WO2006100798A1 - ハイブリッドレーザ加工装置 - Google Patents
ハイブリッドレーザ加工装置 Download PDFInfo
- Publication number
- WO2006100798A1 WO2006100798A1 PCT/JP2005/019298 JP2005019298W WO2006100798A1 WO 2006100798 A1 WO2006100798 A1 WO 2006100798A1 JP 2005019298 W JP2005019298 W JP 2005019298W WO 2006100798 A1 WO2006100798 A1 WO 2006100798A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- laser
- liquid
- workpiece
- liquid column
- inclined surface
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
- B26F3/004—Severing by means other than cutting; Apparatus therefor by means of a fluid jet
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/0665—Shaping the laser beam, e.g. by masks or multi-focusing by beam condensation on the workpiece, e.g. for focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1435—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means
- B23K26/1436—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor involving specially adapted flow control means for pressure control
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/006—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods using material without particles or pellets for deburring, removal of extended surface areas or jet milling of local recessions, e.g. grooves
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24C—ABRASIVE OR RELATED BLASTING WITH PARTICULATE MATERIAL
- B24C1/00—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods
- B24C1/04—Methods for use of abrasive blasting for producing particular effects; Use of auxiliary equipment in connection with such methods for treating only selected parts of a surface, e.g. for carving stone or glass
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F3/00—Severing by means other than cutting; Apparatus therefor
Definitions
- the present invention relates to a hybrid laser cafe apparatus, and more specifically, to a hybrid laser machining apparatus that processes a workpiece by guiding laser light to a liquid column ejected by an ejection nozzle.
- an injection nozzle having an injection hole, liquid supply means for supplying a high-pressure liquid to the injection nozzle, a laser oscillator that oscillates laser light, and a laser beam emitted from the laser oscillator is condensed And a condensing lens for ejecting liquid supplied from the liquid supply means to the outside as an injection hole force liquid column, and guiding the laser light to the liquid column by the condensing lens.
- liquid supply means for supplying a high-pressure liquid to the injection nozzle
- a laser oscillator that oscillates laser light
- a laser beam emitted from the laser oscillator is condensed
- a condensing lens for ejecting liquid supplied from the liquid supply means to the outside as an injection hole force liquid column, and guiding the laser light to the liquid column by the condensing lens.
- a nozzle block having a nozzle passage for injecting a liquid column beam is provided at the tip of a machining head, and a focus lens condenses the laser light at the entrance opening of the nozzle passage. In this way, a laser beam is guided to a liquid beam ejected from a nozzle passage.
- Patent Document 1 Japanese Patent Publication No. 10-500903
- Patent Document 2 JP 2001-321977
- the focus lens must position the focal point of the laser beam at the entrance opening of the nozzle passage and reduce the entrance opening to a small diameter.
- Patent Document 2 As a result of repeated reflection of the laser beam on the conical surface and the cylindrical surface, the incident angle of the laser beam guided to the injected water column is too small on the boundary surface of the water column. Therefore, there is a problem that the laser light jumps out of the water column. Furthermore, since the laser beam is reflected many times by the conical surface and the cylindrical surface, it is necessary to perform a process such as a mirror polishing on the entire conical surface and the cylindrical surface, and the cost of the machining head is high. There is a problem.
- the present invention makes it easy to adjust the focal position of the laser beam by the condensing lens, and the force that the guided laser beam jumps out of the liquid column also reduces the manufacturing cost.
- the present invention provides a hybrid laser processing apparatus capable of the following.
- a hybrid laser cache device of the present invention includes an injection nozzle having an injection hole, liquid supply means for supplying a high-pressure liquid to the injection nozzle, a laser oscillator that oscillates laser light, A condensing lens for condensing the laser light oscillated by the laser oscillator, and the liquid supplied from the liquid supply means is ejected to the outside from the ejection hole as a liquid column.
- a hybrid laser processing apparatus that guides a laser beam to the liquid column and processes a workpiece
- An inclined surface that is reduced in diameter toward the workpiece is formed at the injection hole inlet, and the focal point of the collecting lens is set in a liquid column that extends beyond the minimum diameter portion of the inclined surface toward the workpiece.
- the laser beam irradiated into the injection hole is set to be reflected by the inclined surface and guided to the liquid column.
- the liquid column is ejected with the diameter of the smallest diameter portion of the inclined surface formed in the ejection hole, but the condenser lens collects the laser beam smaller than the smallest diameter portion.
- the condenser lens collects the laser beam smaller than the smallest diameter portion.
- the laser beam is condensed more than the cone angle of the inclined surface. Les The cone angle of the one light becomes smaller, which can reduce the number of times the laser light is reflected by the inclined surface.
- the incident angle of the laser beam guided to the liquid column to the boundary surface between the liquid column and the outside air is increased, the laser beam is prevented from jumping out of the liquid column, and further the mirror surface inside the injection nozzle.
- the range of processing and the like can be reduced, and the cost of the injection nozzle can be reduced.
- FIG. 1 shows a hybrid laser processing apparatus 1 that works according to the present invention, and guides a laser beam L to a liquid column W formed by jetting a liquid, thereby processing the workpiece.
- This is a device that cuts object 2 into the required shape.
- This hybrid laser carriage apparatus 1 includes a processing table 3 that supports the above-described object 2, a laser oscillator 4 that oscillates a laser beam L, and a high pressure as a liquid supply unit that supplies a liquid such as water.
- a pump 5 and a processing head 6 for injecting a liquid as a liquid column W toward the object 2 and guiding a laser beam L to the liquid column W are provided.
- the machining table 3 is conventionally known and will not be described in detail. However, the workpiece 2 is moved in the horizontal direction with respect to the machining head 6, and the machining head 6 is Not shown, moved vertically by lifting and lowering means!
- a thin semiconductor wafer is cut as the above-described object 2 and, in addition, a composite material such as an epoxy resin board and a resin can be cut. it can. In addition to the cutting process, it is also possible to perform groove force on the surface of the workpiece 2.
- the laser oscillator 4 is a YAG laser and can perform CW oscillation or pulse oscillation according to processing, and its output and pulse oscillation period can be adjusted as appropriate.
- a semiconductor laser or a CO laser can be used as the laser oscillator 4.
- the liquid ejected from the machining head 6 may be a liquid that does not absorb the laser light L.
- the machining head 6 is used as an elevating means (not shown).
- the fixed flat frame 11, the condensing lens 12 for condensing the laser light L, and the liquid supplied from the high-pressure pump 5 are ejected as a liquid column W, and the laser is applied to the liquid column W.
- An injection nozzle 13 that guides the light L, and an adjusting unit 14 that adjusts the relative position and angle of the condenser lens 12 and the injection nozzle 13 are provided.
- FIG. 1 a cross-sectional view on the lower side of the drawing (below a sixth plate 41 described later) is a cross-sectional view taken along the line II in FIG.
- the frame 11 is provided on the optical axis of the laser light L oscillated by the laser oscillator 4, and a circular through hole 11a is formed at a position where the optical axis of the laser light L passes.
- the condenser lens 12 is disposed on the optical axis of the laser beam L, and is held at the lower end of a cylindrical lens holder 21.
- the lens holder 21 is attached via a substantially cross-shaped (see FIG. 2) mounting stay 22. Fixed to the bottom of the frame 11!
- FIG. 2 does not show the following second holding cylinder 28b for the explanation of the force that is a cross-sectional view taken along the line II II in FIG.
- the injection nozzle 13 is also disposed on the optical axis of the laser beam L.
- the injection nozzle 13 is held at the lower end of a cylindrical nozzle holder 23 and the nozzle holder 23 is moved by the adjusting means 14. It becomes like this.
- FIG. 3 shows an enlarged view of the injection nozzle 13 and the nozzle holder 23.
- the nozzle holder 23 is formed with a small-diameter portion 23a, a medium-diameter portion 23b, and a large-diameter portion 23c in order of the force to be subjected to the load 2 side.
- the injection nozzle 13 is fixed to the lower end of the small diameter portion 23a using a ring-shaped holding member 24.
- the injection nozzle 13 is made of stainless steel, and an injection hole 13a is formed at the center of the injection nozzle 13.
- the injection hole 13a has a first inclined surface 13b that is reduced in diameter toward the workpiece 2, and the first nozzle 13a.
- a second inclined surface 13c that is formed on the workpiece 2 side with respect to the inclined surface 13b and expands toward the workpiece 2 is formed.
- the first inclined surface 13b and the second inclined surface 13c are connected by a minimum diameter portion 13d, and the first inclined surface 13b is subjected to a mirror surface force for reflecting the laser light L. Yes.
- the angle of the first inclined surface 13b is determined by the condenser lens 12. Therefore, it is set to be larger than the cone angle of the laser beam L that is collected!
- a glass plate 26 is fitted into the intermediate diameter portion 23b of the nozzle holder 23 via a seal member 25, and the glass plate 26 is a screw threaded on the inner peripheral surface of the intermediate diameter portion 23b. It is fixed by the nut 27 that is screwed into the part.
- connection ports 23d are formed at equal intervals on a concentric circle centering on the small diameter portion 23a.
- the connection ports 23d are connected to the small diameter portion 23a via the liquid passage 23e.
- the liquid fed by the high-pressure pump 5 is supplied into the small-diameter portion 23a below the glass plate 26.
- a through hole having a diameter larger than that of the second inclined surface 13c is provided in the center of the holding member 24, and the through hole, together with the second inclined surface 13c, is a liquid ejected from the injection nozzle 13.
- the air pocket P surrounding the column W is formed.
- the adjusting means 14 includes a holding cylinder 28 that holds the nozzle holder 23, an XY axis stage 29 that moves the holding cylinder 28 in the horizontal direction, and a Z axis that moves the XY axis stage 29 in the vertical direction.
- the holding cylinder 28 is composed of a cylindrical first holding cylinder 28a and a second holding cylinder 28b. Of these, the first holding cylinder 28a is fixed to the XY axis stage 29 and is attached to the lower end of the second holding cylinder 28b.
- the nozzle holder 23 is fixed.
- the central axis of the injection hole 13a in the injection nozzle 13 and the central axes of the first and second holding cylinders 28a and 28b are aligned with each other.
- the lens holder 21 is accommodated inside the second holding cylinder 28b so as not to contact each other.
- the first holding cylinder 28a and the second holding cylinder 28b fix the lens holder 21 to the frame 11.
- the four connecting members 32 are connected so as not to interfere with the mounting stays 22.
- the XY axis stage 29 holds the first plate 33 that fixes the first holding cylinder 28a, the second plate 34 that holds the first plate 33 also with a downward force, and the second plate 34 that also holds the downward force.
- a third plate 35 and micrometers 36 and 37 are provided for moving the first holding cylinder 28a in the X-axis direction in the horizontal direction in the figure and the Y-axis direction in the depth direction in the figure.
- Through holes 33a to 35a are formed at the centers of the first to third plates 33 to 35, respectively, and the through holes 33a of the first plate 33 are formed by fixing members 33b fixed to the upper surface of the first plate 33.
- the first holding cylinder 28a is fixed so as to hang down.
- the first to third plates 33 to 35 have a substantially square shape in plan view, and are disposed so that the side surfaces thereof face the X-axis direction and the Y-axis direction, respectively. Further, the first plate 33 and the second plate 34 are relatively moved in the X-axis direction by a rail (not shown) formed in the X-axis direction, and the second plate 34 and the third plate 35 are The rail 35b (see Fig. 1) formed in the axial direction moves relative to the Y axis.
- the micrometers 36 and 37 are fixed to the side surfaces of the second plate 34 in the X-axis direction and the Y-axis direction, respectively, and the side surfaces of the first plate 33 are positioned so as to be pressed by the micrometer 36.
- a protrusion 33c is provided, and a protrusion 35c is provided on a side surface of the third plate 35 at a position that can be pressed by the tip of the micrometer 37.
- the Z-axis stage 30 includes a fourth plate 38 for fixing the third plate 35 on the upper surface, a fifth plate 39 fixed to the upper surface of the angle adjusting stage 31, and fourth and fifth plates 38, 39. And a through hole 38a, 39a is formed in the center of the fourth and fifth plates 38, 39 so as not to contact the moving first holding cylinder 28a. Yes.
- the handle 40 raises and lowers the fourth plate 38 by a conventionally known jack screw system, and detailed description of the configuration is omitted.
- the angle adjustment stage 31 has a sixth plate 41 that fixes the Z-axis stage 30 on the upper surface thereof, and a fulcrum bolt that penetrates the frame 11 and holds the sixth plate 41 at its tip also with a downward force. 42 and two adjusting bolts 43 (see FIG. 5) that also hold the sixth plate 41 with a downward force.
- the sixth plate 41 has a substantially square shape, and the fulcrum bolt 42 supports any one of the four corners of the sixth plate 41 from the lower surface.
- the adjustment bolt 43 is configured to support the corner at the position sandwiching the fulcrum bolt 42 from the bottom surface.
- the tips of the fulcrum bolt 42 and the adjustment bolt 43 are hemispherically caloeed, and the tips are received in the recess 44a of the receiving member 44 embedded in the sixth plate 41. .
- the adjustment bolt 43 can be moved up and down by a dial 43a located on the lower surface side of the frame 11. By using these two adjustment bolts 43, the sixth plate The inclination of 41 to frame 11 can be changed.
- the inclination of the nozzle holder 23 with respect to the frame 11 can be adjusted by the two adjusting bolts 43 together with the holding cylinder 28, the XY axis stage 29, and the Z axis stage 30.
- the XY axis stage 29 and the angle adjusting stage 31 are used to inject from the injection nozzle 13 with respect to the optical axis of the laser light L irradiated from the laser oscillator 4.
- the position and angle of the liquid column W can be matched, and by using the Z-axis stage 30, the focal position of the laser light L collected by the condenser lens 12 can be adjusted along the direction of the liquid column W. Can be moved.
- FIG. 6 shows an enlarged view of the injection nozzle 13, in which the optical axis of the laser light L and the central axis of the liquid column W injected from the injection nozzle 13 are the same as those of the adjusting means 14. Adjusted to match by XY axis stage 29 and angle adjustment stage 31!
- the diameter of the minimum diameter portion 13d of the first inclined surface 13b of the injection hole 13a of the injection nozzle 13 is m
- the diameter of the maximum diameter portion 13e is m
- the distance in the direction is 100 / zm
- the cone angle ⁇ 1 of the first inclined surface is set to be larger than the cone angle ⁇ 2 of the laser light L condensed by the condenser lens 12.
- laser light 4 is oscillated from the laser oscillator 4, and this laser light L is collected by the condenser lens 12, and then the glass plate 26 and the liquid filling the small diameter portion 23 a of the nozzle holder 23 are used. The light is transmitted and irradiated to the injection nozzle 13.
- the focal point of the laser beam L is positioned in the liquid column W beyond the minimum diameter portion 13d of the first inclined surface 13b, and the laser beam L is Light is condensed to be smaller than the maximum diameter portion 13e of the injection hole 13a.
- the focal point of the laser light L when there is no injection nozzle 13 is indicated by a broken line.
- the laser beam L collected in this manner is shielded by the first inclined surface 13b at the portion outside the minimum diameter portion 13d, and the portion is reflected by the first inclined surface 13b only once.
- the liquid column W is guided to the workpiece 2 while being repeatedly reflected at an incident angle larger than the critical angle at the boundary surface with the outside air.
- the focal point of the laser light L is set in the liquid column W beyond the minimum diameter portion 13d of the first inclined surface 13b in the injection nozzle 13, Since the laser beam L positioned outside the smallest diameter portion 13b is reflected by the first inclined surface 13b and guided into the liquid column W, the focal position force of the laser beam L may be slightly shifted in the 3 ⁇ 4 axis direction.
- the laser beam L can be guided to the liquid column W, and the adjustment of the focal position of the laser beam by the Z-axis stage 30 is facilitated.
- the focal point of the laser beam must be set at the opening of the ejection nozzle.
- the laser beam is not guided into the liquid column and the laser beam is unexpectedly irradiated onto the wall surface, which may damage the machining head itself.
- the laser beam L is reflected only once on the first inclined surface 13b, the range of the specular cover or the like with respect to the injection nozzle 13 can be reduced. Even if the reflection surface of the injection nozzle 13 is damaged by the reflection of L, it is sufficient to replace only the injection nozzle 13 provided at the tip of the nozzle holder 23, so that the manufacturing cost and the running cost can be reduced.
- Patent Document 2 described above, the laser beam is reflected many times in the injection nozzle, so it is necessary to widen the range of mirror finishing and the like, and the injection nozzle is damaged by the reflection of the laser beam. In this case, the entire spray nozzle needs to be replaced and repaired, resulting in high manufacturing costs and running costs.
- the incident angle of the laser beam L reflected at the boundary surface with the outside air in the liquid column W is made smaller than necessary. Since the incident angle of the laser beam at the boundary surface of the liquid column can be made larger than the critical angle, the laser beam L does not jump out of the liquid column W into the outside air.
- Patent Document 2 the laser beam is reflected many times in the injection nozzle, and the incidence angle on the inner wall surface of the injection nozzle becomes smaller each time reflection is performed.
- the incident angle of the laser beam becomes smaller than the critical angle, and the laser beam may jump out into the outside air.
- the injection nozzle 13 is made of stainless steel and the first inclined surface 13b is mirror-finished.
- the first inclined surface 13b is coated with a coating that reflects the laser light L.
- the material of the injection nozzle 13 can be another material.
- the condensing lens 12 is fixed to the frame 11 so that the position and angle of the condensing lens 12 cannot be adjusted. It is also possible to adjust the angle.
- FIG. 1 is a cross-sectional view of a hybrid laser processing apparatus in the present example.
- FIG. 2 is a plan view taken along the II section of FIG. [ Figure 3] Cross-sectional view of injection nozzle and nozzle holder [ Figure 4] Plan view of the XY axis stage!
- FIG. 5 is a cross-sectional view taken along the line V-V in FIG.
- FIG. 6 An enlarged cross-sectional view of the injection nozzle.
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Laser Beam Processing (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
Abstract
Description
Claims
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2005800491587A CN101142050B (zh) | 2005-03-18 | 2005-10-20 | 混合激光加工装置 |
US11/885,854 US7705266B2 (en) | 2005-03-18 | 2005-10-20 | Hybrid laser processing apparatus |
KR1020077021127A KR101198341B1 (ko) | 2005-03-18 | 2005-10-20 | 하이브리드 레이저 가공 장치 |
EP05795416.6A EP1859890B1 (en) | 2005-03-18 | 2005-10-20 | Hybrid laser processing system |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005079458A JP5035653B2 (ja) | 2005-03-18 | 2005-03-18 | ハイブリッドレーザ加工装置 |
JP2005-079458 | 2005-03-18 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2006100798A1 true WO2006100798A1 (ja) | 2006-09-28 |
Family
ID=37023491
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/019298 WO2006100798A1 (ja) | 2005-03-18 | 2005-10-20 | ハイブリッドレーザ加工装置 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7705266B2 (ja) |
EP (1) | EP1859890B1 (ja) |
JP (1) | JP5035653B2 (ja) |
KR (1) | KR101198341B1 (ja) |
CN (1) | CN101142050B (ja) |
WO (1) | WO2006100798A1 (ja) |
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CN102423875A (zh) * | 2011-08-24 | 2012-04-25 | 上海交通大学 | 基于激光辅助加热的超高压水射流板材渐进加工喷头及其应用 |
EP4137271A1 (en) * | 2021-08-19 | 2023-02-22 | Raytheon Technologies Corporation | Method and system for drilling ceramic material |
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JP2009119480A (ja) * | 2007-11-12 | 2009-06-04 | Shibuya Kogyo Co Ltd | レーザ加工方法とその装置 |
DE102008053729C5 (de) * | 2008-10-29 | 2013-03-07 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Laserbearbeitungsdüse zum Bearbeiten von Blechen |
EP2189236B1 (en) | 2008-11-21 | 2012-06-20 | Synova S.A. | Method and apparatus for improving reliability of a machining process |
US8525074B2 (en) * | 2008-12-26 | 2013-09-03 | Denso Corporation | Machining method and machining system for micromachining a part in a machine component |
CN101508060B (zh) * | 2009-03-20 | 2011-04-20 | 厦门大学 | 微激光束精密加工光学装置 |
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Also Published As
Publication number | Publication date |
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JP5035653B2 (ja) | 2012-09-26 |
EP1859890A4 (en) | 2012-08-08 |
EP1859890A1 (en) | 2007-11-28 |
KR20070114356A (ko) | 2007-12-03 |
US20080169275A1 (en) | 2008-07-17 |
EP1859890B1 (en) | 2013-05-01 |
JP2006255768A (ja) | 2006-09-28 |
CN101142050B (zh) | 2010-12-08 |
CN101142050A (zh) | 2008-03-12 |
KR101198341B1 (ko) | 2012-11-06 |
US7705266B2 (en) | 2010-04-27 |
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