WO2021074068A3 - Bauelement und verfahren zur herstellung eines bauelements - Google Patents
Bauelement und verfahren zur herstellung eines bauelements Download PDFInfo
- Publication number
- WO2021074068A3 WO2021074068A3 PCT/EP2020/078583 EP2020078583W WO2021074068A3 WO 2021074068 A3 WO2021074068 A3 WO 2021074068A3 EP 2020078583 W EP2020078583 W EP 2020078583W WO 2021074068 A3 WO2021074068 A3 WO 2021074068A3
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- component
- producing
- slide
- support slide
- relates
- Prior art date
Links
- 238000004519 manufacturing process Methods 0.000 title abstract 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/04—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient
- H01C7/042—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having negative temperature coefficient mainly consisting of inorganic non-metallic substances
- H01C7/043—Oxides or oxidic compounds
- H01C7/045—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C1/00—Details
- H01C1/14—Terminals or tapping points or electrodes specially adapted for resistors; Arrangements of terminals or tapping points or electrodes on resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/006—Thin film resistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/022—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances
- H01C7/023—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient mainly consisting of non-metallic substances containing oxides or oxidic compounds, e.g. ferrites
- H01C7/025—Perovskites, e.g. titanates
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/02—Mountings
- H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
- H01G4/252—Terminals the terminals being coated on the capacitive element
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/33—Thin- or thick-film capacitors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Materials Engineering (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Micromachines (AREA)
- Ceramic Capacitors (AREA)
- Thermistors And Varistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Compositions Of Oxide Ceramics (AREA)
Abstract
Es wird ein Bauelement(1) beschrieben aufweisend wenigstens eine Trägerschicht (2), wobei die Trägerschicht (2) eine Oberseite (2a) und eine Unterseite (2b) aufweist, wenigstens eine FunktIonsschicht (5), wobei die FunktIonsschicht (5) an der Oberseite (2a) der Trägerschicht (2) angeordnet ist und ein Material aufweist, das eine spezielle elektrische Charakteristik aufweist, wobei das Bauelement (1) dazu ausgebildet ist als diskretes Bauelement direkt in ein elektrisches System integriert zu werden. Ferner wird ein Verfahren zur Herstellung eines Bauelements beschrieben.
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2022512724A JP2022552067A (ja) | 2019-10-16 | 2020-10-12 | 部品及び部品の製造方法 |
CN202080061152.6A CN114303213A (zh) | 2019-10-16 | 2020-10-12 | 器件和用于制造器件的方法 |
US17/637,725 US20220287187A1 (en) | 2019-10-16 | 2020-10-12 | Component and Method for Manufacturing a Component |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102019127924.0A DE102019127924B3 (de) | 2019-10-16 | 2019-10-16 | Bauelement und Verfahren zur Herstellung eines Bauelements |
DE102019127924.0 | 2019-10-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2021074068A2 WO2021074068A2 (de) | 2021-04-22 |
WO2021074068A3 true WO2021074068A3 (de) | 2021-06-10 |
Family
ID=72964638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2020/078583 WO2021074068A2 (de) | 2019-10-16 | 2020-10-12 | Bauelement und verfahren zur herstellung eines bauelements |
Country Status (5)
Country | Link |
---|---|
US (1) | US20220287187A1 (de) |
JP (1) | JP2022552067A (de) |
CN (1) | CN114303213A (de) |
DE (1) | DE102019127924B3 (de) |
WO (1) | WO2021074068A2 (de) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148178A (ja) * | 1995-11-24 | 1997-06-06 | Kyocera Corp | 表面実装型電子部品ならびにその製造方法 |
WO2006109369A1 (ja) * | 2005-04-12 | 2006-10-19 | Murata Manufacturing Co., Ltd | 電子部品モジュール |
US20100096666A1 (en) * | 2007-03-15 | 2010-04-22 | National University Corporation Toyohashi University Of Technology | Laminar structure on a semiconductor substrate |
WO2015015953A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 誘電体薄膜材料および可変容量素子 |
US20150055682A1 (en) * | 2012-03-30 | 2015-02-26 | Mitsubishi Materials Corporation | Film-type thermistor sensor |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06124810A (ja) * | 1992-10-09 | 1994-05-06 | Hitachi Ltd | 薄膜抵抗体とその製法 |
EP0657932B1 (de) * | 1993-12-13 | 2001-09-05 | Matsushita Electric Industrial Co., Ltd. | Vorrichtung mit Chipgehäuse und Verfahren zu Ihrer Herstellung |
JP3255112B2 (ja) * | 1998-06-17 | 2002-02-12 | 日本電気株式会社 | 抵抗内蔵型の配線基板及びその製造方法 |
JPWO2003007379A1 (ja) * | 2001-07-12 | 2004-11-04 | 株式会社日立製作所 | 電子回路部品 |
JP4523299B2 (ja) * | 2003-10-31 | 2010-08-11 | 学校法人早稲田大学 | 薄膜コンデンサの製造方法 |
DE10358282A1 (de) * | 2003-12-12 | 2005-07-28 | Georg Bernitz | Bauelement und Verfahren zu dessen Herstellung |
JP4476701B2 (ja) * | 2004-06-02 | 2010-06-09 | 日本碍子株式会社 | 電極内蔵焼結体の製造方法 |
JP4572759B2 (ja) * | 2005-07-06 | 2010-11-04 | セイコーエプソン株式会社 | 半導体装置及び電子機器 |
JP2009076608A (ja) * | 2007-09-19 | 2009-04-09 | Mitsubishi Materials Corp | 薄膜サーミスタ及び薄膜サーミスタの製造方法 |
WO2010115434A1 (en) * | 2009-04-06 | 2010-10-14 | Sensic Ab | Gas sensor |
US8436426B2 (en) * | 2010-08-24 | 2013-05-07 | Stmicroelectronics Pte Ltd. | Multi-layer via-less thin film resistor |
KR101773954B1 (ko) * | 2011-09-28 | 2017-09-05 | 한국전자통신연구원 | Mems형 전기화학식 가스 센서 |
US9177899B2 (en) * | 2012-07-31 | 2015-11-03 | Mediatek Inc. | Semiconductor package and method for fabricating base for semiconductor package |
US8610281B1 (en) * | 2012-10-02 | 2013-12-17 | Global Foundries Inc. | Double-sided semiconductor structure using through-silicon vias |
EP2860560B1 (de) * | 2013-10-14 | 2019-07-24 | ams AG | Halbleiterbauteil mit optischen und elektrischen Durchkontaktierungen |
DE102014103747B4 (de) * | 2014-03-19 | 2024-06-13 | Osram Oled Gmbh | Optoelektronisches Bauelement und Verfahren zum Herstellen eines optoelektronischen Bauelements |
CN106796929A (zh) * | 2014-09-26 | 2017-05-31 | 英特尔公司 | 具有背侧无源部件的集成电路管芯及其相关方法 |
KR102494110B1 (ko) * | 2015-08-28 | 2023-01-30 | 쇼와덴코머티리얼즈가부시끼가이샤 | 반도체 장치 및 그 제조 방법 |
DE102016101249A1 (de) * | 2015-11-02 | 2017-05-04 | Epcos Ag | Sensorelement und Verfahren zur Herstellung eines Sensorelements |
-
2019
- 2019-10-16 DE DE102019127924.0A patent/DE102019127924B3/de active Active
-
2020
- 2020-10-12 WO PCT/EP2020/078583 patent/WO2021074068A2/de active Application Filing
- 2020-10-12 JP JP2022512724A patent/JP2022552067A/ja active Pending
- 2020-10-12 CN CN202080061152.6A patent/CN114303213A/zh active Pending
- 2020-10-12 US US17/637,725 patent/US20220287187A1/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09148178A (ja) * | 1995-11-24 | 1997-06-06 | Kyocera Corp | 表面実装型電子部品ならびにその製造方法 |
WO2006109369A1 (ja) * | 2005-04-12 | 2006-10-19 | Murata Manufacturing Co., Ltd | 電子部品モジュール |
US20100096666A1 (en) * | 2007-03-15 | 2010-04-22 | National University Corporation Toyohashi University Of Technology | Laminar structure on a semiconductor substrate |
US20150055682A1 (en) * | 2012-03-30 | 2015-02-26 | Mitsubishi Materials Corporation | Film-type thermistor sensor |
WO2015015953A1 (ja) * | 2013-07-30 | 2015-02-05 | 株式会社村田製作所 | 誘電体薄膜材料および可変容量素子 |
Also Published As
Publication number | Publication date |
---|---|
DE102019127924B3 (de) | 2021-01-21 |
JP2022552067A (ja) | 2022-12-15 |
CN114303213A (zh) | 2022-04-08 |
US20220287187A1 (en) | 2022-09-08 |
WO2021074068A2 (de) | 2021-04-22 |
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