WO2006064953A1 - 洗浄剤 - Google Patents
洗浄剤 Download PDFInfo
- Publication number
- WO2006064953A1 WO2006064953A1 PCT/JP2005/023419 JP2005023419W WO2006064953A1 WO 2006064953 A1 WO2006064953 A1 WO 2006064953A1 JP 2005023419 W JP2005023419 W JP 2005023419W WO 2006064953 A1 WO2006064953 A1 WO 2006064953A1
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- WO
- WIPO (PCT)
- Prior art keywords
- cleaning agent
- cleaning
- liquid crystal
- organic
- cleaned
- Prior art date
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 92
- 239000004973 liquid crystal related substance Substances 0.000 claims abstract description 61
- 239000000463 material Substances 0.000 claims abstract description 50
- 238000004140 cleaning Methods 0.000 claims abstract description 46
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 13
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 11
- 150000002596 lactones Chemical class 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 37
- 239000003599 detergent Substances 0.000 claims description 22
- 150000001875 compounds Chemical class 0.000 claims description 9
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 4
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 125000001501 propionyl group Chemical group O=C([*])C([H])([H])C([H])([H])[H] 0.000 claims description 2
- 239000001993 wax Substances 0.000 abstract description 17
- 235000012431 wafers Nutrition 0.000 description 28
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 26
- 229910052710 silicon Inorganic materials 0.000 description 26
- 239000010703 silicon Substances 0.000 description 26
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 24
- 229910052751 metal Inorganic materials 0.000 description 24
- 239000002184 metal Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 24
- -1 4-tert-butylphenyl Chemical group 0.000 description 17
- 210000002858 crystal cell Anatomy 0.000 description 16
- 239000010410 layer Substances 0.000 description 16
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 11
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 10
- 239000000758 substrate Substances 0.000 description 10
- 239000010408 film Substances 0.000 description 9
- RBTKNAXYKSUFRK-UHFFFAOYSA-N heliogen blue Chemical compound [Cu].[N-]1C2=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=NC([N-]1)=C(C=CC=C3)C3=C1N=C([N-]1)C3=CC=CC=C3C1=N2 RBTKNAXYKSUFRK-UHFFFAOYSA-N 0.000 description 9
- 238000005406 washing Methods 0.000 description 9
- 238000001514 detection method Methods 0.000 description 8
- 229920002120 photoresistant polymer Polymers 0.000 description 8
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- 239000000203 mixture Substances 0.000 description 7
- IBHBKWKFFTZAHE-UHFFFAOYSA-N n-[4-[4-(n-naphthalen-1-ylanilino)phenyl]phenyl]-n-phenylnaphthalen-1-amine Chemical compound C1=CC=CC=C1N(C=1C2=CC=CC=C2C=CC=1)C1=CC=C(C=2C=CC(=CC=2)N(C=2C=CC=CC=2)C=2C3=CC=CC=C3C=CC=2)C=C1 IBHBKWKFFTZAHE-UHFFFAOYSA-N 0.000 description 7
- 238000012545 processing Methods 0.000 description 7
- 239000000243 solution Substances 0.000 description 7
- HEDRZPFGACZZDS-UHFFFAOYSA-N Chloroform Chemical compound ClC(Cl)Cl HEDRZPFGACZZDS-UHFFFAOYSA-N 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 6
- 238000005520 cutting process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000012044 organic layer Substances 0.000 description 6
- 239000003960 organic solvent Substances 0.000 description 6
- 239000000956 alloy Substances 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 5
- HFACYLZERDEVSX-UHFFFAOYSA-N benzidine Chemical compound C1=CC(N)=CC=C1C1=CC=C(N)C=C1 HFACYLZERDEVSX-UHFFFAOYSA-N 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 5
- 239000002904 solvent Substances 0.000 description 5
- 125000001637 1-naphthyl group Chemical group [H]C1=C([H])C([H])=C2C(*)=C([H])C([H])=C([H])C2=C1[H] 0.000 description 4
- QCAHUFWKIQLBNB-UHFFFAOYSA-N 3-(3-methoxypropoxy)propan-1-ol Chemical compound COCCCOCCCO QCAHUFWKIQLBNB-UHFFFAOYSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 230000007797 corrosion Effects 0.000 description 4
- 238000005260 corrosion Methods 0.000 description 4
- 238000011086 high cleaning Methods 0.000 description 4
- 150000002739 metals Chemical class 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 239000012188 paraffin wax Substances 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000007738 vacuum evaporation Methods 0.000 description 4
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- WGKZYJXRTIPTCV-UHFFFAOYSA-N 2-butoxypropan-1-ol Chemical compound CCCCOC(C)CO WGKZYJXRTIPTCV-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LCGLNKUTAGEVQW-UHFFFAOYSA-N Dimethyl ether Chemical compound COC LCGLNKUTAGEVQW-UHFFFAOYSA-N 0.000 description 3
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 3
- 230000002411 adverse Effects 0.000 description 3
- 150000001412 amines Chemical class 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 239000011368 organic material Substances 0.000 description 3
- 238000000059 patterning Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 2
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 241000284156 Clerodendrum quadriloculare Species 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 150000005676 cyclic carbonates Chemical class 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005525 hole transport Effects 0.000 description 2
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- XSCHRSMBECNVNS-UHFFFAOYSA-N quinoxaline Chemical compound N1=CC=NC2=CC=CC=C21 XSCHRSMBECNVNS-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000001228 spectrum Methods 0.000 description 2
- 239000003381 stabilizer Substances 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- LEEANUDEDHYDTG-UHFFFAOYSA-N 1,2-dimethoxypropane Chemical compound COCC(C)OC LEEANUDEDHYDTG-UHFFFAOYSA-N 0.000 description 1
- ROZZAWZLZXTPHU-UHFFFAOYSA-N 1,2-diphenyltetracene Chemical compound C1=CC=CC=C1C1=CC=C(C=C2C(C=C3C=CC=CC3=C2)=C2)C2=C1C1=CC=CC=C1 ROZZAWZLZXTPHU-UHFFFAOYSA-N 0.000 description 1
- JKEHLQXXZMANPK-UHFFFAOYSA-N 1-[1-(1-propoxypropan-2-yloxy)propan-2-yloxy]propan-2-ol Chemical compound CCCOCC(C)OCC(C)OCC(C)O JKEHLQXXZMANPK-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- VZSRBBMJRBPUNF-UHFFFAOYSA-N 2-(2,3-dihydro-1H-inden-2-ylamino)-N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]pyrimidine-5-carboxamide Chemical compound C1C(CC2=CC=CC=C12)NC1=NC=C(C=N1)C(=O)NCCC(N1CC2=C(CC1)NN=N2)=O VZSRBBMJRBPUNF-UHFFFAOYSA-N 0.000 description 1
- DJCYDDALXPHSHR-UHFFFAOYSA-N 2-(2-propoxyethoxy)ethanol Chemical compound CCCOCCOCCO DJCYDDALXPHSHR-UHFFFAOYSA-N 0.000 description 1
- XYVAYAJYLWYJJN-UHFFFAOYSA-N 2-(2-propoxypropoxy)propan-1-ol Chemical compound CCCOC(C)COC(C)CO XYVAYAJYLWYJJN-UHFFFAOYSA-N 0.000 description 1
- JDSQBDGCMUXRBM-UHFFFAOYSA-N 2-[2-(2-butoxypropoxy)propoxy]propan-1-ol Chemical compound CCCCOC(C)COC(C)COC(C)CO JDSQBDGCMUXRBM-UHFFFAOYSA-N 0.000 description 1
- WAEVWDZKMBQDEJ-UHFFFAOYSA-N 2-[2-(2-methoxypropoxy)propoxy]propan-1-ol Chemical compound COC(C)COC(C)COC(C)CO WAEVWDZKMBQDEJ-UHFFFAOYSA-N 0.000 description 1
- KCBPVRDDYVJQHA-UHFFFAOYSA-N 2-[2-(2-propoxyethoxy)ethoxy]ethanol Chemical compound CCCOCCOCCOCCO KCBPVRDDYVJQHA-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- KBGLIBWPBYLNNK-UHFFFAOYSA-N 2-ethoxypropyl acetate Chemical compound CCOC(C)COC(C)=O KBGLIBWPBYLNNK-UHFFFAOYSA-N 0.000 description 1
- BTZVKSVLFLRBRE-UHFFFAOYSA-N 2-methoxypropyl acetate Chemical compound COC(C)COC(C)=O BTZVKSVLFLRBRE-UHFFFAOYSA-N 0.000 description 1
- IDEOPBXRUBNYBN-UHFFFAOYSA-N 2-methylbutane-2,3-diol Chemical compound CC(O)C(C)(C)O IDEOPBXRUBNYBN-UHFFFAOYSA-N 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- PSKIVCBTSGNKBB-UHFFFAOYSA-N 2-propoxypropan-1-ol Chemical compound CCCOC(C)CO PSKIVCBTSGNKBB-UHFFFAOYSA-N 0.000 description 1
- DGWWNMWYNUWPBC-UHFFFAOYSA-N 3,4-dihydroxy-3-methyloxolane-2,5-dione Chemical compound CC1(C(=O)OC(C1O)=O)O DGWWNMWYNUWPBC-UHFFFAOYSA-N 0.000 description 1
- BOGVTNYNTGOONP-UHFFFAOYSA-N 3,4-dihydroxyoxolane-2,5-dione Chemical compound OC1C(O)C(=O)OC1=O BOGVTNYNTGOONP-UHFFFAOYSA-N 0.000 description 1
- YLZOPXRUQYQQID-UHFFFAOYSA-N 3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)-1-[4-[2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidin-5-yl]piperazin-1-yl]propan-1-one Chemical compound N1N=NC=2CN(CCC=21)CCC(=O)N1CCN(CC1)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F YLZOPXRUQYQQID-UHFFFAOYSA-N 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- LDMRLRNXHLPZJN-UHFFFAOYSA-N 3-propoxypropan-1-ol Chemical compound CCCOCCCO LDMRLRNXHLPZJN-UHFFFAOYSA-N 0.000 description 1
- JFMGYULNQJPJCY-UHFFFAOYSA-N 4-(hydroxymethyl)-1,3-dioxolan-2-one Chemical compound OCC1COC(=O)O1 JFMGYULNQJPJCY-UHFFFAOYSA-N 0.000 description 1
- OYUKRQOCPFZNHR-UHFFFAOYSA-N 4-methylquinolin-8-ol Chemical compound C1=CC=C2C(C)=CC=NC2=C1O OYUKRQOCPFZNHR-UHFFFAOYSA-N 0.000 description 1
- XOBOCRSRGDBOGH-UHFFFAOYSA-N 5-phenylnonan-5-ol Chemical compound CCCCC(O)(CCCC)C1=CC=CC=C1 XOBOCRSRGDBOGH-UHFFFAOYSA-N 0.000 description 1
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- LCMKSBFKXKQBES-UHFFFAOYSA-N C(O)CN.N1=CN=C2N=CNC2=C1 Chemical compound C(O)CN.N1=CN=C2N=CNC2=C1 LCMKSBFKXKQBES-UHFFFAOYSA-N 0.000 description 1
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 1
- 101000962041 Homo sapiens Neurobeachin Proteins 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- 102100039234 Neurobeachin Human genes 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-N Propionic acid Chemical class CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 1
- MLHOXUWWKVQEJB-UHFFFAOYSA-N Propyleneglycol diacetate Chemical compound CC(=O)OC(C)COC(C)=O MLHOXUWWKVQEJB-UHFFFAOYSA-N 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- 229920001800 Shellac Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- NBZANZVJRKXVBH-GYDPHNCVSA-N alpha-Cryptoxanthin Natural products O[C@H]1CC(C)(C)C(/C=C/C(=C\C=C\C(=C/C=C/C=C(\C=C\C=C(/C=C/[C@H]2C(C)=CCCC2(C)C)\C)/C)\C)/C)=C(C)C1 NBZANZVJRKXVBH-GYDPHNCVSA-N 0.000 description 1
- XEPMXWGXLQIFJN-UHFFFAOYSA-K aluminum;2-carboxyquinolin-8-olate Chemical compound [Al+3].C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1.C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1.C1=C(C([O-])=O)N=C2C(O)=CC=CC2=C1 XEPMXWGXLQIFJN-UHFFFAOYSA-K 0.000 description 1
- GONYPVVHIATNEG-UHFFFAOYSA-K aluminum;quinoline-8-carboxylate Chemical compound [Al+3].C1=CN=C2C(C(=O)[O-])=CC=CC2=C1.C1=CN=C2C(C(=O)[O-])=CC=CC2=C1.C1=CN=C2C(C(=O)[O-])=CC=CC2=C1 GONYPVVHIATNEG-UHFFFAOYSA-K 0.000 description 1
- 150000001414 amino alcohols Chemical class 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 235000013871 bee wax Nutrition 0.000 description 1
- 239000012166 beeswax Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 125000000319 biphenyl-4-yl group Chemical group [H]C1=C([H])C([H])=C([H])C([H])=C1C1=C([H])C([H])=C([*])C([H])=C1[H] 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- BKMIWBZIQAAZBD-UHFFFAOYSA-N diindenoperylene Chemical compound C12=C3C4=CC=C2C2=CC=CC=C2C1=CC=C3C1=CC=C2C3=CC=CC=C3C3=CC=C4C1=C32 BKMIWBZIQAAZBD-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- POLCUAVZOMRGSN-UHFFFAOYSA-N dipropyl ether Chemical compound CCCOCCC POLCUAVZOMRGSN-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000008014 freezing Effects 0.000 description 1
- 238000007710 freezing Methods 0.000 description 1
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 230000000640 hydroxylating effect Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000005468 ion implantation Methods 0.000 description 1
- 230000007794 irritation Effects 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 231100000053 low toxicity Toxicity 0.000 description 1
- 229910021645 metal ion Inorganic materials 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 239000000025 natural resin Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 125000002080 perylenyl group Chemical group C1(=CC=C2C=CC=C3C4=CC=CC5=CC=CC(C1=C23)=C45)* 0.000 description 1
- CSHWQDPOILHKBI-UHFFFAOYSA-N peryrene Natural products C1=CC(C2=CC=CC=3C2=C2C=CC=3)=C3C2=CC=CC3=C1 CSHWQDPOILHKBI-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- YNPNZTXNASCQKK-UHFFFAOYSA-N phenanthrene Chemical compound C1=CC=C2C3=CC=CC=C3C=CC2=C1 YNPNZTXNASCQKK-UHFFFAOYSA-N 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000001020 plasma etching Methods 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 230000010287 polarization Effects 0.000 description 1
- 229920000767 polyaniline Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920000259 polyoxyethylene lauryl ether Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 150000004040 pyrrolidinones Chemical class 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
- ZLGIYFNHBLSMPS-ATJNOEHPSA-N shellac Chemical compound OCCCCCC(O)C(O)CCCCCCCC(O)=O.C1C23[C@H](C(O)=O)CCC2[C@](C)(CO)[C@@H]1C(C(O)=O)=C[C@@H]3O ZLGIYFNHBLSMPS-ATJNOEHPSA-N 0.000 description 1
- 239000004208 shellac Substances 0.000 description 1
- 235000013874 shellac Nutrition 0.000 description 1
- 229940113147 shellac Drugs 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 230000004083 survival effect Effects 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- JLGLQAWTXXGVEM-UHFFFAOYSA-N triethylene glycol monomethyl ether Chemical compound COCCOCCOCCO JLGLQAWTXXGVEM-UHFFFAOYSA-N 0.000 description 1
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 1
- PWYVVBKROXXHEB-UHFFFAOYSA-M trimethyl-[3-(1-methyl-2,3,4,5-tetraphenylsilol-1-yl)propyl]azanium;iodide Chemical compound [I-].C[N+](C)(C)CCC[Si]1(C)C(C=2C=CC=CC=2)=C(C=2C=CC=CC=2)C(C=2C=CC=CC=2)=C1C1=CC=CC=C1 PWYVVBKROXXHEB-UHFFFAOYSA-M 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/26—Organic compounds containing oxygen
- C11D7/267—Heterocyclic compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K77/00—Constructional details of devices covered by this subclass and not covered by groups H10K10/80, H10K30/80, H10K50/80 or H10K59/80
- H10K77/10—Substrates, e.g. flexible substrates
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention relates to cleaning agents. More specifically, the present invention relates to a cleaning agent used to wash an organic electroluminescent material, a photosensitive resin, liquid crystal, wax and the like. Bright
- organic EL elements Organic electoride luminescent elements
- an organic EL element is obtained by laminating an anode electrode (ITO), a hole transport layer, an organic layer (light emitting layer), an electron transport layer, and a cathode electrode in this order on a transparent substrate such as a glass plate, and sealing cans on the surface. Is arranged.
- the organic layer (light emitting layer), the hole injection layer, the hole transport layer, and the electron transport layer (hereinafter, also simply referred to as an organic layer) contain an organic EL element material, and copper phthalocyanine (an organic EL element material) C u P c), starburst (star-burst), bis (N- (1-naphthyl) -N-phenyl) benzidine, beryllium-monoquinoline complex (B eq 2), 4-methyl-18-hydroxyquinoline, 3 — (4-biphenyl) 1-1 phenyl 5 — (4-tert-butylphenyl) — 1, 2, 4 1 low molecular weight materials such as triazole molecules, poly (p-phenylvinylene), Polymeric materials such as polyaniline are known.
- the organic layer and the like are formed by forming the organic EL device material on the anode electrode layer and, if necessary, the hole injection layer. It is carried out by vacuum evaporation.
- vacuum evaporation When forming an organic layer or the like by vacuum evaporation, it is necessary to perform patterning for each pixel in order to display each color or to control unnecessary light emission. And, a metal mask having a slit is used for this patterning (Japanese Patent Laid-Open No. 20). 03-332057 and JP-A 2003-297566).
- the organic EL element material adheres to the metal mask surface. If the metal mask to which the organic EL element material is attached is continued to be used, the metal mask itself may be deformed or the slit may be blocked by the deposited organic EL element material, so that high-precision patterning can not be performed. For this reason, in order to use a metal mask repeatedly, it is necessary to wash it regularly and to remove the organic EL element material adhering to the surface. At this time, as the cleaning agent and the cleaning method, manual wiping with an organic solvent such as acetone, chloroform, isopropyl alcohol, methylene chloride or the like, washing with high pressure using a supercritical fluid, etc. Are known (refer to Japanese Patent Application Laid-Open No. 2003-305421).
- the method using the above-mentioned supercritical fluid has the advantage that the organic EL device material can be recycled, but not only the pressure device is required, but the method using the above-mentioned supercritical fluid is related to cleaning of the metal mask to which the organic EL device material is attached. There are problems in terms of cleaning efficiency and operability.
- cleaning of the device or article to which the organic EL element material is attached using the cleaning agent can be assembled as an automatic system, and it can be understood from the fact that it is adopted in many fields, industrially Is an advantageous method.
- cleaning with organic solvents such as acetone, chloroform, isopropyl alcohol, and methylene chloride is a problem from the viewpoint of environmental problems and safety to the human body. Therefore, when cleaning an apparatus or article to which an organic EL element material has been attached using a cleaning agent, the cleaning may be performed without using an organic solvent such as acetone, chloroform, isopropyl alcohol or methylene chloride which adversely affects the environment or human body. And, it is necessary to find a cleaning agent with high cleaning power for organic EL device materials.
- the magnetic head element or a liquid crystal panel elements, semiconductor devices such as IC and LS I are formed conductive metal thin film or S I_ ⁇ 2 film on a plate, registration on an insulating film such as S i N film
- the resist pattern is applied, exposed to light through a mask on which the desired pattern is formed, and developed to form a resist pattern on the desired site, and then etching and other processing is performed using this resist pattern as a mask. , Then remove the resist And have been implemented.
- an alkaline cleaning agent containing a water-soluble organic amine as an essential component As a cleaning agent for removing the above-mentioned resist, an alkaline cleaning agent containing a water-soluble organic amine as an essential component has hitherto been used.
- a cleaning agent include (a) monoethanolamine, amines such as ethylenediamine, (b) polar solvents such as dimethyl sulfoxide, N-methyl-2-pyrrolidone, and (c) surfactants.
- Resist stripping solutions are known (see Japanese Patent Application Laid-Open No. 6-2313), and the cleaning remover exhibits excellent resist stripping properties.
- a cleaning agent may be used at a high temperature of, for example, 80 ° C.
- a resist removing agent which does not contain a water-soluble organic amine as an essential component is also known.
- a cleaning agent for example, 50 to 50% by mass of dimethyl sulfoxide and 5 to 50% by mass of alcohols are contained.
- Resist remover see JP-A-63-16347) or a resist remover containing dimethylsulfoxide, an amino alcohol, and water (JP-A-7-69619). See the official gazette).
- the former resist cleaning agent has problems such as low flash point and restricted washing conditions and handling.
- the latter resist remover contains water, and therefore, when a conductive film is formed on a substrate as a material to be cleaned, the conductive film may be corroded to cause disconnection. There is a problem of being there.
- An object of the present invention is to provide a cleaning agent having high detergency and having less adverse effects on human bodies and the environment.
- An object of the present invention is to provide a cleaning agent capable of forming an automatic system, having a high cleaning power to an organic EL element material, and having less adverse effects on the human body and the environment.
- Still another object of the present invention is to preferably remove the photoresist remaining on the work surface after one photolithography step in the manufacture of a magnetic head element, the manufacture of a liquid crystal panel element, the manufacture of a semiconductor element, etc.
- An object of the present invention is to provide a cleaning agent which does not cause corrosion of a conductive film, does not precipitate insolubles even when used at high temperature, and has high safety and resist removal.
- R 1 is an alkylene group having 3 to 6 carbon atoms
- the cleaning agent of the present invention comprises a lactone represented by the above formula (1).
- R 1 is an alkylene group having 3 to 6 carbon atoms.
- the alkylene group may be linear or branched and, for example, —CH 2 CH (CH 3 ) —, — (CH 2 ) 3 —, one (CH 2 ) 4 —, — ( CH 2 ) 5 —, mono (CH 2 ) 6 ⁇ and —CH 2 CH 2 CH (CH 2 CH 2 CH 3 ) — and the like can be mentioned.
- lactones represented by the above-mentioned formula (1) include ⁇ -norerolactone, ⁇ -force prolactone, phenanthrolactone and 7-force prilolactone, ⁇ -propyl- ⁇ -parellolactone and the like.
- ⁇ -strong prolactone is preferred because of its detergency, safety and easy availability.
- lactones can be used alone or in combination of two or more.
- lactones can also be used as a mixture with other solvents that are soluble in lactones, such as propionates, glycol ethers, paraffins, isoparaffins, hydrocarbons such as naphthenes, dimethyl sulfoxide or the like.
- R 2 is an alkylene group having 3 to 6 carbon atoms
- the compounds represented by are preferably used.
- the C 3 -C 6 alkylene group of R 2 may be linear or branched.
- the same group as R1 in Formula (1) can be illustrated.
- cyclic carbonates for example, propylene carbonate, tartaric anhydride, methyl tartaric anhydride, glycerol 1, 2-carbonate and the like can be mentioned.
- R 3 and R 5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, a phenyl group, an acetyl group or a propionyl group
- 4 is an alkylene group of 2 to 4 carbon atoms and n is 1 to 3.
- R 3 and R 5 are not hydrogen atoms in the same ⁇ I temple,
- the compounds represented by are preferably used.
- the alkyl group having 1 to 4 carbon atoms of R 3 and R 5 and the alkylene group having 2 to 4 carbon atoms of R 4 may be either linear or branched. Good.
- the alkyl group having 1 to 4 carbon atoms include methyl, acetyl, n-propyl, iso-propyl, n-butyl, tert-butyl, sec-butyl and the like.
- the alkylene group having 2 to 4 carbon atoms include ethylene, trimethylene, propylene and tetramethylene.
- glycol ethers represented by the above formula (3) include monopropyl glycol monomethyl ether, dipropylene glycol monomethyl ether, tripropylenediaryl monomethyl ether, monopropylene glycol monopropyl ether, dipropylene glycol monopropyl ether, Triply propylene glycol monopropyl ether, monopropylene glycol monobutyl ether, diprolendaryl monobutyl ether, tripropylene glycol monobutyl ether, monopropylene glycol monobutyl ether, mono propylene glycol monomethyl ether acetate, mono Propylene glycol monoethyl ether acetate, monoethylene diaryl monomethyl ether, Polyethylene glycol monomethyl ether, triethylene glycol monomethyl ether, monoethylene glycol monopropyl ether, diethylene glycol monopropyl ether, triethylene glycol monopropyl ether, mono ethylene glycol monobutyl ether, acetylene glycol monobutyl ether
- glycol dimethyl ether examples thereof include glycol dimethyl ether, monopropylene glycol diacetate, acetylene glycol dimethyl ether, diethylene glycol jetyl ether and the like. These glycol ethers may be used alone or in combination of two or more different types.
- dipropylene glycol dimethyl ether triethylene glycol dimethyl ether, dipropylene glycol monomethyl ether, tripropylene glycol monomethyl ether, dipropylene glycol mono ether, among them, from the viewpoints of high detergency and low toxicity and physical properties easy to handle.
- Propyl ether, tripropylene glycol monopropyl ether, monopropylene glycol monobutyl ether, dipropylene dicaryl monobutyl ether and tripropylene dicaryl monobutyl ether are preferred.
- the above other solvent is preferably 80% by weight or less, more preferably 70% by weight or less, still more preferably 50% by weight or less, particularly preferably 30% by weight or less based on the cleaning agent of the present invention. It can be contained below.
- Dimethyl sulfoxide as the other solvent mentioned above has a relatively high freezing point of 18.4 ° C and it may be difficult to use depending on the operating atmosphere temperature, but it is difficult to use it in combination with lactone. It has the advantages of being easy to handle, easy to handle, less harmful to the human body, and less flammable hazards. That is, it exhibits excellent removal performance with respect to organic EL materials attached to the mask, crucible, and vacuum evaporation equipment used in manufacturing displays using organic EL materials, for example, in terms of cleaning power, and removal of resists. Performance is maintained when used at high temperatures and does not corrode conductive films.
- Dimethyl sulfoxide is preferably used at 40 to 80% by weight, more preferably 40 to 70% by weight, based on the detergent of the present invention.
- the other solvent other than dimethylsulfoxide is preferably 0.1 to 20% by weight, more preferably 0.2 to 20% by weight based on the detergent. It is used at 1 to 10% by weight.
- the cleaning agent of the present invention preferably contains as little impurities as possible.
- the problem is that water corrodes metals when cleaning metal wiring such as lead wires and objects having metal patterns on the surface.
- the amount of water is preferably at most 1% by mass, particularly preferably at most 0.5% by mass.
- the content of the metal ion or the anion is preferably 100 ppb or less on a mass basis of the cleaning agent.
- the cleaning agent of the present invention may, if necessary, contain various stabilizing agents such as known hydroxylating agents such as butyl hydroxyl and dibutyl hydroxyl toluene.
- the content of the stabilizer component is preferably 0 to 1000 ppm, particularly preferably 0 to 100 ppm, based on the total weight of the detergent.
- the cleaning agent of the present invention can be advantageously used, for example, for cleaning an organic electroluminescent material, a photosensitive resin, a liquid crystal or a wax.
- the organic elector luminescent material means an organic material used for producing an organic EL display.
- an organic material there can be mentioned, for example, a compound used for forming a hole injecting and transporting layer, a light emitting layer and an electron injecting and transporting layer.
- the organic EL material used for the hole injection transport layer include bis (N- (1-naphthyl) mono-N-phenyl;! /) Benzidine, bis (N-phenyl-1-N-trilyle) benzidine, oligoamine, spiroamine, etc. Can be mentioned.
- organic EL material used for the light emitting layer for example, beryllium-quinoline complex (B eq 2), 4-methyl-8-hydroxyquinoline, N-methylquinaxone, perylene, diphenyl naphthacene, periflanthene, etc. may be mentioned.
- organic material used for the electron injection layer include 3-(4-biphenyl)-14-phenyl 5- (4- tert-butylphenyl) 1, 2, 4-triazole, phenanthrin-based compounds, and silole-based compounds.
- Compounds, perfluoro-based compounds, quinoxaline-based compounds and the like can be mentioned.
- the object to be cleaned is not particularly limited as long as it is a device or an article to which these organic EL materials are attached.
- a vacuum deposition device used in manufacturing a display using an organic EL material, an organic EL material on a substrate A metal mask used when depositing, a crucible for heating and melting an organic EL material, and the like can be mentioned.
- a vacuum evaporation apparatus is an apparatus for attaching an organic EL material to a substrate in a vacuum, and a resistance heating type, an electronic beam type, a high frequency induction type, a complete set of lasers, etc., depending on the method of heating and melting. There is no particular limitation.
- the method is not particularly limited, and can be carried out in the same manner as in the case of using a conventional cleaning agent.
- a cleaning tank to prevent the leakage of the cleaning solution is provided outside, the cleaning agent of the present invention is stored, and the metal mask is immersed to remove the adhered organic EL material.
- the organic EL material may be wiped off with a cloth impregnated with the cleaning agent of the present invention. In the former case, cleaning may be promoted by heating or ultrasonic waves.
- the material to be washed may be rinsed with a highly volatile organic solvent such as isopropyl alcohol or hydrofluoroether, or the like, or a drying line such as drying air may be provided to perform drying after washing. May be
- a photoresist As a photosensitive material, a photoresist can be mentioned, for example. In particular, it is most effective for positive photoresists for g-line, i-line and excimer light.
- the resin include nopolac resin and polyhydroxystyrene resin.
- the cleaning agents of the present invention are usually used in removing these photoresists developed on a substrate.
- the effect is most remarkably exhibited when it is applied to a substrate which has been subjected to a dry etching such as reactive ion etching after the development and a treatment such as an ion implantation treatment.
- a silicon wafer but are not limited especially as a substrate, an insulating such S I_ ⁇ 2 on the surface Ji ⁇ Ya A and C u, conductive film such as S i and alloys are formed Glass, etc. are generally used.
- the cleaning agent of the present invention When such an object to be cleaned is cleaned using the cleaning agent of the present invention, the same procedure as in the case of using a conventional cleaning agent is performed except that the present invention is used as the cleaning agent. be able to. For example, by providing a cleaning tank that prevents the cleaning liquid from leaking outside, A bright cleaning agent may be stored, the object to be cleaned may be immersed, and the deposited resist may be removed. Cleaning may be promoted by heating or ultrasonic waves at the time of removal.
- the cleaning agent of the present invention is effective even when used at room temperature, but can be further enhanced when used after heating. In general, it is preferable to use at a temperature of 20 to 95 ° C. After the resist has been washed and removed, if necessary, a rinsing process such as rinsing with isopropyl alcohol (IPA) vapor is performed, and then the object to be cleaned is dried.
- IPA isopropyl alcohol
- An object to be cleaned having a liquid crystal attached thereto, such as a liquid crystal cell and a liquid crystal panel can be similarly cleaned using the cleaning agent of the present invention.
- a region (hollow portion) in which liquid crystal is sealed is referred to as a liquid crystal cell, which includes such a liquid crystal cell as a part of its configuration, for example, a frame region where wiring and terminals are provided Is called the liquid crystal panel to distinguish the two.
- a liquid crystal cell which includes such a liquid crystal cell as a part of its configuration, for example, a frame region where wiring and terminals are provided Is called the liquid crystal panel to distinguish the two.
- those that correspond to the liquid crystal panel in the present invention may be simply referred to as a liquid crystal cell without distinction between the two.
- the liquid crystal attached to the liquid crystal panel having the liquid crystal cell and the exposed conductive member made of an amphoteric metal or an alloy containing an amphoteric metal can be removed.
- the liquid crystal is not particularly limited, and examples thereof include publicly known ones such as S TN liquid crystal and TN liquid crystal.
- the amphoteric metal means at least one metal selected from the group consisting of A 1, Z n, P b and S n.
- the alloy containing the amphoteric metal is not particularly limited as long as it is an alloy of these amphoteric metals and other metals, and examples thereof include solder alloys containing these amphoteric metals.
- the conductive member means a wire, an electrode, a terminal, an electrode, a solder layer formed on the surface of the terminal, and the like.
- the cleaning agent of the present invention has not only the liquid crystal attached to a normal liquid crystal cell but also the gap width (w) is 5 / m or less and the depth (gap depth: d) Liquid crystal attached to a liquid crystal cell having a gap portion (hereinafter also referred to as a specific gap portion) having a width (w) ratio (w / d) of 10 or less, in particular a gap between substrates of 5 m or less, and
- the present invention can be applied to the removal of liquid crystal attached to the gap of a liquid crystal panel with a metal member, and is particularly suitably used to remove liquid crystal attached to a liquid crystal panel with an amphoteric metal member having a specific gap portion.
- the method of removing the liquid crystal adhering to the liquid crystal cell or liquid crystal panel is not particularly limited except that the specific cleaning agent described above is used as the cleaning agent.
- the liquid crystal panel is immersed in the cleaning agent and irradiated with ultrasonic waves.
- a publicly known cleaning method such as a method, a method of immersing the liquid crystal panel in a cleaning agent having a jet flow or the like, a method of spraying a cleaning agent onto the liquid crystal panel by a spray or the like may be employed without any limitation.
- the liquid crystal cell or the liquid crystal panel may be dried without being rinsed after the cleaning.
- a rinse solution consisting of an organic solvent in which the detergent is dissolved, or a fresh detergent having the same composition as the detergent.
- the amphoteric metal member When water is used as the rinse solution, the amphoteric metal member may be corroded, and when an organic solvent other than the above rinse solution is used as the rinse solution, the rinse efficiency is lowered, and a large amount of rinse solution is required. Do.
- the cleaning agent of the present invention can be used to wash the object to which the wax is attached.
- the wax to be cleaned means a wax used as a temporary tacking adhesive for processing, and more specifically, natural resins such as shellac, beeswax and rosin, thermoplastic resins, petroleum-based waxes Etc.
- the cleaning agent of the present invention has a high detergency to the wax
- the method for producing an article having such a processing step and separation step that is, a fixing step for fixing the object to be processed with a wax, holding A process step of cutting, cutting, polishing, etc. the workpiece fixed on a table, and a separation step of separating the processed product and the holding table by removing the cake with a cleaning agent It is suitably used as the cleaning agent in the manufacturing method.
- the article to be processed in the above manufacturing method is a process such as cutting, cutting or polishing
- An optical article such as an optical lens or prism made of a translucent material such as glass or quartz; an article to be a component thereof; silicon substrate, ceramic substrate, quartz oscillator Including the raw materials and parts of electronic products such as.
- the material is sliced to a predetermined thickness, and then a plurality of sliced pieces are joined together using wax,
- the cleaning agent of the present invention can be suitably used when separating the bonded articles after etching.
- the articles after being processed into the cleaning agent introduced into the cleaning tank It may be cleaned by dipping it in a state of being joined to a table or another article, and applying ultrasonic waves as needed.
- the cleaning agent of the present invention has a very high detergency to the wax, so that both can be separated in a short time.
- the cleaning agent of the present invention is not limited to use in manufacturing optical articles and electronic parts, and is fixed to a jig (jig) with a wax, for example, and then polished. Cleaning after polishing of mechanical parts, It can also be suitably used as a cleaning agent for removing similar contaminants such as resin coating masks and cleaning of jigs.
- the organic EL material bis (N- (1-naphthyl) mono-N-phenyl is prepared to be 500 nm thick on a 1 cm x 2 cm silicon wafer A benzidine ( ⁇ -NPD) (manufactured by Dojin Chemical Co., Ltd.) was vacuum deposited.
- ⁇ -NPD benzidine
- the silicon wafer on which the organic EL material was deposited was immersed in 10 O mL of ⁇ -prolactone at room temperature for 30 seconds and washed. After washing, the silicon wafer was immersed in 100 mL of isopropyl alcohol at room temperature for 30 seconds to rinse.
- the peak area at 1,600 cm- 1 was quantified by the transmission method using an infrared spectrophotometer (Perkin Elmer One: Spectrum One).
- the peak area before cleaning is 100% and the peak area of the silicon wafer on which the organic EL material is not deposited is 0%, the ⁇ -NPD residual rate on the cleaned and rinsed silicon wafer is 3 It was less than% (less than the detection limit).
- Example 6 is similar to Example 1 except that instead of ⁇ -force prolactone in Example 1, a detergent in which 1 volume of dimethyl propylene glycol is mixed with 1 volume of £ pro-lactone is used.
- a detergent in which 1 volume of dimethyl propylene glycol is mixed with 1 volume of £ pro-lactone is used.
- Example 2 The same method as in Example 1 except that instead of the ⁇ -force prolactone of Example 1, a cleaning agent in which 4 volumes of propylene carbonate were mixed with 6 volumes of ⁇ -force prolactone was used.
- the cleaning ability of the cleaning agent was evaluated as described above, and the residual NPD rate on cleaned and rinsed silicon wafers was 3% or less (less than the detection limit).
- the cleaning ability of the cleaning agent was evaluated in the same manner as in Example 1 except that normal paraffin was used as the cleaning agent in place of the ⁇ -force prolactone in Example 1.
- the residual rate of ⁇ -NPD was 96%.
- the cleaning ability of the cleaning agent was evaluated in the same manner as in Example 1 except that methyl propylene diglycol was used as the cleaning agent in place of the ⁇ -force prolactone of Example 1, and it was found that the cleaned and rinsed silicon was used.
- the ⁇ -NPD residual rate on the wafer was 86%.
- Example 4 The cleaning ability of the cleaning agent was evaluated in the same manner as in Example 1 except that acetone was used as the cleaning agent in place of the ⁇ -force prolactone in Example 1. The residual rate of ⁇ -NPD was 80%.
- Example 4 The cleaning ability of the cleaning agent was evaluated in the same manner as in Example 1 except that acetone was used as the cleaning agent in place of the ⁇ -force prolactone in Example 1. The residual rate of ⁇ -NPD was 80%.
- the cleaning power of the cleaning agent was the same as in Example 1 except that the vacuum deposited organic EL material was changed to tris (8-quinolinate) aluminum (III) (A 1 q 3) instead of Q! -NPD.
- the ⁇ -NPD residual rate on the cleaned and rinsed silicon wafer was 3% or less (less than the detection limit).
- RC cleaning is a cleaning method developed by RCA, and is based on ammonia ⁇ hydrogen peroxide solution cleaning (SC 1) and hydrochloric acid 'hydrogen peroxide solution cleaning (SC 2).
- SC 1 ammonia ⁇ hydrogen peroxide solution cleaning
- SC 2 hydrochloric acid 'hydrogen peroxide solution cleaning
- a commercially available positive photoresist manufactured by Tokyo Ohka Kogyo Co., Ltd .: THMR-i P 3300 was placed on a 4-inch silicon wafer treated with hexamethyldisilazane (HMDS). The coating was applied at a thickness of m and prebaked at 90 ° C. for 2 minutes. Then, after i-ray irradiation and development, rinsing was performed and post-baking was further performed at 150 ° C. for 30 minutes.
- HMDS hexamethyldisilazane
- a test piece was cut out of the silicon wafer subjected to the above processing with a diamond cutter, and the resist cleaning and removing performance of the resist cleaning and removing agent having the composition described in Table 1 was evaluated by the following method. That is, a beaker containing 1 ml of resist cleaning agent was placed in a hot bath, kept at 50 ° C., the 1 cm square test piece was immersed in this, removed after 10 minutes, and the surface condition was visually observed and It observed by the metallographic microscope. The results are shown in Table 1. The evaluation was based on the following criteria.
- the cleaning agent was evaluated in the same manner as in Example 5 except that the cleaning agent was kept at 80 ° C. in Example 5. The results are shown in Table 1 together.
- Example 5 In place of the cleaning agent of Example 5, a resist cleaning agent having the composition described in Table 1 was used, and a beaker filled with 10 m of the resist cleaning agent was placed in a hot bath at 80 ° C. The cleaning agent was evaluated in the same manner as in Example 5 except that the temperature was maintained at. The results are shown in Table 1.
- PE 61 New Pole PE 61 (San surfactant manufactured by Sanyo Chemical Industries, Ltd.)
- Example 1 0 In order to evaluate the cleaning power of the cleaning agent, vacuum vacuum copper phthalocyanine (manufactured by Wako Pure Chemical Industries, Ltd.), which is an organic EL material, on a 1 cm 2 cm silicon wafer so as to have a thickness of 500 nm. It was deposited. Then, the silicon wafer on which the organic EL material was vapor-deposited was immersed in a cleaning agent consisting of 50 g of ⁇ -force prolactone and 50 g of dimethyl sulfoxide for 3 minutes at 15 ° C. for cleaning. After washing, the silicon wafer was immersed in 10 O mL of isopropyl alcohol at room temperature for 30 seconds to rinse.
- a cleaning agent consisting of 50 g of ⁇ -force prolactone and 50 g of dimethyl sulfoxide for 3 minutes at 15 ° C. for cleaning. After washing, the silicon wafer was immersed in 10 O mL of isopropyl alcohol at room temperature for 30 seconds to rinse.
- the infrared spectrophotometer (Perkin-Elmer One: Spectrum One) is used to measure the transmittance by 1,600 The peak area of cm- 1 was quantified. When the peak area before cleaning is 100% and the peak area of the silicon wafer on which the organic EL material is not deposited is 0%, the copper phthalocyanine residual rate on the cleaned and rinsed silicon wafer is 3% or less (Less than detection limit).
- a cleaning agent was prepared in the same manner as in Example 10, except that instead of the cleaning agent of Example 10, a cleaning agent consisting of 30 g of ⁇ -force prolactone and 70 g of dimethyl sulfoxide was used. As a result of evaluation of the detergency, the residual rate of copper phthalocyanine on the cleaned and rinsed silicon wafer was 3% or less (less than the detection limit).
- Example 10 The same procedure as in Example 10 was followed, except that instead of the detergent of Example 10, a detergent consisting of 80 g of ⁇ -force prolactone and 20 g of dimethyl sulfoxide was used. As a result of evaluating the detergency, the residual rate of copper and copper on the cleaned and rinsed silicon wafer was 5%.
- Example 10 Except that instead of the detergent of Example 10, a detergent consisting of 70 g of ⁇ -force prolactone, 20 g of dimethyl sulfoxide and 10 g of methyl propylene diglycol was used.
- the cleaning power of the cleaning agent was evaluated in the same manner as in 10, and the copper phthalocyanine residual rate on the cleaned and rinsed silicon wafer was 6%.
- Comparative example 9 The cleaning power of the cleaning agent was evaluated in the same manner as in Example 10 except that 100% dimethyl sulfoxide was used instead of the cleaning agent in Example 10. However, dimethyl sulfoxide coagulated and could not be cleaned.
- the cleaning power of the cleaning agent was evaluated in the same manner as in Example 10 except that 100% dimethyl sulfoxide was used instead of the cleaning agent in Example 10. However, dimethyl sulfoxide coagulated and could not be cleaned.
- the cleaning power of the cleaning agent was evaluated in the same manner as in Example 10 except that acetone was used as the cleaning agent instead of the cleaning agent of Example 10.
- the copper phthalocyanine remaining on the cleaned and rinsed silicon wafer was evaluated. The rate was 100%.
- the cleaning ability of the cleaning agent was evaluated in the same manner as in Example 10 except that the vacuum deposited organic EL material was changed to tris (8-hydroxyquinolinate) aluminum (III) (A 1 q 3) instead of copper phthalocyanine.
- the A 1 Q 3 survival rate on cleaned and rinsed silicon wafers was 3% or less (less than the detection limit).
- a cleaning agent was cleaned in the same manner as in Example 10 except that the vacuum deposited organic EL material was changed to (N- (1-naphthyl) -N-phenyl) benzidine ( ⁇ -NPD) instead of copper phthalocyanine.
- ⁇ -NPD N- (1-naphthyl) -N-phenyl benzidine
- STN liquid crystal is injected from the liquid crystal injection port into the liquid crystal cell, and then the liquid crystal injection port is sealed, whereby excess liquid crystal is formed between the surface and the two opposing glass plates constituting the liquid crystal cell.
- the liquid crystal panel to which was attached was obtained.
- the detergents of the composition shown in Table 2 were prepared.
- the figures for the composition of the detergent are shown by weight.
- the liquid crystal cell was immersed while maintaining the temperature of the prepared cleaning agent at 400 ° C. at 40 ° C., and ultrasonic cleaning was performed for 2 minutes. After slowly pulling out the liquid crystal cell from the detergent, warm air at 40 ° C 1 Sprayed for 0 minutes to dry the liquid crystal cell.
- the liquid crystal in the gap portion can hardly be removed, and a slight amount of liquid crystal remains on the surface.
- NS polyoxyethylene lauryl ether (nonionic surfactant).
- EXAMPLE 20 Instead of ⁇ -force prolactone instead of 0, a mixture of 8 volumes of ⁇ -force prolactone to 2 volumes of dipropylenediaryl dimethyl ether, detergent ( ⁇ -force prolactone content 26. The sample was completely dissolved when examined in the same manner as in Example 2 1 except that 4% by mass was used.
- Example 20 The sample was completely dissolved, as examined in the completely same manner as in Example 20 except that Shift Wax 640 manufactured by Nicha Seiei Co., Ltd. was used instead of the wax of Example 20. .
- the sample was immersed for 8 hours at 40 ° C. using normal paraffin instead of ⁇ -strong prolactone of Example 20, but the sample was hardly dissolved.
- the sample was immersed for 8 hours at 40 ° C. using dipropylene glycol diproyl ether instead of ⁇ -force prolactone of Example 20, but the sample was hardly dissolved.
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- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
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- Cleaning By Liquid Or Steam (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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US11/793,384 US7700531B2 (en) | 2004-12-17 | 2005-12-14 | Cleaning agent |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-366703 | 2004-12-17 | ||
JP2004366703A JP2006169442A (ja) | 2004-12-17 | 2004-12-17 | 洗浄剤 |
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WO2006064953A1 true WO2006064953A1 (ja) | 2006-06-22 |
Family
ID=36587992
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PCT/JP2005/023419 WO2006064953A1 (ja) | 2004-12-17 | 2005-12-14 | 洗浄剤 |
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US (1) | US7700531B2 (ja) |
JP (1) | JP2006169442A (ja) |
KR (1) | KR100966691B1 (ja) |
TW (1) | TWI393774B (ja) |
WO (1) | WO2006064953A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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US20220056376A1 (en) * | 2018-12-26 | 2022-02-24 | 3M Innovative Properties Company | Removal of electroluminescenct materials for substrates |
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TWI764923B (zh) * | 2016-09-02 | 2022-05-21 | 日商富士軟片股份有限公司 | 溶液、溶液收容體、感光化射線性或感放射線性樹脂組成物、圖案形成方法、半導體裝置的製造方法 |
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- 2005-12-14 WO PCT/JP2005/023419 patent/WO2006064953A1/ja not_active Application Discontinuation
- 2005-12-14 KR KR1020077013563A patent/KR100966691B1/ko not_active IP Right Cessation
- 2005-12-14 US US11/793,384 patent/US7700531B2/en not_active Expired - Fee Related
- 2005-12-16 TW TW094144845A patent/TWI393774B/zh not_active IP Right Cessation
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US20220056376A1 (en) * | 2018-12-26 | 2022-02-24 | 3M Innovative Properties Company | Removal of electroluminescenct materials for substrates |
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US20080153732A1 (en) | 2008-06-26 |
KR20070086266A (ko) | 2007-08-27 |
JP2006169442A (ja) | 2006-06-29 |
US7700531B2 (en) | 2010-04-20 |
TW200629011A (en) | 2006-08-16 |
TWI393774B (zh) | 2013-04-21 |
KR100966691B1 (ko) | 2010-06-29 |
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