WO2006006253A1 - 電子装置の製造方法、はんだ付け方法及び熱遮蔽治具 - Google Patents
電子装置の製造方法、はんだ付け方法及び熱遮蔽治具 Download PDFInfo
- Publication number
- WO2006006253A1 WO2006006253A1 PCT/JP2004/011980 JP2004011980W WO2006006253A1 WO 2006006253 A1 WO2006006253 A1 WO 2006006253A1 JP 2004011980 W JP2004011980 W JP 2004011980W WO 2006006253 A1 WO2006006253 A1 WO 2006006253A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- soldering
- heat
- solder
- component
- absorbing member
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
- H05K2203/304—Protecting a component during manufacturing
Definitions
- the present invention relates to a soldering method suitable for mixed mounting, in particular, soldering using a Pb-free solder alloy with low toxicity, a heat shielding jig used therefor, and a method for manufacturing an electronic device using the same And about.
- soldering an organic substrate or the like on a circuit board are roughly classified into: hot air is blown onto the circuit board, and the solder paste printed on the electrodes is melted to form a surface mount component.
- soldering is performed and a flow soldering process in which a molten jet of solder is brought into contact with a circuit board to solder some surface mounting components such as insertion mounting components and chip components.
- These soldering methods are called mixed mounting methods.
- solder used in this mixed mounting method uses a low-toxicity Pb-free solder alloy. Requests are emerging.
- This Pb-free solder alloy can be used to connect electronic components to circuit boards such as organic substrates, and is an alternative to Sn-37Pb solder (unit: mass%) used for soldering at around 220 ° C. Goods
- Conventional techniques relating to mounting methods using Pb-free solder include Japanese Patent Laid-Open No. 10-166178 (Conventional Technology 1), Japanese Patent Laid-Open No. 11-179586 (Conventional Technology 2), and Japanese Patent Laid-Open No. 11-221 694 Japanese Patent Laid-Open No. 11-354919 (Prior Art 4), Japanese Patent Laid-Open No. 2001-168519 (Prior Art 5), Japanese Patent Laid-Open No. 2001-36233 (Prior Art 6), etc. It has been.
- Prior art 1 describes Sn—Ag_Bi solder or Sn—Ag_Bi—Cu solder alloy as Pb-free solder.
- Prior art 2 describes connecting Sn-Ag-Bi-based solder, which is promising as Pb-free solder, to an electrode with a Sn-Bi-based layer on the surface. ing.
- the prior art 3 the electronic component, on each of both surfaces consisting of first and second surfaces of the organic substrate, a main component Sn, and Bi 0- 65 mass 0/0, Ag 0 ⁇ 5-4 - 0 weight 0/0 has been described that the reflow soldering Kesuru by, Cu or / and summing an in 0- 3. 0 wt% Pb-free solder containing.
- Prior art 4 describes that in a method of connecting an electronic component and a circuit board using Pb-free solder containing Bi, the solder is cooled at a cooling rate of about 10-20 ° C / s. It is listed.
- Conventional Technology 5 electronic components are surface-mounted by reflow soldering on the A side of the board, and then the flow of the electronic components inserted from the A side is flowed to the electrodes by flow soldering on the B side of the board.
- the solder used for reflow soldering on the A side is Sn_ (l. 5-3.
- Prior Art 6 flow soldering has a higher melting point eutectic composition than conventional Sn-37Pb.
- the temperature difference between the organic substrate and the electronic component body must be large when the substrate is cooled after soldering by providing a thermally conductive material between the component body and the substrate. It's been described that you want to do it.
- Patent Document 1 Japanese Patent Laid-Open No. 10-166178
- Patent Document 2 Japanese Patent Laid-Open No. 11-179586
- Patent Document 3 Japanese Patent Laid-Open No. 11-221694
- Patent Document 4 JP-A-11-1354919
- Patent Document 5 Japanese Patent Laid-Open No. 2001-168519
- Patent Document 6 JP 2001-36233 A
- Sn-Ag-Cu-In solders tend to have a shorter temperature cycle life depending on the In content.
- the temperature is 55 ° C-125 ° C, 1 cycle / hour.
- connection reliability such as a temperature cycle life of about 1500 cycles in cycle testing, it is necessary to keep the In content as low as about 5% (Sn-3Ag-0. 5Cu temperature cycle life is about 1800 cycles).
- the present invention provides low heat resistance even when using a solder having a high reflow temperature such as a Sn-3Ag_0.5Cu solder containing no In or a Sn-Ag-Cu-In solder having a low In content. It is an object of the present invention to provide a mounting component soldering method and a heat shielding jig capable of mounting a component, and an electronic device manufacturing method using them.
- a heat shielding jig provided with a heat absorption member is mounted on a surface mount component and heated while the heat absorption member is in contact with the surface mount component.
- a soldering method is provided by performing soldering.
- the heat shielding jig used in the present invention is a height regulating jig provided on the surface of the heat absorbing member that contacts the surface-mounted component. It is desirable to provide further.
- the solder bump height after soldering is desirably 65% or more and 95% or less of the solder bump height after soldering without mounting the heat shielding jig.
- the present invention provides a soldering heat shielding jig comprising a heat absorbing member and a height defining jig provided on one of the front and back surfaces of the heat absorbing member.
- the heat absorbing member used in the present invention is preferably made of aluminum or an aluminum alloy.
- the present invention further includes a component mounting step of mounting a surface-mounted component on a circuit board, and the component mounting step solders the surface-mounted component to the circuit board using the soldering method of the present invention described above.
- An electronic device manufacturing method including the steps is provided.
- normal processes that are not particularly limited can be applied as they are.
- FIG. 1 is an explanatory diagram showing a method for mounting surface-mounted components in Example 1.
- FIG. 2 is a perspective view showing an appearance of a heat shielding jig in Example 2.
- FIG. 3 is an explanatory view showing an example of mounting surface-mounted components in Example 2.
- 11 heat absorbing member, 12 ... surface mount component, 13 ... external connection terminal (solder bump), 14 ... solder paste, 15 ... circuit board, 16 ... solder bump, 20 ... heat shielding jig, 21 ... high A regulating member.
- a reflow-one soldering process in which a surface mount component 12 including a low heat resistant component (heat resistant temperature 220 ° C.) for bump connection is soldered on a circuit board 15 using a solder paste 14
- the heat-absorbing member 11 which is a bulk material with a large heat capacity, is mounted on the upper surface of the package of the surface-mounted component 12 that performs bump connection as shown in FIG.
- the height force of S should be 65% and 95% of the average solder bump height after reflow soldering without loading bulk material.
- connection part may be significantly reduced.
- the mounted heat absorbing member 11 is too light (that is, the heat capacity of the butter material is too small), so the temperature of the bulk material rapidly rises during reflow soldering. In many cases, sufficient heat shielding cannot be achieved. Even when the heat absorbing member 11 with sufficient heat capacity is used, such as by using a height regulating jig, if the sinking of the bump is small, the bump height during reflow soldering When the locality becomes unstable locally, there is a moment when the bulk material and the package are separated at the place where the bump height is the lowest, so the bulk material cannot fully absorb the heat of the package and the heat shielding is insufficient. It may become.
- the heat shielding jig 20 shown in FIG. 2 can be used in the present invention.
- the height of the solder bumps 16 on the surface mount component 12 after reflow soldering is predetermined.
- the jig 20 When the end of the height regulating member 21 provided on the substrate 15 contacts the substrate 15, sinking of the package is suppressed.
- the bump height and the height of the upper surface of the mounting component can be kept constant, and the mounting component can be prevented from being inclined.
- the heat absorbing member 11 of the heat shielding jig 20 is made of aluminum or aluminum from the viewpoint of heat capacity. It is desirable to use a minimum alloy. This is because aluminum or aluminum-based alloys have a relatively large specific heat among metal materials and can absorb a lot of heat from low heat-resistant parts.
- substrates and parts are heated by using an infrared heater and hot air in combination, but aluminum or aluminum-based alloys have an infrared reflectance that is as large as gold and silver, and are not conductive to the surface of the material.
- the formation of the state makes it difficult for the surface state to change, and the low cost is an advantage.
- the heat absorbing member 11 is desirably a bulk material having a certain height and volume. Furthermore, the heat absorption member is placed on the upper surface of the component 12 (the surface opposite to the substrate) so as not to block the hot air from the reflow furnace that flows between the surface-mounted component 12 and the substrate 15 that perform bump connection. It is desirable.
- Full grid BGA (heat resistant temperature: 220 ° C, component size: 17mm X 17mm, bump pitch: lmm, number of bumps: 256, bump solder composition: Sn_37Pb), which is a low heat resistant component, is soldered to package 12.
- the paste (composition: Sn_3Ag_0.5Cu_5In, supply thickness: 0.15mm) 14 is placed on the printed circuit board 15, and the aluminum bulk material 11 (size) is used as a heat-shielding tool 20 on the full grid BGA package. : 17mm X 17mm, thickness: 4mm) and reflow soldering.
- the reflow conditions were such that reflow was possible with Sn-3Ag-0.5Cu solder base. It is known that the average bump height becomes 0 ⁇ 75mm when reflow is performed without loading bulk material 11 on this full grid BGA.
- the use of the cover-type heat shielding jig is effective in reducing the temperature of the package part without reducing the temperature of the bump part of the low heat-resistant component (full grid BGA) as much as possible. It was found that there was almost no difference from the case where no tools were used.
- the bump portion to be soldered reaches 222 ° C to 223 ° C, and a margin of 7 ° C to 8 ° C is obtained.
- the solder bump height of the surface mounted component after reflow soldering is the average solder bump after reflow soldering without loading bulk material. It was also confirmed that a normal connection shape was obtained that would be 70% of the height and would not cause a significant decrease in connection reliability.
- FIG. 2 A full grid BGA is used in the same manner as in Example 1 except that the shape of the heat shielding jig used is different. Reflow soldering was performed.
- the heat shielding jig 20 used in this embodiment includes four columnar height regulating members 21 at the four corners of the lower surface of the heat absorbing member 11.
- Fig. 2 (a) is a perspective view seen from the upper surface, that is, the side that faces upward when loaded
- Fig. 2 (b) is a perspective view seen from the lower surface, that is, the side that contacts the mounted component when loaded.
- the full grid BGA package portion is thermally shielded by the butter-like heat absorbing member 11 mounted thereon.
- the heat shielding member 20 is provided with the height regulating member 21, the solder bump height force of the surface mount component after reflow soldering Bulk material If 90% of the average solder bump height after reflow soldering is reached without loading the solder, the end of the jig 21 comes into contact with the substrate 15 and the sinking of the package is suppressed.
- the package part of the low heat resistant component (full grid BGA) 12 has a heat resistant temperature of 218 ° C.
- the temperature profile was adjusted before soldering.
- Table 3 shows the temperature of each part around the parts during reflow soldering in this example.
- the solder bump height of the surface-mounted component after reflow soldering is determined after reflow soldering without loading bulk material. It was also confirmed that the normal solder bump height was 90% of the average solder bump height, and a normal connection shape that did not cause a significant decrease in connection reliability was obtained.
- a low heat resistant component having a heat resistant temperature of about 220 ° C. can be mounted and mounted, which is suitable for manufacturing an electronic device.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
Claims
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004205227A JP2006032436A (ja) | 2004-07-12 | 2004-07-12 | 電子装置の製造方法、はんだ付け方法及び熱遮蔽治具 |
JP2004-205227 | 2004-07-12 |
Publications (1)
Publication Number | Publication Date |
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WO2006006253A1 true WO2006006253A1 (ja) | 2006-01-19 |
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Family Applications (1)
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PCT/JP2004/011980 WO2006006253A1 (ja) | 2004-07-12 | 2004-08-20 | 電子装置の製造方法、はんだ付け方法及び熱遮蔽治具 |
Country Status (2)
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JP (1) | JP2006032436A (ja) |
WO (1) | WO2006006253A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2707895A4 (en) * | 2011-05-10 | 2015-08-12 | Kla Tencor Corp | HEAD CABLE MODULE FOR A METROLOGY DEVICE WITH ONE SUBSTRATE |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111246680B (zh) * | 2020-02-07 | 2021-02-09 | 浪潮商用机器有限公司 | 一种保障板卡的可靠性和寿命的方法、装置 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11298131A (ja) * | 1998-04-07 | 1999-10-29 | Matsushita Electric Ind Co Ltd | ボンド塗布装置 |
JP2000031342A (ja) * | 1998-07-14 | 2000-01-28 | Nec Corp | Icパッケージ |
JP2003051672A (ja) * | 2001-08-06 | 2003-02-21 | Matsushita Electric Ind Co Ltd | リフロー半田付け装置 |
-
2004
- 2004-07-12 JP JP2004205227A patent/JP2006032436A/ja active Pending
- 2004-08-20 WO PCT/JP2004/011980 patent/WO2006006253A1/ja active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11298131A (ja) * | 1998-04-07 | 1999-10-29 | Matsushita Electric Ind Co Ltd | ボンド塗布装置 |
JP2000031342A (ja) * | 1998-07-14 | 2000-01-28 | Nec Corp | Icパッケージ |
JP2003051672A (ja) * | 2001-08-06 | 2003-02-21 | Matsushita Electric Ind Co Ltd | リフロー半田付け装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2707895A4 (en) * | 2011-05-10 | 2015-08-12 | Kla Tencor Corp | HEAD CABLE MODULE FOR A METROLOGY DEVICE WITH ONE SUBSTRATE |
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JP2006032436A (ja) | 2006-02-02 |
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