WO2006109369A1 - 電子部品モジュール - Google Patents
電子部品モジュール Download PDFInfo
- Publication number
- WO2006109369A1 WO2006109369A1 PCT/JP2006/302856 JP2006302856W WO2006109369A1 WO 2006109369 A1 WO2006109369 A1 WO 2006109369A1 JP 2006302856 W JP2006302856 W JP 2006302856W WO 2006109369 A1 WO2006109369 A1 WO 2006109369A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electronic component
- electrode
- work function
- organic compound
- sample
- Prior art date
Links
- 239000000463 material Substances 0.000 claims abstract description 51
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 36
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 15
- 125000004433 nitrogen atom Chemical group N* 0.000 claims abstract description 14
- MHZGKXUYDGKKIU-UHFFFAOYSA-N Decylamine Chemical compound CCCCCCCCCCN MHZGKXUYDGKKIU-UHFFFAOYSA-N 0.000 claims abstract description 13
- -1 amine compound Chemical class 0.000 claims abstract description 13
- 125000004430 oxygen atom Chemical group O* 0.000 claims abstract description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims abstract description 10
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052737 gold Inorganic materials 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 6
- 239000000956 alloy Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000002344 surface layer Substances 0.000 abstract description 22
- 239000000919 ceramic Substances 0.000 abstract description 13
- IMFACGCPASFAPR-UHFFFAOYSA-N tributylamine Chemical compound CCCCN(CCCC)CCCC IMFACGCPASFAPR-UHFFFAOYSA-N 0.000 abstract description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 20
- 239000000758 substrate Substances 0.000 description 18
- 238000004381 surface treatment Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- GYSCBCSGKXNZRH-UHFFFAOYSA-N 1-benzothiophene-2-carboxamide Chemical compound C1=CC=C2SC(C(=O)N)=CC2=C1 GYSCBCSGKXNZRH-UHFFFAOYSA-N 0.000 description 8
- GHVNFZFCNZKVNT-UHFFFAOYSA-N Decanoic acid Natural products CCCCCCCCCC(O)=O GHVNFZFCNZKVNT-UHFFFAOYSA-N 0.000 description 8
- 230000003247 decreasing effect Effects 0.000 description 7
- ROSDSFDQCJNGOL-UHFFFAOYSA-N Dimethylamine Chemical compound CNC ROSDSFDQCJNGOL-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000012756 surface treatment agent Substances 0.000 description 5
- 238000005259 measurement Methods 0.000 description 4
- DPBLXKKOBLCELK-UHFFFAOYSA-N n-pentylamine Natural products CCCCCN DPBLXKKOBLCELK-UHFFFAOYSA-N 0.000 description 4
- 238000001179 sorption measurement Methods 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 3
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 239000004519 grease Substances 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229910000077 silane Inorganic materials 0.000 description 3
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 125000000896 monocarboxylic acid group Chemical group 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- IMNIMPAHZVJRPE-UHFFFAOYSA-N triethylenediamine Chemical compound C1CN2CCN1CC2 IMNIMPAHZVJRPE-UHFFFAOYSA-N 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- XFNJVJPLKCPIBV-UHFFFAOYSA-N trimethylenediamine Chemical compound NCCCN XFNJVJPLKCPIBV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- BMVXCPBXGZKUPN-UHFFFAOYSA-N 1-hexanamine Chemical compound CCCCCCN BMVXCPBXGZKUPN-UHFFFAOYSA-N 0.000 description 1
- WGTASENVNYJZBK-UHFFFAOYSA-N 3,4,5-trimethoxyamphetamine Chemical compound COC1=CC(CC(C)N)=CC(OC)=C1OC WGTASENVNYJZBK-UHFFFAOYSA-N 0.000 description 1
- JRZMWIXMFXOHRN-UHFFFAOYSA-N 3-methyl-2h-pyran-2-amine Chemical compound CC1=CC=COC1N JRZMWIXMFXOHRN-UHFFFAOYSA-N 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- XBPCUCUWBYBCDP-UHFFFAOYSA-N Dicyclohexylamine Chemical compound C1CCCCC1NC1CCCCC1 XBPCUCUWBYBCDP-UHFFFAOYSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- WJYIASZWHGOTOU-UHFFFAOYSA-N Heptylamine Chemical compound CCCCCCCN WJYIASZWHGOTOU-UHFFFAOYSA-N 0.000 description 1
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 description 1
- XTUVJUMINZSXGF-UHFFFAOYSA-N N-methylcyclohexylamine Chemical compound CNC1CCCCC1 XTUVJUMINZSXGF-UHFFFAOYSA-N 0.000 description 1
- BHHGXPLMPWCGHP-UHFFFAOYSA-N Phenethylamine Natural products NCCC1=CC=CC=C1 BHHGXPLMPWCGHP-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- GHWVXCQZPNWFRO-UHFFFAOYSA-N butane-2,3-diamine Chemical compound CC(N)C(C)N GHWVXCQZPNWFRO-UHFFFAOYSA-N 0.000 description 1
- 239000003985 ceramic capacitor Substances 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 125000005266 diarylamine group Chemical group 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- JRBPAEWTRLWTQC-UHFFFAOYSA-N dodecylamine Chemical compound CCCCCCCCCCCCN JRBPAEWTRLWTQC-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002346 iodo group Chemical group I* 0.000 description 1
- KDSNLYIMUZNERS-UHFFFAOYSA-N isobutyl amine Natural products CC(C)CN KDSNLYIMUZNERS-UHFFFAOYSA-N 0.000 description 1
- GKQPCPXONLDCMU-CCEZHUSRSA-N lacidipine Chemical compound CCOC(=O)C1=C(C)NC(C)=C(C(=O)OCC)C1C1=CC=CC=C1\C=C\C(=O)OC(C)(C)C GKQPCPXONLDCMU-CCEZHUSRSA-N 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000004570 mortar (masonry) Substances 0.000 description 1
- KVKFRMCSXWQSNT-UHFFFAOYSA-N n,n'-dimethylethane-1,2-diamine Chemical compound CNCCNC KVKFRMCSXWQSNT-UHFFFAOYSA-N 0.000 description 1
- UQKAOOAFEFCDGT-UHFFFAOYSA-N n,n-dimethyloctan-1-amine Chemical compound CCCCCCCCN(C)C UQKAOOAFEFCDGT-UHFFFAOYSA-N 0.000 description 1
- XTAZYLNFDRKIHJ-UHFFFAOYSA-N n,n-dioctyloctan-1-amine Chemical compound CCCCCCCCN(CCCCCCCC)CCCCCCCC XTAZYLNFDRKIHJ-UHFFFAOYSA-N 0.000 description 1
- HVAAHUDGWQAAOJ-UHFFFAOYSA-N n-benzylethanamine Chemical compound CCNCC1=CC=CC=C1 HVAAHUDGWQAAOJ-UHFFFAOYSA-N 0.000 description 1
- XWCCTMBMQUCLSI-UHFFFAOYSA-N n-ethyl-n-propylpropan-1-amine Chemical compound CCCN(CC)CCC XWCCTMBMQUCLSI-UHFFFAOYSA-N 0.000 description 1
- PXSXRABJBXYMFT-UHFFFAOYSA-N n-hexylhexan-1-amine Chemical compound CCCCCCNCCCCCC PXSXRABJBXYMFT-UHFFFAOYSA-N 0.000 description 1
- RIWRFSMVIUAEBX-UHFFFAOYSA-N n-methyl-1-phenylmethanamine Chemical compound CNCC1=CC=CC=C1 RIWRFSMVIUAEBX-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- IOQPZZOEVPZRBK-UHFFFAOYSA-N octan-1-amine Chemical compound CCCCCCCCN IOQPZZOEVPZRBK-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- GPCKFIWBUTWTDH-UHFFFAOYSA-N pentane-3,3-diamine Chemical compound CCC(N)(N)CC GPCKFIWBUTWTDH-UHFFFAOYSA-N 0.000 description 1
- 229940100684 pentylamine Drugs 0.000 description 1
- 229940117803 phenethylamine Drugs 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 102220047090 rs6152 Human genes 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- YBRBMKDOPFTVDT-UHFFFAOYSA-N tert-butylamine Chemical compound CC(C)(C)N YBRBMKDOPFTVDT-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- ODHXBMXNKOYIBV-UHFFFAOYSA-N triphenylamine Chemical compound C1=CC=CC=C1N(C=1C=CC=CC=1)C1=CC=CC=C1 ODHXBMXNKOYIBV-UHFFFAOYSA-N 0.000 description 1
- YFTHZRPMJXBUME-UHFFFAOYSA-N tripropylamine Chemical compound CCCN(CCC)CCC YFTHZRPMJXBUME-UHFFFAOYSA-N 0.000 description 1
- 238000001132 ultrasonic dispersion Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/40—Structural combinations of fixed capacitors with other electric elements, the structure mainly consisting of a capacitor, e.g. RC combinations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
- H01C1/148—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors the terminals embracing or surrounding the resistive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
- H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax or thiol
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to an electronic component module, and more particularly to an electronic component module in which electronic components are electrically connected via a bonding material.
- Electronic components such as multilayer ceramic capacitors and semiconductor elements have external electrodes for electrical connection with other electronic components such as circuit boards, and solder or conductive grease applied to the external electrodes. It is electrically connected to other electronic components through a bonding material such as a material.
- connection part between electronic components is not only the reliability of the connection material itself, such as the conductive grease material, and the reliability such as moisture resistance, but also the connection resistance and connection strength of the contact part between the connection material and the electrode. Which is affected by reliability.
- Patent Document 1 proposes a method for manufacturing an electronic circuit board in which a metal surface is treated with a coupling agent such as a silane in advance and a conductive paste is applied or printed.
- Patent Document 1 it is said that the adhesion between the metal surface and the cured conductive paste coating film is enhanced by treating the metal surface with a silane-based coupling agent in advance.
- Patent Document 1 Japanese Patent Laid-Open No. 6-61602
- Patent Document 1 improves adhesion by surface treatment with a coupling agent such as a silane, and has focused on work function and Schottky current. It is not a thing. Rather, since the silane coupling agent specifically exemplified in Patent Document 1 has a strong electron arch I and oxygen atom in the molecular skeleton, the work function of the electrode surface increases and the Schottky current decreases. I think that.
- the present invention reduces the work function of the electrode surface and increases the Schottky current, thereby reducing the connection resistance value between the electrode and the connection material, thereby increasing the electrical connection reliability. It aims at providing a subcomponent module.
- an electronic component module is configured such that a first electronic component having an external electrode and a second electronic component having an external electrode are electrically connected via a bonding material.
- An organic compound that lowers the work function of the electrode surface is adsorbed on the electrode surface.
- the organic compound is an amine compound having no oxygen atom in a molecular skeleton and having a nitrogen atom, specifically, Tetraethylenepentamine, triethinoleamine, tri- n -butinoreamine, and 1-aminodecane can be preferably used.
- the electronic component module of the present invention is characterized in that the electrode surface includes one selected from Au, Ag, Sn, and alloys thereof.
- the electronic component module of the present invention is characterized in that the conductive adhesive is formed by a misalignment between a conductive resin material and a conductive adhesive sheet.
- the bonding material for electrically connecting the first electronic component and the second electronic component is made of a conductive adhesive, and the first and second electronic components Since an organic compound that lowers the work function of the electrode surface is adsorbed on the surface of at least one of the external electrodes of each electronic component, the work function of the electrode surface is reduced and Schottky is reduced.
- the current increases, which can reduce the connection resistance between the electrode and the conductive adhesive, improving the reliability of the electrical connection between the first electronic component and the second electronic component Can do.
- an amine compound having no oxygen atom in the molecular skeleton and having a nitrogen atom specifically, tetraethylenepentamine, triethylamine, tri-n-butylamine, 1-aminodecane.
- the surface of the external electrode contains at least one selected from Au, Ag, Sn, and alloys thereof, the electrode is used when a metal material normally used as the external electrode is used.
- the connection resistance between the first electronic component and the conductive adhesive can be effectively reduced, and the reliability of the electrical connection between the first electronic component and the second electronic component can be improved.
- the conductive adhesive is formed by a gap between the conductive resin material and the conductive adhesive sheet, even when a lead-free bonding material is used, Electronic component modules with improved connection reliability can be realized.
- FIG. 1 is a cross-sectional view showing an electronic component module according to the present invention.
- FIG. 2 is a plan view of a test substrate.
- FIG. 3 is a cross-sectional view taken along the line AA in FIG.
- FIG. 1 is a cross-sectional view schematically showing one embodiment of an electronic component module according to the present invention.
- the electronic component module is configured such that a multilayer ceramic electronic component 10 as a first electronic component and a circuit board 20 as a second electronic component are electrically connected via a bonding material 30 made of a conductive resin material. Connected.
- the multilayer ceramic electronic component 10 includes a ceramic substrate 11 as an electronic component body and an external electrode 12 formed on the surface of the ceramic substrate 11.
- the ceramic substrate 11 also has a ceramic material force such as dielectric ceramics and magnetic ceramics, and has an internal electrode. However, in the present embodiment, illustration is omitted.
- the surface layer of the external electrode 12 contains Ag, Au, Sn, or an alloy thereof, and an organic compound that lowers the work function on the surface of the external electrode 12, such as tetraethylene pentamine, triethylamine, and tree n.
- the branched skeleton such as —butylamine, 1-aminodecane, etc. has adsorbed in advance an amine compound having no nitrogen atom and having a nitrogen atom.
- the multilayer ceramic electronic component 10 is surface-treated, whereby the organic compound is transformed. It is adsorbed on the surface layer (surface) of the external electrode 12.
- the circuit board 20 includes a substrate body 21 formed of a resin material, acid aluminum, or the like, and an electrode pad (external electrode) 22 formed on the main surface of the substrate body 21. Similar to the external electrode 12, the surface layer of the electrode pad 22 contains Ag, Au, Sn, or an alloy thereof, and an organic compound that reduces the work function on the surface of the electrode pad 22, such as tetraethylenepentamine. Amine compounds having no nitrogen atoms and no nitrogen atoms in the branched skeletons such as triethylamine, tri- n -butylamine and 1-aminodecane are adsorbed in advance.
- the circuit board 20 is surface-treated before the conductive resin material as the bonding material 30 is applied between the external electrode 12 and the electrode pad 22, whereby the organic compound is converted into the organic compound. It is adsorbed on the surface layer (surface) of the electrode pad 22.
- these organic compounds are diluted with a solvent such as ethanol as necessary, and then dipped and sprayed ( There is a method of applying to the surface layer of the external electrode 12 and the electrode pad 22 by a method such as spraying, transfer, or application using a brush, and drying the solvent, but is not limited thereto.
- the conductive resin material forming the bonding material 30 includes a resin such as epoxy resin and a conductive powder such as Ag, and after being applied between the external electrode 12 and the electrode pad 22, It is cured by methods such as thermosetting and UV curing.
- the organic compound that lowers the work function is adsorbed in advance on the surface layers of the external electrode 12 and the electrode pad 22, the external electrode 12 or the electrode pad 33 and the bonding material 30 Increases the value of the Schottky current responsible for conduction between the two.
- each of the connection resistance between the external electrode 12 and the conductive resin material 30 and the connection resistance between the electrode pad 22 and the bonding material 30 are reduced.
- the external electrode 12 and the electrode pad 22 are reduced.
- the reliability of the electrical connection between the ceramic electronic component 10 and the circuit board 20 is improved.
- the present invention is not limited to the above-described embodiment.
- the force of adsorbing the organic compound that lowers the work function on the surface layer of both the external electrode 12 and the electrode pad 22 reduces the work function only on the surface layer of either the external electrode 12 or the electrode pad 22. The same effect can be obtained even if the organic compound to be adsorbed is adsorbed.
- tetraethylenepentamine, triethylamine, tri- n -butylamine, and 1-aminodecane are illustrated as suitable organic compounds to be adsorbed on the electrode surface.
- the present invention is not limited thereto. is not. That is, any amine compound having no oxygen atom in the molecular skeleton and a nitrogen atom in the molecular skeleton can be preferably used.
- a conductive resin material is used as the bonding material 30.
- the same effect can be obtained even when a conductive adhesive sheet or the like is used as long as it is a conductive adhesive. Togashi.
- the form of the first electronic component and the second electronic component is not limited to the multilayer ceramic electronic component and the circuit board, but can be applied to any electronic component such as a multilayer substrate and a semiconductor element. The only thing you can do is ...
- FIG. 2 is a plan view showing the test substrate used in this example
- FIG. 3 is a cross-sectional view taken along the line AA in FIG.
- the test substrate includes a substrate body 41 made of a glass-epoxy composite material, through holes 42a and 42b formed in the substrate body 41, and both main bodies 41 of the substrate body 41 through the through holes 42a and 42b.
- the electrodes 43a and 43b are formed so as to cover the surface, and the conductive resin material 44 as a bonding material is applied so as to connect the electrodes 43a and 43b.
- Electrodes 43a and 43b are 10 thick It has a two-layer structure consisting of an underlayer made of Cu of m and a surface layer of 1 m thickness formed so as to cover the underlayer.
- the surface layer material of the electrode a material different depending on each sample, specifically, any one of Sn, Ag, Au, and Sn-37Pb was used.
- test substrate subjected to surface cleaning in (1) above was immersed in the ethanol solution, subjected to ultrasonic dispersion for 10 minutes, and then air-dried for 24 hours.
- the work function of each sample on the surface of the electrodes 43a and 43b was measured using an atmospheric-type ultraviolet photoelectron analyzer (Riken Keiki AC-2). Then, the work function value before the surface treatment measured in the above (1) was subtracted from the measured work function value, and the amount of change in the work function due to the adsorption of the organic compound was determined.
- the conductive grease material 44 is applied by a printing method using a metal mask so that the electrodes 43a and 43b of each test substrate subjected to the surface treatment in (2) are electrically connected.
- the resistance value R between the electrodes 43a and 43b was measured by the four-terminal method.
- the surface treatment is applied to the test substrate!
- the conductive resin material (bonding material) is applied and cured in the same manner as described above.
- the resistance value RO between 43b was measured by the 4-terminal method. Based on the following formula (A), the change rate AR (%) of the connection resistance value due to the adsorption of the organic compound was obtained.
- AR ⁇ (R-RO) / RO ⁇ X 100--(A)
- Table 1 shows the composition and measurement results for each sample prepared and measured by the methods (1) to (5) above. Table 1 shows no surface treatment for comparison! Samples (sample numbers 17-20) are also shown. In Table 1, sample numbers marked with * indicate comparative examples.
- sample numbers 1 to 4 and 17 the surface layer of the electrode is made of Sn.
- sample number 17 without surface treatment had a resistance value R of 128 m ⁇
- sample numbers 1 to 4 had no oxygen atoms in the molecular skeleton and nitrogen atoms.
- the surface treatment is performed with an ethanol solution containing an organic compound having the following properties (hereinafter referred to as “specific organic compound” t), and the specific organic compound is adsorbed on the surface layers of the electrodes 43a and 43b.
- the work function decreased from -0.05 to 0.16 eV compared to Sample No. 17, and as a result, the resistance value R decreased from 94 to 108 m ⁇ .
- the surface layer of the electrode is formed of Ag.
- the sample number 18 that was not subjected to the surface treatment had a resistance value R of 59 m ⁇ , whereas the sample numbers 5 to 8 adsorb specific organic compounds to the surface layers of the electrodes 43a and 43b. Therefore, the work function change amount was -0.01 to 0.33 eV, and the work function was decreased as compared with Sample No. 18. As a result, the resistance value R was lowered to 48 to 55 ⁇ .
- sample number 19 without surface treatment had a resistance value R of 38 ⁇ , while sample numbers 9 and 10 adsorbed specific organic compounds to the surface layers of electrodes 43a and 43b.
- the work function changes were 0.46 and 0.25 eV, respectively, and the work function decreased compared to Sample No. 19, resulting in a decrease in resistance R of 33 and 34 m ⁇ , respectively.
- sample number 20 without surface treatment has a resistance value R of 165 m ⁇
- sample number 11 adsorbs a specific organic compound to the surface layers of electrodes 43a and 43b.
- the work function change amount was 0.03 eV
- the work function decreased compared to Sample No. 11.
- the resistance value R decreased to 146 m ⁇ .
- Sample No. 12 is triethanolamine [(C H
- the work function change amount was +0.05 eV
- the work function increased
- the resistance value R increased to 128 m ⁇ and the resistance increased to 130 m ⁇ . This is thought to be because the oxygen atoms contained in the molecular skeleton of trihetanolamine outweigh the effect of the electron-feeding effect of nitrogen atoms, which have a high electron-withdrawing property.
- Sample No. 14 also uses an ethanol solution containing triethanolamine [(CHOH) N] as a surface treating agent, as in Sample No. 12, and therefore for the same reason, Compared to Sample No. 18, where the surface of the pole surface was not treated, the work function change was +0.21 eV, the work function increased, and the resistance R increased to 59 m ⁇ and the force increased to 65 m ⁇ .
- Sample No. 13 is a decanoic acid having an oxygen atom in the branched skeleton and no nitrogen atom.
- Sample No. 15 also used decanoic acid [C H COO as a surface treatment agent in the same manner as Sample No. 13.
- the change in work function is +0.21 eV and the work function increases for the same reason. Increased from 59 m ⁇ to 71 m ⁇ .
- Sample No. 16 also used decanoic acid [C
- the surface of the electrode was not subjected to surface treatment.
- the specific organic compound that reduces the work function of the electrode surface can be adsorbed to the electrode surface, whereby the resistance value R can be reduced, and thus the connection reliability can be reduced. It was confirmed that the property was improved.
- an amine compound having no oxygen atom in the molecular skeleton and a nitrogen atom in the molecular skeleton specifically tetraethylenepentamine, triethylamine, trin- Butylamine and 1-aminodecane were also suitable.
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Conductive Materials (AREA)
- Wire Bonding (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
Claims
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CN2006800096525A CN101147217B (zh) | 2005-04-12 | 2006-02-17 | 电子器件模块 |
JP2007512411A JP4482945B2 (ja) | 2005-04-12 | 2006-02-17 | 電子部品モジュール |
TW095109016A TW200642539A (en) | 2005-04-12 | 2006-03-16 | Electronic component module |
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JP (1) | JP4482945B2 (ja) |
KR (1) | KR100938554B1 (ja) |
CN (1) | CN101147217B (ja) |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2010225606A (ja) * | 2009-03-19 | 2010-10-07 | Sanyo Electric Co Ltd | 固体電解コンデンサの製造方法 |
WO2021074068A3 (de) * | 2019-10-16 | 2021-06-10 | Tdk Electronics Ag | Bauelement und verfahren zur herstellung eines bauelements |
US12014852B2 (en) | 2019-10-16 | 2024-06-18 | Tdk Electronics Ag | Sensor element and method for producing a sensor element |
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KR101051045B1 (ko) * | 2009-06-02 | 2011-07-21 | 중앙대학교 산학협력단 | 도전성 접착제를 이용한 단자간 접속방법 |
KR102122933B1 (ko) * | 2013-10-16 | 2020-06-15 | 삼성전기주식회사 | 전자부품의 실장 기판 및 전자부품 실장용 페이스트 |
KR101813361B1 (ko) | 2016-02-03 | 2017-12-28 | 삼성전기주식회사 | 전자부품 및 전자부품 실장 회로보드 |
KR102105384B1 (ko) | 2018-07-19 | 2020-04-28 | 삼성전기주식회사 | 적층형 커패시터 |
KR102345115B1 (ko) | 2018-07-19 | 2021-12-30 | 삼성전기주식회사 | 적층형 커패시터 |
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JPS61142438U (ja) * | 1985-02-25 | 1986-09-03 | ||
JPH0661602A (ja) * | 1992-08-10 | 1994-03-04 | Kao Corp | 電子回路基板の製造方法 |
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JP3567759B2 (ja) * | 1998-09-28 | 2004-09-22 | 株式会社村田製作所 | 誘電体セラミック組成物および積層セラミックコンデンサ |
JP4097566B2 (ja) * | 2001-10-16 | 2008-06-11 | 東洋紡績株式会社 | 接着複合体の解体方法 |
JP3730209B2 (ja) * | 2002-11-14 | 2005-12-21 | 株式会社東郷製作所 | 通電接着剤 |
-
2006
- 2006-02-17 JP JP2007512411A patent/JP4482945B2/ja active Active
- 2006-02-17 WO PCT/JP2006/302856 patent/WO2006109369A1/ja active Application Filing
- 2006-02-17 KR KR1020077022408A patent/KR100938554B1/ko active IP Right Grant
- 2006-02-17 CN CN2006800096525A patent/CN101147217B/zh not_active Expired - Fee Related
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Patent Citations (2)
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JPS61142438U (ja) * | 1985-02-25 | 1986-09-03 | ||
JPH0661602A (ja) * | 1992-08-10 | 1994-03-04 | Kao Corp | 電子回路基板の製造方法 |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010225606A (ja) * | 2009-03-19 | 2010-10-07 | Sanyo Electric Co Ltd | 固体電解コンデンサの製造方法 |
WO2021074068A3 (de) * | 2019-10-16 | 2021-06-10 | Tdk Electronics Ag | Bauelement und verfahren zur herstellung eines bauelements |
CN114303213A (zh) * | 2019-10-16 | 2022-04-08 | Tdk电子股份有限公司 | 器件和用于制造器件的方法 |
US12014852B2 (en) | 2019-10-16 | 2024-06-18 | Tdk Electronics Ag | Sensor element and method for producing a sensor element |
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KR100938554B1 (ko) | 2010-01-22 |
JP4482945B2 (ja) | 2010-06-16 |
TWI308041B (ja) | 2009-03-21 |
KR20070110401A (ko) | 2007-11-16 |
TW200642539A (en) | 2006-12-01 |
JPWO2006109369A1 (ja) | 2008-10-09 |
CN101147217A (zh) | 2008-03-19 |
CN101147217B (zh) | 2010-09-22 |
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