Classifications

• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L23/00—Details of semiconductor or other solid state devices
  • H01L23/02—Containers; Seals
  • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/0001—Technical content checked by a classifier
  • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
  • H01L2924/01—Chemical elements
  • H01L2924/01079—Gold [Au]

Definitions

• the present invention relates to an electronic component package in which an opening of a case for storing an electronic component is sealed with a lid, the lid, and a lid serving as a material thereof.
• a package for storing various electronic components such as a semiconductor element and a piezoelectric vibrator is a recess for storing an electronic component as disclosed in Japanese Patent Application Laid-Open No. 2000-3973 (Patent Document 1). And a lid body brazed to the outer periphery of the case so as to close the opening of the case so as to seal the recess.
• the case is formed mainly of ceramics such as alumina and aluminum nitride.
• the lid was laminated on one surface of the base material layer formed of a low thermal expansion metal such as Fe-29% Ni-17% Co alloy (trade name: Kovar), And a brazing filler metal layer formed of a metal brazing material.
• a silver brazing alloy mainly composed of silver is mainly used.
• Seam welding may be applied as means for brazing the lid to the opening of the case, as disclosed in Patent Document 1.
• Seam welding is a relatively simple facility that does not need to be performed in a vacuum, and can perform brazing efficiently.
• electron beam welding can also be applied, in which the outer periphery of the lid overlapped with the case is irradiated with an electron beam from the back surface (outer surface) to melt and join the brazing material layer. it can.
• the melting point of the silver brazing alloy is about 780 ° C.
• the electronic component package described in Patent Document 1 has a brazing filler due to the difference in thermal expansion coefficient between the ceramic forming the case and the low thermal expansion metal forming the base layer of the lid. During the cooling process, a large thermal stress is generated on the wall of the case, and this stress causes cracks, resulting in a problem that the airtightness is lowered. Such a problem is not limited to seam welding but also applies to welding by local heating such as electron beam welding.
• Patent Document 2 Japanese Patent Application Laid-Open No. 2003-209197
• LlONZmm an intermediate metal layer strength is formed by pure Cu of 2 hereinafter LlONZmm
• Patent Document 2 Japanese Patent Laid-Open No. 2003-209197
• the present invention has been made in view of the problem of power, and even when a degassing treatment for mainly removing water by heating is performed, deformation hardly occurs, and the heat generated in the case wall portion when the brazing force is brazed to the ceramic case.
• a lid for an electronic component package capable of reducing the stress and preventing the occurrence of cracks
• a lid for the material and a method for manufacturing the lid and to seal the lid by the lid
• a lid material according to the present invention is a lid material for a lid of an electronic component package that is welded to an outer peripheral portion of an opening of a case formed so that a storage space for storing an electronic component opens on the surface.
• a base layer formed of a low thermal expansion metal and laminated on one surface of the base layer, and a Cu—Ni alloy or Ag containing 0.05 to 6% Omass%
• An intermediate metal layer formed of a Cu-Ag alloy containing 10 mass% and a brazing material layer formed of a silver brazing alloy containing silver as a main component are laminated on the intermediate metal layer.
• the unit of the component is simply expressed as “%”.
• the intermediate metal layer is formed of a Cu-Ni alloy containing 0.5 to 6.0% Ni or a Cu-Ag alloy containing 0.05 to 10% Ag. Therefore, even if the degassing process is performed before the lid body manufactured from the lid material is brazed to the outer periphery of the opening of the case, the intermediate metal layer is plastically deformed by this process. Is less likely to warp.
• the base material layer can also be obtained by local heating (heating to the periphery of the lid) such as seam welding or electron beam welding when the lid is brazed. The Joule heat generated by the!
• the brazing material layer through the intermediate metal layer and the heat applied to the base material layer is coupled with the fact that the lid body is less likely to warp.
• the body can be soldered to the outer periphery of the case easily and reliably.
• the proof stress of the Cu-Ni alloy and Cu-Ag alloy is 100 N / mm 2 or less, the difference in thermal expansion coefficient between the case and the base material layer when the lid is brazed to the outer periphery of the case opening. Due to the case of Even if a large thermal stress is generated on the wall, the intermediate metal layer is easily plastically deformed, so that the thermal stress can be reduced, and cracking on the wall of the bow IV or the case can be prevented. it can.
• the thickness of the intermediate metal layer is preferably 10 to 200 / ⁇ ⁇ (10 / zm or more and 200 ⁇ m or less). More preferably, it is less than. If it is less than 10 m, the amount of plastic deformation cannot be taken sufficiently, so that the effect of reducing the thermal stress generated in the case becomes insufficient. On the other hand, if it exceeds 200 m, the thermal deformation of the intermediate metal layer itself cannot be ignored, and the thermal stress generated in the case cannot be reduced.
• the other surface of the base material layer may be pure nickel or a nickel alloy containing nickel as a main component (these alloys may be collectively referred to as “nickel-based alloy”).
• nickel-based alloy a nickel alloy containing nickel as a main component
• the formed nickel-based metal layer can be bonded.
• the corrosion resistance of the outer surface of the base material layer can be improved.
• the lid material, the lid processed from the lid material, and the contamination of the package for electronic components sealed thereby can be obtained. Can be prevented.
• the nickel-based metal layer also has an effect of reducing warpage caused by the difference in thermal expansion coefficient between the base material layer and the intermediate metal layer.
• a method for manufacturing a lid material according to the present invention is a method for manufacturing a lid material for a lid body that is welded to an outer periphery of an opening of a case formed so that a storage space for storing an electronic component is opened on the surface.
• a Cu—Ni alloy containing 0.5 to 6.0% Ni or a Cu—Ag alloy containing 0.05 to 10% of Ag on one surface of a base material layer formed of a low thermal expansion metal A preparation step of preparing an intermediate metal layer laminate in which an intermediate metal layer formed by the above method is laminated, and a brazing filler metal layer formed of a silver brazing alloy mainly composed of silver on the intermediate metal layer of the intermediate metal layer laminate Pressure welding process for obtaining a brazing material layer pressure welded body, and diffusion annealing process for producing a lid material in which the intermediate metal layer and the brazing material layer are diffusion bonded to each other by subjecting the brazing material layer pressure welded product to diffusion annealing. And have.
• the average thickness of the intermediate metal layer of the brazing material layer pressure welded body is preferably 10 to 200 m, more preferably 10 m or more and less than 100 m. Further, in the preparation step, it is preferable to laminate a nickel-based metal layer formed of a pure nickel or a nickel alloy containing nickel as a main component on the other surface of the base material layer of the intermediate metal layer laminate. ⁇ .
• An electronic component package according to the present invention is welded to a case in which a storage space for storing an electronic component is opened on the surface, and to the outer periphery of the opening so as to cover the opening of the case. And a covered lid.
• the lid is processed from the lid material, for example, by punching.
• the intermediate metal layer is formed of a predetermined Cu-Ni alloy or Cu-Ag alloy. Even if degassing is performed before brazing, the lid is unlikely to warp. In addition, since the alloy has excellent thermal conductivity, the heat generated or applied to the base material layer can be quickly transferred to the brazing material layer through the intermediate metal layer when the lid is brazed. In combination with the fact that the lid is less likely to warp, the lid can be easily and reliably brazed to the outer periphery of the opening of the case.
• the alloy has its yield strength is LOONZmm 2 or less, upon brazing of the lid, even when thermal expansion lid with respect to the case, the wall portion of the casing intermediate metal layer is plastically deformed The generated thermal stress can be alleviated and, in turn, cracks occurring in the wall portion can be prevented. For this reason, the package for electronic components excellent in airtightness can be obtained. Moreover, according to the manufacturing method of the cover material of this invention, the said cover material can be manufactured easily.
• FIG. 1 is a partial cross-sectional schematic view showing a basic structure of a lid member according to an embodiment of the present invention.
• FIG. 2 is a schematic cross-sectional view showing the basic structure of a package for electronic components that is useful in an embodiment of the present invention.
• the lid 1 has a nickel-based metal layer 5 on one surface (upper surface in the example) of the base material layer 2 and an intermediate metal layer 3 on the other surface (lower surface in the example).
• a brazing filler metal layer 4 is pressure-welded and diffusion bonded to the surface of the intermediate metal layer 3.
• the base material layer 2 has a resistance against pure iron (pure Fe) (200 N / mm 2 ) or more, and is formed of a low thermal expansion metal having a thermal expansion coefficient smaller than that of iron.
• the low thermal expansion metal is preferably one coefficient of thermal expansion at 30 to 3 00 ° C is 4. is 0 ⁇ 5. 5 X 10- 6 Z ° C.
• a preferable low thermal expansion metal for example, Fe—Ni alloy containing 36-50% of nickel (Ni) such as Fe—42% Ni alloy, and Ni such as Kovar (trade name) 20-30
• An Fe—Ni—Co alloy containing 1 to 20% of Cobalt (Co) is suitable.
• the nickel-based metal layer 5 improves the corrosion resistance of the outer surface of the lid 1 and is a nickel alloy mainly composed of Ni, such as pure nickel or a Cu-Ni alloy containing 50 wt% or more of Ni. Formed by.
• the nickel-based metal has good pressure contact properties and diffusion contact properties with the base material layer 2. However, this nickel-based metal layer 5 may be formed if necessary. Not necessarily what you need.
• the intermediate metal layer 3 contains 0.5 to 6.0% Ni, the balance Cu and impurity Cu-Ni alloy, or 0.05 to 10% Ag, and the balance Cu and impurities. It is made of Cu-Ag alloy. If the Ni content is less than 0.5% and the Ag content is less than 0.05%, the Ni and Ag contents are too small, and the material becomes too soft due to heating during the degassing process. For this reason, the thermal expansion of the intermediate metal layer 3 is constrained by the base material layer 2 and compression plastic deformation occurs, and the warping after cooling cannot be sufficiently suppressed.
• the Ni content exceeds 6.0%, the strength of the alloy is improved and it is preferable for preventing warpage, but the thermal conductivity deteriorates, and the brazing filler metal layer is melted by local heating to the base material layer. May become difficult and a bonding failure may occur.
• the lower limit of the Ni content is 0.5%, preferably 1.5%, and the upper limit is 6.0%, preferably 5.5%.
• the amount of Ag exceeds 10%, Ag is an expensive material, so the material cost becomes too high and the economy is impaired.
• the lower limit of the amount of Ag is 0.05%, preferably 0.15%, and the upper limit is 10%, preferably 5.0%, more preferably 2.0%.
• the force that typically forms the balance with Cu and impurities If the range does not impair the characteristics of the alloy, a small amount of element such as Zr or Sn is added. ⁇ is acceptable.
• the effect of reducing the thermal stress of the case wall when brazing the intermediate metal layer 3 depends on the resistance (0.2% resistance) of the metal material (annealing material) forming the same layer, l It is known that LONZmm is 2 or less, preferably lOONZmm 2 or less. However, for both the Cu-Ni alloy and Cu-Ag alloy, the heat resistance of the annealed material is 45 NZmm 2 or more and lOONZmm 2 or less. In addition to resistance to heat, it also excels in reducing thermal stress.
• the brazing filler metal layer 4 is formed of a silver brazing alloy containing silver (Ag) as a main component.
• the content of Ag as the main component is preferably 70 to 90%.
• the melting point of the silver brazing alloy is preferably about 700 to 900 ° C.
• Specific examples of silver brazing alloys include Ag-Cu alloys such as 85% Ag-Cu alloys (melting point 7 80 ° C), Ag-Cu-Zn alloys, and Ag-Cu-Ni alloys whose melting points are within the above melting point range. Can be mentioned. Since the electronic component package is soldered to the substrate at a temperature of about 400 ° C. or lower, it is necessary that the welded brazing material layer is soft and does not deteriorate at that temperature. Silver brazing alloys with an Ag content of 70-90% It is preferred because it satisfies the temperature conditions and has good strength and corrosion resistance.
• the silver brazing alloy tends to generate voids at the interface during diffusion bonding of the intermediate metal layer and the brazing filler metal layer, as will be described later.
• the melting point is high, when the lid processed from the lid material 1 is brazed to the outer periphery of the opening of the case, the brazed portion of the lid must be heated to a high temperature.
• the average thickness of each layer is a force depending on the size of the opening of the case.
• the base material layer 2 has a thickness of about 30 to 200 ⁇ m, preferably 50 to about LOO ⁇ m.
• the intermediate metal layer 3 is about 10 to 200 m, preferably about 10 ⁇ m or more and less than about 100 ⁇ m, more preferably about 15 to 60 m. If the intermediate metal layer is less than about 10 m, the effect of reducing thermal stress is insufficient. On the other hand, if it exceeds about 200 m, the layer thickness is too thick, and the thermal deformation of the intermediate metal layer itself cannot be ignored. The effect of reducing thermal stress is deteriorated.
• the amount of plastic deformation of the intermediate metal layer 3 with respect to the thickness tb of the base material layer 2 can be sufficiently secured against the thermal stress generated by the expansion of the base material layer 2.
• the ratio tmZtb of the thickness tm of the intermediate metal layer 3 is preferably about 0.25 to 0.6.
• the brazing filler metal layer 4 may be about 5-50 / z m and the nickel-based metal layer 5 may be about 3-50 m.
• the total thickness of the cover material is about 50 to 150 m. In this case, the total thickness of the base material layer and the intermediate metal layer is 35 to 135 m. It is preferable to set the degree.
• the lid 1 is manufactured by the following process. Overlay the nickel-based metal sheet, which is the material of the nickel-based metal layer 5, on one surface of the base material sheet, which is the material of the base material layer 2, and the copper alloy sheet, which is the material of the intermediate metal layer 3, on the other surface. .
• the superposed polymer is passed through a pair of rolls and reduced at a reduction rate of about 70 to 80%, whereby each sheet is reduced and pressed, and a nickel-based metal layer and an intermediate layer are formed on both sides of the base material layer.
• An intermediate metal layer laminate in which the metal layer is pressed is obtained.
• the intermediate metal layer laminate can be further subjected to intermediate annealing at a temperature of about 950 to 1050 ° C. as necessary.
• a brazing filler metal sheet that is a material of the brazing filler metal layer 4 is superposed on the surface of the intermediate metal layer of the intermediate metal layer laminate.
• the superposed polymer is again passed through a pair of rolls, whereby a brazing filler metal pressure welded body in which the brazing filler metal layer is pressed against the surface of the intermediate metal layer is obtained. This process is called a pressure welding process.
• the brazing material pressure welded body is subjected to diffusion annealing to obtain a lid material 1 in which both layers are diffusion bonded without interposing a void between the intermediate metal layer and the brazing material layer as much as possible. This process is called a diffusion bonding process.
• the lid member 1 may be further subjected to finish rolling as necessary to adjust its plate thickness. The thickness of each layer after finish rolling is reduced to (1 ⁇ R) times the original layer thickness, where R is the rolling reduction ratio.
• a reduction ratio for obtaining the brazing filler metal layer pressed body is 50-80.
• the diffusion annealing temperature may be about 380 to 590 ° C.
• the diffusion annealing time is preferably 2 minutes or longer, more preferably 3 minutes or longer.
• the upper limit of annealing time is not specified, but considering productivity, it should be 10 minutes or less, preferably 5 minutes or less.
• the lid body 21 used for sealing the package case 31 is obtained by punching the lid material 1 into a predetermined size with a press.
• the same reference numerals are given and description thereof is omitted.
• This package includes a case 31 in which a storage space (concave portion) 33 for storing an electronic component P is opened on the upper surface, and a lid welded to the outer periphery of the opening of the case 31 by brazing With body 21.
• the case 31 includes a case body 32 having an insulating property, the storage space 33 having an opening on the upper surface, and formed of ceramics such as alumina and nitride nitride.
• a welding promoting layer 37 that promotes welding with the body is formed in a body. The welding promotion layer 37 is formed with the case body 32.
• a metallized layer 34 made of a refractory metal such as tungsten (W) or molybdenum (Mo), which is integrally fired, on which a nickel layer 35 and, if necessary, a gold layer 36 are formed. Yes.
• a refractory metal such as tungsten (W) or molybdenum (Mo)
• the brazing material layer 4 is applied to the outer periphery of the opening of the case 31 so as to close the opening of the case 31.
• the lid 21 is placed so as to be in contact, the brazing material layer 4 is melted in vacuum or in an inert gas, and the lid 21 is welded to the outer periphery of the opening of the case 31.
• the brazing material layer 4 is preferably melted by local heating using seam welding, electron beam welding, or the like. The seam welding is conducted while rolling a pair of electrode rollers along the two opposite ends of the lid 21 and mainly locally in the vicinity of the contact portion of the roller of the base material layer 2.
• the base material layer 2 is made of a 20 mm wide and 2.5 mm thick Fe-29% Ni-17% Co alloy (trade name Kovar), and the nickel-based metal layer 5 is made of 20 mm wide.
• Pure nickel (oxygen-free copper) or copper alloy (hereinafter collectively referred to as Table 1) with a width of 20 mm and a thickness of 1.36 mm as a material for the intermediate metal layer 3 is a nickel sheet with a pure N content of 0.23 mm thick.
• the roll was cold-rolled to obtain a three-layer pressed body having a thickness of 1 mm, in which adjacent materials were pressed together. Furthermore, this pressure-bonded body is subjected to diffusion annealing that is held at 800 to 1000 ° C for about 1 to 3 minutes, and three-layered Got the body.
• a brazing material sheet made of 85% Ag—15% Cu (melting point: 780 ° C) having a width of 20 mm and a thickness of 0.13 mm as a material of the brazing material layer 4 is superimposed on the copper material layer of the three-layer laminate. Then, the roll was cold-rolled at a reduction rate of 60% or more to obtain a four-layer pressed body in which the brazing filler metal layer was pressed against the copper layer of the three-layer laminate. The four-layer press-bonded body was subjected to diffusion annealing that was held at 500 to 600 ° C. for about 3 minutes, and then subjected to finish rolling to obtain a lid material having a thickness of 85 m and a four-layer laminate.
• a test piece having a width of 10 mm and a length of 50 mm was collected from each cover material thus produced, and flattened on a platen, and then the maximum heating temperature (under the degassing conditions ( 300 ° C) for 30 minutes, after cooling, place the bowed test piece on the surface plate again, and measure the maximum height (warpage amount) of the surface plate surface force with a non-contact laser displacement meter did.
• the results are shown in Table 1.
• a copper material sheet having the same component as that of the copper material forming the intermediate metal layer of each lid material is prepared, and a copper material plate that is pressed and annealed under the same production conditions as the lid material is produced, and then JISZ2201
• the test piece specified in JIS was collected and subjected to a tensile test according to the method specified in JISZ2241 to measure the resistance against the intermediate metal layer of the lid (stress when causing 0.2% permanent elongation). The results are also shown in Table 1.
• the cover material with the intermediate metal layer made of pure copper has a very large warping amount of 12 mm.
• the amount of warpage was significantly reduced in samples with 5% or more and Ag content of 0.05% or more, and the amount of warpage decreased as the amount of alloying elements increased.
• Ni amount is 12% in yield strength is unsuitable for relaxation of LlONZmm 2 super, and the thermal stress.
• the thermal conductivity is less than lOOWZm'K, and the brazeability deteriorates.
• Sample No. 2-4, 7 and 8 and warpage is greatly reduced, and in the intermediate metal layer resistant mosquitoes also lOONZmm less than 2, the thermal conductivity is also practical, suitable as a cover material It has a good nature.

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• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Engineering & Computer Science (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
• Pressure Welding/Diffusion-Bonding (AREA)

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• 2006
  • 2006-03-10 JP JP2007508103A patent/JP4986843B2/ja active Active
  • 2006-03-10 WO PCT/JP2006/304720 patent/WO2006098233A1/ja active Application Filing
  • 2006-03-10 KR KR1020077023075A patent/KR101212826B1/ko active IP Right Grant

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