WO2005117148A1 - 発光ダイオードランプ - Google Patents
発光ダイオードランプ Download PDFInfo
- Publication number
- WO2005117148A1 WO2005117148A1 PCT/JP2005/007522 JP2005007522W WO2005117148A1 WO 2005117148 A1 WO2005117148 A1 WO 2005117148A1 JP 2005007522 W JP2005007522 W JP 2005007522W WO 2005117148 A1 WO2005117148 A1 WO 2005117148A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- electrode
- light
- emitting diode
- diode chip
- light emitting
- Prior art date
Links
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 57
- 239000000057 synthetic resin Substances 0.000 claims abstract description 57
- 239000004065 semiconductor Substances 0.000 claims abstract description 23
- 239000000126 substance Substances 0.000 claims abstract description 23
- 239000000843 powder Substances 0.000 claims abstract description 21
- 239000012212 insulator Substances 0.000 claims description 12
- 230000002093 peripheral effect Effects 0.000 claims description 11
- 238000001579 optical reflectometry Methods 0.000 claims description 3
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 229910052751 metal Inorganic materials 0.000 description 20
- 239000002184 metal Substances 0.000 description 20
- 230000000694 effects Effects 0.000 description 4
- 239000012528 membrane Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002994 synthetic fiber Polymers 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/505—Wavelength conversion elements characterised by the shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1204—Optical Diode
- H01L2924/12041—LED
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
Definitions
- the present invention provides a force for die bonding a light emitting diode chip to the inner bottom surface of a cup formed by recessing the tip of a metal lead terminal, and packaging the tip of the lead terminal with a transparent synthetic resin.
- a light-emitting diode lamp in which a transparent synthetic resin is filled in a cup portion, a light-reflecting electrode film is formed on the inner surface of the cup portion formed by recessing an insulator, and a light-emitting diode chip is mounted on the inner bottom surface of the cup portion.
- the present invention relates to a light emitting diode lamp formed by bonding and filling a transparent synthetic resin in the cup.
- the surface of the light emitting diode chip is made to transmit light containing phosphor powder. It has been practiced to coat with a synthetic resin, partially convert the wavelength of the blue light emission to yellow with the fluorescent substance in the film, and convert the color to white light with high luminance by mixing these colors.
- FIG. 5 of Patent Document 1 as a prior art shows that, at the tip of one of the two metal lead terminals, a cup portion having an inner peripheral surface serving as a light reflecting surface is recessed. Then, a blue light emitting diode chip is die-bonded to the inner bottom surface of the cup portion, and the light emitting diode chip is connected to the other lead terminal with a thin metal wire, while the tip portions of both lead terminals are connected.
- the cup portion is previously filled with a light-transmitting synthetic resin containing a powder of a fluorescent substance so as to bury the entire light-emitting diode chip. Accordingly, it has been proposed to convert the color to white light emission.
- an inner peripheral surface is provided on a front end surface of an insulator.
- a cup portion having a surface recessed in a shape expanding outward is provided, an electrode film having light reflectivity is formed on the inner surface of the cup portion, and a blue light emitting diode chip is die-bonded to the inner bottom surface of the cup portion.
- the inside of the cup portion is filled with a light-transmitting synthetic resin containing a powder of a fluorescent substance so as to bury the whole of the light-emitting diode chip, thereby converting the color tone to white light emission.
- Patent Document 1 JP-A-11-40848
- the light-transmitting synthetic resin containing the powder of the fluorescent substance is applied to the entire inside of the cup portion in a liquid state.
- the light emitting diode chip is filled so as to be buried therein, and the light emitted from the light emitting diode chip is made of a light-transmitting synthetic resin containing a fluorescent substance powder filled in the cup portion.
- the wavelength is converted and the direction is changed in the direction of going out of the cup portion by the light reflecting surface on the inner surface of the cup portion. In other words, the fluorescent material is dispersed.
- the present invention relates to a light-emitting diode lamp in which the color tone of light emitted from a light-emitting diode chip is changed by a light-transmitting synthetic resin containing a powder of a fluorescent substance, and the above-described problems are caused. It is a technical task to avoid such a situation.
- claim 1 of the present invention is directed to at least two pairs of lead terminals and a shape having a shape in which the inner peripheral surface is outwardly spread at the tip of one of the lead terminals.
- the cup portion recessed to serve as a light reflecting surface, the light emitting diode chip, and the two lead terminals A transparent synthetic resin body for packaging a tip portion of the light emitting diode chip, or a transparent synthetic resin body for filling the light emitting diode chip in the cup part so as to package the light emitting diode chip.
- claim 2 of the present invention provides at least an insulator, a cup portion formed by recessing the insulator so that an inner peripheral surface is outwardly widened, and a light reflective surface formed on the inner surface of the cup portion.
- a light-emitting diode chip comprising a light-emitting diode chip, a light-emitting diode chip, and a transparent synthetic resin body filled in the cup portion so as to package the light-emitting diode chip.
- the light emitting diode chip is formed in a laminated shape, and the side surface excluding the n-electrode and the p-electrode is covered with a light-transmitting synthetic resin containing a powder of a fluorescent substance.
- the semiconductor device is characterized in that the n-electrode is disposed inside the cup with the n-electrode facing upward, and die-bonding is performed so that the downward n-electrode or p-electrode is connected to the electrode film on the inner bottom surface of the cup.
- a third aspect of the present invention is the light emitting diode lamp according to the first aspect, wherein the power part is formed in a horizontally long and rectangular shape in plan view, and the entirety of the both lead terminals is A plate-shaped transparent synthetic resin body is characterized in that it is packaged so that a part of the both lead terminals is exposed as a connection terminal on one surface of the transparent synthetic resin body.
- Claim 4 of the present invention relates to the light-emitting diode lamp according to claim 2, wherein The edge body is formed in a plate shape, and the cup portion is formed in a horizontally long rectangular shape in plan view.
- a fifth aspect of the present invention is the light emitting diode lamp according to any one of the first to fourth aspects, wherein an upward p-electrode or an n-electrode of the light-emitting diode chip includes a fluorescent substance powder. It is characterized by applying a transparent synthetic resin.
- the light-emitting diode chip is provided with the n-electrode or p-electrode on the upper surface and a p-electrode or n-electrode on the lower surface, and an n-semiconductor layer and a p-semiconductor layer are interposed between the n-electrode and the p-electrode.
- the light emitting die is formed by forming a laminate with a light emitting layer interposed therebetween and further covering the side surface excluding the n-electrode and the p-electrode with a light-transmitting synthetic resin containing a powder of a fluorescent substance. Light emitted from the light emitting layer of the chip is mainly emitted laterally from the side surface between the n-electrode and the p-electrode, through the light-transmitting synthetic resin covering the side surface.
- the light emitting diode chip having the above-described structure is arranged inside a cup portion formed in a lead terminal or an insulator with its n-electrode or p-electrode facing downward and the p-electrode or n-electrode facing upward. Then, the downwardly directed n-electrode or p-electrode is die-bonded so as to be electrically connected to the inner bottom surface of the cup part or to the electrode film on the inner bottom surface, so that the light-transmitting synthetic resin on the side surface is transmitted and the side surface is horizontally oriented.
- the light emitted to the cup is converted into a wavelength when passing through the light-transmitting synthetic resin, and the light after this wavelength is converted into light inside the cup at a light reflecting surface on the inner peripheral surface of the cup. Will be reflected in the direction of exit
- the wavelength conversion and the light reflection are not performed during the transmission through the light-transmitting synthetic resin containing the powder of the fluorescent substance, but the fluorescent substance is first
- the wavelength is converted by a light-transmitting synthetic resin containing powder, and after the wavelength is converted, light is reflected, so that the light attenuation rate is significantly reduced as compared with the prior art. Therefore, the brightness of light as a light emitting diode lamp can be significantly improved.
- the light-transmitting synthetic material containing a fluorescent substance powder entirely inside the cup portion is also used. Since the resin is not filled, the variation of the color tone obtained by converting the wavelength with the light-transmitting synthetic resin containing the powder of the fluorescent substance can be reduced to a smaller extent than in the case of the prior art. .
- the two lead terminals are formed.
- a light-emitting diode lamp with high cost and little variation in color tone can be configured as a surface mount type. Powerful surface-mounted light-emitting diode lamps are very useful when used as a backlight source in liquid crystal displays and the like.
- the insulator is formed in a plate shape, and the cup portion is horizontally long and rectangular in a plan view.
- a light emitting diode lamp having high light brightness and little variation in color tone can be configured as a surface mount type, as in the case of the above-described claim 3.
- a light-emitting surface-mounted light-emitting diode lamp can be configured.
- the light-emitting diode lamp according to any one of claims 1 to 4 when the configuration described in claim 5 is adopted, light leaking from an upward p-electrode or an n-electrode of the light-emitting diode chip is reduced.
- the light-transmitting synthetic resin containing the powder of the fluorescent substance applied to the upward p-electrode or n-electrode can be converted into the same color tone as the light-transmitting synthetic resin on the side surface of the light emitting diode chip, and By forming the light-transmitting synthetic resin containing the powder of the fluorescent substance on the side surface and the upper surface of the light emitting diode chip, fine adjustment of the chromaticity becomes possible.
- FIG. 1 is an enlarged view of a main part showing a light emitting diode lamp according to a first embodiment.
- FIG. 2 is a partially cutaway side view of a light emitting diode chip used in the present invention.
- FIG. 3 is a plan view of FIG. 2.
- FIG. 4 is an enlarged view of a main part showing a light emitting diode lamp according to a second embodiment.
- Garden 5 is an enlarged view of a main part showing a light emitting diode lamp according to a third embodiment.
- FIG. 6 is an enlarged view of a main part showing a light emitting diode lamp according to a fourth embodiment.
- FIG. 7 is a longitudinal sectional front view showing a light emitting diode lamp according to a fifth embodiment.
- FIG. 8 is a sectional view taken along the line VIII-VIII in FIG. 7.
- FIG. 9 is a vertical sectional front view showing a light emitting diode lamp according to a sixth embodiment.
- FIG. 10 is a sectional view taken along line XX of FIG. 9.
- FIG. 1 shows a light emitting diode lamp 1 according to a first embodiment.
- the light emitting diode lamp 1 includes a pair of two lead terminals 2 and 3 made of a metal plate and a die-bonded die attached to a tip end surface of one of the two lead terminals 2 and 3.
- a light emitting diode chip 4 having the structure described above, a metal wire 5 wire-bonded between the light emitting diode chip 4 and the other lead terminal 3, and a transparent package for packaging the leading end portions of the two lead terminals 2 and 3.
- a molded part 6 made of synthetic resin.
- the tip of the mold section 6 is formed on a lens section 7 having a focal point at or near the light emitting diode chip 4.
- a cup portion 8 is formed in a portion of the one end where the light emitting diode chip 4 is die-bonded, and an inner peripheral surface of the cup portion 8 has a conical light reflecting surface 9. It is formed in
- At least the inner surface of the cup portion 8 of the surfaces of the two lead terminals 2 and 3 includes: A metal plating that reflects light, for example, a silver plating is provided.
- FIG. 2 and FIG. 3 show details of the light emitting diode chip 4.
- the light-emitting diode chip 4 has a p-type semiconductor layer 4b under a transparent thick n-type semiconductor layer 4a such as an n-type SiC crystal substrate, and a blue light-emitting layer 4c interposed therebetween.
- a part of the side surface around the light emitting diode chip 4 is formed with an inclined surface 4 ′ such that the width W 1 at the upper portion is smaller than the width W 2 at the lower portion. .
- the side surface of the light-emitting diode chip 4 other than the n-electrode 4d on the upper surface and the p-electrode 4e on the lower surface is in a powdery state in which the phosphor is adapted to convert the color of blue light into white light. Covered with a light-transmitting synthetic resin 10.
- the light emitting diode chip 4 having the above structure is connected to the force at the one lead terminal 2.
- the p-electrode 4e is supplied with the n-electrode 4d facing upward into the cap portion 8, and the conductive paste is applied so that the p-electrode 4e is electrically connected to the inner bottom surface of the cup portion 8.
- die bonding is performed in a solder, and then a metal wire 5 from the other lead terminal 3 is connected to the upward n-electrode 4d of the light emitting diode chip 4.
- leading end portions of the two lead terminals 2 and 3 are made of a transparent synthetic resin body 6 having a lens portion at the leading end. Package so that it protrudes downward from the lower surface of 6.
- the blue light emission in the light emitting layer 4 c of the light emitting diode chip 4 by applying a current between the two lead terminals 2 and 3 is mainly due to the lateral force of the light emitting diode chip 4 and the side surface force of the cup portion 8.
- the light is laterally emitted with a force directed to the light reflecting surface 9 on the inner peripheral surface, the light is transmitted through the light transmitting synthetic resin 10 covering the side surface, and is included in the light transmitting synthetic resin 10.
- the color is converted into white light by the fluorescent substance, and then reflected by the light reflecting surface 9 in the direction of going out of the cup portion 8.
- part of the blue light emitted from the light emitting layer 4c of the light emitting diode chip 4 is a force that is emitted upward from the n-electrode 4d on the upper surface.
- the n-electrode 4d is connected to the metal wire 5 by the wire bonding as in the light emitting diode lamp 11 according to the second embodiment shown in FIG.
- the resin 12 By coating the resin 12 with the resin 12, all of the blue light emitted from the light emitting layer 4c of the light emitting diode chip 4 can be converted into white light.
- the light emitting diode chip 4 is placed in the cup portion 8 of the one lead terminal 2 with its n-electrode 4d facing upward.
- the p electrode 4e is die-bonded downward and the metal wire 5 from the other lead terminal 3 is connected to the upward n-electrode 4d, but the light emitting diode lamp 21 according to the third embodiment shown in FIG.
- the light emitting diode chip 4 is die-bonded in the cup portion 8 of the one lead terminal 2 with its p-electrode 4e facing upward and the n-electrode 4d facing downward, and the other is connected to the p-electrode 4e upward.
- the metal wire 5 from the lead terminal 3 When the metal wire 5 from the lead terminal 3 is connected, a configuration similar to that of the first embodiment can be obtained, whereby the same effect as that of the first embodiment can be obtained. Furthermore, in the configuration shown in FIG. 5, when a part of the blue light emission is emitted upward from the p-electrode 4e on the upper surface, the p-electrode 4e is connected to the fourth electrode shown in FIG. Like the light emitting diode lamp 31 according to the embodiment, after the metal wire 5 is connected by the wire bonding, the light emitting synthetic resin 32 containing the same fluorescent substance in a powder state is coated on the light emitting synthetic resin 32 to thereby form the light emitting diode. All of the blue light emitted from the light emitting layer 4c of the chip 4 can be converted into white light.
- FIGS. 7 and 8 show a light emitting diode lamp 41 according to a fifth embodiment.
- the light emitting diode lamp 41 has a cup portion ⁇ at the tip end surface of one of the two lead terminals 2 'and 3' made of a metal plate, with the inner peripheral surface facing outward.
- the light emitting diode chip 4 having the structure shown in FIG. 2 and FIG. 3 is formed inside the cup portion ⁇ by forming a concave so as to have a light reflecting surface 9 which spreads, and the n electrode 4d with the p electrode 4e facing downward.
- the p-electrode 4e is supplied upward and die-bonded with a conductive paste or solder so that the p-electrode 4e is electrically connected to the inner bottom surface of the cup portion ⁇ . Connect a metal wire from the other lead terminal to electrode 4d.
- the entirety of the two lead terminals 2 ′ and 3 ′ is made into a plate-shaped transparent synthetic resin body 6 ′, and a part of both the lead terminals and 3 ′ is made of the transparent synthetic resin body 6 ′.
- the package is configured so that the connection terminals 2 and 3 are exposed on one surface 6 of FIG.
- FIGS. 9 and 10 show a light emitting diode lamp 51 according to a sixth embodiment.
- the light-emitting diode lamp 51 has a cup-shaped portion 8 ′′ having a shape in which the inner peripheral surface expands outwardly, which is formed in the distal end surface of a plate-shaped insulator 52. Then, a light-reflective electrode film 2 ⁇ made of a metal such as silver is formed, and the inside of the cup portion 8 ⁇ is The light emitting diode chip 4 having the structure shown in FIGS. 2 and 3 is supplied with its p-electrode 4e facing downward and the n-electrode 4d facing upward, and the p-electrode 4e is applied to the electrode film 2 ′′ in the cup portion 8.
- a transparent synthetic resin body 6 # is packaged inside the cup portion 8 #, and the light emitting diode chip 4 and the metal wire 5 # are packaged with the transparent synthetic resin body 6 #. It is configured to be filled like this.
- the same effects as those of the above-described embodiments can be obtained, and in addition, a thin plate-shaped body and a metal lead terminal are used. No, therefore, the light-emitting diode lamp 51 of a light-weight surface mount type can be configured.
- the cup portions and 8 ⁇ ⁇ ⁇ are formed in a horizontally long rectangle so that they can be used as a backlight light source in a liquid crystal display device or the like.
- the second embodiment shown in FIG. 4, the third embodiment shown in FIG. 5, and the fourth embodiment shown in FIG. 6 can be applied to both of the fifth and sixth embodiments. Needless to say.
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11/597,493 US7772597B2 (en) | 2004-05-27 | 2005-04-20 | Light emitting diode lamp |
EP05734311A EP1791188A1 (en) | 2004-05-27 | 2005-04-20 | Light emitting diode lamp |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004-157221 | 2004-05-27 | ||
JP2004157221A JP3994094B2 (ja) | 2004-05-27 | 2004-05-27 | 発光ダイオードランプ |
Publications (1)
Publication Number | Publication Date |
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WO2005117148A1 true WO2005117148A1 (ja) | 2005-12-08 |
Family
ID=35451166
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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PCT/JP2005/007522 WO2005117148A1 (ja) | 2004-05-27 | 2005-04-20 | 発光ダイオードランプ |
Country Status (6)
Country | Link |
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US (1) | US7772597B2 (ja) |
EP (1) | EP1791188A1 (ja) |
JP (1) | JP3994094B2 (ja) |
KR (1) | KR20070025899A (ja) |
CN (1) | CN100466309C (ja) |
WO (1) | WO2005117148A1 (ja) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1976030A1 (en) | 2006-01-04 | 2008-10-01 | Rohm Co., Ltd. | Thin-type light emitting diode lamp, and its manufacturing |
TWI460881B (zh) | 2006-12-11 | 2014-11-11 | Univ California | 透明發光二極體 |
TWI463708B (zh) * | 2009-02-24 | 2014-12-01 | Advanced Optoelectronic Tech | 側面出光型發光元件封裝結構及其製造方法 |
JP5496570B2 (ja) * | 2009-08-05 | 2014-05-21 | シャープ株式会社 | 発光装置 |
US20120106126A1 (en) * | 2010-11-01 | 2012-05-03 | Seiko Epson Corporation | Wavelength conversion element, light source device, and projector |
CN103137839B (zh) * | 2013-02-19 | 2015-12-02 | 东南大学 | 一种薄片型白光led封装结构 |
JP6322828B2 (ja) * | 2014-02-07 | 2018-05-16 | ローム株式会社 | 発光モジュールおよび発光装置 |
US10090448B2 (en) | 2014-02-07 | 2018-10-02 | Rohm Co., Ltd. | Light-emitting module, light-emitting device and method of making light-emitting module |
CN208963686U (zh) | 2018-06-15 | 2019-06-11 | 泉州梅洋塑胶五金制品有限公司 | 一种新型密封包装容器 |
US11592166B2 (en) | 2020-05-12 | 2023-02-28 | Feit Electric Company, Inc. | Light emitting device having improved illumination and manufacturing flexibility |
US11876042B2 (en) | 2020-08-03 | 2024-01-16 | Feit Electric Company, Inc. | Omnidirectional flexible light emitting device |
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JP2003218401A (ja) * | 2002-01-18 | 2003-07-31 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
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JPH0291980A (ja) * | 1988-09-29 | 1990-03-30 | Toshiba Lighting & Technol Corp | 固体発光素子 |
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JP3257455B2 (ja) | 1997-07-17 | 2002-02-18 | 松下電器産業株式会社 | 発光装置 |
US6340824B1 (en) * | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
JP3707279B2 (ja) * | 1998-03-02 | 2005-10-19 | 松下電器産業株式会社 | 半導体発光装置 |
CN1396667A (zh) * | 2001-07-16 | 2003-02-12 | 诠兴开发科技股份有限公司 | 发光二极管的封装 |
JP2003258320A (ja) * | 2002-02-28 | 2003-09-12 | Rohm Co Ltd | 発光ダイオードランプ |
CN2567782Y (zh) * | 2002-03-18 | 2003-08-20 | 常耀辉 | 高亮度白光的二极管白光光源 |
US6791116B2 (en) * | 2002-04-30 | 2004-09-14 | Toyoda Gosei Co., Ltd. | Light emitting diode |
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2004
- 2004-05-27 JP JP2004157221A patent/JP3994094B2/ja not_active Expired - Fee Related
-
2005
- 2005-04-20 WO PCT/JP2005/007522 patent/WO2005117148A1/ja active Application Filing
- 2005-04-20 CN CNB2005800005714A patent/CN100466309C/zh not_active Expired - Fee Related
- 2005-04-20 US US11/597,493 patent/US7772597B2/en active Active
- 2005-04-20 KR KR1020057019171A patent/KR20070025899A/ko not_active Application Discontinuation
- 2005-04-20 EP EP05734311A patent/EP1791188A1/en not_active Withdrawn
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JP2000312033A (ja) * | 1999-02-25 | 2000-11-07 | Nichia Chem Ind Ltd | 発光ダイオード及びそれを用いたドットマトリックスディスプレイ |
JP2002261325A (ja) * | 2001-03-02 | 2002-09-13 | Nichia Chem Ind Ltd | 発光装置およびその製造方法 |
JP2002324915A (ja) * | 2001-04-24 | 2002-11-08 | Nichia Chem Ind Ltd | 集積型窒化物半導体発光素子 |
JP2002353518A (ja) * | 2001-05-28 | 2002-12-06 | Nitto Denko Corp | 光半導体装置 |
WO2003034508A1 (en) * | 2001-10-12 | 2003-04-24 | Nichia Corporation | Light emitting device and method for manufacture thereof |
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JP2003218401A (ja) * | 2002-01-18 | 2003-07-31 | Matsushita Electric Ind Co Ltd | 半導体発光装置およびその製造方法 |
Also Published As
Publication number | Publication date |
---|---|
US7772597B2 (en) | 2010-08-10 |
CN100466309C (zh) | 2009-03-04 |
US20070221934A1 (en) | 2007-09-27 |
JP3994094B2 (ja) | 2007-10-17 |
KR20070025899A (ko) | 2007-03-08 |
JP2005340494A (ja) | 2005-12-08 |
CN1820379A (zh) | 2006-08-16 |
EP1791188A1 (en) | 2007-05-30 |
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