EP1187319A2 - Cadre conducteur et filtre à ondes acoustiques de surface l'employant - Google Patents

Cadre conducteur et filtre à ondes acoustiques de surface l'employant Download PDF

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Publication number
EP1187319A2
EP1187319A2 EP01120423A EP01120423A EP1187319A2 EP 1187319 A2 EP1187319 A2 EP 1187319A2 EP 01120423 A EP01120423 A EP 01120423A EP 01120423 A EP01120423 A EP 01120423A EP 1187319 A2 EP1187319 A2 EP 1187319A2
Authority
EP
European Patent Office
Prior art keywords
lead
leads
chosen
frame set
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP01120423A
Other languages
German (de)
English (en)
Other versions
EP1187319A3 (fr
Inventor
Minoru Sakai
Yasushi Yamamoto
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NRS Technologies Inc
Original Assignee
NEC Corp
NRS Technologies Inc
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, NRS Technologies Inc, Nippon Electric Co Ltd filed Critical NEC Corp
Publication of EP1187319A2 publication Critical patent/EP1187319A2/fr
Publication of EP1187319A3 publication Critical patent/EP1187319A3/fr
Withdrawn legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
    • H03H9/46—Filters
    • H03H9/64—Filters using surface acoustic waves
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
    • H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
    • H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Definitions

  • the present invention relates to a lead frame set and, more particularly, to elastic surface wave (SAW) filters used for portable telephone sets and the like and also lead frames used in such SAW filters.
  • SAW elastic surface wave
  • Prior art SAW filters are disclosed as, for instance, "Elastic Surface Wave Devices” in JP-A-5-63495.
  • prior art leads frames for such electronic components as IC are disclosed, for instance, as “TAB Tape” in Japanese Patent Laid-Open No. 5-121492 and as “Semiconductor Device and Method of Manufacturing the Same” in Japanese Patent Laid-Open No. 10-270626.
  • Fig. 11 is a plan view showing an example of such prior art lead frames.
  • Fig. 12 is a plan view showing an SAW filter using these lead frames.
  • the lead frames are shown together with a resin molding 5 for securing them thereto.
  • Each lead frame has an inner and an outer lead 1 and 2.
  • the lead frames each having the inner and outer leads 1 and 2 are coupled together at a predetermined interval by a tie bar (or carrier) 3.
  • An object of the present invention is to solve the above problem inherent in the prior art by the provision of lead frames, which is used for small-in-size, light-in-weight and highly integrated portable telephone terminals or the like and has high versatility of connection to the PWB, and also an SAW filter using such lead frames.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: at least the widths or the pitches of the inner and outer leads are chosen to be different values.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: at least the widths or the pitches of the inner and outer leads are chosen to be different values and the lead frames each have a transient portion intervening between the inner and outer leads and have the transient portion secured to a resin molding base.
  • the inner and outer leads are matched in position to the top and bottom surfaces, respectively, of a bottom portion of the resin molding base.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be greater than that of the inner leads and the width of the outer leads is chosen to be greater than that of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be less than that of the inner leads and the width of the outer leads is chosen to be the same as that of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be greater than that of the inner leads and the width of the outer leads is chosen to be less than the width of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be less than that of the inner leads and also the width of the outer leads is chosen to be less than that of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be greater than that of the inner leads and the width of the outer leads is chosen to be less than that of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be the same than that of the inner leads and the width of the outer leads is chosen to be less than that of the inner leads.
  • a lead frame set comprising a plurality of lead frames disposed in parallel and each having an inner lead and an outer lead, wherein: the pitch of the outer leads is chosen to be the same than that of the inner leads and the width of the outer leads is chosen to be greater than that of the inner leads.
  • an SAW filter comprising the lead frame set according to one of claims 1 and 4-10, and an SAW chip connected to the inner leads of the lead frames.
  • the lead frames each have a transient portion intervening between the inner and outer leads, the transient portion being secured to a resin molding base.
  • the lead frames each have a transient portion intervening between the inner and outer leads, the transient portion being secured to a resin molding base, the bottom surface of the outer leads of the lead frames are made to be substantially flush with the bottom surface of the resin molding base, and the width and the pitch of the outer leads are matched to the wiring pattern of a connector board.
  • the lead frames each have a transient portion intervening between the inner and outer leads, the transient portion being secured to a resin molding base and the SAW chip and a connector part are covered by a resin molding cap.
  • Fig. 1 is a plan view showing the construction of a first embodiment of the lead frame set (for SAW) according to the present invention.
  • the embodiment of the lead frame set 10A shown in Fig. 1 according to the present invention comprises a plurality of lead frames each having an inner and an outer leads 1 and 2.
  • the lead frames are coupled together in a juxtaposed or parallel fashion by a tie bar 3.
  • A1 is the pitch of the inner leads 1
  • A2 is the pitch of the outer leads
  • A3 is the width of the inner leads 1
  • denoted by A4 is the width of the outer leads 2.
  • the lead frame set 10A is made of a copper (Cu) alloy and has a plating surface layer having a thickness of 0.01 mm.
  • the tie bars coupling together the juxtaposed outer lead 2 has a width of 0.2 mm and a thickness of 0.125 mm.
  • the width A4 of the outer leads 2 coupled together by the tie bar 3 is chosen to be 0.6 mm.
  • the width A3 and the thickness of the inner leads 1 are chosen to be 0.4 and 0.125 mm, respectively.
  • the embodiment of the lead frame set 10A shown in Fig. 1, compared to the prior art lead frame set shown in Fig. 11, features contriving of its matching to PWB foot patterns by increasing the width A4 of the outer leads 2 and also choosing the pitch A2 of the outer leads 2 to be greater than the pitch A1 of the inner leads 1.
  • Fig. 2 is a schematic plan view showing an SAW filter 20A using the lead frame set 10A shown in Fig. 1.
  • the lead frame set 10A is secured to a resin molding comprising a resin molding base and a resin molding cap (only resin molding cap 5 being shown in Fig. 2).
  • the outer leads 2 of the lead frame set 10A are dimension converted in width and pitch from the inner leads 1 on the outer surface of resin molding base 4 to be described later.
  • the tie bar 3 of the lead frame set 10A is cut off.
  • Fig. 3 is a sectional view showing the SAW filter 20A using the lead frame set 10A shown in Fig. 1 according to the present invention.
  • the SAW filter 20A comprises the lead frame set 10A having the inner and outer leads 1 and 2 shown in Fig. 1, the resin molding base 4, the resin molding cap 5, thin metal wires 6 and an SAW chip 7.
  • As hollow space 8 is defined between the resin molding base 4 and cap 5, in which space the SAW chip 7 and thin wires 6 are disposed or accommodated.
  • the thin wires may be gold wires, and connect electrodes of the SAW chip 7 and the corresponding inner leads 1 of the lead frames 10A.
  • the lead frame set 10A is bent such that the inner leads 1 and outer leads 2 of each leads frame 10 are stepped in level by a transient or intermediate portion along side walls of the resin molding base 4. Specifically, the inner leads 1 are made to be flush with the top surface of a bottom portion 4a of the resin molding base 4, and the outer leads 2 are made to be flush with the bottom surface of the bottom portion 4a.
  • This structure permits optimum bonding of the inner leads 1 of the lead frame set 10A to the corresponding electrodes of the SAW chip 7 by the thin metal wires 6 and also soldering (for instance, reflow soldering) of the outer leads 2 to the PWB (printed wiring board) with the SAW filter 20A matched to the wiring pattern (not shown) of the PWB.
  • soldering for instance, reflow soldering
  • Fig. 4 is a plan view showing a second embodiment of the SAW filter 20B using a lead frame set 10B according to the present invention.
  • This second embodiment features that the pitch A2 of the outer leads 2 of the lead frame set 10B is chosen to be greater than the pitch A1 of the inner leads 1 and also that the width A4 of the outer leads 2 is chosen to be greater than the width A3 of the inner leads 1.
  • Fig. 5 is a plan view showing a third embodiment of the SAW filter 20C using a lead frame 10C according to the present invention.
  • This third embodiment features that the pitch A2 of the outer leads 2 of the lead frame set 10C is chosen to be less than the pitch A1 of the inner leads 1 and also that the width A4 of the outer leads 2 is chosen to be the same as the width A3 of the inner leads 1.
  • Fig. 6 is a plan view showing a fourth embodiment of the SAW filter 20D using the lead frame set 10D according to the present invention.
  • the pitch A2 of the outer leads 2 of the lead frame set 10D is chosen to be greater than the pitch A1 of the inner leads 1 and also that width A4 of the outer leads 2 is chosen to be less than the width A3 of the inner leads 1.
  • Fig. 7 is a plan view showing a fifth embodiment of the SAW filter 20E using a lead frame set 10E according to the present invention.
  • the pitch A2 of the outer leads 2 of the lead frame set 10E is chosen to be less than the pitch A1 of the inner leads 1 and also that the width A4 of the outer leads 2 is chosen to be less than the width A3 of the inner leads 1.
  • Fig. 8 is a plan view showing a sixth embodiment of the SAW filter 20F using a lead frame set 10F according to the present invention.
  • the pitch A2 of the outer leads 2 of the lead frame set 10F is chosen to be greater than the pitch A1 of the inner leads 1 and also that the width A4 of the outer leads 2 is chosen to be less than the width A3 of the inner leads 1.
  • Fig. 9 is a plan view showing a seventh embodiment of the SAW filter 20G using a lead frame set 10G according to the present invention.
  • the pitch A2 of the outer leads 2 of the lead frame set 10G is chosen to be the same as the pitch A1 of the inner leads 1 and also the width A4 the outer leads 2 is chosen to be less than the width A3 of the inner leads 1.
  • Fig. 10 is a plan view showing an eighth embodiment of the SAW filter 20H using a lead frame set 10H according to the present invention.
  • the pitch A2 of the outer leads 2 of the lead frame set 10H is chosen to be the same as the pitch A1 of the inner leads 1 and also that the width A4 of the outer leads 2 is chosen to be greater than the width A3 of the inner leads 1.
  • the pitches A1 and A2 and the widths A3 and A4 of the inner and outer leads 1 and 2 of the lead frame set can be freely chosen, it is possible to match the lead frame set to the foot (or wiring) pattern of PWB.
  • the present invention provides for high freedom of designing the outer leads 2, it is possible to set leads which are matched to a PWB circuit evade detachment of components due to falling or vibrations of the portable terminal or the like using the circuit.

Landscapes

  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
EP01120423A 2000-08-28 2001-08-27 Cadre conducteur et filtre à ondes acoustiques de surface l'employant Withdrawn EP1187319A3 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000257347A JP2002076831A (ja) 2000-08-28 2000-08-28 リードフレームおよびそれを使用するｓａｗフィルタ
JP2000257347 2000-08-28

Publications (2)

Publication Number Publication Date
EP1187319A2 true EP1187319A2 (fr) 2002-03-13
EP1187319A3 EP1187319A3 (fr) 2004-10-27

Family

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Family Applications (1)

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EP01120423A Withdrawn EP1187319A3 (fr) 2000-08-28 2001-08-27 Cadre conducteur et filtre à ondes acoustiques de surface l'employant

Country Status (4)

Country Link
US (1) US6566982B2 (fr)
EP (1) EP1187319A3 (fr)
JP (1) JP2002076831A (fr)
KR (1) KR20020018007A (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006061274A1 (fr) * 2004-12-07 2006-06-15 Robert Bosch Gmbh Module de puce et son procede de production

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6997750B2 (en) * 2003-07-23 2006-02-14 Fci Americas Technology, Inc. Electrical connector contact

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1093383A (ja) * 1996-05-15 1998-04-10 Matsushita Electric Ind Co Ltd 弾性表面波デバイス及びその製造方法
EP0840375A2 (fr) * 1996-10-29 1998-05-06 Nec Corporation Structure d'interconnexion puce-conducteur pour dispositif semi-conducteur
US6097081A (en) * 1997-01-16 2000-08-01 Hitachi, Ltd. Semiconductor device having adhesive between lead and chip

Family Cites Families (15)

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US4711700A (en) * 1985-07-03 1987-12-08 United Technologies Corporation Method for densifying leadframe conductor spacing
US5072283A (en) * 1988-04-12 1991-12-10 Bolger Justin C Pre-formed chip carrier cavity package
JPH01312856A (ja) * 1988-06-10 1989-12-18 Toshiba Corp 樹脂封止型半導体装置及びその製造方法
JPH0278262A (ja) * 1988-09-14 1990-03-19 Matsushita Electric Ind Co Ltd 電子部品
JPH0563495A (ja) 1991-08-29 1993-03-12 Toshiba Corp 弾性表面波装置
JP2730352B2 (ja) 1991-10-25 1998-03-25 日本電気株式会社 Ｔａｂテープ
US5859471A (en) * 1992-11-17 1999-01-12 Shinko Electric Industries Co., Ltd. Semiconductor device having tab tape lead frame with reinforced outer leads
JP2875122B2 (ja) * 1992-11-20 1999-03-24 株式会社東芝 リ−ド・キャリア
US5760526A (en) * 1995-04-03 1998-06-02 Motorola, Inc. Plastic encapsulated SAW device
JP3426811B2 (ja) * 1995-10-18 2003-07-14 株式会社東芝 半導体装置およびその製造方法
US6072239A (en) * 1995-11-08 2000-06-06 Fujitsu Limited Device having resin package with projections
JP3638750B2 (ja) 1997-03-25 2005-04-13 株式会社ルネサステクノロジ 半導体装置
KR19980080551A (ko) * 1997-03-25 1998-11-25 사또아끼오 수지 패키지, 반도체장치 및 수지 패키지의 제조방법
US6265761B1 (en) * 1999-05-07 2001-07-24 Maxim Integrated Products, Inc. Semiconductor devices with improved lead frame structures
KR20010036142A (ko) * 1999-10-06 2001-05-07 윤종용 다층 리드를 갖는 반도체 칩 패키지

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1093383A (ja) * 1996-05-15 1998-04-10 Matsushita Electric Ind Co Ltd 弾性表面波デバイス及びその製造方法
EP0840375A2 (fr) * 1996-10-29 1998-05-06 Nec Corporation Structure d'interconnexion puce-conducteur pour dispositif semi-conducteur
US6097081A (en) * 1997-01-16 2000-08-01 Hitachi, Ltd. Semiconductor device having adhesive between lead and chip

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
PATENT ABSTRACTS OF JAPAN vol. 1998, no. 09, 31 July 1998 (1998-07-31) -& JP 10 093383 A (MATSUSHITA ELECTRIC IND CO LTD), 10 April 1998 (1998-04-10) *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006061274A1 (fr) * 2004-12-07 2006-06-15 Robert Bosch Gmbh Module de puce et son procede de production

Also Published As

Publication number Publication date
US6566982B2 (en) 2003-05-20
KR20020018007A (ko) 2002-03-07
US20020024409A1 (en) 2002-02-28
EP1187319A3 (fr) 2004-10-27
JP2002076831A (ja) 2002-03-15

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