TW200711060A - Optical semiconductor, sealer for the same and sealing composition - Google Patents

Optical semiconductor, sealer for the same and sealing composition

Info

Publication number
TW200711060A
TW200711060A TW095103803A TW95103803A TW200711060A TW 200711060 A TW200711060 A TW 200711060A TW 095103803 A TW095103803 A TW 095103803A TW 95103803 A TW95103803 A TW 95103803A TW 200711060 A TW200711060 A TW 200711060A
Authority
TW
Taiwan
Prior art keywords
optical semiconductor
composition
sealer
same
sealing composition
Prior art date
Application number
TW095103803A
Other languages
English (en)
Inventor
Toshiyuki Akiike
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Publication of TW200711060A publication Critical patent/TW200711060A/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/293—Organic, e.g. plastic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/22—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen
    • C08G77/24—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen and oxygen halogen-containing groups
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/52—Encapsulations
    • H01L33/56—Materials, e.g. epoxy or silicone resin
TW095103803A 2005-02-04 2006-02-03 Optical semiconductor, sealer for the same and sealing composition TW200711060A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005029398 2005-02-04
JP2005296471 2005-10-11

Publications (1)

Publication Number Publication Date
TW200711060A true TW200711060A (en) 2007-03-16

Family

ID=36777386

Family Applications (1)

Application Number Title Priority Date Filing Date
TW095103803A TW200711060A (en) 2005-02-04 2006-02-03 Optical semiconductor, sealer for the same and sealing composition

Country Status (2)

Country Link
TW (1) TW200711060A (zh)
WO (1) WO2006083025A1 (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460232B (zh) * 2008-01-08 2014-11-11 Dow Corning Toray Co Ltd 倍半矽氧烷樹脂

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008019422A (ja) * 2006-06-16 2008-01-31 Shin Etsu Chem Co Ltd エポキシ・シリコーン混成樹脂組成物及び発光半導体装置
KR101390087B1 (ko) 2006-06-16 2014-04-28 신에쓰 가가꾸 고교 가부시끼가이샤 에폭시ㆍ실리콘 혼성 수지 조성물 및 발광 반도체 장치
JP5224734B2 (ja) * 2007-06-25 2013-07-03 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP5132239B2 (ja) * 2007-10-05 2013-01-30 日東電工株式会社 光半導体素子封止用エポキシ樹脂組成物およびそれを用いた光半導体装置
JP5626856B2 (ja) * 2010-06-11 2014-11-19 日本化薬株式会社 硬化性樹脂組成物およびその硬化物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183474B2 (ja) * 1992-04-03 2001-07-09 日本化薬株式会社 エポキシ樹脂組成物
JPH0725987A (ja) * 1993-07-14 1995-01-27 Nitto Denko Corp 光半導体封止用エポキシ樹脂組成物
JP3391681B2 (ja) * 1998-01-26 2003-03-31 松下電工株式会社 光半導体封止用のエポキシ樹脂組成物および樹脂封止型光半導体装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI460232B (zh) * 2008-01-08 2014-11-11 Dow Corning Toray Co Ltd 倍半矽氧烷樹脂

Also Published As

Publication number Publication date
WO2006083025A1 (ja) 2006-08-10

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