded portion formed by expanding a part of the press-fit pin.
  • the closing means includes a plug or a seal that closes an opening located on the opposite side to the opening on the side into which the press-fit pin is press-fitted in the through hole. It is preferable to include.
  • the press-fit pins led out from the mold are inserted into through-holes formed in the electric circuit board, and the respective signals led out from the mold.
  • the line is led along the main surface of the electric circuit board I prefer to do that!
  • a coaxial cable unit for transmitting a signal comprising: a ground layer; and a signal line surrounded by the ground layer; A coaxial cable, a mold provided on at least one end of the coaxial cable, and a press-fit pin for deriving the molding force, and the press-fit bin is electrically connected to the ground layer.
  • a coaxial cable boot including a ground press-fit pin connected and a signal press-fit pin electrically connected to the signal line is provided (see claim 4).
  • the ground layer of the coaxial cable is electrically connected to the ground press-fit pin to be led out from the mold, and the signal line of the coaxial cable is electrically connected to the signal press-fit pin.
  • ground press-fit pin and the signal press-fit pin are led out from the mold in substantially the same direction.
  • the closing means includes a packing led out from the mold and into which the press fit pin is press-fitted.
  • the closing means includes a convex portion formed by raising a part of the mold (see claim 6).
  • the closing means includes a diameter-expanded portion formed by expanding a part of the press-fit pin.
  • the blocking means is formed in the through hole. It is preferable that a plug or a seal for closing the opening located on the opposite side to the opening on the side into which the press-fit pin is press-fitted is included.
  • the ground press-fit pins and the signal press-fit pins derived from the mold are through-holes formed on an electric circuit board. It is preferable that each hole is press-fitted.
  • a socket board having a socket to which an electronic component is electrically contacted and a tester for testing the electronic component are electrically connected.
  • a socket board on which a socket to which an electronic component is electrically contacted and a tester for testing the electronic component are electrically connected.
  • a device interface apparatus comprising: a first performance cable; and a first coaxial cable unit and a second coaxial cable unit that electrically connect the socket board and the performance board.
  • the coaxial cable cut includes a plurality of coaxial cables having a ground layer and a signal line surrounded by the ground layer, and a mold provided on at least one end of the plurality of coaxial cables.
  • the ground layers of the plurality of coaxial cables are electrically connected to a single press-fit pin and the press-fit pin.
  • each signal line of the plurality of coaxial cables is derived from the mold, and the second coaxial cable unit is surrounded by a ground layer and the ground layer.
  • a single coaxial cable having a signal line, and a mold provided on at least one end of the single coaxial cable, and the ground layer of the single coaxial cable includes: Provided by a device interface device that is electrically connected to a press-fit pin, the press-fit pin is derived from the mold, and the signal line of the single coaxial cable is derived from the mold. Is done.
  • the coaxial cable mounting density on the electric circuit board can be improved by using a coaxial cable that does not share a ground layer.
  • an electrical interface is provided between the device interface apparatus according to claim 7 and the electronic component mounted with the device interface apparatus.
  • An electronic component testing apparatus is provided that includes a test head that transmits and receives signals, and a tester that performs a test of the electronic component via the test head (see claim 8).
  • the cost of the electronic component testing apparatus can be reduced.
  • FIG. 1 is a side view showing an electronic component testing apparatus according to a first embodiment of the present invention.
  • FIG. 2 is an exploded perspective view showing a HiFix and a test head according to the first embodiment of the present invention.
  • FIG. 3 is a side view showing the entire first coaxial cable unit according to the first embodiment of the present invention.
  • FIG. 4A is a perspective view of an end portion of the first coaxial cable unit shown in FIG.
  • FIG. 4B is a front view of the end portion of the first coaxial cable unit shown in FIG. 4A.
  • FIG. 4C is a side view of the end portion of the first coaxial cable unit shown in FIG. 4A.
  • FIG. 4D is a diagram showing an internal structure of an end portion of the first coaxial cable unit shown in FIG. 4A.
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. 4C.
  • FIG. 6A is a cross-sectional view showing a state where the first coaxial cable unit according to the first embodiment of the present invention is attached to a socket board in which a through-side through hole is formed.
  • FIG. 6B is a cross-sectional view showing a state in which the first coaxial cable unit according to the first embodiment of the present invention is attached to the socket board in which the non-through hole is formed.
  • FIG. 6C is a cross-sectional view showing a state in which the first coaxial cable unit according to the first embodiment of the present invention is attached to a socket board on which a ground pad is formed.
  • FIG. 7A is a perspective view showing an end portion of the second coaxial cable unit according to the first embodiment of the present invention.
  • FIG. 7B is a front view of the end portion of the second coaxial cable unit shown in FIG. 7A.
  • FIG. 7C is a side view of the end portion of the second coaxial cable unit shown in FIG. 7A.
  • FIG. 7D is a diagram showing an internal structure of an end portion of the second coaxial cable unit shown in FIG. 7A.
  • FIG. 8 is a sectional view taken along line VIII-VIII in FIG. 7C.
  • FIG. 9 is a perspective view showing an end portion of a coaxial cable unit according to a second embodiment of the present invention.
  • FIG. 10A is a perspective view showing an end of the coaxial cable unit according to the third embodiment of the present invention.
  • FIG. 10B is a front view of the coaxial cable unit shown in FIG. 10A.
  • FIG. 10C is a side view of the coaxial cable unit shown in FIG. 10A.
  • FIG. 11 is a cross-sectional view showing a state where a coaxial cable unit according to a third embodiment of the present invention is attached to a socket board.
  • FIG. 12 is a partially enlarged cross-sectional view showing a coaxial cable unit according to a fourth embodiment of the present invention.
  • FIG. 13 is a partially enlarged cross-sectional view showing a coaxial cable unit according to a fifth embodiment of the present invention.
  • FIG. 14 is a partially enlarged sectional view showing a coaxial cable unit according to a sixth embodiment of the present invention.
  • FIG. 15 is a partially enlarged cross-sectional view showing a coaxial cable unit according to a seventh embodiment of the present invention.
  • FIG. 16 is a cross-sectional view showing an end portion of the coaxial cable unit according to the eighth embodiment of the present invention.
  • FIG. 17 is a sectional view showing an end portion of a coaxial cable unit according to a ninth embodiment of the present invention.
  • FIG. 18 is a cross-sectional view showing the structure of a conventional coaxial cable unit.
  • FIG. 1 is a side view showing an electronic component testing apparatus according to the first embodiment of the present invention
  • FIG. 2 is an exploded perspective view showing a HiFix and a test head according to the first embodiment of the present invention.
  • the electronic component test apparatus 1 includes a HiFix 10 to which the IC under test is electrically contacted, and the HiFix 10 attached thereto.
  • Test head 50 that sends and receives electrical signals to / from the test IC
  • tester 60 that sends a test signal to this test head 50 and executes the test of the IC under test
  • the IC under test before the test to the test
  • a handler 70 that classifies the tested ICs under test according to the test results, and the power.
  • the handler 70 is provided with a chamber (not shown) so that high or low temperature stress can be applied to the IC.
  • the electronic component test apparatus 1 can test (inspect) whether or not the IC operates properly with temperature stress applied, and can classify the IC according to the test result. Yes.
  • the HiFix 10 tests the socket board 20 with the socket 21 to which the IC under test is electrically contacted, and the IC under test.
  • the performance board 30 electrically connected to the tester 60, the first and second coaxial cable boots 40a and 40b that electrically connect the socket board 20 and the performance board 30, and the force configuration Has been.
  • FIG. 2 does not show the second coaxial cap nole unit 40b.
  • the cable units 40a and 40b are provided with molds 42a and 42b at both ends.
  • This HiFix 10 is attached to the test head 50 and is electrically connected to the tester 60 via a cable.
  • the socket board 20 is not shown! It is placed in the chamber of LA 70. As shown in FIG. 2, the socket board 20 is provided with a ground through hole 22 and a signal through hole 24.
  • the chamber of the handler 70 is passed through the through holes 22 and 24 provided in the socket board 20. It is necessary to prevent the circulation of inside and outside air. Especially when the chamber is cooled, condensation may occur due to intrusion of outside air moisture, resulting in poor insulation between the terminals of the socket board 20 and the coaxial cable unit 40, and may classify non-defective devices as defective. This will interfere with the implementation of the test. There is a big difficulty in this respect.
  • the through hole 22 for ground is connected to the ground plane pattern 23 on the entire surface of the socket board 20 provided in the inner layer of the socket board 20 (see FIG. 6A).
  • the ground press-fit pins 43 of the coaxial cable units 40a and 40b shown in FIGS. 4A to 4D and 7A to 7D are press-fitted into the ground through holes 22.
  • the packing 45 shown in the figure closes the ground through-hole 22, so that the outflow of gas from the chamber of the handler 70 is prevented.
  • the signal through hole 24 is connected to a signal wiring pattern 25 provided in the inner layer of the socket board 20 (see FIG. 6A).
  • the signal through hole 24 is connected to the signal electrode pad 26 (see FIG. 6A) formed on the surface (the lower surface in FIG. 2) to which the coaxial cable units 40a and 40b are attached on the socket board 20. ing.
  • a signal line 411 led out from the coaxial cable units 40a and 40b is soldered to the signal electrode pad 26.
  • the through hole of the through hole 24 is sealed with solder, so that the outflow of gas from the chamber of the handler 70 through the through hole 24 is prevented.
  • the signal through hole 24 may be formed by, for example, a printing hole filling method, or may be a non-through-type through hole such as SVH.
  • the performance board 30 is also provided with a ground through hole and a signal through hole (not shown).
  • the ground through hole of the performance board 30 is connected to a ground plane pattern provided in the inner layer of the performance board 30 although not particularly illustrated. .
  • the ground press-fit pins 43 of the coaxial cable units 40a and 40b are press-fitted into the ground through holes. Note that the packing 45 shown in FIG. 10 does not have to be inserted into the ground press-fit pin 43 that is press-fitted into the ground through hole of the performance board 30.
  • the signal through hole of the performance board 30 is connected to a signal wiring pattern provided in the inner layer of the performance board 30 although not particularly shown.
  • the signal through hole is connected to a signal electrode node formed on a surface (upper surface in FIG. 2) on which the coaxial cable units 40a and 40b are attached in the performance board 30.
  • a signal line 411 led out from the coaxial cable units 40a and 40b is soldered to the signal electrode pads.
  • a high-speed test signal for testing the IC under test is received from the test head 50 by the high fidelity. 10 performance board 30
  • the test signal transmitted to the performance board 30 is provided to the signal wiring pattern 25 provided on the socket board 20 via the coaxial cable units 40a and 40b and the socket board 20, and further via the socket 21. And given to the IC under test.
  • an output signal output from the IC under test at the time of the test is given to the test head 50 through the socket 21, the socket board 20, the coaxial cable units 40a, 40b, and the performance board 30.
  • FIG. 3 is a side view showing the entire first coaxial cable unit according to the first embodiment of the present invention
  • FIG. 4A is a perspective view of the end of the first coaxial cable unit shown in FIG. 3
  • FIG. 4B is a front view of the end of the first coaxial cable unit shown in Fig. 4A
  • Fig. 4C is a side view of the end of the first coaxial cable unit shown in Fig. 4A
  • Fig. 4D is the first coaxial cable unit shown in Fig. 4A
  • FIG. 5 is a cross-sectional view taken along line VV in FIG. 4C
  • FIGS. 6A to 6C are first coaxial cable units according to the first embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing a state in which is attached to the socket board.
  • the first coaxial cable unit 40a includes two coaxial cables 41 having a signal line 411 and a ground layer 413, and end portions of the coaxial cable 41. 42a provided on the ground and the press fit for the ground derived from the mold 42a The pin 43 and the packing 45 for closing the through hole into which the ground press-fit pin 43 is inserted are provided.
  • each coaxial cable 41 includes a signal line 411, an insulating layer 412 disposed on the outer periphery of the signal line 411, a ground layer 413 disposed on the outer periphery of the insulating layer 412, and these And a covering layer 414 covering the surface.
  • the signal line 411 is made of a material having excellent conductivity, such as a metal material, and is formed by twisting a plurality of strands.
  • the ground layer 413 is formed of a braided body having a material strength excellent in conductivity, such as a metal material.
  • the insulating layer 412 and the covering layer 414 are made of a material excellent in flexibility and electrical insulation, such as a synthetic resin material. Note that the signal line 411 may be a single wire, but it is preferable to form a plurality of strands by twisting them as described above.
  • the ground layer 413 may be formed of a foil having excellent conductivity, but it is preferable that the ground layer 413 is formed of a braided body as described above.
  • the mold 42a is provided at the ends of the two coaxial cables 41 as shown in Figs.
  • the mold 42a is made of, for example, a material excellent in electrical insulation, such as a synthetic resin material, and is preferably formed with a smaller thickness. This facilitates high-density mounting on the electric circuit board.
  • three or more coaxial cables may be attached to one mold 42a.
  • the force shown in FIG. 3 is such that only one end of the coaxial cable 41 is provided with a mold 42a. Molds 42a are provided at both ends!
  • each of the coaxial cables 41 the ground layer 413 is exposed by peeling the covering layer 414 in the mold 42a.
  • Each exposed ground layer 413 is joined to the rear end portion of a single ground press-fit pin 43 by using a method such as soldering. Therefore, in the first coaxial cable unit 40a according to the present embodiment, one ground press-fit pin 43 is shared by the two coaxial cables 41 as a ground layer.
  • the exposed ground layer 413 and the rear end portion of the ground press-fit pin 43 may be joined with a metal plate and spot welded or soldered.
  • the ground press-fit pin 43 in which the ground layers 413 of the two coaxial cables 41 are joined to the rear end portion is formed on the opposite side of the mold 42a from the side where the coaxial cable 41 is led out. Derived along a direction substantially parallel to 41 axial directions.
  • the press-fit pin 43 is made of a material having excellent conductivity such as a metal material.
  • the press-fit pin 43 has a press-fit portion 431 having a shape that is inertially constricted and press-fitted into the through hole.
  • the press-fit portion 431 has a short distance to be electrically connected to the ground through-hole 22 to be connected.
  • the press-fit portion 431 is placed close to the mold 42a side within a range that can be accurately retained by press-fitting.
  • the press-fit portion 431 may be formed long, or may be formed so as to be provided at the top and bottom.
  • each coaxial cable 41 is peeled off after the ground layer 413 is exposed for a predetermined length in the mold 42a, so that the insulating layer 412 is exposed.
  • the coaxial cable 41 is located on the left side and enters the mold 42a.
  • the coaxial cable 41 is connected to the direction where the ground press-fit bin 43 is led out. After bending in a substantially perpendicular direction (left direction in the figure), the left side force of the mold 42a is also derived.
  • the coaxial cable 41 located on the right side and entering the mold 42a in FIG. 5 is a direction in which the press-fit pin 43 for the landing is substantially perpendicular to the lead-out direction (right direction in the figure).
  • each coaxial cable 41 from which the side force of the mold 42a is derived is also peeled off at the position of the predetermined distance, and the signal line 411 of each coaxial cable 41 is individually exposed.
  • the knock 45 prevents the flow of gas through the ground through-hole 22 when the IC is tested in a state where a high or low temperature stress is applied to the IC in the chamber.
  • a press-fit pin 43 for ground which has an annular shape and also derives the force of the mold 42a, is inserted into the inner hole thereof.
  • an elastomer having rubber elasticity can be cited.
  • a non-through-type through hole like SVH was applied as ground through hole 22 In this case, the packing 45 is not necessary.
  • the first coaxial cable unit 40a configured as described above is attached to the socket board 20 as follows. That is, as shown in FIG. 6A, first, the press fit pin 43 for the ground of the coaxial cable unit 4 Oa is press-fitted into the through hole 22 for the ground from the back side of the socket board 20 until the mold 42a hits the socket board 20. . With this press-fitting, the opening 221 on the lower side of the ground through-hole 22 is closed by the packing 45 into which the ground press-fit pin 43 is inserted.
  • each signal line 411 led out from the mold 42 a in the lateral direction is connected to the signal electrode pad 26 formed on the back surface of the socket board 20 by soldering.
  • the surface side force of the performance board 30 is also press-fitted into the ground through hole.
  • each signal line 411 led out from the mold 42a is connected to a signal electrode pad formed on the surface of the performance board 30 by soldering.
  • packing 45 is inserted into the press foot pin 43 for the ground on the performance board 30 side!
  • FIG. 6A shows an example in which the signal through hole 24 is a through-type through hole
  • FIG. 6B shows an example in the case of non-through through SVH (Surface Via Hole).
  • the first coaxial cable unit 40a according to the present embodiment can cope with a non-through-type through hole by SVH shown in FIG. 6B in addition to the through-type through hole shown in FIG. 6A.
  • FIG. 6C shows an example in which a ground pad 22 b is formed around the opening 221 of the ground through hole 22.
  • the ground pad 22b is disposed around the signal line 411 from which the ground layer 413 has been peeled off in the mold 42a, whereby the characteristic impedance of the coaxial cable 41 can be approached.
  • the first coaxial cable unit 40a is derived from the mold 42a.
  • One ground press-fit pin 43 is shared by each ground layer 413 of the two coaxial cables 41. Therefore, a large number of coaxial cable units 40a ranging from several hundred to several thousand are used. Can be easily mounted with high density, and the number of soldering points can be reduced when mounting to the socket board 20 or performance board 30. In addition, since all connection work can be performed on one side of the board, the number of mounting steps can be reduced. In addition, repairability such as repair and maintenance can be performed by connecting all the powers of one side.
  • solder has a higher melting point by about 40 ° C than conventional solder (containing lead). For this reason, soldering that requires heat capacity such as the ground of a coaxial cable is difficult. However, even with the same coaxial cable, the soldering of signals and the like does not require a heat capacity as large as the ground, so it is much easier than the ground and can be lead-free. In this respect, according to the present embodiment, it is possible to cope with lead-free soldering while suppressing an increase in the number of mounting steps by reducing the number of soldering portions of the ground. Moreover, regarding the transmission path of the coaxial cable unit, the coaxial structure mismatch distance L2 shown in FIG. 4D can be shortened, and a coaxial cable unit suitable for high-frequency transmission can be provided.
  • the ground through hole 22 of the socket board 20 is closed by the packing 45 in which the ground press fit pin 43 is inserted.
  • FIG. 7A is a perspective view showing an end of the second coaxial cable unit in the first embodiment of the present invention
  • FIG. 7B is a front view of the end of the coaxial cable unit shown in FIG. 7A
  • FIG. 7C is
  • FIG. 7D is a diagram showing the internal structure of the end of the first coaxial cable unit shown in FIG. 7A
  • FIG. 8 is a cross-sectional view taken along line VIII-VIII in FIG. 7C. It is a figure.
  • socket board 20 and performer are used.
  • a second coaxial cable unit 40 b described below is used in addition to the first coaxial cable cut 40 a described above.
  • the second coaxial cable unit 40b in the first embodiment of the present invention is different from the first coaxial cable unit 40a in that only one coaxial cable 41 is used as the model 42b. Is not attached to. Accordingly, the signal line 411 is led out only from one side surface of the mold 42b, and the signal line is not led out from the other side surface. Further, as shown in FIG. 8, only the ground layer 413 of one coaxial cable 41 is connected to the press-fit pin 43 for the ground from which the force of the mold 42b is also derived.
  • the coaxial cable 41 can be provided on the socket board 20 or the performance board 30 even in a narrow area that is impossible with the first coaxial cable unit 40a. Can be mounted, and the mounting density of the coaxial cable 41 can be improved.
  • FIG. 9 is a perspective view showing an end portion of the coaxial cable unit according to the second embodiment of the present invention.
  • each ground of the two coaxial cables 41 is provided.
  • a press-fit pin 43 for ground, to which the layer 413 is electrically connected, is derived from the mold 42c.
  • the signal line 411 of the coaxial cable 41 located on the left side and entering the mold 42c in FIG. is electrically connected to an electrode pad 421 formed on the upper and left sides of 42c.
  • the signal line 411 of the coaxial cable 41 located on the right side and entering the mold 42c in the same figure is electrically connected to the electrode pad 421 formed on the upper surface and the right side surface of the mold 42c.
  • Both signal lines 411 are electrically connected to an electrode pad 421 (for example, a material suitable for soldering or a soldered material), and this exposes the electrode pad 421 like a mold 42c shown in FIG.
  • the ground press-fit pin 43 is press-fitted into the ground through-hole 22, and then the surface of the mold 42c.
  • Each formed electrode pad 421 is connected to the signal electrode pad 26 (see FIG. 6A) formed on the lower surface of the socket board 20 by a reflow method or the like.
  • the performance board 30 press the ground press-fit pin 43 into the ground through hole formed in the performance board 30 and then attach each electrode pad 421 formed on the surface of the mold 42c to the performance board.
  • the signal electrode pad formed on the surface of 30 is joined by a reflow method or the like.
  • the signal line 411 of the coaxial cable 41 is led out from the mold 42c via the electrode pad 421, whereby the coaxial cable unit 40c is connected to the electric circuit.
  • FIG. 10A is a perspective view showing an end of the coaxial cable unit according to the third embodiment of the present invention
  • FIG. 10B is a front view of the coaxial cable unit shown in FIG. 10A
  • FIG. 10C is a coaxial cable unit shown in FIG.
  • FIG. 11 is a sectional view showing a state where the coaxial cable unit according to the third embodiment of the present invention is attached to the socket board.
  • the coaxial cable unit 40d according to the third embodiment of the present invention has one coaxial cable 41 attached to the mold 42d and two molds from the mold 42d. Press fit pins 43 and 44 are derived!
  • the ground layer 413 of the coaxial cable 41 is electrically connected to the ground press-fit pin 43, as in the first embodiment.
  • a signal line 411 of the coaxial cable 41 is electrically connected to the signal press-fit bin 44 using a technique such as welding.
  • the signal line 411 from which the insulating layer 412, the ground layer 413, and the covering layer 414 are peeled off in the mold 42d is connected to the signal press-fit pin 44 so that the length of the exposed portion is the shortest. It is connected. This makes it possible to minimize the different characteristic impedances at the part. Therefore, the waveform quality can be improved especially when testing a high-speed device, so that a better device test quality can be achieved.
  • press-fit pins 43, 44 are led out from the mold 42d in substantially the same direction. Yes. Further, these press-fit pins 43 and 44 are inserted into the inner holes of the packing 45 as in the first embodiment.
  • the coaxial cable unit 40d configured as described above press-fits the ground press-fit pin 43 into the ground through-hole 22 and simultaneously inserts the signal press-fit pin 44 into the signal through-wheel. It can be attached to the socket board 20 by press-fitting into 24. Along with this press-fitting, the opening 45 221 on the lower side of the ground through-hole 22 is closed and the signal press-fit pin 44 is inserted by the packing 45 into which the ground press-fit pin 43 is inserted. The opening 45 241 below the signal through hole 24 is closed by the packing 45.
  • the press-fit pins 43 and 44 are press-fitted into the through holes 22 and 24 so that the coaxial cable unit 40d that does not perform soldering work is attached to the performance board 30. It is done. However, the packing 45 does not have to be inserted into the press-fit pins 43 and 44 on the performance board 30 side.
  • the coaxial cable unit 40d according to the present embodiment does not require any soldering work when attached to the socket board 20 or the performance board 30, so that the number of mounting steps can be reduced. . In addition, repairability is improved as soldering becomes unnecessary.
  • the through holes 22 and 24 are closed by the packing 45 in which the press-fit pins 43 and 44 are inserted. It is possible to prevent condensation from forming on the socket board 20 and the coaxial cable unit 40d due to the cold air. Also, the occurrence of poor insulation due to condensation As a result, it is possible to always maintain a stable test quality.
  • FIG. 12 is a partially enlarged sectional view showing a coaxial cable unit according to the fourth embodiment of the present invention.
  • an annular structure is formed by extending the mold 42e in the direction of the press-fit pin 43, and the through hole 22 is closed. It is also possible to use a light press-fit shape. Also in this case, the knock 45 can be deleted, so that it can be configured at a lower cost.
  • FIG. 13 is a partially enlarged cross-sectional view showing the coaxial cable unit according to the fifth embodiment of the present invention.
  • the diameter of the root portion of the ground press-fit pin 43 is expanded instead of the packing 45 in the first embodiment.
  • An enlarged diameter portion 432 is formed.
  • the enlarged diameter portion 432 closes the opening 221 below the ground through-hole 22. This prevents condensation on the socket board, coaxial cable unit 40f, etc. due to cool air in the chamber of the handler 70.
  • a plug 46 is connected to the opening 222 above the ground through-hole 22. Has been inserted.
  • This opening 222 is the ground through hole It is located on the side opposite to the side where the ground press-fit pin 43 is inserted.
  • the opening 222 on the upper side of the ground through hole 22 is provided.
  • the sticker 47 is pasted on.
  • the socket board 20 or the coaxial cable unit 40g due to the cold air in the chamber of the handler 70 is obtained. Condensation to 40h etc. is prevented. If desired, it may be used in combination with the packing 45 to seal the socket board 20 at the top and bottom.
  • FIG. 16 is a cross-sectional view showing an end portion of the coaxial cable unit according to the eighth embodiment of the present invention.
  • the two coaxial cables 41 are the same as the first coaxial cable boot 40a according to the first embodiment.
  • the mold 42i is provided at the end of each of the two coaxial cables 41.
  • the ground press-fit pins 42 to which the ground layers 413 of the two coaxial cables 41 are electrically connected are led out from the mold 42i, and two coaxial cables 41 Each signal line 411 of the cable 41 also leads to the mold 42 individually.
  • the coaxial cable unit 40i according to this embodiment is the first in that the ground press-fit pin 43 is led out from the mold 42 along a direction substantially perpendicular to the axial direction of the coaxial cable 41. Different from the first coaxial cable unit 40a according to the embodiment. In the coaxial cable unit 40i according to the present embodiment, each signal line 411 is led out from the mold 42i along the axial direction of the coaxial cable 41.
  • FIG. 17 is a cross-sectional view showing an end portion of the coaxial cable unit according to the ninth embodiment of the present invention.
  • the plate spring 424 is formed of a conductive and elastic metal plate such as adjacent bronze, for example, and is disposed on both sides of the press-fit pin 43.
  • One end of the plate panel 424 passes through the contact surface part and is electrically connected to the signal line 411 inside the mold 42j. Further, the other end of the plate panel 424 is formed so as to be inertially disposed on the contact surface portion of the mold 43 ⁇ 4.
  • connection form between one end of the panel panel 424 and the signal line 411 may be a structure in which both are in electrical contact with each other when pressed using the elasticity of the panel panel 424 itself. Also, a structure in which both are mechanically and electrically connected by welding or soldering may be employed.
  • a wedge 433 is formed on the press-fit pin 43 in order to prevent the press-fit pin 43 from moving in the removal direction due to long-term use.
  • a ring-shaped convex portion or concave portion, or a helical convex portion or concave portion may be formed on the press fit 43.
  • the press-fit pins 43 are press-fitted into the through holes of the electric circuit board, and at the same time, the two plate panels 424 are brought into contact with and electrically connected to the signal electrode pads 26 (see FIG. 4D) of the electric circuit board.
  • soldering is unnecessary.
  • the adjacent coaxial cable units 40 can be closely mounted. As a result, thousands of coaxial cable units 40 can be mounted with high density.
  • the first and second coaxial cable units 40a and 40b according to the first embodiment are configured so that the ground layer 413 of the coaxial cable 41 is led out from the mold 42a using the ground press-fit pin 43.
  • the present invention is not limited to this, and the ground layer 413 itself may be electrically connected to each other without using a press-fit pin, and may be led out from the mold 42a as a single common ground layer.
  • the convex portion 422 is formed on the mold as in the fourth embodiment.
  • the enlarged diameter portion 432 is formed on the press-fit pins 43, 44, the plug 46 is inserted into the openings of the through holes 22, 24, as in the sixth embodiment, and the seventh A seal 47 may be attached to the openings of the through holes 22 and 24 as in the embodiment.
  • the diameter of a part of the press-fit pin is expanded to the inner periphery of the through-hole 22 with respect to a portion that does not interfere with the press-fit of the press-fit pin 43 (for example, the tip portion, the intermediate portion, the root portion) You may form the ring-shaped structure which press-contacts. Even with these structures, the flow of air can be blocked, and as a result, the occurrence of insulation failure or the like due to condensation can be prevented.
  • a wedge 433, a ring-shaped convex portion or concave portion, or a spiral convex portion or concave portion may be formed on the press-fit pin 43. According to this, since the movement of the press-fit pin 43 in the removal direction can be prevented, the press-fitted position state can be stably maintained even in a long-term use or a use environment with a large temperature change.
  • a plurality of coaxial cables 41 are attached to the same mold 42d, and the ground layer 413 of each coaxial cable 41 has one ground press. You may comprise so that the fit pin 43 may be shared. This makes it possible to further reduce the man-hours required for mounting the coaxial cape unit 40h on the socket board 20 and performance board 30.

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Multi-Conductor Connections (AREA)

Abstract

La présente invention concerne une unité de câble coaxial (40a) conçue pour transmettre des signaux qui comprend deux câbles coaxiaux (41), composés de couches de masse (413) et de lignes de signal (411) entourées par les couches de masse (413), ainsi qu'un moule (42a) disposé aux extrémités des deux câbles coaxiaux (411). Chacune des couches de masse (413) des deux câbles coaxiaux (411) est en connexion électrique avec une broche à insertion en force (43) pour la masse. Ladite broche à insertion en force (43) pour la masse sort du moule (42a) et chacune des lignes de signal (411) des deux câbles coaxiaux (41) sort séparément du moule (42a).
PCT/JP2005/010881 2005-06-14 2005-06-14 Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques WO2006134644A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
PCT/JP2005/010881 WO2006134644A1 (fr) 2005-06-14 2005-06-14 Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques
JP2007521293A JPWO2006134901A1 (ja) 2005-06-14 2006-06-13 同軸ケーブルユニット、デバイスインターフェース装置及び電子部品試験装置
TW095120948A TW200717928A (en) 2005-06-14 2006-06-13 Coaxial cable unit, device interface apparatus and electronic component testing apparatus
PCT/JP2006/311813 WO2006134901A1 (fr) 2005-06-14 2006-06-13 Unite de câble coaxial, appareil d’interface de dispositif et appareil d’essai de composant electronique

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2005/010881 WO2006134644A1 (fr) 2005-06-14 2005-06-14 Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques

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PCT/JP2005/010881 WO2006134644A1 (fr) 2005-06-14 2005-06-14 Unité de câble coaxial, appareil d'interface de dispositifs et appareil de contrôle de composants électroniques
PCT/JP2006/311813 WO2006134901A1 (fr) 2005-06-14 2006-06-13 Unite de câble coaxial, appareil d’interface de dispositif et appareil d’essai de composant electronique

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TWI408690B (zh) * 2009-05-18 2013-09-11 Wistron Corp 可提升測試品質的自動化測試系統
EP3809522B1 (fr) * 2018-06-12 2023-11-08 KMW Inc. Structure de connexion et filtre à cavité la comprenante

Citations (5)

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Publication number Priority date Publication date Assignee Title
JPH08236227A (ja) * 1995-02-27 1996-09-13 Yokowo Co Ltd 同軸基板間コネクタ
JPH10189167A (ja) * 1996-12-25 1998-07-21 Hitachi Electron Eng Co Ltd ピン端子付き２線接続ケーブル
JP2000040543A (ja) * 1998-07-10 2000-02-08 Advantest Europ Gmbh ケ―ブルアダプタ
JP2000235061A (ja) * 1999-02-12 2000-08-29 Advantest Corp ケーブルターミナル、同軸ケーブルユニット及びハイフィックス
JP2001291565A (ja) * 2000-04-10 2001-10-19 Hirakawa Hewtech Corp 基板接続用同軸ケーブル

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Publication number Priority date Publication date Assignee Title
US5046966A (en) * 1990-10-05 1991-09-10 International Business Machines Corporation Coaxial cable connector assembly
JP2629555B2 (ja) * 1993-04-28 1997-07-09 日本電気株式会社 電子部品の実装構造
JPH11237439A (ja) * 1998-02-20 1999-08-31 Advantest Corp テストフィクスチャ
JP3676073B2 (ja) * 1998-02-24 2005-07-27 株式会社カネカ ポリイミドフィルムとその製造方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08236227A (ja) * 1995-02-27 1996-09-13 Yokowo Co Ltd 同軸基板間コネクタ
JPH10189167A (ja) * 1996-12-25 1998-07-21 Hitachi Electron Eng Co Ltd ピン端子付き２線接続ケーブル
JP2000040543A (ja) * 1998-07-10 2000-02-08 Advantest Europ Gmbh ケ―ブルアダプタ
JP2000235061A (ja) * 1999-02-12 2000-08-29 Advantest Corp ケーブルターミナル、同軸ケーブルユニット及びハイフィックス
JP2001291565A (ja) * 2000-04-10 2001-10-19 Hirakawa Hewtech Corp 基板接続用同軸ケーブル

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JPWO2006134901A1 (ja) 2009-01-08
TW200717928A (en) 2007-05-01
TWI320246B (fr) 2010-02-01
WO2006134901A1 (fr) 2006-12-21

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