WO2006083025A1 - Semiconducteur optique, materiau d’etancheite pour celui-ci et composition d’etancheite - Google Patents

Semiconducteur optique, materiau d’etancheite pour celui-ci et composition d’etancheite Download PDF

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Publication number
WO2006083025A1
WO2006083025A1 PCT/JP2006/302295 JP2006302295W WO2006083025A1 WO 2006083025 A1 WO2006083025 A1 WO 2006083025A1 JP 2006302295 W JP2006302295 W JP 2006302295W WO 2006083025 A1 WO2006083025 A1 WO 2006083025A1
Authority
WO
WIPO (PCT)
Prior art keywords
group
optical semiconductor
carbon atoms
composition
branched
Prior art date
Application number
PCT/JP2006/302295
Other languages
English (en)
Japanese (ja)
Inventor
Toshiyuki Akiike
Original Assignee
Jsr Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corporation filed Critical Jsr Corporation
Publication of WO2006083025A1 publication Critical patent/WO2006083025A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Silicon Polymers (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

L'invention décrit une composition destinée à l’encapsulation de semiconducteur optique contenant un polyorganosiloxane (A), de 100 à 1 000 parties en poids d’un composé époxy aliphatique ou alicyclique (B) pour 100 parties en poids du polyorganosiloxane (A) et un durcisseur anhydre à base d’acide carboxylique (C). La composition peut en outre contenir un accélérateur de durcissement (D). La composition destinée à l’encapsulation de semiconducteur optique est utile en tant que composant principal pour des matériaux d’étanchéité de semiconducteurs optiques qui peuvent être utilisés pour l’enrobage et permet de former un matériau d’étanchéité de semiconducteur optique qui est excellent de par sa transparence, sa résistance aux UV, sa résistance à la chaleur et sa résistance aux fissures pendant le cycle de fusion et de traitement thermique.
PCT/JP2006/302295 2005-02-04 2006-02-03 Semiconducteur optique, materiau d’etancheite pour celui-ci et composition d’etancheite WO2006083025A1 (fr)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2005-029398 2005-02-04
JP2005029398 2005-02-04
JP2005296471 2005-10-11
JP2005-296471 2005-10-11

Publications (1)

Publication Number Publication Date
WO2006083025A1 true WO2006083025A1 (fr) 2006-08-10

Family

ID=36777386

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2006/302295 WO2006083025A1 (fr) 2005-02-04 2006-02-03 Semiconducteur optique, materiau d’etancheite pour celui-ci et composition d’etancheite

Country Status (2)

Country Link
TW (1) TW200711060A (fr)
WO (1) WO2006083025A1 (fr)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019422A (ja) * 2006-06-16 2008-01-31 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
JP2009001752A (ja) * 2007-06-25 2009-01-08 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP2009091438A (ja) * 2007-10-05 2009-04-30 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
WO2011155583A1 (fr) * 2010-06-11 2011-12-15 日本化薬株式会社 Composition de résine durcissable et produit durci obtenu
KR101390087B1 (ko) 2006-06-16 2014-04-28 신에쓰 가가꾸 고교 가부시끼가이샤 에폭시ㆍ실리콘 혼성 수지 조성물 및 발광 반도체 장치

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20100126295A (ko) * 2008-01-08 2010-12-01 다우 코닝 도레이 캄파니 리미티드 실세스퀴옥산 수지

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287172A (ja) * 1992-04-03 1993-11-02 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JPH0725987A (ja) * 1993-07-14 1995-01-27 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物
JPH11209579A (ja) * 1998-01-26 1999-08-03 Matsushita Electric Works Ltd 封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05287172A (ja) * 1992-04-03 1993-11-02 Nippon Kayaku Co Ltd エポキシ樹脂組成物
JPH0725987A (ja) * 1993-07-14 1995-01-27 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物
JPH11209579A (ja) * 1998-01-26 1999-08-03 Matsushita Electric Works Ltd 封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019422A (ja) * 2006-06-16 2008-01-31 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
KR101390087B1 (ko) 2006-06-16 2014-04-28 신에쓰 가가꾸 고교 가부시끼가이샤 에폭시ㆍ실리콘 혼성 수지 조성물 및 발광 반도체 장치
JP2009001752A (ja) * 2007-06-25 2009-01-08 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP2009091438A (ja) * 2007-10-05 2009-04-30 Nitto Denko Corp 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
WO2011155583A1 (fr) * 2010-06-11 2011-12-15 日本化薬株式会社 Composition de résine durcissable et produit durci obtenu

Also Published As

Publication number Publication date
TW200711060A (en) 2007-03-16

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