WO2006061274A1 - Module de puce et son procede de production - Google Patents

Module de puce et son procede de production Download PDF

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Publication number
WO2006061274A1
WO2006061274A1 PCT/EP2005/055199 EP2005055199W WO2006061274A1 WO 2006061274 A1 WO2006061274 A1 WO 2006061274A1 EP 2005055199 W EP2005055199 W EP 2005055199W WO 2006061274 A1 WO2006061274 A1 WO 2006061274A1
Authority
WO
WIPO (PCT)
Prior art keywords
housing
chip
premold
pads
leads
Prior art date
Application number
PCT/EP2005/055199
Other languages
German (de)
English (en)
Inventor
Ronny Ludwig
Original Assignee
Robert Bosch Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch Gmbh filed Critical Robert Bosch Gmbh
Publication of WO2006061274A1 publication Critical patent/WO2006061274A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0032—Packages or encapsulation
    • B81B7/0077—Other packages not provided for in groups B81B7/0035 - B81B7/0074
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0084—Electrical connection means to the outside of the housing
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/141—Monolithic housings, e.g. molded or one-piece housings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Definitions

  • Chip module and method for its production
  • the invention relates to a chip module with a micromechanically structured sensor element for optical or stress-sensitive measurements, which can be used in particular in the automotive sector, and a method for its production.
  • Such chip modules may in particular be gas sensor modules with sensor chips for the detection of CO2, which may be e.g. used in CO2-powered automotive air conditioning systems for the detection of leaks.
  • Micromechanical sensor elements allow for cost-effective production of a standardized design of the measuring structures and accurate measurements. They are housed in suitable housings for protection against damage and contamination as well as for suitable optical alignment. The sensor module formed from the housing and the sensor element can subsequently be mounted on a substrate, e.g. a printed circuit board.
  • the chips are contacted on leadframes, for example, and the housing is injected or molded around the chips with part of the leadframe.
  • the pins of the leadframe extend laterally out of the housing for contacting and fastening the sensor module as connection pins.
  • housings are unsuitable. Therefore, premold housings are often used for such sensor chips, in which first a leadframe with several leads in a housing body of a molding material, generally a plastic or epoxy resin, is injected or molded.
  • the premold housings are based on SIP (Single Inline Packages), SOP (Small Outline Packages) or PSOP (Power Small Outline Packages) or similar housing designs.
  • One or more sensor chips are subsequently mounted in the premold housing, eg. B. glued, and contacted with the leads, eg by means of bonding wires.
  • the leads generally form bonding pads in the interior of the housing body for contacting with the contact pads of the sensor chip and extend laterally outwards through the housing body, where they laterally form protruding connection pins with which the gas sensor module can be fastened and contacted on the substrate.
  • the space required to mount the premold housings on the substrate is determined by the size of the housing and the width of the connection pins.
  • the laterally projecting, sensitive connection pins can bend during handling due to mechanical damage, which can lead to problems in the subsequent contacting on the substrate.
  • sensor chip modules with metal housings e.g. the TO design, known, which can be further processed in fürstecktechnik on the circuit boards.
  • TO design the TO design
  • such an assembly is very time consuming and expensive.
  • a premold housing is formed whose leads form bonding pads for contacting with the micromechanical measurement structure in the interior of the housing and also extend to the bottom of the housing floor. dens are bent such that they form on the underside of the housing exposed, advantageously round, contact areas, so-called ball pads.
  • the space requirement on the substrate is thus significantly reduced.
  • mechanical damage to the contacts can be avoided.
  • the ball pads can be directly attached and contacted to the substrate either via printed solder deposits or conductive adhesive deposits, or attached and contacted by the production of solder bumps or conductive bumps similar to flip chip mounting.
  • the solder or conductive adhesive contacts between the premold housing and the substrate can be additionally passivated and protected by filling underfiller material. This also achieves an additional mechanical attachment to the substrate.
  • the contacting of at least one chip in the interior of the premold housing is advantageously carried out by known wire bonds, which can be safely protected by filling the housing interior with passivation.
  • the leads of the premold housing according to the invention in this case make it possible to make contact with the sensor element via a shoulder region on the inside of the premold housing.
  • a plurality of ball pads may be formed as a ball grid array (BGA), for which purpose advantageously a leadframe with a plurality of differently long leads extending in a lateral direction is used, on which the ball pads in the lateral direction arranged offset to each other and each bent to the underside of the housing bottom.
  • BGA ball grid array
  • the invention can in principle be used for any chips, in particular over chips for stress-sensitive or optical applications.
  • Such chips may in particular be micromechanical sensor chips or micromechanical sensor elements with a plurality of chips, which for optical measurements, e.g. B. spectroscopic gas measurements, or z.
  • As stress-sensitive pressure or flow measurements can be used. In principle, but also z.
  • As optical chips or electro-optical chips are used, which require an optical access.
  • the z. B. requires six contacts and thus six ball pads, which can be formed as a BGA on the bottom of the housing, without that the housing is to be sized larger.
  • a leadframe strip with correspondingly structured leadframe areas is used, in which the leads are bent in common bend lines or fold lines.
  • the housing body are subsequently encapsulated or molded with a plastic or an epoxy resin and the resulting premold housing, advantageously after assembling the chips, separated by breaking the leads outside the premold housing, so that the individual premold housing in a few finished steps and cost and standardization can be trained.
  • FIG. 1 shows a section of a leadframe strip with a plurality of unbent leadframe areas
  • FIG. 2 shows the detail from FIG. 1 after the bending process in plan view (a) and in cross section (b)
  • FIG. 3 shows the cutout on the leadframe strip after the molding of housing bodies in the bent leadframe areas in plan view (a) and cross-section (b)
  • 4a to f a premold housing according to the invention with six BaII
  • FIG. 5 shows a two-channel gas sensor module first Embodiment of a chip module with the BGA premold package of Figure 4, a hermetically sealed two-channel thermopile chip and glued on the silicon chip cap filter chips with integrated aperture;
  • FIG. 6 shows the gas sensor module from FIG. 5 with additional chip calibration;
  • FIG. 7 a, b show cross sections through the gas sensor module of FIG. 6 along a long and a short lead;
  • FIG. 8 shows the gas sensor module from FIGS. 6, 7 after mounting on a substrate
  • FIG. 9a, b show a top view (a) and side view (b) of a dual-channel gas sensor according to another embodiment with the BGA premold housing and a hermetically sealed two-channel thermopile chip with extended housing edge before mounting the cover panel;
  • Fig. 10 shows the gas sensor module of Fig. 9 with additional, e.g. more transparent, chip assimilation;
  • the gas sensor module of Figure 7 or 8 with additionally mounted cover cover in plan view (a), side view (b) and cross-section (c).
  • FIGS. 5 to 11 shows a cross section through a hermetically sealed two-channel thermopile sensor produced in surface micromechanics, constructed as a chip stack, which can be inserted into the BGA premold housings according to the invention for forming the gas sensor modules of FIGS. 5 to 11.
  • a leadframe Strip 2 produced, of which in Fig. 1 a section is shown; the entire leaframe strip 2 extends in the longitudinal direction, that is, in Fig. 1 to the left and right, over several such cutouts.
  • the leadframe strip 2 is produced by punching a sheet, the z.
  • copper or a copper-tin alloy for. B.
  • CuSn ⁇ advantageously with a coating, for. As a nickel-gold coating exists.
  • a pattern of several leadframe areas 3 is punched, which correspond to the later premold housings in the approach.
  • the leadframe areas 3 each have a free space 4 and several, z. B.
  • leads 5 six parallel in the free space 4 extending leads 5, which are added to a - in Fig. 1 left - end in the leadframe strip 2 and in their other - right in Fig. 1 - End Scheme a ball pad. 6 7, on which, in turn, a narrower area of the lead 5 adjoins to the right, which is free in the free space 4.
  • the leads 5 are of an age-varying length, with their ball pads 6 and 7 offset from one another in the longitudinal direction of the leads 5.
  • the leads 5 can basically be aligned differently in the leadframe strip 2, z. B. in the transverse direction.
  • the stamped or structured leadframe strip 2 is subsequently bent by inserting corresponding punches into the leadframe areas 3 from above (or also correspondingly from below).
  • the leads 5 are bent such that they starting from the ground plane of the leadframe strip 2 in a first bend 8, z. B. substantially at right angles, bent downwards and in turn bent horizontally in at least one further counterbending 9.
  • Fig. 2b and 3b and z. B. also the cross sections of Fig. 4e, f can be seen, in this case a plurality of bending radii can be formed. It is relevant here that the leads 5 in their ball pads 6, 7 run horizontally and the left and right portions of the leads 5 next to the ball pads 6, 7 are bent in contrast upwards, so that the ball pads 6, 7 form the lowest level of the lead frame areas 3.
  • Fig. 3a, b are hereinafter housing body 10 of a
  • premold housing 1 are formed, which are separated from the leadframe strip 2 by cutting or punching the leads 5 below.
  • Each premold housing 1 thus has a housing body 10 and a leadframe 14 with a plurality of leads 5.
  • the punching line 12 during cutting or punching of the individual premold housing 1 runs through the leads 5 outside the housing body 10, so that the leads 5 are subsequently electrically separated.
  • the separation of the housing from the leadframe strip is advantageously carried out after the entire construction of the sensor module.
  • the housing bodies 10 are injection-molded such that they have a housing bottom 15 and a peripheral housing edge 16, whereby an upwardly open interior space 17 is formed.
  • the individual leads 5 are in each case exposed on one shoulder 18 of the housing body 10 in areas serving as bond pads 20 (FIG. 7a), and on the other hand lie in ball pads 6, 7 on the underside 15a of the housing floor 15 below free.
  • the housing edge 16 has a stop edge 22 (FIG. 7a) for the passivation medium to be introduced later, as will be described below.
  • FIGS. 5 to 7 show a first embodiment of a two-channel gas sensor module 24, in which a microstructured, shown in more detail in FIG. 12, in the preform housing 1
  • Sensor element 23 is glued, which is formed as a chip stack of a sensor chip 26, a cap chip 28 and two filter chips 30 a, b. in this connection is the sensor chip 26 on the housing bottom 15 of the gas sensor module 24 by means of an adhesive layer 25, for. As a conventional chip adhesive attached.
  • Two optical measuring structures 32 a, b are formed in the surface of the sensor chip 26 in surface micromachining (OMM), each measuring structure 32 a, b each having a membrane 33, a cavern 34 underneath the membrane 33 and a thermopile on the membrane 33 -Structure
  • OMM surface micromachining
  • thermopile structure 35 comprises interconnected interconnects formed of materials having different Seebeck coefficients and extending from the membrane 33 to the bulk material of the sensor chip 26.
  • thermopile structure 35 of each measuring structure 32 a, b is an absorber layer
  • a cavern 38 is formed, which serves as a common sensor space for both measuring structures 32 a, b and includes a vacuum.
  • the cap chip 28 is in this case on the sensor chip 26 in a vacuum-tight connection, for. B. Sealglas- connection 40, fixed so that the vacuum of the cavity 38 is sealed from the outside.
  • the two filter chips 30 a, b are fastened on the upper side of the cap chip 28 in each case by means of an adhesive layer 42 transparent to IR radiation.
  • the two optical measuring structures 32a, 32b of the dual-channel sensor element 23 serve for a first measurement and a reference measurement and are of identical design; the filter chips 30a, b bonded to the common cap chip 28 have different absorption characteristics.
  • the first filter chip 30a selectively absorbs infrared radiation in the CO2-relevant wavelength range at approximately 4.26 ⁇ m and the second filter chip 30b in a different reference wavelength range at, for example, 3.9 ⁇ m.
  • Incident IR radiation thus passes through the filter chips 30a, b, the transparent adhesive layers 42 and the common, for IR radiation transparent silicon cap chip 28, the cavern 38th and reaches the absorber layers 36 of the respective measurement structure 32a, b.
  • thermopile structure 35 Depending on the incident IR radiation, it heats up, so that its temperature increase is detected by the particular thermopile structure 35 underneath as a thermoelectric voltage and corresponding measuring voltages are generated.
  • the conductor tracks of the thermopile structure 35 are connected to contact pads 44 (or bond pads) on the upper side of the sensor chip 36 outside the cap chip 28, so that the measurement voltages generated in the two optical measurement structures 32 a, b can be read out via the contact pads 44 , and subsequently - in a manner known per se - from a difference or a ratio of the measurement signals, the content of CO2 in a measuring space between a radiation source, not shown, and the gas sensor module 24 can be determined.
  • the sensor elements 23 from the chips 26, 28 and 30 a, b are already produced at the wafer level in a conventional manner by the sensor chips 26 structured, the cap chips 28 etched and the respective wafer are mounted on each other, whereupon the sensor elements 23 from the wafer stack to be isolated.
  • the respective sensor elements 23 is glued to the housing bottom 15 via the adhesive layer 25, then the filter chips 30a, b are glued to the cap chip by means of the IR-transparent adhesive, subsequently the contact pads 44 of the sensor chip 26 to the bond pads 20 of the leads 5 via wire bonds 46 contacted and in the housing interior 17 of the premold housing 1 a passivation agent 50, z.
  • a passivation agent 50 As a common gel poured.
  • the passivation agent 50 in this case reaches the peripheral stop edge 22, which is arranged slightly below the surface of the filter chips 30a, 30b, so that the passivation means 50 does not cover the surface of the filter chips 30a, b.
  • the gas sensor module 24 has no laterally outwardly projecting connection pins, but only the ball grid array (BGA) forming ball pads 6 and 7, via which the gas sensor module 24 below on a substrate 52, for. B. a printed circuit board or a Ke- ramiksubstrat, fastened and contacted.
  • BGA ball grid array
  • B. silver conductive adhesive applied in screen printing on the circuit board 52 The assembly is thus carried out by gluing or soldering on the substrate 52.
  • the connecting means regions 54 are in this case received completely below the gas sensor module 24, so that no further lateral space on the substrate 52 is required.
  • FIGS. 9 to 11 show a two-channel gas sensor module 58 according to a further embodiment, with an otherwise corresponding structure such as the gas sensor module 24 of the first embodiment on the housing body 10 of the premold housing 1 on two opposite sides an upwardly projecting bending edge 60 of z. B. in addition 0.5 mm in length is formed.
  • the bending edge 60 is used to attach a cover cap 62 made of metal of z. B. 150 microns thickness.
  • a passivation agent 50 in particular a silicone gel, can be used that is permeable and softer than the passivating agent used in the first embodiment.
  • a protection of the interior 17 of the premold housing 1 and the passivation means 50 introduced therein takes place via the attached cover 61, which is fixed to the premold housing 1 by staking the bending edge 62 according to FIG. 10 a, b.
  • cover edges 64 of the diaphragm cover 62 are angled downward by 90 °, so that an additional lateral fixation is achieved.
  • the diaphragm cover 62 is thus fixed recorded and fixed, so that formed in it apertures 66 a, b above the two filter chips 30 a, b are positioned.
  • the diaphragm cover 62 thus serves, on the one hand, to protect the interior 17 of the premold housing 1, in particular also when using the soft passivation agent 50, so that no or hardly any dirt can penetrate, and, on the other hand, as an optical diaphragm or numerical aperture the optical measuring structures 23 a, b to keep stray radiation away.
  • filter chips 30 without aperture coating can be used.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Photometry And Measurement Of Optical Pulse Characteristics (AREA)
  • Light Receiving Elements (AREA)

Abstract

L'invention concerne un module de puce, servant notamment à des mesures optiques et sensibles aux contraintes, présentant au moins: un boîtier prémoulé (1), qui comprend un corps (10) constitué d'une matière plastique ou d'une résine époxy, comportant un bord (16) et un fond (15), ainsi qu'une grille de connexion (14) injectée dans ce dernier, pourvue de plusieurs connecteurs (5) qui s'étendent à travers le corps de boîtier (10) et sont coudés de façon à être dégagés dans le compartiment intérieur (17) du boîtier prémoulé (1) dans des plages de connexion (20) et sur le côté inférieur (15a) du fond de boîtier (15) dans des plages de billes de soudure (6,7), qui se présentent en particulier sous la forme d'un boîtier à billes; et une puce (26) fixée dans le boîtier prémoulé (1), de préférence une puce de détection microstructurée (26) destinée à des mesures optiques ou sensibles aux contraintes, dont les plages de contact (44) sont mises en contact avec les plages de connexion (20) par l'intermédiaire de soudures de connexions (46). Selon l'invention, il est possible de réduire l'encombrement sur le substrat par rapport aux modules présentant des broches de connexion latérales et de limiter les dégradations mécaniques des contacts. En complément, il est possible d'utiliser à cet effet une matière de remplissage sous-jacente.
PCT/EP2005/055199 2004-12-07 2005-10-12 Module de puce et son procede de production WO2006061274A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE102004058815.5 2004-12-07
DE200410058815 DE102004058815A1 (de) 2004-12-07 2004-12-07 Chipmodul und Verfahren zu dessen Herstellung

Publications (1)

Publication Number Publication Date
WO2006061274A1 true WO2006061274A1 (fr) 2006-06-15

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PCT/EP2005/055199 WO2006061274A1 (fr) 2004-12-07 2005-10-12 Module de puce et son procede de production

Country Status (2)

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DE (1) DE102004058815A1 (fr)
WO (1) WO2006061274A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
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CN107324274A (zh) * 2017-07-13 2017-11-07 中国工程物理研究院电子工程研究所 用于sip三维集成的封装载体

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DE102007005630B4 (de) 2007-02-05 2019-08-08 Infineon Technologies Ag Sensorchip-Modul und Verfahren zur Herstellung eines Sensorchip-Moduls
DE102007037841A1 (de) 2007-08-10 2009-02-12 Robert Bosch Gmbh Trägermodul und Verfahren zur Herstellung eines Trägermoduls
DE102007051870A1 (de) 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
DE102008041035A1 (de) 2008-08-06 2010-02-11 Robert Bosch Gmbh Elektronischer Sensor oder Sensorgerät, insbesondere Beschleunigungssensor, mit einem in ein Sensorgehäuse eingebauten Chipmodul
WO2013081519A1 (fr) * 2011-12-02 2013-06-06 Senseair Ab Cellule à gaz époxy moulée pour mesures optiques et procédé de moulage

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107324274A (zh) * 2017-07-13 2017-11-07 中国工程物理研究院电子工程研究所 用于sip三维集成的封装载体
CN107324274B (zh) * 2017-07-13 2024-04-05 中国工程物理研究院电子工程研究所 用于sip三维集成的封装载体

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