WO2021074068A3 - Bauelement und verfahren zur herstellung eines bauelements - Google Patents

Bauelement und verfahren zur herstellung eines bauelements Download PDF

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Publication number
WO2021074068A3
WO2021074068A3 PCT/EP2020/078583 EP2020078583W WO2021074068A3 WO 2021074068 A3 WO2021074068 A3 WO 2021074068A3 EP 2020078583 W EP2020078583 W EP 2020078583W WO 2021074068 A3 WO2021074068 A3 WO 2021074068A3
Authority
WO
WIPO (PCT)
Prior art keywords
component
producing
slide
support slide
relates
Prior art date
Application number
PCT/EP2020/078583
Other languages
English (en)
French (fr)
Other versions
WO2021074068A2 (de
Inventor
Jan Ihle
Thomas Bernert
Stefan Bernd Endler
Michael Krenn
Stephan Bigl
Markus Puff
Sebastian REDOLFI
Original Assignee
Tdk Electronics Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Electronics Ag filed Critical Tdk Electronics Ag
Priority to JP2022512724A priority Critical patent/JP2022552067A/ja
Priority to CN202080061152.6A priority patent/CN114303213A/zh
Priority to US17/637,725 priority patent/US20220287187A1/en
Publication of WO2021074068A2 publication Critical patent/WO2021074068A2/de
Publication of WO2021074068A3 publication Critical patent/WO2021074068A3/de

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/04Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
    • H01C7/042Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
    • H01C7/043Oxides or oxidic compounds
    • H01C7/045Perovskites, e.g. titanates
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C1/00Details
    • H01C1/14Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/006Thin film resistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01CRESISTORS
    • H01C7/00Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/02Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
    • H01C7/022Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
    • H01C7/023Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
    • H01C7/025Perovskites, e.g. titanates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02Mountings
    • H01G2/06Mountings specially adapted for mounting on a printed-circuit support
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/018Dielectrics
    • H01G4/06Solid dielectrics
    • H01G4/08Inorganic dielectrics
    • H01G4/12Ceramic dielectrics
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/002Details
    • H01G4/228Terminals
    • H01G4/252Terminals the terminals being coated on the capacitive element
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01GCAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00Fixed capacitors; Processes of their manufacture
    • H01G4/33Thin- or thick-film capacitors 
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Materials Engineering (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Micromachines (AREA)
  • Ceramic Capacitors (AREA)
  • Thermistors And Varistors (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Apparatuses And Processes For Manufacturing Resistors (AREA)
  • Compositions Of Oxide Ceramics (AREA)

Abstract

Es wird ein Bauelement(1) beschrieben aufweisend wenigstens eine Trägerschicht (2), wobei die Trägerschicht (2) eine Oberseite (2a) und eine Unterseite (2b) aufweist, wenigstens eine FunktIonsschicht (5), wobei die FunktIonsschicht (5) an der Oberseite (2a) der Trägerschicht (2) angeordnet ist und ein Material aufweist, das eine spezielle elektrische Charakteristik aufweist, wobei das Bauelement (1) dazu ausgebildet ist als diskretes Bauelement direkt in ein elektrisches System integriert zu werden. Ferner wird ein Verfahren zur Herstellung eines Bauelements beschrieben.
PCT/EP2020/078583 2019-10-16 2020-10-12 Bauelement und verfahren zur herstellung eines bauelements WO2021074068A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2022512724A JP2022552067A (ja) 2019-10-16 2020-10-12 部品及び部品の製造方法
CN202080061152.6A CN114303213A (zh) 2019-10-16 2020-10-12 器件和用于制造器件的方法
US17/637,725 US20220287187A1 (en) 2019-10-16 2020-10-12 Component and Method for Manufacturing a Component

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102019127924.0A DE102019127924B3 (de) 2019-10-16 2019-10-16 Bauelement und Verfahren zur Herstellung eines Bauelements
DE102019127924.0 2019-10-16

Publications (2)

Publication Number Publication Date
WO2021074068A2 WO2021074068A2 (de) 2021-04-22
WO2021074068A3 true WO2021074068A3 (de) 2021-06-10

Family

ID=72964638

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2020/078583 WO2021074068A2 (de) 2019-10-16 2020-10-12 Bauelement und verfahren zur herstellung eines bauelements

Country Status (5)

Country Link
US (1) US20220287187A1 (de)
JP (1) JP2022552067A (de)
CN (1) CN114303213A (de)
DE (1) DE102019127924B3 (de)
WO (1) WO2021074068A2 (de)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148178A (ja) * 1995-11-24 1997-06-06 Kyocera Corp 表面実装型電子部品ならびにその製造方法
WO2006109369A1 (ja) * 2005-04-12 2006-10-19 Murata Manufacturing Co., Ltd 電子部品モジュール
US20100096666A1 (en) * 2007-03-15 2010-04-22 National University Corporation Toyohashi University Of Technology Laminar structure on a semiconductor substrate
WO2015015953A1 (ja) * 2013-07-30 2015-02-05 株式会社村田製作所 誘電体薄膜材料および可変容量素子
US20150055682A1 (en) * 2012-03-30 2015-02-26 Mitsubishi Materials Corporation Film-type thermistor sensor

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06124810A (ja) * 1992-10-09 1994-05-06 Hitachi Ltd 薄膜抵抗体とその製法
EP0657932B1 (de) * 1993-12-13 2001-09-05 Matsushita Electric Industrial Co., Ltd. Vorrichtung mit Chipgehäuse und Verfahren zu Ihrer Herstellung
JP3255112B2 (ja) * 1998-06-17 2002-02-12 日本電気株式会社 抵抗内蔵型の配線基板及びその製造方法
JPWO2003007379A1 (ja) * 2001-07-12 2004-11-04 株式会社日立製作所 電子回路部品
JP4523299B2 (ja) * 2003-10-31 2010-08-11 学校法人早稲田大学 薄膜コンデンサの製造方法
DE10358282A1 (de) * 2003-12-12 2005-07-28 Georg Bernitz Bauelement und Verfahren zu dessen Herstellung
JP4476701B2 (ja) * 2004-06-02 2010-06-09 日本碍子株式会社 電極内蔵焼結体の製造方法
JP4572759B2 (ja) * 2005-07-06 2010-11-04 セイコーエプソン株式会社 半導体装置及び電子機器
JP2009076608A (ja) * 2007-09-19 2009-04-09 Mitsubishi Materials Corp 薄膜サーミスタ及び薄膜サーミスタの製造方法
WO2010115434A1 (en) * 2009-04-06 2010-10-14 Sensic Ab Gas sensor
US8436426B2 (en) * 2010-08-24 2013-05-07 Stmicroelectronics Pte Ltd. Multi-layer via-less thin film resistor
KR101773954B1 (ko) * 2011-09-28 2017-09-05 한국전자통신연구원 Mems형 전기화학식 가스 센서
US9177899B2 (en) * 2012-07-31 2015-11-03 Mediatek Inc. Semiconductor package and method for fabricating base for semiconductor package
US8610281B1 (en) * 2012-10-02 2013-12-17 Global Foundries Inc. Double-sided semiconductor structure using through-silicon vias
EP2860560B1 (de) * 2013-10-14 2019-07-24 ams AG Halbleiterbauteil mit optischen und elektrischen Durchkontaktierungen
DE102014103747B4 (de) * 2014-03-19 2024-06-13 Osram Oled Gmbh Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements
CN106796929A (zh) * 2014-09-26 2017-05-31 英特尔公司 具有背侧无源部件的集成电路管芯及其相关方法
KR102494110B1 (ko) * 2015-08-28 2023-01-30 쇼와덴코머티리얼즈가부시끼가이샤 반도체 장치 및 그 제조 방법
DE102016101249A1 (de) * 2015-11-02 2017-05-04 Epcos Ag Sensorelement und Verfahren zur Herstellung eines Sensorelements

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09148178A (ja) * 1995-11-24 1997-06-06 Kyocera Corp 表面実装型電子部品ならびにその製造方法
WO2006109369A1 (ja) * 2005-04-12 2006-10-19 Murata Manufacturing Co., Ltd 電子部品モジュール
US20100096666A1 (en) * 2007-03-15 2010-04-22 National University Corporation Toyohashi University Of Technology Laminar structure on a semiconductor substrate
US20150055682A1 (en) * 2012-03-30 2015-02-26 Mitsubishi Materials Corporation Film-type thermistor sensor
WO2015015953A1 (ja) * 2013-07-30 2015-02-05 株式会社村田製作所 誘電体薄膜材料および可変容量素子

Also Published As

Publication number Publication date
DE102019127924B3 (de) 2021-01-21
JP2022552067A (ja) 2022-12-15
CN114303213A (zh) 2022-04-08
US20220287187A1 (en) 2022-09-08
WO2021074068A2 (de) 2021-04-22

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