WO2005116141A1 - Composition de résine thermoplastique - Google Patents

Composition de résine thermoplastique Download PDF

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Publication number
WO2005116141A1
WO2005116141A1 PCT/JP2005/000987 JP2005000987W WO2005116141A1 WO 2005116141 A1 WO2005116141 A1 WO 2005116141A1 JP 2005000987 W JP2005000987 W JP 2005000987W WO 2005116141 A1 WO2005116141 A1 WO 2005116141A1
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WO
WIPO (PCT)
Prior art keywords
resin composition
thermoplastic resin
acid
composition according
liquid crystal
Prior art date
Application number
PCT/JP2005/000987
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English (en)
Japanese (ja)
Inventor
Yoshiaki Taguchi
Toshio Nakane
Toshiaki Yokota
Original Assignee
Polyplastics Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2004211511A external-priority patent/JP2006008964A/ja
Application filed by Polyplastics Co., Ltd. filed Critical Polyplastics Co., Ltd.
Publication of WO2005116141A1 publication Critical patent/WO2005116141A1/fr

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/04—Polyesters derived from hydroxycarboxylic acids, e.g. lactones

Definitions

  • the present invention relates to a thermoplastic resin composition suitably used for injection molded articles and the like, comprising a non-crystalline liquid crystal resin and a molding resin that does not show optical anisotropy when melted. More specifically, it significantly improves the fluidity of a molding resin that does not exhibit optical anisotropy when melted into a matrix, has excellent heat deformation temperature and rigidity, and has less peeling of the surface of the molded body.
  • the present invention also relates to a thermoplastic resin composition having excellent heat resistance.
  • Liquid crystal resins are well-suited and widely used as high-performance engineering plastics because they have excellent balance of fluidity, mechanical strength, heat resistance, chemical resistance, and electrical properties.
  • liquid crystal resins With the remarkable industrial development in recent years, the applications of such liquid crystal resins have been diversified, and there has been a tendency to become more sophisticated and specialized.
  • injection molding and the like make it more efficient and economical. It has been expected to obtain an injection molded product or the like which retains its excellent physical properties by molding.
  • high mechanical properties and high heat resistance are required for outer panels of automobiles, housings for electric and electronic products, etc. in order to reduce the weight and thickness of the molded body, and the molded body is large and has a high appearance. Is required.
  • liquid crystal resin is not suitable for the exterior of automobiles and housings for electric and electronic products because of the appearance of the molded product, and it is difficult to use it versatile for large products from the viewpoint of cost. there were.
  • Patent Documents 13 and 13 all attempt to improve fluidity, heat resistance, and mechanical properties by using a resin composition of an amorphous resin and a liquid crystal resin.
  • Patent Documents 13 and 13 all attempt to improve fluidity, heat resistance, and mechanical properties by using a resin composition of an amorphous resin and a liquid crystal resin.
  • the appearance of the molded body, particularly the surface of the molded body is peeled off by a small impact, and the technology disclosed in these patent documents is disclosed. Now, solve this problem It is hard to say that there is.
  • Patent Document 1 JP 2002-80724 A
  • Patent Document 2 JP 2001-192518 A
  • Patent Document 3 JP 2000-159957 A
  • the present invention solves the above-mentioned problems of the prior art, and has excellent heat deformation temperature and rigidity.
  • thermoplastic resin composition which is less likely to peel off the surface of a molded product and has excellent appearance, and which is suitably used for an outer panel for automobiles and a housing for electric and electronic products.
  • the inventors of the present invention have conducted intensive studies to achieve the above object, and as a result, by mixing a specific liquid crystal resin with a molding resin that does not exhibit optical anisotropy when molten as a matrix.
  • the present inventors have found that a thermoplastic resin composition having excellent mechanical properties and appearance can be obtained while significantly improving the fluidity of a molding resin serving as a matrix and maintaining good heat resistance. Reached.
  • the present invention relates to a molding resin (A) having no optical anisotropy when melted with respect to 100 parts by weight of an amorphous liquid crystal resin (A) having the following features (1) and (4).
  • a thermoplastic resin composition containing 100 to 900 parts by weight.
  • the glass transition temperature is in the range of 100-180 ° C
  • melt viscosity at 230 ° C and a shear rate of lOOOOsec- 1 is 50 2000 Pa's
  • thermoplastic resin composition comprising the specific amorphous liquid crystal resin (A) of the present invention and a molding resin which does not exhibit optical anisotropy when melted) has high fluidity and moldability. Further, the surface of the obtained molded article has little peeling and is excellent in appearance. In addition, since it has excellent rigidity and heat deformation temperature, it is suitable for outer panels for automobiles and housings for electric and electronic products.
  • the amorphous liquid crystal resin (A) used in the present invention has no melting point observed by DSC measurement at a heating rate of 20 ° C / min, softens near the glass transition temperature, and becomes substantially amorphous. It is necessary that This is because the amorphous liquid crystal resin shows excellent fluidity by cooling from the molten state and maintaining the molten state up to the glass transition temperature without being crystallized in the process and being flowable. For polymers that can be observed, the fluidity improving effect is not desirable due to the higher temperature processing process, which is not desirable.
  • the glass transition temperature and liquid crystallinity can be considered as indices of the processability of the present invention. Whether or not it exhibits liquid crystallinity is closely related to the fluidity during melting, and it is essential that the amorphous liquid crystal resin of the present application exhibit liquid crystallinity in a molten state.
  • a nematic liquid crystal resin exhibits liquid crystallinity at a temperature equal to or higher than the melting point, and is subjected to various molding processes and then cooled to a temperature lower than a crystallization temperature, thereby solidifying the shape of the molded product. Is done.
  • the amorphous liquid crystal resin of the present invention does not crystallize, the fluidity is not impaired until the resin temperature reaches the vicinity of the glass transition temperature. It can be said. Therefore, the glass transition temperature is preferably 100 ° C. or more from the viewpoints of heat resistance of the molded article and efficiency of the drying step of the resin pellets. On the other hand, if the glass transition temperature is higher than 180 ° C, it is necessary to raise the process temperature significantly, which is not preferable.
  • melt viscosity at a shear rate of 100 sec- 1 at a temperature 70 to 120 ° C higher than the glass transition temperature, preferably 230 ° C, is preferably 502000 Pa's. More preferably, it is 800 Pa's or less. These melt viscosities are generally realized by having liquid crystallinity.
  • melt anisotropy can be confirmed by a conventional polarization inspection method using a crossed polarizer. More specifically, the melting anisotropy can be confirmed by using a Olympus polarizing microscope, melting a sample placed on a Lincom hot stage, and observing the sample under a nitrogen atmosphere at a magnification of 150 times.
  • the amorphous liquid crystal resin used in the present invention is optically anisotropic and transmits light when inserted between orthogonal polarizers. When the sample is optically anisotropic, polarized light is transmitted, for example, even in the state of a molten still liquid.
  • the amorphous liquid crystal resin (A) having the above characteristics, as monomers constituting the amorphous liquid crystal resin (A), the following (i) 4-hydroxybenzoic acid and (ii) 6- It must contain hydroxy-2-naphthoic acid and the ratio (i) / (ii) must be in the range of 0.15-4.0. (i) 4-hydroxybenzoic acid and (ii) 6-hydroxy-2-naphthoic acid may be derivatives thereof. Further, it is necessary to contain 735 mol% of a monomer derived from a 1,3-phenylene group as a component of the amorphous liquid crystal resin (A).
  • the monomer derived from the 1,3-phenylene group is, for example, isophthalic acid, resorcinol, 3-hydroxybenzoic acid, 3-aminophenol, 1,3-phenylenediamine, Examples thereof include 3-aminobenzoic acid and derivatives thereof, and it is preferable that one or more of these are selected.
  • the skeleton component of the amorphous liquid crystal resin (A) is a wholly aromatic polyesteramide, and the amide component is preferably contained in the total bond in a ratio of 7 to 35 mol%.
  • 4-aminophenol, 3-aminophenol, 4-aminobenzoic acid, 3-aminobenzoic acid, 1,3-phenylenediamine, 1,4-phenylenediamine and their derivatives in the polymer as monomers Is preferably introduced.
  • it is 5 to 25 mol%, more preferably 10 to 20 mol%.
  • the amide component is less than 7 mol% in the total bond, surface peeling of the target molded article cannot be suppressed, and if it exceeds 35 mol%, the toughness of the liquid crystalline polyesteramide is lost, and the mechanical properties are greatly reduced.
  • an amorphous liquid crystal resin (A) 1S a wholly aromatic polyesteramide obtained by copolymerizing the following (i) one (iv) monomer in the range described below,
  • the copolymerization ratio of each component is remarkable even in alloys with heterogeneous amorphous polymers having excellent mechanical properties while maintaining good fluidity, which is the object of the present invention. This is important for suppressing surface peeling of molded products without reducing heat resistance.
  • the ratio is out of this range, the melting point is observed by DSC measurement at a heating rate of 20 ° C / min, and the effect of improving fluidity and surface peeling of the molded product is small.
  • the amorphous liquid crystal resin of the present invention is polymerized using a direct polymerization method or a transesterification method, and a polymerization method such as a melt polymerization method, a solution polymerization method, or a slurry polymerization method is used.
  • an acylating agent for the polymerized monomer or a monomer having an activated terminal as an acid chloride derivative can be used.
  • the acylating agent include acid anhydrides such as acetic anhydride.
  • the amount used is preferably 1.01 to 1.10 times the total equivalent of amino groups and hydroxyl groups, more preferably 1.02 to 1.0 times. 1.05 times.
  • Various catalysts can be used in these polymerizations, and typical ones are dialkyl tin oxide, diaryl tin oxide, titanium dioxide, alkoxytitanium silicates, titanium alcoholates, carboxylic acids Alkali and alkaline earth metal salts, such as BF
  • the amount of catalyst used is generally about 1% based on the total weight of the monomers.
  • liquid paraffin When performing solution polymerization or slurry polymerization, liquid paraffin, high heat-resistant synthetic oil, inert mineral oil, or the like is used as a solvent.
  • the reaction conditions include a reaction temperature of 200-380 ° C and a final ultimate pressure of 0.1 760 Torr (ie,
  • the reaction temperature is 260-380 ° C, preferably 300-360 ° C
  • the final ultimate pressure is 1-1100 Torr (ie, 133-13,300 Pa), preferably 1-150.
  • the molding resin (B) which does not show optical anisotropy when melted used in the present invention includes polycarbonate, polyethenoleimide, polysanolefon, polyarylate, polyamide, polyphenylene ether, and olefin-based resin. Resins and the like are exemplified.
  • polyphenylene ether Preferred is polyphenylene ether, and particularly preferred is modified polyphenylene ether from the viewpoint of handling during the processing process. Further, as the modified polyphenylene ether, those having a melt flow rate based on IS01133 of 320 g / l0 min are preferable in order to improve fluidity and appearance.
  • a polyamide resin is also a preferable component (B).
  • the polyamide resin used in the present invention is a polyamide containing amino acid, ratatam, or diamine and dicarboxylic acid as main components.
  • Typical examples of the main components are 6_aminocaproic acid, 11-aminoundecanoic acid, Amino acids such as 12-aminodecanoic acid and paraaminomethylbenzoic acid; ⁇ -force product; ⁇ — ratatum such as lauguchi ratatam; tetramethylenediamine; hexamethylenediamine; 2-methylpentamethylenediamine; Nonamethylene diamine, pendecamethylene diamine, dodecamethylene diamine, 2,2,4- / 2,4,4-trimethylhexamethylene diamine, 5-methylnonamethylene diamine , Meta-xylylenediamine, para-xylylenemethylenediamine, 1,3-bis (aminomethyl) cyclohexane, 1,4-
  • a polyamide resin having a melting point of 200 ° C or more is particularly useful from the viewpoint of excellent heat resistance and strength.
  • Specific examples include polycaprolamide (Naiguchi 6), polyhexamethylene adipamide (nylon 66), polycaprolamide / polyhexamethylene adipamide copolymer (nylon 6/66), polytetramethylene adipamide (nylon 46), polyhexamethylene Sebacamide (nylon 610), polyhexamethylene dodecamide (nylon 612), polyhexamethylene terephthalamide (nylon 6T), polyhexamethylene terephthalamide / polyamide copolymer (nylon 6TZ6), poly Hexamethylene adipamide / polyhexamethylene terephthalamide copolymer (nylon 66 / 6T), polyhexamethylene adipamide / polyhexamethylene isophthalamide copolymer (nylon 66/61), polyhexamethylene adipamide (Naigu
  • an olefin resin is also a preferable component (B).
  • the olefin resin used in the present invention is a polymer or copolymer containing ethylene, propylene or other olefin monomer as a main component, and specifically, high-density polyethylene, polypropylene, polybutene-11, poly-3-ethylene.
  • Ethylene and ⁇ -olefin such as methylbutene-11, poly-4-methylbutene-11, and vinyl esters such as biel acetate, acrylic acid and methacrylic acid derivatives (eg, methyl acrylate, methyl methacrylate, dimethylaminoethyl acrylate) Amides), glycidyl esters of ⁇ , ⁇ -unsaturated acids (eg, glycidyl acrylate, daricidinole methacrylate, etc.), and copolymers with gens such as butadiene and isoprene. Further, a polyolefin modified with a polar compound can also be used.
  • polar compound examples include acrylates such as methyl acrylate and ethyl acrylate, vinyl acetate, acrylic acid, methacrylic acid, and maleic anhydride. These polar compounds are modified with 0.1 to 50% by weight. Polyethylene or the like is preferably used.
  • melt flow rate based on IS01133 is 290 gZ olefin resin, which is lOmin, is preferred.
  • Such a molding resin (B) can be obtained by a known method, and a commercially available product can be used in the present invention.
  • the mixing ratio of the amorphous liquid crystal resin (A) and the molding resin (B) is (B) 100 to 900 parts by weight with respect to (A) 100 parts by weight. If the molding resin (B) force is less than S100 parts by weight, and if the molding resin (B) is more than 900 parts by weight to form a matrix, the effect of improving the fluidity, which is the object of the present invention, is unfavorably small.
  • the molding resin (B) power is 00 to 700 parts by weight based on 100 parts by weight of the amorphous liquid crystal resin (A).
  • the resin composition of the present invention may contain various fibrous, powdery or plate-like inorganic fillers depending on the purpose of use.
  • the fibrous filler examples include glass fiber, asbestos fiber, silica fiber, silica'alumina fiber, alumina fiber, dinoreconia fiber, boron nitride fiber, silicon nitride fiber, boron fiber, potassium titanate fiber, wollastonite.
  • inorganic fibrous materials such as silicate fibers, magnesium sulfate fibers, aluminum borate fibers, and metal fibrous materials such as stainless steel, aluminum, titanium, copper, and brass.
  • a particularly typical fibrous filler is glass fiber.
  • a high melting point organic fibrous substance such as polyamide, fluorine resin, polyester resin, and acrylic resin can also be used.
  • examples of the particulate filler include carbon black, graphite, silica, quartz powder, glass beads, milled glass fiber, glass balloon, glass powder, calcium silicate, aluminum silicate aluminum, kaolin, clay, and silicon.
  • Alkaline earth, silicate such as wollastonite, iron oxide, titanium oxide, zinc oxide, antimony trioxide, metal oxide such as alumina, metal carbonate such as calcium carbonate, magnesium carbonate, calcium sulfate, sulfuric acid
  • examples thereof include sulfates of metals such as barium, ferrite, silicon carbide, silicon nitride, boron nitride, and various metal powders.
  • Examples of the plate-like filler include My power, glass flake, talc, various metal foils, and the like.
  • inorganic fillers can be used alone or in combination of two or more. However, when a large amount of inorganic filler is contained, the toughness is significantly reduced. %. From the viewpoint of improving rigidity, it is preferable that at least one type contains glass fiber.
  • a sizing agent or a surface treatment agent can be used if necessary.
  • thermoplastic resins other than those described above may be further supplementarily added to the thermoplastic resin composition of the present invention as long as the object intended by the present invention is not impaired.
  • thermoplastic resin used in this case examples include polyolefins such as polyethylene and polypropylene, aromatic dicarboxylic acids such as polyethylene terephthalate and polybutylene terephthalate, and aromatic polyesters composed of diols and the like, and polyacetals (homoplastics). Or copolymers), polystyrene, polyvinyl chloride, polycarbonate, ABS, polyphenylene oxide, polyphenylene sulfide, fluororesin, and the like. These thermoplastic resins can be used as a mixture of two or more kinds.
  • each component such as an amorphous liquid crystal resin, a molding resin that does not show optical anisotropy when melted, and an inorganic filler that is used if necessary, is used.
  • a method in which melt kneading is performed simultaneously using an extruder is exemplified.
  • the melting temperature at the time of melt-kneading is preferably from 220 to 350 ° C from the viewpoint of suppressing resin decomposition. It is extremely useful to be able to knead at a melting temperature of 220-350 ° C, especially when blending a thermoplastic resin whose melt stability at high temperatures is slightly inferior, since thermal decomposition of the resin can be avoided.
  • kneading may be performed by using a master batch in which any one is melt-kneaded in advance.
  • the resin composition obtained by melt-kneading with an extruder is preferably cut into pellets by a pelletizer, and then a molded product is obtained by injection molding.
  • the measurement was performed with a differential scanning calorimeter (DSC7, manufactured by PerkinElmer) at a heating condition of 20 ° C / min.
  • the amorphous liquid crystal resin was measured at a temperature of 230 ° C. and a shear rate of 100 sec- 1 using an orifice having an inner diameter of lmm and a length of 20 mm using a Capillograph IB manufactured by Toyo Seiki.
  • the molding temperature described below (270 ° C or 300 when the thermoplastic resin is modified polyphenylene ether; 220C for nylon 12, 220C for nylon 66, 270.C for nylon 66, polyolefin)
  • the flexural modulus was measured in accordance with ASTM D790.
  • the measurement was performed at a measurement pressure of 1.8 MPa according to IS075 / A.
  • a Scotch transparent adhesive tape manufactured by Sumitomo 3M Co., Ltd. was pressure-bonded to the surface of the above-mentioned injection molded piece, and the presence or absence of peeling at the time of peeling force S was evaluated according to the following three grades.
  • the following raw material monomer, catalyst, and acylate were charged into a polymerization vessel equipped with a stirrer, a reflux column, a monomer inlet, a nitrogen inlet, and a vacuum / outflow line, and nitrogen replacement was started.
  • the temperature of the reaction system was raised to 140 ° C, and the reaction was performed at 140 ° C for 1 hour. After that, the temperature was further increased to 330 ° C over 3.3 hours, and then lOTorr (ie, The pressure was reduced to 1330 Pa), and melt polymerization was carried out while distilling acetic acid, excess acetic anhydride and other low-boiling components. After the stirring torque reached a predetermined value, nitrogen was introduced to change the pressure from a reduced pressure to a normal pressure, and the polyesteramide ⁇ 1> was discharged from the lower part of the polymerization vessel.
  • lOTorr ie, The pressure was reduced to 1330 Pa
  • Polyesteranolamide ⁇ 2>- ⁇ 3> having the same monomer formulation was produced in the same manner, except for changing only the target value of the stirring torque.
  • the temperature of the reaction system was raised to 140 ° C, and the reaction was performed at 140 ° C for 1 hour. Thereafter, the temperature was further increased to 330 ° C over 3.5 hours, and ⁇ ⁇ (that is, ⁇ ⁇ ⁇
  • the pressure was reduced to 1330 Pa), and melt polymerization was carried out while distilling acetic acid, excess acetic anhydride and other low-boiling components. After the stirring torque reached a predetermined value, nitrogen was introduced to change the pressure from a reduced pressure to a pressurized state through normal pressure, and the polyesteramide ⁇ 4> was discharged from the lower part of the polymerization vessel.
  • the temperature of the reaction system was raised to 140 ° C, and the reaction was performed at 140 ° C for 1 hour. Thereafter, the temperature was further increased to 330 ° C over 3.5 hours, and then reduced to lOTorr (that is, 1330 Pa) over 20 minutes while distilling off acetic acid, excess acetic anhydride, and other low-boiling components. Melt polymerization was performed. After the stirring torque reached a predetermined value, nitrogen was introduced to change the pressure from a reduced pressure to a normal pressure and then to a pressurized state, and the polyester ⁇ 6> was discharged from the lower part of the polymerization vessel.
  • lOTorr that is, 1330 Pa
  • thermotope pick liquid crystal resin It showed anisotropy and was confirmed to be a thermotope pick liquid crystal resin.
  • Table 1 shows the characteristics of each liquid crystal resin. From the observation results of the glass transition temperature and the melting point by DSC, it was confirmed that polyesteramide ⁇ 1>- ⁇ 4> and polyester ⁇ 5> are amorphous liquid crystal resins, and polyester ⁇ 6> is a crystalline liquid crystal resin. Was.
  • AH90 modified polyphenylene ether
  • polystyrene Toyo Styrol Co., Ltd., G19
  • glass fiber Asahi Fiber Glass Co., Ltd., CS03JA416)
  • stabilizer Asahi Denka Kogyo Co., Ltd., PEP36
  • Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Example F Comparative Example "! Comparative Example 2 Comparative Example 3 Comparative Example 4 Comparative Example 5 Modified polyphenylene ether (parts by weight) 400 400 400 400 400 400 400 400 400 400 400 65 100 Polyester amide ⁇ 1> (parts by weight) 100 100
  • Polyesteramide ⁇ 2> (parts by weight) 100
  • Polyester amide ⁇ 3> (parts by weight) 100
  • Polyester amide ⁇ 4> (parts by weight) 100 100
  • Polyester ⁇ 5> (parts by weight) 100
  • Polyester ⁇ 6> (parts by weight) 100 100
  • Glass fiber parts by weight 200 200 200 200 200
  • Polystyrene (parts by weight) 100 100
  • Stabilizer (parts by weight) 2 2 2 2 2 2 2 2 2.7 2.7 2 2.7 2 0.7
  • PCM-30 twin-screw extruder
  • Polyester ⁇ 6> (parts by weight) 100 100 100 100 100 Melt viscosity ZPa's (240 ° C) 285 165 300 130 380 415 190 430 170 530 Flexural modulus MPa 1000 2200 1300 5100 Molding impossible 400 1600 1200 4500 Molding impossible Load Deflection temperature Z ° C 60 90 65 1 15 Unmoldable ⁇ 50 70 85 112 Unmoldable
  • Polyesteramide ⁇ 1> (parts by weight) 100
  • Polyester ⁇ 6> (parts by weight) 100

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

Composition de résine thermoplastique laquelle comprend 100 parties en poids d'une résine cristalline liquide amorphe (A) ayant les caractéristiques (1) à (4) suivantes : (1) elle ne présente pas de point de fusion dans une mesure de DSC utilisant une vitesse de montée en température de 20°C/min, (2) elle a une température de transition vitreuse de 100 à 180°C, (3) elle présente une viscosité à l'état fondu à 230°C et à un taux de cisaillement de 1000 sec-1 de 50 à 2000 Pa·s et (4) elle présente une anisotropie optique lorsqu'elle ramollit et coule, et 100 à 900 parties en poids d'une résine à moulage (B) laquelle ne présente pas d'anisotropie optique au cours de la fusion. La composition de résine thermoplastique a une excellente température de déformation à chaud et une excellente rigidité et en plus elle est réduite en termes d'écaillage de la surface d'un article formé à partir de celle-ci et elle est excellente en termes de son apparence et donc elle peut être utilisée de façon appropriée pour un panneau extérieur d'une automobile et un boîtier pour des produits électriques et électroniques.
PCT/JP2005/000987 2004-05-26 2005-01-26 Composition de résine thermoplastique WO2005116141A1 (fr)

Applications Claiming Priority (4)

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JP2004-155658 2004-05-26
JP2004155658 2004-05-26
JP2004211511A JP2006008964A (ja) 2004-01-22 2004-07-20 熱可塑性樹脂組成物
JP2004-211511 2004-07-20

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2042556A1 (fr) * 2006-07-18 2009-04-01 Asahi Kasei Chemicals Corporation Composition de polyamide
JP2020097712A (ja) * 2018-12-19 2020-06-25 ポリプラスチックス株式会社 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物、及びポリエステルアミド成形品

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220335A (ja) * 1992-11-25 1994-08-09 Toray Ind Inc 液晶性樹脂組成物成形品の製造方法
JPH0762172A (ja) * 1993-08-25 1995-03-07 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
WO1996011985A1 (fr) * 1994-10-18 1996-04-25 Polyplastics Co., Ltd. Composition de resines thermoplastiques, son procede de moulage par injection et article ainsi moule
JPH10501277A (ja) * 1994-06-06 1998-02-03 ヘキスト・セラニーズ・コーポレーション サーモトロピック液晶性ポリ（エステルアミド）
JP2001200034A (ja) * 2000-01-14 2001-07-24 Ticona Llc 伸縮自在なポリマーを製造するための組成物および方法ならびにそれらによって製造される造形物品
JP2001220433A (ja) * 2000-01-14 2001-08-14 Ticona Llc 高度の延伸性をもつ非晶質異方性溶融物形成性ポリマーの製造方法およびその方法で製造したポリマー
JP2001226471A (ja) * 2000-01-14 2001-08-21 Ticona Llc 高度な伸縮性を有する非晶質異方性溶融体形成ポリマーを製造するための方法およびそれによって製造されるポリマー
JP2001302902A (ja) * 2000-04-25 2001-10-31 Asahi Kasei Corp 新規樹脂組成物
JP2004217889A (ja) * 2002-12-27 2004-08-05 Polyplastics Co 非晶質全芳香族ポリエステルアミド組成物
JP2004323663A (ja) * 2003-04-24 2004-11-18 Polyplastics Co 非晶質全芳香族ポリエステルアミド及びその組成物
JP2004339462A (ja) * 2003-04-25 2004-12-02 Polyplastics Co 非晶質全芳香族ポリエステルアミド及びその組成物

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06220335A (ja) * 1992-11-25 1994-08-09 Toray Ind Inc 液晶性樹脂組成物成形品の製造方法
JPH0762172A (ja) * 1993-08-25 1995-03-07 Sumitomo Chem Co Ltd 熱可塑性樹脂組成物
JPH10501277A (ja) * 1994-06-06 1998-02-03 ヘキスト・セラニーズ・コーポレーション サーモトロピック液晶性ポリ（エステルアミド）
WO1996011985A1 (fr) * 1994-10-18 1996-04-25 Polyplastics Co., Ltd. Composition de resines thermoplastiques, son procede de moulage par injection et article ainsi moule
JP2001200034A (ja) * 2000-01-14 2001-07-24 Ticona Llc 伸縮自在なポリマーを製造するための組成物および方法ならびにそれらによって製造される造形物品
JP2001220433A (ja) * 2000-01-14 2001-08-14 Ticona Llc 高度の延伸性をもつ非晶質異方性溶融物形成性ポリマーの製造方法およびその方法で製造したポリマー
JP2001226471A (ja) * 2000-01-14 2001-08-21 Ticona Llc 高度な伸縮性を有する非晶質異方性溶融体形成ポリマーを製造するための方法およびそれによって製造されるポリマー
JP2001302902A (ja) * 2000-04-25 2001-10-31 Asahi Kasei Corp 新規樹脂組成物
JP2004217889A (ja) * 2002-12-27 2004-08-05 Polyplastics Co 非晶質全芳香族ポリエステルアミド組成物
JP2004323663A (ja) * 2003-04-24 2004-11-18 Polyplastics Co 非晶質全芳香族ポリエステルアミド及びその組成物
JP2004339462A (ja) * 2003-04-25 2004-12-02 Polyplastics Co 非晶質全芳香族ポリエステルアミド及びその組成物

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2042556A1 (fr) * 2006-07-18 2009-04-01 Asahi Kasei Chemicals Corporation Composition de polyamide
EP2042556A4 (fr) * 2006-07-18 2011-07-20 Asahi Kasei Chemicals Corp Composition de polyamide
US8017034B2 (en) 2006-07-18 2011-09-13 Asahi Kasei Chemicals Corporation Polyamide composition
JP2020097712A (ja) * 2018-12-19 2020-06-25 ポリプラスチックス株式会社 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物、及びポリエステルアミド成形品
JP7169869B2 (ja) 2018-12-19 2022-11-11 ポリプラスチックス株式会社 全芳香族ポリエステルアミド、ポリエステルアミド樹脂組成物、及びポリエステルアミド成形品

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