WO2006040939A1 - 電解液とこれを用いた酸化物皮膜の形成方法、積層体及びその製造方法、並びに金属酸化物膜 - Google Patents
電解液とこれを用いた酸化物皮膜の形成方法、積層体及びその製造方法、並びに金属酸化物膜 Download PDFInfo
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- WO2006040939A1 WO2006040939A1 PCT/JP2005/018022 JP2005018022W WO2006040939A1 WO 2006040939 A1 WO2006040939 A1 WO 2006040939A1 JP 2005018022 W JP2005018022 W JP 2005018022W WO 2006040939 A1 WO2006040939 A1 WO 2006040939A1
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- oxide film
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/04—Anodisation of aluminium or alloys based thereon
- C25D11/06—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used
- C25D11/10—Anodisation of aluminium or alloys based thereon characterised by the electrolytes used containing organic acids
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D11/00—Electrolytic coating by surface reaction, i.e. forming conversion layers
- C25D11/02—Anodisation
- C25D11/26—Anodisation of refractory metals or alloys based thereon
Definitions
- the present invention relates to an electrolytic solution for forming an oxide film by anodic oxidation on the surface of a material to be treated whose main component is a metal (hereinafter, sometimes referred to as "i-forming solution").
- i-forming solution A method of forming an oxide film on the surface of a material containing metal as a main component by anodic oxidation using this electrolytic solution (hereinafter, the process for forming this oxide film is referred to as “deposition treatment”.
- a material to be treated having a metal oxide film formed by anodic oxidation using this electrolytic solution, and a metal formed on the surface of the material to be treated by anodic oxidation using this electrolytic solution.
- an electrolyte solution for efficiently forming a high-quality oxide film with excellent surface smoothness with pinholes on the surface of a material to be treated mainly containing a metal and an oxide solution.
- the present invention relates to a method for forming an oxide film, a material to be treated, and a metal oxide film.
- the present invention can be suitably applied to a material to be processed mainly containing a valve metal such as aluminum, tantalum, or niobium.
- a valve metal such as aluminum, tantalum, or niobium.
- a valve metal is a metal having a so-called valve action (rectifying action) in which the oxide layer on the metal passes current only in one direction and hardly passes current in the opposite direction (edited by the Metal Surface Technology Association). Metal Surface Technology Handbook (Revised New Edition), P. 712, (1976)), the oxide film formed on the surface of the material to be treated with valve metal as the main component is other precious metals or It differs in many respects compared to oxide films formed on transition metals, etc., and is used for many purposes by virtue of its unique properties. For example, it is used as various electronic components or elements, especially dielectric thin films used for capacitors and semiconductor elements, gate insulating films for thin film transistors, oxide films used for reflectors for flat displays and switching elements, etc.
- Such an oxide film used as a dielectric thin film of a capacitor or a semiconductor element or a gate insulating film of a thin film transistor is thin and dense and has no pinhole.
- the oxide film obtained by chemical conversion of the material mainly composed of valve metal is, in principle, not pinned at the time of film formation. Since it has the feature that it is not possible to form holes, it has been useful for these applications.
- an oxide film having high insulation and high hillock resistance can be obtained by using a chemical conversion solution in which an aromatic carboxylate is dissolved using ethylene glycol and water as a solvent. It forms in a short time.
- a two-step anodizing process ie, a constant current anodizing process and a constant voltage anodizing process. That is, first, an anodized film is formed by anodizing at a constant current until a voltage corresponding to a desired film thickness is obtained. After that, in order to repair the roughness of the formed oxide film, the voltage is maintained at a constant voltage until the current is sufficiently reduced.
- Japanese Patent Laid-Open No. 6-216389 describes that the film quality of an oxide film formed by anodizing with an alternating current containing a direct current component is improved. In this method, alternating current is used. Therefore, there is a problem that a special and expensive power supply is required. Japanese Patent Laid-Open No.
- 9-138420 discloses that constant current anodization is performed at a very high current density to obtain a flat film without waviness. In the oxidation, even if the undulation is eliminated, fine roughness cannot be avoided, and it is difficult to apply it to a reflector or a device that requires finer and higher surface smoothness.
- Patent Document 1 JP 2000-328293 A
- Patent Document 2 JP-A-6-216389
- Patent Document 3 Japanese Patent Laid-Open No. 9138420
- the present invention meets the above requirements and is intended to form a high-quality oxide film with a smooth surface free from pinholes and surface roughness by anodic oxidation on the surface of a material to be treated whose main component is a metal. It is an object of the present invention to provide an electrolytic solution and a method for forming an oxide film using the electrolytic solution.
- Another object of the present invention is to provide such a high-quality metal oxide film, a laminate having a metal oxide film on the surface of a material to be treated, and a method for producing the same.
- the present invention is also capable of forming a high-quality film even when the amount of water is increased, and forming an oxide film using the electrolytic solution in which film quality change due to variation in the amount of water is reduced.
- the purpose is to provide a method. It is another object of the present invention to provide an electrolytic solution capable of stably forming such a high quality oxide film regardless of specific electrical conditions, and a method for forming an oxide film using the same. It is another object of the present invention to provide a nonaqueous solvent that does not conflict with the PRTR method, an electrolytic solution that can reduce the amount of the nonaqueous solvent in the electrolytic solution, and a method for forming an oxide film using the electrolytic solution. And
- the gist of the present invention is that the surface of the material to be treated mainly containing metal is oxidized by anodic oxidation.
- An electrolytic solution used for forming a chemical film which is an electrolytic solution containing 50% by mass or more of a non-aqueous solvent having 4 or more carbon atoms and containing an alcoholic hydroxyl group.
- the non-aqueous solvent preferably contains two or more alcoholic hydroxyl groups, more preferably one or more selected from the group consisting of diethylene glycol, triethylene glycol, and polyethylene glycol.
- the electrolytic solution of the present invention preferably further contains water.
- the electrolytic solution of the present invention contains an anion derived from an aromatic carboxylic acid or a hydroxycarboxylic acid.
- another gist of the present invention includes 50% by mass or more of a non-aqueous solvent having 4 or more carbon atoms including an alcoholic hydroxyl group, and 1% by mass or more and 80% by mass of water with respect to the non-aqueous solvent.
- the electrolyte contains less than%.
- the non-aqueous solvent preferably contains two or more alcoholic hydroxyl groups, more preferably one or more selected from the group consisting of diethylene glycol, triethylene glycol, and polyethylene glycol.
- the electrolytic solution of the present invention contains an anion derived from an aromatic carboxylic acid or a hydroxycarboxylic acid.
- Another subject matter of the present invention resides in a method for forming an oxide film including a step of anodizing a material to be treated mainly containing a metal in the electrolytic solution.
- the material to be treated has a valve metal as a main component.
- Another aspect of the present invention is a laminate having a metal oxide film on a surface of a material containing metal as a main component, wherein the metal oxide film has an alcoholic hydroxyl group.
- the laminate is characterized in that it is a film formed by positive oxidation on the surface of the material to be treated using an electrolyte containing a non-aqueous solvent containing 4 or more carbon atoms as a main solvent.
- another gist of the present invention is a method for producing a laminate comprising a metal oxide film on the surface of a material to be treated containing a metal as a main component, the carbon number containing an alcoholic hydroxyl group.
- a method for producing a laminate comprising a step of forming a metal oxide film by anodizing the surface of the material to be treated using an electrolytic solution containing four or more non-aqueous solvents as a main solvent.
- another gist of the present invention is a metal oxide film, wherein an electrolyte containing an alcoholic hydroxyl group and containing a non-aqueous solvent having 4 or more carbon atoms as a main solvent is used.
- the metal oxide film is a film formed by anodic oxidation on the surface of the material to be processed.
- the electrolytic solution of the present invention and the method of forming an oxide film using the same, there is an advantage that a high-quality oxide film with high surface smoothness free from pinholes and surface roughness can be obtained.
- the invention can be suitably used for forming almost all dense and smooth oxide films such as thin film transistors, ceramic capacitors, MIM diodes, and MIM field emission devices.
- the electrolytic solution of the present invention and the method for forming an oxide film using the electrolytic solution, a high-quality film is formed even if the amount of water in the electrolytic solution is increased.
- the amount of non-aqueous solvent can be reduced, the amount of water can be increased, and the processing force that does not conflict with the PRTR method can be used.
- the change in film quality due to fluctuations in moisture content can be reduced, the liquid components can be easily controlled, increasing convenience. It is also suitable for use in environments where the amount of water is variable.
- a laminated body in which a high-quality metal oxide film having a smooth surface free from pinholes and surface roughness is formed on a material to be processed can be obtained.
- a laminate made of a material to be processed on which such a high-quality metal oxide film is formed has a force S used in various applications, such as a thin film transistor, a ceramic capacitor, a MIM diode, a MIM field emission device, a flat surface. It can be suitably used as a reflection plate for a display.
- a high-quality metal oxide film having a smooth surface free from pinholes and surface roughness can be obtained.
- a high-quality metal oxide film can be used for various applications.
- it can be suitably used as a thin film transistor, a ceramic capacitor, a MIM diode, a MIM field emission device, and a reflection plate for a flat display.
- an electrolytic solution used for forming an oxide film on the surface of a material to be treated mainly containing a metal preferably a material to be treated mainly containing a valve metal, by anodic oxidation.
- an electrolytic solution containing a non-aqueous solvent containing 4 or more carbon atoms containing an alcoholic hydroxyl group as a main solvent is used.
- the main solvent refers to a solvent when one kind of solvent is used alone, and refers to a solvent having the largest mass ratio when two or more kinds of solvents are used in combination.
- the metal includes an alloy.
- the material to be processed whose main component is a metal is that the element having the largest mass in the material to be processed is a metal.
- the metal is contained in an amount of 50% by mass to 100% by mass.
- the material to be treated has a valve metal as a main component.
- the valve metal is such that the oxide layer on the metal passes a current only in one direction and hardly passes a current in the opposite direction as described above.
- the valve metal used in the present invention is not particularly limited as long as a dense and smooth oxide film can be formed, but aluminum, tantalum, titanium, niobium, zirconium, hafnium, tungsten, molybdenum, nonadium. And one or more selected from the group consisting of silicon and silicon. Preferably, it is one or more selected from the group consisting of ananolium, tantalum, titanium, niobium, zirconium and hafnium, more preferably one or more selected from the group consisting of aluminum, tantalum and niobium. Two or more kinds, more preferably aluminum and / or tantalum.
- the material to be treated whose main component is the valve metal means that the element having the largest mass in the material to be treated is the valve metal.
- the total amount of the valve metal in the material to be treated is 50 mass% or more and 100 mass% or less. When importance is attached to the properties of valve metal, the total amount of valve metal is 85% by mass or more and 100% by mass or less in the material to be treated.
- the material to be treated in the present invention may contain a material other than metal as long as it does not hinder the anodic oxidation according to the present invention.
- the materials other than the metal include, but are not limited to, for example, forces such as silicon, carbon, boron, and phosphorus.
- the solute anion contained in the electrolytic solution used for the anodic oxidation of the present invention is not particularly limited, but anion derived from an aromatic carboxylic acid or hydroxycarboxylic acid is preferred.
- aromatic carboxylic acid a compound having a benzene ring, a condensed benzene ring, a non-benzene aromatic ring, a heteroaromatic ring and the like and a carboxynole group can be used.
- aromatic carboxylic acid having a functional group other than a carboxyl group can be used as long as the desired effect of the present invention is not impaired.
- aromatic carboxylic acids having a nitro group or an amino group such as nitrobenzoic acid, anthranilic acid, monomethylaminobenzoic acid and dimethylaminobenzoic acid can also be used.
- aromatic carboxylic acids can be used alone or in combination of two or more.
- salicylic acid particularly preferred is salicylic acid, phthalic acid, benzoic acid, and ⁇ -resorcinic acid.
- Hydroxycarboxylic acids having optical isomers are not particularly limited in type, and any of L-type, D-type, and DL-type may be used. In addition, even meso body is good. It can be natural or synthetic. Specific examples of hydroxycarboxylic acids include, for example, monooleic acid, glycololeic acid, lactic acid, monooxy_n-butyric acid, monooxyisobutyric acid, monooxyn-valeric acid, monooxyisovaleric acid, 2_oxy_ 2_methylbutyric acid, monooxyacrylic acid; ⁇ -oxyacid, hydroacryloleic acid, ⁇ -oxybutyric acid, / 3-oxyisobutyric acid, j3_oxy_ ⁇ -valeric acid, / 3_oxyisovaleric acid, Hexylhydroacrylic acid, oxypivalic acid; as oxydicarboxylic acid, monohydroxy such as tanotrenoic acid, methyltartronic acid, eth
- a hydroxycarboxylic acid having 2 to 5 carbon atoms having a functional group other than an alcoholic hydroxyl group or a carboxyl group can be used as long as the desired effect of the present invention is not inhibited.
- These hydroxycarboxylic acids may be used alone or in combination of two or more. Of these hydroxycarboxylic acids, lactic acid, malic acid and tartaric acid are preferred.
- one or more aromatic carboxylic acids are contained.
- the counter ion of the solute anion is not particularly limited, but for example, ammonium ions, alkali metal ions, 1, 2, 3 and quaternary alkyl ammonium ions, phosphonium ions and sulfonium ions may be used. Can do. Among them, it is preferable to use ammonium ions or 1, 2, 3 or quaternary alkyl ammonium ions.
- an alkynole ammonium ion the carbon number of the alkyl group can be selected in consideration of solubility in a solvent. Usually, an alkyl group having 1 to 4 carbon atoms is selected.
- solutes may be used singly or in combination of two or more. Moreover, you may use combining said solute and other arbitrary solutes other than the above.
- Ammonium aromatic carboxylic acid is particularly preferable as the solute of the electrolytic solution of the present invention. Salts and ammonium salts of Z or tartaric acid, among which the ammonium salts of aromatic carboxylic acids are preferred and the most preferred is ammonium salicylate.
- the concentration of these solutes in the electrolytic solution of the present invention is not particularly limited as long as it is in a stable dissolved range, but is usually 0.01% by mass or more, preferably 0.1% by mass or more. Particularly preferably, it is 1% by mass or more, usually 30% by mass or less, preferably 25% by mass or less, particularly preferably 15% by mass or less.
- it is desirable that the solute concentration is not too low. In addition, it is desirable that the solute concentration is not too high in order to suppress dissolution of the generated oxide film.
- the electrolytic solution of the present invention uses a non-aqueous solvent containing 4 or more carbon atoms containing an alcoholic hydroxyl group as a main solvent.
- the main solvent is a non-aqueous solvent having 4 or more carbon atoms containing 2 or more alcoholic hydroxyl groups.
- the carbon number of the non-aqueous solvent is 4 or more.
- the non-aqueous solvent in order to increase the electrical conductivity of the electrolyte and facilitate oxidation at normal current density, it is desirable that the non-aqueous solvent not have too many carbon atoms, preferably 15 or less, and more preferably. Is 10 or less.
- the molecular weight of the nonaqueous solvent according to the present invention is preferably 80 or more, particularly 100 or more, and 400 or less, particularly 200 or less.
- non-aqueous solvents examples include glycols such as diethylene glycol, triethylene glycol, and polyethylene glycol, chain alcohols such as butanol and hexanol, and alicyclic alcohols such as cyclohexanol.
- glycols such as diethylene glycol, triethylene glycol, and polyethylene glycol
- chain alcohols such as butanol and hexanol
- alicyclic alcohols such as cyclohexanol.
- One or two or more of these forces are preferable.
- One or more selected from the group consisting of diethylene glycol, triethylene glycol, and polyethylene glycol are preferable.
- Diethylene glycol, triethylene glycol, and polyethylene glycol are also preferably used because they do not conflict with the PRTR method.
- the polyethylene glycol those having an average molecular weight of 100 to 400, particularly 100 to 200 are preferred for the above reasons.
- the number of alcoholic hydroxyl groups in this non-aqueous solvent is not too small. Therefore, the number of alcoholic hydroxyl groups in this non-aqueous solvent is preferably 2 or more. However, in order to increase the electrical conductivity of the electrolyte and facilitate oxidation at normal current density, it is desirable that the number of alcoholic hydroxyl groups in the nonaqueous solvent is not too large, preferably 3 or less. It is.
- the number of alcoholic hydroxyl groups in the non-aqueous solvent is two.
- the main solvent refers to the solvent when one kind of solvent as described above is used alone, and the mass ratio is the largest when two or more kinds of solvents are used in combination. Refers to the solvent.
- the nonaqueous solvent as the main solvent is contained in the total amount of the electrolytic solution in an amount of 50% by mass or more, particularly 80% by mass or more, 99% by mass or less, and particularly 95% by mass or less. It is preferable that In order to form a high-quality oxide film, it is desirable that the amount of the non-aqueous solvent in the electrolytic solution is large. However, in order to increase the electrical conductivity of the electrolyte and facilitate oxidation at normal current density, it is desirable that the amount of the non-aqueous solvent in the electrolyte is not too large.
- the electrolytic solution of the present invention preferably contains water as another solvent (hereinafter referred to as “subsolvent”) of the non-aqueous solvent.
- the content of water with respect to the non-aqueous solvent is preferably 1% by mass or more, more preferably 5% by mass or more, and further preferably 8% by mass or more. It is preferably less than 80% by weight, more preferably less than 60% by weight, and even more preferably less than 50% by weight.
- the electrolyte contains some water.
- the amount of water in the electrolyte is not too large.
- the electrolytic solution of the present invention can be used by mixing a sub-solvent other than water.
- a sub-solvent other than water one kind may be used alone, or two or more kinds may be used in combination.
- This co-solvent is composed of a solvent having an alcoholic hydroxyl group and an aprotic organic solvent. It is preferable to contain one or more solvents selected from the group consisting of
- the solvent having an alcoholic hydroxyl group that can be used as a sub-solvent can be used for both aliphatic alcohols and aromatic alcohols, regardless of the type. Of these, fatty alcohols are preferred. For example, monohydric alcohols such as methanol, ethanol, propanol, and isopropanol; bivalent alcohols such as ethylene glycol and propylene glycol; A solvent having a functional group other than an alcoholic hydroxyl group in the molecule can also be used as long as the desired effect of the present invention is not impaired. For example, it is possible to use a solvent having an alkoxy group such as methyl cecum solve or cecum solve.
- a polar solvent or a nonpolar solvent may be used.
- polar solvents include latonic solvents such as ⁇ -petit-latatotone, ⁇ -valerolatatatone, and 5-valerolatataton; carbonate solvents such as ethylene carbonate, propylene carbonate, and butylene carbonate; ⁇ -methylformamide, ⁇ -ethylformamide Amide solvents such as, ⁇ -Dimethylformamide, ⁇ , ⁇ -Jetylformamide, ⁇ -Methylacetamide, ⁇ , ⁇ -Dimethylacetamide, ⁇ -Methylpyrrolidinone; 3-Methoxypropiononitrile And nitrile solvents such as glutaronitrile; and phosphate ester solvents such as trimethyl phosphate and triethyl phosphate.
- nonpolar solvents include hexane, toluene, silicone oil, and the like.
- the anodic oxidation method is not particularly limited, but it is preferable to first perform a constant current anodizing step at a constant current density and then perform a constant voltage anodizing step at a constant voltage in the next stage.
- the constant current anodizing step is usually performed by direct current, but an alternating current component or a fluctuation component may be added, or the current density may be gradually decreased or gradually increased.
- a method of anodizing at a low current density followed by anodizing at a high current density as proposed in Japanese Patent Application No. 2004-113292, may be used. Les. By using this method in combination, a smooth oxide film with less surface roughness may be obtained.
- the current density in the constant current anodizing step is not particularly limited, but preferably 5 / i A Zcm 2 or more, more preferably 50 ⁇ A / cm 2 or more, further preferably 0. ImA / cm 2 or more, particularly preferably 0.5 mAZcm 2 or more, preferably less than 100 mA / cm 2 , more preferably less than 50 mAZcm 2 More preferably, it is less than 10 mA / cm 2 , particularly preferably less than 5 mA / cm 2 .
- the treatment after the constant current anodization is not particularly limited.
- Constant voltage anodic oxidation is carried out by maintaining the pressure for a certain time and anodizing.
- the ultimate voltage Vf at this time is not particularly limited as long as a sufficient oxide film is formed, but is usually 500 V or less, preferably 200 V or less, more preferably 150 V or less, particularly preferably 100 V or less. Further, it is preferably IV or higher, more preferably 2 V or higher, particularly preferably 3 V or higher.
- the temperature during such anodization is a temperature range in which the electrolyte solution stably exists as a liquid, and is usually 20 ° C or higher, preferably 0 ° C or higher, and usually 150 ° C or lower, preferably 100 °. C or less.
- the anodic oxidation may be performed over the entire surface of the material to be treated, or may be performed only on a part thereof.
- a part to be anodized can be selected in advance by photolithography using a photoresist.
- the oxide film thus obtained has no pinholes and is excellent in surface smoothness. For example, it is possible to reduce the average surface roughness (Ra) or the root mean square surface roughness (RMS) to 50 to 80% compared to the case of using a conventional electrolyte.
- Ra average surface roughness
- RMS root mean square surface roughness
- the method for obtaining the metal oxide film from the material to be treated having the metal oxide film formed as described above may be in accordance with an ordinary method without any particular limitation.
- an acid such as sulfuric acid or sodium hydroxide
- a method of dissolving and removing the material to be treated with an alkaline solution or the like can be used.
- the aluminum substrate that is the processing material is removed, and another metal substrate such as platinum is removed.
- a non-conventional laminate such as platinum Z aluminum anodic oxide film / platinum (to form an oxide film on platinum by anodic oxidation) Is impossible).
- a pure A1 thin film having a thickness of about 300 nm was deposited on an alkali-free glass substrate by ion plating. Next, this film was anodized at a constant current up to 50V at a current density of ImA / cm 2 in a diethylene glycol solution of 10% by weight ammonium salicylate with a water content of 10% by weight, and then constant voltage anodized at 50V for 10 minutes. An oxide film was formed.
- Example 1 an oxide film was formed in the same manner as in Example 1 except that a 1% by mass ammonium salicylate solution having a water content of 30% by mass was used as the electrolytic solution.
- Ra and RMS of the obtained oxide film were 0 ⁇ 20 nm and 0.26 nm, respectively.
- Example 1 an oxide film was formed in the same manner as in Example 1 except that an ethylene Daricol solution of 1% by mass ammonium salicylate having a water content of 10% by mass was used.
- Ra and RMS of the obtained oxide film were 0.24 nm and 0.30 nm, respectively.
- Example 2 an oxide film was formed in the same manner as in Example 1, except that a 1% by mass ammonium salicylate ethylene dalicol solution having a water content of 30% by mass was used.
- Ra and RMS of the obtained oxide film were 0.33 nm and 0.46 nm, respectively.
- Example 3 [Example and comparative example of material to be treated S Ta ]
- a pure Ta thin film having a thickness of about 200 nm was deposited on an alkali-free glass substrate by sputtering. Next, this film was anodized at a constant current of 5 mA at a current density of 0.5 mA / cm 2 in a 1% by weight ammonium salicylate solution of 30% by weight of ammonium salicylate, followed by a constant voltage at 5V for 10 minutes. Anodized to form an oxide film.
- the surface roughness of the obtained oxide film was measured using the software supplied with the SPM (Seiko Instruments Inc .: SPA-300 HV) device.
- the average surface roughness (Ra: defined in JIS B0601)
- the average roughness of the center line expanded to three dimensions) was 0.20 nm. Comparative Example 3
- Example 3 an oxide film was formed in the same manner as in Example 3, except that an ethylene Daricol solution of 1% by mass ammonium salicylate having a water content of 30% by mass was used.
- Ra of the obtained oxide film was 0.27 nm.
- a pure Nb thin film having a thickness of about 400 nm was deposited on an alkali-free glass substrate by sputtering. Next, this film was anodized at a constant current of 5 mA at a current density of 0.5 mA / cm 2 in a 1% by weight ammonium salicylate solution of 30% by weight of ammonium salicylate, followed by a constant voltage at 5V for 10 minutes. Anodized to form an oxide film.
- Example 4 The surface roughness of the obtained oxide film was measured using the software attached to the SPM (Seiko Instruments Inc .: SPA-300 HV) device. The average surface roughness (Ra: defined in JIS B0601) The average roughness of the center line expanded to three dimensions) was 0.93 nm. Comparative Example 4 [0083] In Example 4, an oxide film was formed in the same manner as in Example 4 except that a 1% by mass ammonium salicylate ethylene dalicol solution having a water content of 30% by mass was used.
- Ra of the obtained oxide film was 1.78 nm.
- the oxide film formed using the electrolytic solution according to the present invention containing diethylene glycol as the main solvent is smaller in both Ra and RMS than those using the conventional electrolytic solution containing ethylene glycol as the main solvent. It can be seen that the surface smoothness is excellent. Further, comparing Example 2 with Comparative Example 2, Example 2 has a particularly large effect of improving the surface smoothness when the amount of water in the electrolyte solution is large, where Ra and RMS are significantly smaller than about half of Comparative Example 2. I understand that. Furthermore, the difference in Ra and RMS between Example 1 and Example 2 is significantly smaller than the difference between Ra and RMS in Comparative Example 1 and Comparative Example 2. It can be seen that the effect on film quality (smoothness) is small.
- the electrolytic solution and oxide film forming method of the present invention can be applied to almost all oxide films such as thin film transistors, ceramic capacitors, MIM type diodes, MIM type field emission devices and the like that require dense and surface smoothness. It can employ
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Abstract
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11/577,144 US7906004B2 (en) | 2004-10-12 | 2005-09-29 | Method of forming oxide film by anodically oxidizing in an electrolyte solution |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2004297846 | 2004-10-12 | ||
| JP2004-297846 | 2004-10-12 | ||
| JP2005-084209 | 2005-03-23 | ||
| JP2005084209 | 2005-03-23 |
Publications (1)
| Publication Number | Publication Date |
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| WO2006040939A1 true WO2006040939A1 (ja) | 2006-04-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| PCT/JP2005/018022 Ceased WO2006040939A1 (ja) | 2004-10-12 | 2005-09-29 | 電解液とこれを用いた酸化物皮膜の形成方法、積層体及びその製造方法、並びに金属酸化物膜 |
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| Country | Link |
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| US (1) | US7906004B2 (ja) |
| KR (1) | KR20070060111A (ja) |
| TW (1) | TW200626753A (ja) |
| WO (1) | WO2006040939A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008050674A (ja) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemicals Corp | 酸化物皮膜形成方法および酸化物皮膜形成装置 |
| CN102864427A (zh) * | 2012-10-23 | 2013-01-09 | 南京大学 | 一种利用磁控溅射法制备Nb薄膜的方法 |
| CN102916083A (zh) * | 2012-10-23 | 2013-02-06 | 南京大学 | 一种基于特殊掺杂的超导铌薄膜材料的纳米线单光子探测器的制备方法 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI469219B (zh) * | 2009-02-16 | 2015-01-11 | Nat Univ Tsing Hua | 降低金屬薄膜表面粗糙度的方法 |
| CN102071448A (zh) * | 2009-11-20 | 2011-05-25 | 莱尔德电子材料(深圳)有限公司 | 物理气相沉积(pvd)及冷阳极氧化金属着色 |
| US8905237B2 (en) | 2010-12-17 | 2014-12-09 | The Procter & Gamble Company | Blister cards promoting intuitive dosing |
| US9445970B2 (en) | 2010-12-17 | 2016-09-20 | The Procter & Gamble Company | Blister cards promoting intuitive dosing |
| JP6740579B2 (ja) * | 2015-08-12 | 2020-08-19 | 日本ケミコン株式会社 | 固体電解コンデンサおよび固体電解コンデンサの製造方法 |
| CA3112225C (en) * | 2018-09-11 | 2023-02-14 | Novelis Inc. | Continuous coils containing a thin anodized film layer and systems and methods for making the same |
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| JPH06208934A (ja) * | 1992-09-29 | 1994-07-26 | Matsushita Electric Ind Co Ltd | 電解コンデンサ駆動用電解質 |
| JP2000306913A (ja) * | 1999-02-19 | 2000-11-02 | Mitsubishi Chemicals Corp | 金属配線の製造方法 |
| JP2001131794A (ja) * | 1999-11-02 | 2001-05-15 | Mitsubishi Chemicals Corp | 金属酸化物皮膜形成用化成液 |
| JP2001135636A (ja) * | 1999-11-04 | 2001-05-18 | Mitsubishi Chemicals Corp | 金属酸化物皮膜形成用化成液 |
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| JPH06216389A (ja) | 1993-01-20 | 1994-08-05 | Matsushita Electric Ind Co Ltd | 薄膜トランジスタの製造方法および薄膜トランジスタ |
| JPH09138420A (ja) | 1995-10-30 | 1997-05-27 | Internatl Business Mach Corp <Ibm> | 薄膜トランジスタアレイ基板およびその製造方法 |
| AU9652098A (en) * | 1997-11-18 | 1999-06-07 | Mitsubishi Chemical Corporation | Chemical conversion fluid for forming metal oxide film |
| JPH11246994A (ja) | 1997-11-21 | 1999-09-14 | Mitsubishi Chemical Corp | 金属酸化物皮膜形成用化成液 |
| JP3997035B2 (ja) | 1999-05-17 | 2007-10-24 | 三菱化学株式会社 | 金属酸化物皮膜形成用化成液 |
| US20040256242A1 (en) * | 2003-06-17 | 2004-12-23 | Melody Brian John | Method of anodizing valve metal derived anode bodies and electrolyte therefore |
| US7286336B2 (en) * | 2004-05-14 | 2007-10-23 | Greatbatch Ltd. | Plasma treatment of anodic oxides for electrolytic capacitors |
| US7427776B2 (en) * | 2004-10-07 | 2008-09-23 | Hewlett-Packard Development Company, L.P. | Thin-film transistor and methods |
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2005
- 2005-09-29 KR KR1020077008319A patent/KR20070060111A/ko not_active Ceased
- 2005-09-29 WO PCT/JP2005/018022 patent/WO2006040939A1/ja not_active Ceased
- 2005-09-29 US US11/577,144 patent/US7906004B2/en not_active Expired - Fee Related
- 2005-10-04 TW TW094134595A patent/TW200626753A/zh unknown
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06208934A (ja) * | 1992-09-29 | 1994-07-26 | Matsushita Electric Ind Co Ltd | 電解コンデンサ駆動用電解質 |
| JP2000306913A (ja) * | 1999-02-19 | 2000-11-02 | Mitsubishi Chemicals Corp | 金属配線の製造方法 |
| JP2001131794A (ja) * | 1999-11-02 | 2001-05-15 | Mitsubishi Chemicals Corp | 金属酸化物皮膜形成用化成液 |
| JP2001135636A (ja) * | 1999-11-04 | 2001-05-18 | Mitsubishi Chemicals Corp | 金属酸化物皮膜形成用化成液 |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008050674A (ja) * | 2006-08-28 | 2008-03-06 | Mitsubishi Chemicals Corp | 酸化物皮膜形成方法および酸化物皮膜形成装置 |
| CN102864427A (zh) * | 2012-10-23 | 2013-01-09 | 南京大学 | 一种利用磁控溅射法制备Nb薄膜的方法 |
| CN102916083A (zh) * | 2012-10-23 | 2013-02-06 | 南京大学 | 一种基于特殊掺杂的超导铌薄膜材料的纳米线单光子探测器的制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200626753A (en) | 2006-08-01 |
| US20090023001A1 (en) | 2009-01-22 |
| US7906004B2 (en) | 2011-03-15 |
| KR20070060111A (ko) | 2007-06-12 |
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