WO2006057102A1 - 構造体および構造体の製造方法 - Google Patents
構造体および構造体の製造方法 Download PDFInfo
- Publication number
- WO2006057102A1 WO2006057102A1 PCT/JP2005/017590 JP2005017590W WO2006057102A1 WO 2006057102 A1 WO2006057102 A1 WO 2006057102A1 JP 2005017590 W JP2005017590 W JP 2005017590W WO 2006057102 A1 WO2006057102 A1 WO 2006057102A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- structure according
- present
- molten salt
- tungsten
- salt bath
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00642—Manufacture or treatment of devices or systems in or on a substrate for improving the physical properties of a device
- B81C1/0065—Mechanical properties
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/66—Electroplating: Baths therefor from melts
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12535—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.] with additional, spatially distinct nonmetal component
- Y10T428/12576—Boride, carbide or nitride component
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12493—Composite; i.e., plural, adjacent, spatially distinct metal components [e.g., layers, joint, etc.]
- Y10T428/12771—Transition metal-base component
- Y10T428/12806—Refractory [Group IVB, VB, or VIB] metal-base component
Definitions
- the present invention relates to a structure and a method for producing the structure, and more particularly to a structure having high hardness and excellent surface smoothness and a method for producing the structure.
- Tungsten carbide is used in various structures such as mechanical parts and dies due to its excellent mechanical properties (hardness, strength, toughness, wear resistance, etc.).
- Such a structure containing tungsten carbide is manufactured by a method such as thermal spraying or sintering.
- tungsten carbide itself has a high melting point, the tungsten carbide crystal grains are connected in any method. Therefore, it is necessary to use a binder metal such as cobalt, nickel or iron.
- a binder metal lump may cause the structure to break.
- An object of the present invention is to provide a structure having high hardness and excellent surface smoothness and a method for producing the structure.
- the present invention is a structure containing tungsten as a main component and also containing tungsten carbide, wherein the carbon content is 0.1% by mass or more of the structure, and cobalt, nickel and iron are contained.
- the structure of the present invention preferably has a Vickers hardness of 800 or more.
- the density of the structure of the present invention is preferably lOgZcm 3 or more.
- the surface roughness of the structure of the present invention is preferably 1 ⁇ m or less.
- the average crystal grain size of the crystal grains constituting the structure of the present invention is preferably 50 nm or less.
- the number of pools of 5 ⁇ m or more composed of at least one selected group force including cobalt, nickel, and iron force is 1 or less per 100 mm 2 of the surface of the structure. Can be.
- the structure of the present invention may have a micrometer order shape.
- the present invention provides a method for producing the structure according to any one of the above, wherein the group of lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, force russia, strontium and barium Force Precipitate a structure from a molten salt bath containing at least two selected species, a group strength of fluorine, chlorine, bromine and iodine, at least one selected species, tungsten, zinc, and an organic compound.
- a method for producing a structure including a process.
- the structure is deposited when the temperature of the molten salt bath is 300 ° C or lower.
- the organic compound may be polyethylene glycol.
- a structure having high hardness and excellent surface smoothness and a method for producing the structure can be provided.
- FIG. 1 is a schematic configuration diagram showing an example of an apparatus used for manufacturing a structure according to the present invention.
- FIG. 2 (A) is a schematic cross-sectional view illustrating the structure of the present invention having a concave shape on the order of micrometers.
- FIG. 2 (B) is a schematic cross-sectional view illustrating the structure of the present invention having a convex shape on the order of micrometers.
- the present invention is a structure containing tungsten as a main component and tungsten carbide, the carbon content is 0.1 mass% or more of the structure, and the contents of cobalt, nickel and iron It is a structure whose total is 3 mass% or less of the structure.
- “contained as a main component” means that it is contained in an amount of 50% by mass or more of the entire structure of the present invention.
- “carbon content” means that tungsten carbide is formed by chemical bonding with tandastain, and carbon bonded with tungsten! /, Na! /, Or single carbon. , The total content of
- a novel structure containing tungsten as a main component and tungsten carbide without using a binder metal such as cobalt, nickel and iron can be produced.
- Such a structure of the present invention is a polycrystalline body in which fine crystal grains are densely assembled, and contains tungsten and tungsten carbide in which tungsten and carbon are chemically bonded.
- the structure of the present invention may contain a simple carbon that is chemically bonded to tandasten.
- binder metal such as cobalt, nickel and iron in order to link the tungsten carbide crystal grains.
- a binder metal such as cobalt, nickel and iron
- the Vickers hardness of the structure of the present invention is preferably 800 or more. In this case, the hardness of the structure of the present invention is further improved. Since the structure of the present invention has a structure in which fine crystal grains are densely assembled, the Vickers hardness can be increased to 800 or more.
- the density of the structure of the present invention is preferably lOgZcm 3 or more.
- physical properties such as hardness and surface smoothness of the structure of the present invention tend to be further improved.
- a conventional structure containing tungsten carbide obtained by thermal spraying is porous, and thus a density of 10 g / cm 3 cannot be obtained.
- fine crystal grains are dense. The density can be increased to lOgZcm 3 or more.
- the surface roughness of the structure of the present invention is preferably 1 ⁇ m or less. In this case, the surface smoothness of the structure of the present invention tends to be improved.
- the surface roughness of the conventional structure containing tandasten carbide obtained by thermal spraying is larger than 1 ⁇ m and the surface smoothness is poor.
- the structure of the present invention has fine crystal grains densely assembled. Since it has a polycrystalline structure, the surface roughness of the structure can be reduced to 1 ⁇ m or less.
- the surface roughness means an arithmetic average roughness (Ra FIS B0601-1994).
- the average crystal grain size of the crystal grains constituting the structure of the present invention is preferably 50 nm or less.
- the structure of the structure of the present invention becomes denser, and physical properties such as hardness and surface smoothness of the structure of the present invention tend to be further improved.
- the “average grain size” means the average of the length of the longest part and the length of the shortest part of the crystal grains constituting the structure of the present invention. As an average, the crystal grain sizes of 100 arbitrary crystal grains are averaged.
- the number of pools of 5 ⁇ m or more composed of at least one binder metal selected from the group force of cobalt, nickel, and iron is selected. No more than 1 per 100mm 2 of body surface. In this case, the above There is a tendency that the destruction of the structure based on the pool of the Norder metal can be further reduced. Conventional methods such as thermal spraying and sintering require the use of at least one selected binder metal with cobalt, nickel, and iron power. Therefore, in conventional structures containing tungsten carbide, More than one pool of 5 ⁇ m or more that has the above binder metal force per 100 mm 2 of the surface of the body. In the present invention, the binder metal is not used in the present invention. The number of pools of 5 ⁇ m or more can be reduced to 1 or less.
- the number of the binder metal pool is specified as follows. First, an arbitrary entire surface of the structure of the present invention is analyzed by elemental mapping using an EDX (energy dispersive X-ray analyzer), and at least one binder metal selected from the group force including cobalt, nickel, and iron is selected. Image processing is performed so that regions containing 80% by mass or more can be identified. Next, the average of the length of the longest part and the length of the shortest part of this region is taken as the pool diameter, and the number of regions having this pool diameter of 5 ⁇ m or more on the entire surface of the structure is counted. Finally, the number of the above-mentioned binder metal pools is specified by converting the number of counted regions into the number per 100 mm 2 of the surface area of the structure.
- EDX energy dispersive X-ray analyzer
- This molten salt bath is a halogen (fluorine, chlorine, bromine or iodine) halide of a given alkali metal (lithium, sodium, potassium or rubidium) and a given alkaline earth metal (beryllium, magnesium, calcium, strontium or nor)
- a mixture of at least two selected compounds of the halogen (fluorine, chlorine, bromine or iodine) group of tungsten, tungsten compounds such as salt and tungsten, and zinc compounds such as zinc chloride After producing the molten salt, it can be produced by adding an organic compound such as polyethylene glycol.
- lithium, sodium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, norium, fluorine, chlorine, odor which can be contained in the molten salt bath
- the form of elemental, iodine, tungsten, or zinc in the molten salt bath is not particularly limited, and may exist in the molten salt bath as ions, for example, or in the state of forming a complex.
- these elements can be detected by performing, for example, ICP (inductively coupled plasma) emission spectroscopic analysis on a sample obtained by dissolving the molten salt bath of the present invention in water.
- the presence of the organic compound contained in the molten salt bath of the present invention is carried out by performing, for example, FT-IR (Fourier transform infrared spectroscopy) on a sample in which the molten salt bath is dissolved in water. Can be detected.
- FT-IR Fastier transform infrared spectroscopy
- This molten salt bath is accommodated in an electrolytic cell 1 shown in the schematic block diagram of FIG. Then, after immersing anode 3 and cathode 4 in molten salt bath 2 accommodated in electrolytic cell 1, current is passed between anode 3 and cathode 4 to perform electrolysis of molten salt bath 2.
- the metal contained in the molten salt bath 2 can be deposited on the surface of the cathode 4.
- a molten salt bath of the present invention When such a molten salt bath of the present invention is used, electrolysis can be performed at a low temperature of 400 ° C. or less. Therefore, when a negative electrode with a resist pattern finely formed by irradiating a resin such as polymethylmethalate (PMMA) with X-rays on a conductive substrate is immersed as a cathode. However, deformation of the resist pattern due to the temperature of the molten salt bath can be suppressed. Therefore, in this case, the structure of the present invention can be deposited at a low temperature of the molten salt bath of 400 ° C. or lower. From the viewpoint of suppressing the decomposition of organic compounds such as polyethylene glycol in the molten salt, it is preferable to perform the electrolysis of the molten salt bath at a molten salt bath temperature of 300 ° C or lower.
- PMMA polymethylmethalate
- the structure of the present invention is microscopic because electrolysis can be carried out by using the above-mentioned method with a negative electrode having a resist pattern finely formed on the micrometer order as a cathode. It can have a metric order shape.
- “having a micrometer-order shape” means that the structure 5 of the present invention has a structure 5 as shown in, for example, the schematic cross-sectional views of FIGS.
- a recess and a Z or projection are formed, and at least one of the widths of the recess and Z or the projection has a width D of 1 ⁇ m to 100 ⁇ m, and 1 m to 100 ⁇ m.
- the height of the concave part and Z or convex part having a width D of m or less is 1 ⁇ m or more and 1000 ⁇ m or less
- the conductive substrate for example, a substrate made of a simple metal or an alloy, a substrate in which a conductive metal or the like is attached on a nonconductive base material such as glass, and the like can be used.
- the structural body of the present invention is used as a mechanical part such as a contact probe, a microconnector, a microrelay, various sensor parts, or a film for coating these mechanical parts.
- the structure of the present invention includes, for example, RFMEMS (Radio Frequency Micro Electro Mechanical System) such as variable capacitors, inductors, arrays, and antennas, optical MEMS members, inkjet heads, biosensor internal electrodes, and power MEMS members ( It is used as a machine part such as an electrode) or a film that coats these machine parts.
- RFMEMS Radio Frequency Micro Electro Mechanical System
- Each powder of potassium was dried in a vacuum oven at 200 ° C. for 12 hours.
- the WC1 (tungsten tetrachloride) powder was dried in a 100 ° C vacuum oven for 12 hours.
- the powder was contained.
- the molten alumina crucible was heated to melt the powder in the alumina crucible to prepare 500 g of molten salt.
- 0.54 mol (same mol as WC1) of the above polyethylene glycol (weight average molecular weight 2000) dehydrated for 24 hours with molecular sieves was dissolved in the above solution.
- a molten salt bath was prepared by adding to the molten salt.
- Example 1 The same operation as described above was performed a plurality of times, and a plurality of structures of Example 1 were obtained.
- composition of the structure of Example 1 the surface roughness, the density, the Vickers hardness, the pool diameter of the binder metal (at least one of cobalt, nickel and iron) per surface of 100 mm 2 is 5 ⁇ m or more
- the number of pools and the average crystal grain size were evaluated. The evaluation results are shown in Table 1.
- composition of components such as tungsten (W), zinc (Zn), oxygen (O), cobalt (Co), nickel (Ni) and iron (Fe) other than carbon (C).
- W tungsten
- Zn zinc
- O oxygen
- Co cobalt
- Ni nickel
- Fe iron
- the high-frequency heating combustion infrared absorption method in an oxygen stream was performed as follows. First, the structure of Example 1 was housed in an alumina crucible in an oxygen stream, and the alumina crucible was heated to react the carbon in the structure of Example 1 with oxygen in the oxygen stream to produce a monoacid solution. Carbon and Z or diacid carbon were produced. Next, infrared rays were irradiated into the atmosphere containing carbon monoxide and Z or carbon dioxide thus produced. Finally, the carbon content in the structure of Example 1 was investigated by investigating the infrared attenuation caused by the absorption of carbon monoxide and Z or carbon dioxide in this atmosphere. The rate (mass%) was measured.
- the surface roughness of the structure of Example 1 was evaluated using a laser microscope (a model number “VK-8500” manufactured by Keyence Corporation). The lower the surface roughness value shown in Table 1, the smoother the surface. The surface roughness shown in Table 1 is the arithmetic average roughness Ra (jIS B0601-1994).
- the density of the structure of Example 1 was evaluated by using a FIB (focused ion beam) apparatus to cut the vicinity of the center of the structure into a 3 mm X 3 mm rectangle together with the nickel plate, This was done by calculating the density of the structures in the obtained sample. The density of this structure was calculated as follows. First, the thickness of the structure in the sample was measured using an FIB device.
- the volume of the structure was calculated by multiplying the surface area (3 mm ⁇ 3 mm) of the structure by the measured thickness.
- the mass of the portion corresponding to the cut nickel plate was calculated from the mass of the whole nickel plate measured in advance.
- the mass of the entire sample was measured, and the mass of the structure was calculated by subtracting the mass of the portion corresponding to the cut nickel plate from the measured mass of the entire sample.
- the density of the structure was calculated by dividing the mass of the structure by the volume of the structure.
- Example 1 the Vickers hardness of the structure of Example 1 was measured using a nano-intender.
- the number of pools having a pool diameter of 5 ⁇ m or more made of at least one binder metal selected from the group consisting of cobalt, nickel and iron on the surface of the structure of Example 1 is the same as that in Example 1.
- the entire surface of the structure was analyzed by elemental mapping with EDX, and after image processing was performed so that regions containing 80 mass% or more of the noder metal could be identified, the number of regions with a pool diameter of 5 m or more was counted and counted. The number of regions was calculated in terms of the number per 100 mm 2 of the surface area of the structure of Example 1.
- the average crystal grain size of the structure of Example 1 was measured by analyzing an image from a dark field image of a TEM (transmission electron microscope).
- Example 1 was performed using a plurality of obtained structures of Example 1 for IJ.
- Example 2 Add diethylene glycol monomethyl ether instead of polyethylene glycol Except that, a plurality of the structures of Example 2 were obtained in the same manner as Example 1. And the composition of the structure of Example 2, surface roughness, density, Vickers hardness, pool of a single metal (at least one of cobalt, nickel and iron) per surface of 100 mm 2 Pool diameter of 5 ⁇ m or more The number and average crystal grain size were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
- Comparative Example 1 A plurality of structures of Comparative Example 1 were obtained in the same manner as in Example 1 except that polyethylene glycol was not added. Then, the composition of the structure of Comparative Example 1, surface roughness, density, Pitsuka over scan hardness, surface 100 mm 2 per binder metal (cobalt, least one nickel and iron) pool size 5 mu m or more The number of pools and the average crystal grain size were evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1.
- Tungsten carbide (WC) of 90 mass 0/0 and thermal spraying powder containing 10 mass% of cobalt was prepared by granulation sintering method. Then, the surface of the nickel plate similar to that used in Example 1 was sprayed by the high-speed flame spraying method using this thermal spraying powder, and a 10 m thick coating ( The structure of Comparative Example 2) was formed. And the composition of the structure of Comparative Example 2, surface roughness, density, Vickers hardness, number of pools with a pool diameter of 5 ⁇ m or more of binder metal (at least one of cobalt, nickel and iron) per surface of 100 mm 2 The average crystal grain size was evaluated in the same manner as in Example 1. The evaluation results are shown in Table 1. A plurality of structures of Comparative Example 2 were also formed.
- a titanium layer was formed on the surface of a disk-shaped silicon substrate having a diameter of 3 inches by sputtering titanium with a thickness of 0.3 ⁇ m. Then, a photoresist having a width of 1 cm X, a length of 1 cm, and a thickness of 30 / zm made of PMMA was applied onto the titanium layer. Next, a portion of this photoresist is irradiated with SR light (synchrotron radiation), and the photoresist of the portion irradiated with SR light is selectively removed, so that the line Z space is 50 mZ5 on the titanium layer. A 0 ⁇ m striped resist pattern was formed.
- SR light synchrotron radiation
- the silicon substrate after forming the resist pattern was used as a cathode, and a tungsten rod was used as an anode, and was produced in the same manner as the molten salt bath used in Example 1. It was immersed in molten salt bath lOOOOg. Then, by the current of the titanium layer lcm 2 per 3mA on a silicon substrate (current density 3mAZcm 2) by passing 60 hours perform constant current electrolysis between the electrodes while holding the molten salt bath 250 ° C Then, the structure of Example 3 was deposited on the titanium layer.
- the silicon substrate was taken out with a glove box force.
- the silicon substrate was washed with water to remove salt adhering to the silicon substrate.
- a plasma using a mixed gas of CF (carbon tetrafluoride) and O (oxygen) is used.
- Example 3 having a shape on the order of micrometers could be obtained by mechanically peeling the structure of Example 3 on the titanium layer.
- the composition of the structure of Example 3 was evaluated in the same manner as in Example 1, the composition of the structure of Example 3 was the same as the composition of the structure of Example 1 shown in Table 1.
- the present invention is suitable for manufacturing a machine part and a film coated on the machine part. Used for
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Abstract
Description
Claims
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/586,923 US7611591B2 (en) | 2004-11-24 | 2005-09-26 | Structure and method of manufacturing the same |
CN2005800063283A CN1926263B (zh) | 2004-11-24 | 2005-09-26 | 结构体及其制造方法 |
DE112005000355T DE112005000355B4 (de) | 2004-11-24 | 2005-09-26 | Verfahren zur Herstellung eines Formteils oder einer Beschichtung |
KR1020077014039A KR101204610B1 (ko) | 2004-11-24 | 2005-09-26 | 구조체 및 구조체의 제조방법 |
US12/219,573 US7776200B2 (en) | 2004-11-24 | 2008-07-24 | Structure and method of manufacturing the same |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004339418A JP4649962B2 (ja) | 2004-11-24 | 2004-11-24 | 構造体および構造体の製造方法 |
JP2004-339418 | 2004-11-24 |
Related Child Applications (2)
Application Number | Title | Priority Date | Filing Date |
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US10/586,923 A-371-Of-International US7611591B2 (en) | 2004-11-24 | 2005-09-26 | Structure and method of manufacturing the same |
US12/219,573 Division US7776200B2 (en) | 2004-11-24 | 2008-07-24 | Structure and method of manufacturing the same |
Publications (1)
Publication Number | Publication Date |
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WO2006057102A1 true WO2006057102A1 (ja) | 2006-06-01 |
Family
ID=36497846
Family Applications (1)
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PCT/JP2005/017590 WO2006057102A1 (ja) | 2004-11-24 | 2005-09-26 | 構造体および構造体の製造方法 |
Country Status (6)
Country | Link |
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US (2) | US7611591B2 (ja) |
JP (1) | JP4649962B2 (ja) |
KR (1) | KR101204610B1 (ja) |
CN (1) | CN1926263B (ja) |
DE (1) | DE112005000355B4 (ja) |
WO (1) | WO2006057102A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2015193899A (ja) * | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP4883534B2 (ja) * | 2008-03-26 | 2012-02-22 | 住友電気工業株式会社 | 溶融塩浴、溶融塩浴の製造方法およびタングステン析出物 |
JP5568883B2 (ja) * | 2009-03-27 | 2014-08-13 | 住友電気工業株式会社 | 溶融塩浴および溶融塩浴の製造方法 |
KR101369285B1 (ko) * | 2012-04-13 | 2014-03-06 | 한국과학기술연구원 | 2차원 나노구조의 텅스텐 카바이드 및 그 제조방법 |
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JPH07316817A (ja) * | 1994-05-31 | 1995-12-05 | Kyocera Corp | 超硬質複合部材およびその製造方法 |
JP2003213484A (ja) * | 2002-01-16 | 2003-07-30 | Nippon Steel Corp | Mg添加電気Znめっき浴およびその浴によるめっき方法 |
JP2004084059A (ja) * | 2002-07-04 | 2004-03-18 | Sumitomo Electric Ind Ltd | 微細パターンを有するメッキ用型、微細金属構造体、微細加工用型、微細パターンを有するメッキ用型の製造方法、および微細金属構造体の製造方法 |
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SU647359A1 (ru) * | 1975-10-06 | 1979-02-15 | Институт электрохимии Уральского научного центра АН СССР | Способ получени вольфрамовых покрытий |
CH647818A5 (de) | 1980-12-05 | 1985-02-15 | Castolin Sa | Pulverfoermiger beschichtungswerkstoff zum thermischen beschichten von werkstuecken. |
JP2684721B2 (ja) * | 1988-10-31 | 1997-12-03 | 三菱マテリアル株式会社 | 表面被覆炭化タングステン基超硬合金製切削工具およびその製造法 |
EP0698002B1 (en) * | 1993-04-30 | 1997-11-05 | The Dow Chemical Company | Densified micrograin refractory metal or solid solution (mixed metal) carbide ceramics |
CN1057802C (zh) * | 1997-04-11 | 2000-10-25 | 冯乃祥 | 熔盐电解制取细钨粉的方法 |
WO2002044437A2 (en) * | 2000-11-02 | 2002-06-06 | Composite Tool Company, Inc. | High strength alloys and methods for making same |
JP4346883B2 (ja) | 2002-09-30 | 2009-10-21 | 株式会社フジミインコーポレーテッド | 溶射用粉末 |
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2004
- 2004-11-24 JP JP2004339418A patent/JP4649962B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-26 WO PCT/JP2005/017590 patent/WO2006057102A1/ja active Application Filing
- 2005-09-26 DE DE112005000355T patent/DE112005000355B4/de not_active Expired - Fee Related
- 2005-09-26 CN CN2005800063283A patent/CN1926263B/zh not_active Expired - Fee Related
- 2005-09-26 KR KR1020077014039A patent/KR101204610B1/ko active IP Right Grant
- 2005-09-26 US US10/586,923 patent/US7611591B2/en active Active
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2008
- 2008-07-24 US US12/219,573 patent/US7776200B2/en active Active
Patent Citations (3)
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JPH07316817A (ja) * | 1994-05-31 | 1995-12-05 | Kyocera Corp | 超硬質複合部材およびその製造方法 |
JP2003213484A (ja) * | 2002-01-16 | 2003-07-30 | Nippon Steel Corp | Mg添加電気Znめっき浴およびその浴によるめっき方法 |
JP2004084059A (ja) * | 2002-07-04 | 2004-03-18 | Sumitomo Electric Ind Ltd | 微細パターンを有するメッキ用型、微細金属構造体、微細加工用型、微細パターンを有するメッキ用型の製造方法、および微細金属構造体の製造方法 |
Non-Patent Citations (1)
Title |
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TAKENISHI H AND KATAGIRI.: "Effect of Oxide Ion on the Electrodeposition of Tungsten in the ZnCl2-NaCl (60-40mol%) Melt.", ELECTROCHEMISTRY., vol. 67, no. 6, 1999, pages 669 - 676, XP002993884 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2015193899A (ja) * | 2013-11-19 | 2015-11-05 | 住友電気工業株式会社 | 電析用電解質および金属膜の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7776200B2 (en) | 2010-08-17 |
KR20070089706A (ko) | 2007-08-31 |
JP4649962B2 (ja) | 2011-03-16 |
US20080296163A1 (en) | 2008-12-04 |
CN1926263B (zh) | 2011-06-15 |
DE112005000355T5 (de) | 2007-02-15 |
US7611591B2 (en) | 2009-11-03 |
CN1926263A (zh) | 2007-03-07 |
US20070160866A1 (en) | 2007-07-12 |
DE112005000355B4 (de) | 2010-03-04 |
KR101204610B1 (ko) | 2012-11-27 |
JP2006144107A (ja) | 2006-06-08 |
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