JP2008109340A - 複合部品 - Google Patents
複合部品 Download PDFInfo
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- JP2008109340A JP2008109340A JP2006289567A JP2006289567A JP2008109340A JP 2008109340 A JP2008109340 A JP 2008109340A JP 2006289567 A JP2006289567 A JP 2006289567A JP 2006289567 A JP2006289567 A JP 2006289567A JP 2008109340 A JP2008109340 A JP 2008109340A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
- H01L2223/64—Impedance arrangements
- H01L2223/66—High-frequency adaptations
- H01L2223/6661—High-frequency adaptations for passive devices
- H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19105—Disposition of discrete passive components in a side-by-side arrangement on a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19106—Disposition of discrete passive components in a mirrored arrangement on two different side of a common die mounting substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
Abstract
【解決手段】複合部品は、少なくとも一方主面に表面電極が形成された第1基体と、金属薄板の折り曲げ加工によって表面部24s,26s,28s,31と接続部とが形成された接続部材を樹脂モールド成型してなる第2基体12とが、第1基体の表面電極と第2基体12の表面部24s,26s,28s,31とを介して接合されてなる。少なくとも一部の接続部材は、接続部の一部が第2基体12の側面12sに露出して形成された側面電極部34を有している。
【選択図】図8
Description
12 ケース(第2基体)
12a 支持部
12b 天板部
14 基板(第1基体)
14a 一方主面
14b 他方主面
20 ケース本体
22 アンテナ板(アンテナ用放射電極)
24 グランド板(グランド電極)
24a,24b,24m,24n 延出部分
24s 接続端子(表面部)
24x 接続部材
26 供給電源用端子(接続部材)
26s 接続端子(表面部)
28 給電端子(接続部材)
28s 接続端子(表面部)
30 測定用接続部材(接続部材)
31 第1片(表面部)
34 第4片(側面電極部)
70 チップ部品(表面実装型電子部品)
72 ICチップ(表面実装型電子部品)
80 チップ部品(表面実装型電子部品)
82,84 ICチップ(表面実装型電子部品)
Claims (5)
- 少なくとも一方主面に表面電極が形成された第1基体と、金属薄板の折り曲げ加工によって形成された表面部と接続部とを含む接続部材を樹脂モールド成型してなる第2基体とが、前記第1基体の前記表面電極と前記第2基体の前記表面部とを介して接合されてなる複合部品であって、
少なくとも一部の前記接続部材は、前記接続部の一部が前記第2基体の側面に露出して形成された側面電極部を有していることを特徴とする複合部品。 - 前記第1基体の前記一方主面上に表面実装型電子部品が搭載され、
前記第2基体は、
前記第1基体の前記一方主面上に搭載された前記表面実装型電子部品の周囲に配置される支持部と、
前記支持部に接続され、前記第1基体の前記一方主面上に搭載された前記表面実装型電子部品を覆う天板部と、
を有する、ケース型基体であり、
前記天板部には、前記金属薄板によって形成されたアンテナ用放射電極が設けられ、
前記支持部には、前記アンテナ用放射電極に電気的に接続され、前記側面電極が形成された前記接続部材が設けられ、
当該接続部材の前記側面電極部は、前記アンテナ用放射電極のアンテナ特性を測定するための測定用電極部であることを特徴とする、請求項1に記載の複合部品。 - 前記ケース型基体は、前記天板部に、前記アンテナ用放射電極と対向して配置されたグランド電極が設けられていることを特徴とする、請求項2に記載の複合部品。
- 前記金属薄板は可撓性を有していることを特徴とする、請求項1〜3のいずれか一項に記載の複合部品。
- 前記第1基体は、複数のセラミック層を積層してなるセラミック多層基板であることを特徴とする、請求項1〜4のいずれか一項に記載の複合部品。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006289567A JP4645911B2 (ja) | 2006-10-25 | 2006-10-25 | 複合部品 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006289567A JP4645911B2 (ja) | 2006-10-25 | 2006-10-25 | 複合部品 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2008109340A true JP2008109340A (ja) | 2008-05-08 |
JP4645911B2 JP4645911B2 (ja) | 2011-03-09 |
Family
ID=39442346
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2006289567A Expired - Fee Related JP4645911B2 (ja) | 2006-10-25 | 2006-10-25 | 複合部品 |
Country Status (1)
Country | Link |
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JP (1) | JP4645911B2 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014011746A (ja) * | 2012-07-02 | 2014-01-20 | Sharp Corp | アンテナ部材、通信装置および導通検査方法 |
JP2017118476A (ja) * | 2015-12-21 | 2017-06-29 | ホシデン株式会社 | 非接触通信モジュール |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07142881A (ja) * | 1993-11-18 | 1995-06-02 | Murata Mfg Co Ltd | 複合電子部品 |
JPH0742126U (ja) * | 1993-12-27 | 1995-07-21 | 株式会社村田製作所 | 複合部品 |
JPH07288422A (ja) * | 1993-04-23 | 1995-10-31 | Murata Mfg Co Ltd | 表面実装型アンテナ装置 |
JPH0964636A (ja) * | 1995-08-21 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 平面アンテナ |
JP2002290140A (ja) * | 2001-03-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | アンテナ装置 |
JP2005019649A (ja) * | 2003-06-25 | 2005-01-20 | Kyocera Corp | アンテナ一体型高周波素子収納用パッケージおよびアンテナ装置 |
JP2005039330A (ja) * | 2003-07-15 | 2005-02-10 | Alps Electric Co Ltd | アンテナ装置 |
JP2006101494A (ja) * | 2004-09-01 | 2006-04-13 | Sanyo Electric Co Ltd | アンテナ一体型回路装置 |
-
2006
- 2006-10-25 JP JP2006289567A patent/JP4645911B2/ja not_active Expired - Fee Related
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07288422A (ja) * | 1993-04-23 | 1995-10-31 | Murata Mfg Co Ltd | 表面実装型アンテナ装置 |
JPH07142881A (ja) * | 1993-11-18 | 1995-06-02 | Murata Mfg Co Ltd | 複合電子部品 |
JPH0742126U (ja) * | 1993-12-27 | 1995-07-21 | 株式会社村田製作所 | 複合部品 |
JPH0964636A (ja) * | 1995-08-21 | 1997-03-07 | Matsushita Electric Ind Co Ltd | 平面アンテナ |
JP2002290140A (ja) * | 2001-03-26 | 2002-10-04 | Furukawa Electric Co Ltd:The | アンテナ装置 |
JP2005019649A (ja) * | 2003-06-25 | 2005-01-20 | Kyocera Corp | アンテナ一体型高周波素子収納用パッケージおよびアンテナ装置 |
JP2005039330A (ja) * | 2003-07-15 | 2005-02-10 | Alps Electric Co Ltd | アンテナ装置 |
JP2006101494A (ja) * | 2004-09-01 | 2006-04-13 | Sanyo Electric Co Ltd | アンテナ一体型回路装置 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014011746A (ja) * | 2012-07-02 | 2014-01-20 | Sharp Corp | アンテナ部材、通信装置および導通検査方法 |
JP2017118476A (ja) * | 2015-12-21 | 2017-06-29 | ホシデン株式会社 | 非接触通信モジュール |
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JP4645911B2 (ja) | 2011-03-09 |
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