Classifications

• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/25—Arrangements for cooling characterised by their materials
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B82—NANOTECHNOLOGY
  • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
  • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W40/00—Arrangements for thermal protection or thermal control
  • H10W40/20—Arrangements for cooling
  • H10W40/22—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections
  • H10W40/226—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area
  • H10W40/228—Arrangements for cooling characterised by their shape, e.g. having conical or cylindrical projections characterised by projecting parts, e.g. fins to increase surface area the projecting parts being wire-shaped or pin-shaped
• • H—ELECTRICITY
  • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
  • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
  • H10W72/00—Interconnections or connectors in packages
  • H10W72/30—Die-attach connectors
  • H10W72/381—Auxiliary members
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S977/00—Nanotechnology
  • Y10S977/70—Nanostructure
  • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
  • Y10S977/742—Carbon nanotubes, CNTs
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S977/00—Nanotechnology
  • Y10S977/70—Nanostructure
  • Y10S977/734—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc.
  • Y10S977/753—Fullerenes, i.e. graphene-based structures, such as nanohorns, nanococoons, nanoscrolls or fullerene-like structures, e.g. WS2 or MoS2 chalcogenide nanotubes, planar C3N4, etc. with polymeric or organic binder
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10S977/00—Nanotechnology
  • Y10S977/70—Nanostructure
  • Y10S977/778—Nanostructure within specified host or matrix material, e.g. nanocomposite films
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T29/00—Metal working
  • Y10T29/49—Method of mechanical manufacture
  • Y10T29/4935—Heat exchanger or boiler making
• • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
  • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
  • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
  • Y10T428/00—Stock material or miscellaneous articles
  • Y10T428/30—Self-sustaining carbon mass or layer with impregnant or other layer

Definitions

• the present invention relates to systems and methods for thermal management of electronic components, and more particularly to a thermal junction device for facilitating heat transfer between a heat source and a heat sink.
• Heat transfer for thermal management between two materials at different temperatures often may be accomplished by conduction, radiation and/or convection.
• the temperature present in the integrated circuit (IC) can typically be between about 40° C to 150° C.
• thermal management may typically be accomplished through conduction.
• the use of flat plates at the interface to facilitate the heat transfer from the integrated circuit to the heat sink has not been optimal.
• the use of a flat plate may provide only between 20 to 50 points of contact to the integrated circuit and/or the heat sink. As a result, the heat that flows out of the hot integrated circuit can only pass through these few contact spots.
• the heat sink device in general, may be of any type, including a passive heat sink, a Peltier cooler, a refrigerated copper block, a heat pipe, or an active fan type, or a copper block in which embedded heat pipes can carry heat to a water-cooled bus outside of the system.
• thermal greases that are commercially available typically contain silver powder or silver flake, and may be used by applying to machined, and occasionally, lapped heat sinks and integrated circuit lids.
• thermal conductivity of these commercially available greases at best may only be about 9 watts/m-deg K.
• U.S. Patent No. 6,891,724 discloses the use of carbon nanotubes deposited on a CVD diamond coated thermally heat die.
• a CVD diamond coating is placed on a heat die, and the die subsequently coated with carbon nanotubes.
• the present invention in one embodiment, is directed to a heat-conducting medium for placement between a heat source and heat sink to facilitate transfer of heat from the source to the sink.
• the heat-conducting medium includes a disk, made from a material having a relatively high thermal conductivity characteristic, for placement between a heat source and a heat sink.
• the disk may also have a heat spreading characteristic.
• the heat-conducting medium further includes a first recessed surface on the disk for placement adjacent the heat source and an opposing second recessed surface on the disk for placement adjacent the heat sink.
• the heat-conducting medium may further include an array of heat conducting bristles extending from within the first and second recessed surfaces.
• the recessed surfaces may be defined by a rim positioned circumferentially about the disk.
• each recessed surface acts to provide a spacer between the heat source and heat sink and to minimize the amount of pressure that may be exerted by the heat sink and the heat source against the bristles.
• the bristles in an embodiment, may extend beyond the rim on the respective surface from which the bristle are positioned to provide a plurality of contact points to the heat source and to the heat sink to aid in the transfer of heat.
• the present invention in another embodiment, is directed to a substantially flexible heat-conducting medium.
• This heat-conducting medium in one embodiment, includes a flexible member made from an array of interweaving carbon nanotubes.
• the flexible member may include an upper surface against which a heat source may be placed, an opposing lower surface, and edges about the member designed for coupling to a heat sink toward which heat from the heat source can be directed.
• the heat-conducting medium also includes a pad for placement on the upper surface of the member to provide structural support to the member. In an embodiment, a second pad may be provided against the lower surface of the member to provide additional support to the flexible member.
• the heat-conducting medium may further include a heat spreader positioned adjacent the heat source and the upper surface of the member to facilitate radial transfer of heat from the heat source to a wider area on the member.
• a second heat spreader may be provided against the lower surface of the flexible member to enhance spreading of heat from the heat source radially along the flexible member.
• the present invention provides a method for manufacturing a heat-conducting medium.
• a disk having opposing recessed surfaces and a relatively high thermal conductivity characteristic may initially be provided.
• a plurality of catalyst particles may be deposited into the recessed surfaces.
• the recessed surfaces may be coated with a material that can enhance attachment of the particles to the recessed surfaces.
• the catalyst particles may be exposed to a gaseous carbon source, and from the uptake of carbon by the catalyst particles, may be allowed to permit growth of nanotubes from the recessed surfaces. Once the nanotubes have extended beyond the recessed surfaces, the growth of the nanotubes may be terminated.
• Fig. 1 illustrates a table with examples of commercial conducting greases and their thermal conductivity.
• Fig. 2 illustrates a cross-sectional perspective view of a heat conducting medium in accordance with one embodiment of the present invention.
• Fig. 3 illustrates a cross-sectional view of the heat-conducting medium in Fig.
• FIG. 4 illustrates a cross-sectional view of a heat-conducting medium in accordance with another embodiment of the present invention.
• the present invention provides, in one embodiment, a medium for thermal management of electronic components.
• the medium in an embodiment may be a thinly designed device that may be place at a thermal junction between a heat source, such as an integrated circuit, and a heat sink to facilitate heat transfer from the heat source to the heat sink
• the present invention provides, in one embodiment, a heat-conducting medium 20 for carrying thermal energy away from a heat source.
• the heat-conducting medium 20 in an embodiment, includes a substantially thin disk 21 designed so that it may be placed in a narrow region at, for instance, an interface between a lid of a heat generating integrated circuit (IC) and a heat sink.
• disk 21 may be provided with a thickness ranging from about 2 millimeter (mm) to about 4 mm. Of course the thickness of the disk 21 may vary according to the particular application and placement.
• disk 21 may be made from a material having relatively high thermal conductivity and heat spreading characteristics, so as to facilitate heat transfer from the heat generating IC to the heat sink.
• disk 21 may be made from substantially high purity copper. Of course other materials may be used, so long as they provide disk 21 with high thermal conductivity and heat spreading characteristics.
• disk 21 of heat-conducting medium 20 may include a first surface 211 for placement adjacent a heat source.
• Disk 21 may also include an opposing second surface 212 for placement adjacent a heat sink.
• the first and second surfaces 211 and 212 may act as a conduit to pull heat from a heat source to the heat sink.
• First surface 211 in an embodiment, may be designed to include a recessed surface 23 defined by rim 25, while the second surface 212 may be designed to include a recessed surface 24 defined by rim 26.
• Recessed surfaces 23 and 24 may be situated, in an embodiment, approximately in the center of disk 21 for accommodating an array of carbon nanotube bristles 30 (see Fig. 3).
• the recessed surfaces 23 and 24 may be provided with a depth that is measurably less than the length of the nanotube bristles 30.
• the depth of each recessed surface may be approximately between 100 microns and 500 microns or more, depending of the particular application and location at which the disk may be placed.
• Rims 25 and 26, situated circumferentially about disk 21, may be provided, in an embodiment, to act as a spacer between the heat sink and the heat source.
• the presence of rims 25 and 26 on disk 21 may also act to limit the amount of pressure or provide the appropriate amount of pressure that may be exerted by the heat sink and heat source against the nanotube bristles 30. To the extent that a significant amount of pressure is exerted on the nanotube bristles 30, that is, significantly more than necessary, the bristles 30 may be damaged and the transfer of heat may be compromised.
• the recessed surfaces 23 and 24 may be created by machining, coined on a coin press, or any other methods known in the art.
• the disk 21 may be provided with any geometric shape, for instance, square, hexagonal, octagonal etc., so long as the disk can act as an interface between a heat source and a heat sink.
• the heat-conducting medium 20 may also include an array of heat-conducting bristles 30 situated within recessed surfaces 23 and 24.
• the presence of the array of bristles 30, which may be flexible in nature, can overcome the low number of contact spots between the heat source and heat sink typically observed in prior art flat plate.
• the flexible bristles 30 may be situated substantially transverse to the recessed surfaces 23 and 24, and may extend or protrude from within recessed surfaces 23 and 24 to about 10 microns to about 100 microns or slight more beyond rims 25 and 26 of disk 21. In this way, the tips of the bristles 30 can maintain substantially good contact with the heat source and heat sink during use.
• bristles 30, in an embodiment may be made from carbon nanotubes.
• the carbon nanotubes for use in connection with the heat-conducting medium 20 of the present invention may be single wall nanotubes or multi-wall nanotubes, and may, in an embodiment, be less than approximately 50 nm in diameter.
• the number of contact points can be significantly increased.
• the number of contact points provided may range on the order of up to about 10 8 per square centimeter or higher.
• an approximate thermal conductivity can be estimated to be about 0.20 * 2980 watts/m-deg. K or about 600 watts/m-deg. K, which compares rather well with currently available 9 watts/m-deg K for thermally conducting grease.
• Fig. 3 may be substantially similar on recessed surface 23 and recessed surface 24, the medium 20 can be designed so that the amount of bristles 30 on each surface may be uneven relative to one another.
• the heat source is a small die or small integrated circuit
• the heat source side (i.e., surface 23) of disk 21 can be relatively smaller with fewer bristles 30 in comparison to the heat sink side (i.e., surface 24) of disk 21.
• the heat-conducting medium 20 may also act as a heat spreader, spreading heat from the smaller heat source surface 23 radially along the medium 20 to the larger heat sink surface 24.
• recessed surface 23 which may generally be similar in size to recessed surface 24, may be made to be smaller relatively to recessed surface 24.
• rim 25 may, in an embodiment, be made to be radially thicker.
• the array of bristles 30, in an embodiment, may be provided on opposing recessed surfaces 23 and 24 of the disk 21 by various means known in the art.
• coatings may be placed on the heat-conducting medium 20 in the region where the nanotube bristles 12 may grow (i.e., the recessed surfaces 23 and 24). These coatings may be selected so as not to react with the material from which the heat-conducting medium 20 may be made.
• the coatings may include, for example, iron, molybdenum, alumina, silicon carbon, aluminum nitride, tungsten or a combination thereof.
• the coatings can be applied onto the recessed surfaces 23 and 24 by any means known in the art, so that a dense substantially pore-free deposit may be produced.
• certain catalysts may be deposited onto the coatings. Deposition of the catalysts onto the coatings can be accomplished, in an embodiment, by spraying, painting, screen-printing, evaporation or by any process known in the art.
• Catalysts that may be used in connection with the heat-conducting medium 20 of the present invention may generally be magnetic transition metals, examples of which include as iron, cobalt, nickel or a combination thereof.
• the catalyst particles may subsequently be exposed to a gaseous carbon source, such as that associated with a chemical vapor deposition (CVD) process, a well-known process in the art, and allowed to take up carbon to permit growth of nanotubes therefrom.
• CVD chemical vapor deposition
• the heat conducting medium 20 of the present invention can overcome a number of problems, including a low number of contact spots observed in prior art flat plates by employing an array of flexible nanotube bristles 30.
• the bristles 30 on disk 21 may be pressed onto a hot surface of the heat source and act to carry heat away or act as a heat spreader from the surface of the heat source to a cooler heat sink in a manner that results in a low thermal resistance path between the heat source and the heat sink.
• heat can travel along the nanotube bristles 30 and across the thin disk 21 to the contacting surfaces with substantially low contact resistance.
• thermal resistance between such heat source and a heat sink can be as high as 20 degrees Centigrade. It is believed that this thermal resistance can be reduced to a small fraction of this amount using the present invention. The consequences can be that the power dissipated can be increased, and the temperature of the heat source can also be reduced.
• the temperature gradient required to drive heat to the heat sink can be reduced to much less than 20° C.
• rough interfaces may be accommodated so that lapping the interfaces may not be required. In other words, grinding of the rough interfaces may be minimized.
• differences in the coefficient of thermal expansion between the heat source (e.g., Hd of the IC) and the heat sink may be accommodated, so that, for example, expensive copper tungsten heat spreaders and the required brazing process can be eliminated.
• the heat-conducting medium 20 with an array of nanotube bristles 30 can also be used as a drop-in substitute for "conducting grease" taking up only a few mm in vertical geometry.
• the heat-conducting material 40 in an embodiment, includes a flexible member 41, such as a mat or textile material made from carbon nanotubes.
• a flexible member 41 such as a mat or textile material made from carbon nanotubes.
• carbon nanotubes may be wound into fibers or yarns and the fibers or yarns formed or woven into a mat or textile material 41.
• the heat-conducting material 40 in one embodiment, may be infiltrated with polyamide 42, epoxy, other polymers or a combination thereof.
• the heat-conducting medium 40 may also include a pad 43 placed on upper surface 44 of textile material 41 to support a heat source, such as IC 46.
• the presence of pad 43 may also provide structural support to the flexible member 41.
• pad 43 may also be placed against lower surface 45 of textile material 41 to provide additional structural support to the flexible member 41.
• the heat-conducting medium 40 may be used as a heat conducting medium in the manner similar to that discussed with medium 20 above.
• a heat source such as IC 46 may be placed onto heat conducting medium 40 against the upper surface 44 of the flexible member 41.
• heat generated from the heat source may be carried by the flexible member 41 toward its edges 411 designed to couple to a heat sink, such as water cooling pipe 47, a heat pipe, or any material that passively conducts heat along the flexible member 41 away from the heat source 46.
• the heat-conducting medium 40 may further include a heat spreader 48 placed adjacent to the heat source 46 and the upper surface 44 of the flexible member 41.
• Heat spreader 48 in one embodiment, may be situated between the heat source 46 and the upper surface 44 of the textile material 41. As such, heat spreader 48 may act to facilitate the radial transfer of heat from the heat source 46 quickly to a wider area on the textile material 41 than otherwise may be, so that the heat from the heat source 46 may subsequently be carried to heat sink 47.
• an additional heat spreader 49 may be positioned against the lower surface 45 of the textile material 41 to further facilitate the spreading of heat from the heat source 46 radially along the textile material 41. In an embodiment, the additional heat spreader 49 may be placed directly below the heat spreader 48 on the upper surface of the flexible member 41.
• the textile material 41 may also, in one embodiment of the present invention, be incorporated within, for example, a printed circuit board for diverting heat from a heat source.
• the textile material 51 may not be a textile or textile-like in nature, but rather, be part of a thermally conductive composite, such as a highly loaded carbon-carbon composite, where the fiber loading may be above about 50%, and further be directional in the direction of the heat flux.

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• Engineering & Computer Science (AREA)
• Chemical & Material Sciences (AREA)
• Nanotechnology (AREA)
• Physics & Mathematics (AREA)
• Mathematical Physics (AREA)
• Theoretical Computer Science (AREA)
• Crystallography & Structural Chemistry (AREA)
• Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
• Cooling Or The Like Of Electrical Apparatus (AREA)
• Carbon And Carbon Compounds (AREA)

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• 2006
  • 2006-04-28 WO PCT/US2006/016255 patent/WO2006127208A2/en not_active Ceased
  • 2006-04-28 EP EP09165823A patent/EP2112249A1/en not_active Withdrawn
  • 2006-04-28 AU AU2006249601A patent/AU2006249601B2/en not_active Ceased
  • 2006-04-28 EP EP06751776A patent/EP1885907A4/en not_active Withdrawn
  • 2006-04-28 JP JP2008513499A patent/JP4972640B2/ja not_active Expired - Fee Related
  • 2006-04-28 US US11/413,512 patent/US7898079B2/en active Active
  • 2006-04-28 CA CA 2609712 patent/CA2609712C/en not_active Expired - Lifetime
• 2011
  • 2011-01-18 US US13/008,256 patent/US20110214850A1/en not_active Abandoned
• 2012
  • 2012-02-21 JP JP2012035331A patent/JP2012119725A/ja active Pending

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