WO2005107344A1 - Carte imprimee multicouche - Google Patents

Carte imprimee multicouche Download PDF

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Publication number
WO2005107344A1
WO2005107344A1 PCT/US2005/014360 US2005014360W WO2005107344A1 WO 2005107344 A1 WO2005107344 A1 WO 2005107344A1 US 2005014360 W US2005014360 W US 2005014360W WO 2005107344 A1 WO2005107344 A1 WO 2005107344A1
Authority
WO
WIPO (PCT)
Prior art keywords
circuit board
printed circuit
multilayer printed
acid dianhydride
polyimide film
Prior art date
Application number
PCT/US2005/014360
Other languages
English (en)
Inventor
Takashi Kikuchi
Hiroyuki Tsuji
Takashi Itoh
Shigeru Tanaka
Eiichiro Kuribayashi
Greg Clements
Original Assignee
Kaneka High Tech Materials
Kaneka Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaneka High Tech Materials, Kaneka Corporation filed Critical Kaneka High Tech Materials
Priority to US11/587,771 priority Critical patent/US20080032103A1/en
Priority to JP2007510908A priority patent/JP2007535179A/ja
Publication of WO2005107344A1 publication Critical patent/WO2005107344A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24942—Structurally defined web or sheet [e.g., overall dimension, etc.] including components having same physical characteristic in differing degree
    • Y10T428/2495—Thickness [relative or absolute]
    • Y10T428/24959—Thickness [relative or absolute] of adhesive layers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31725—Of polyamide

Definitions

  • the present invention relates to multilayer printed circuit boards which can be used in high-frequency applications, which are not easily affected by the environment, and which are highly reliable.
  • a first problem relates to the flexibility of the substrate.
  • a rigid substrate is produced by impregnating a fibrous base composed of glass cloth, aramid paper, or the like with a thermosetting resin, such as an epoxy resin or a phenol resin, followed by hardening. Therefore, the rigid substrate has low flexibility. Consequently, it is difficult to fold the substrate so as to be placed in an open space of an electronic device.
  • a second problem relates to the thickness of the substrate. As described above, a rigid substrate is produced by impregnating a fibrous base composed of glass cloth, aramid paper, or the like with a thermosetting resin.
  • the thickness of the substrate is restricted by the fiber thickness of the base, and there is a limitation in decreasing the thickness of the substrate. Furthermore, since the base is impregnated with the thermosetting resin, the dielectric characteristics of the substrate itself are not very good. From the standpoint of securing interlayer insulation, it is not possible to decrease the thickness of the substrate. If a plurality of substrates each having a large thickness are laminated to form a multilayer circuit board, the thickness of the multilayer circuit board will become relatively large.
  • a third problem relates to surface smoothness. Since the rigid substrate includes a fibrous base, the smoothness of the surface of the substrate is not very good. Consequently, transmission loss increases when a wiring sheet is formed by disposing a metal wiring layer on the substrate .
  • multilayer printed circuit boards have been developed in which wiring sheets including rigid substrates are partially disposed on a wiring sheet including a substrate composed of an insulating film.
  • a printed circuit board is disclosed in Japanese Patent Publication No. 6-268339, titled "Flex- Rigid Multilayer Printed Wiring Board and Production Therof.” Since the multilayer printed circuit board having such a structure has flexible parts, folding can be performed in these parts, and thus the problem of flexibility is overcome. However, since the rigid substrates are still included, the problems of the thickness of the substrate and the surface smoothness are not overcome .
  • multilayer printed circuit boards comprising only wiring sheets including substrates each composed of an insulating film have come into use.
  • an insulating film is used for the substrate, interlayer insulation can be more easily ensured compared with the rigid substrate.
  • the thickness of each wiring sheet and the thickness of the entire multilayer board can be decreased.
  • a highly smooth film is used as the base, the problem of surface smoothness is overcome.
  • conductive anodic filaments may grow along the glass fiber interfaces between via-holes or between via-holes and patterns, resulting in a decrease in insulating properties.
  • the glass fiber that generates CAFs is not involved, the decrease in insulating properties attributable to CAFs can be avoided.
  • the multilayer printed circuit board including substrates each composed of an insulating film
  • printed wiring sheets each including an insulating film and a metal wiring layer disposed on the insulating film with an adhesive layer therebetween are laminated using an interlayer bonding member.
  • a copper foil is laminated on a polyimide film using a thermosetting resin, such as an epoxy resin, as an adhesive, and a circuit is formed by etching.
  • a thermosetting resin such as an epoxy or acrylic resin
  • Such a multilayer printed circuit board also has poor dielectric characteristics. Consequently, as the frequencies further increase, specifically, in a range of 10 GHz or more, the dielectric characteristics of the entire multilayer board are believed to be degraded.
  • a copper-clad laminate which includes no adhesive layer or which includes an adhesive layer composed of a polyimide material has been proposed by several companies .
  • Examples of such laminates are disclosed in Japanese Patent Publication Nos. 3-104185, 5- 327207, and 2001-129918, respectively titled, "Manufacture of Double Surface Conductor Polyimide Laminate,” “Manufacture of Polyimide Base Plate,” and “Manufacturing Method of Laminated Sheet.”
  • interlayer bonding member With respect to the interlayer bonding member, a method has been proposed in which polyimide varnish is applied to a wiring sheet, followed by drying to form an adhesive layer, and interlayer bonding is performed using the adhesive layer.
  • An example of such a method is disclosed in Japanese Patent Publication No. 5-275568, titled “Multilayer Interconnection Circuit Board and Manufacture Thereof.”
  • the present invention relates to a multilayer printed circuit board including at least two printed wiring sheets laminated with an interlayer bonding member therebetween. At least one of the printed wiring sheets includes a non-thermoplastic polyimide film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the non-thermoplastic polyimide film, and a metal wiring layer disposed on the adhesive layer.
  • the interlayer bonding member contains a thermoplastic polyimide.
  • One or more embodiments of the present invention to provide a multilayer printed circuit board which has improved dielectric characteristics in the high-frequency range, is not easily affected by environmental changes, and has high reliability.
  • a multilayer printed circuit board according to the present invention includes at least two printed wiring sheets laminated with an interlayer bonding member therebetween.
  • a printed wiring sheet in accordance with one or more embodiments of the present invention, includes a non- thermoplastic polyimide film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the non-thermoplastic polyimide film, and a metal wiring layer disposed on the adhesive layer.
  • the interlayer bonding member contains a thermoplastic polyimide.
  • a printed wiring sheet used for a multilayer printed circuit board in accordance with one or more embodiments of the present invention includes a non- thermoplastic polyimide film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the non-thermoplastic polyimide film, and a metal wiring layer disposed on the adhesive layer.
  • the non-thermoplastic film used for the printed wiring sheet is not particularly limited, and any of various types of resin films may be generally used.
  • polyimide film a commercially available polyimide film, such as APICAL (manufactured by Kaneka Corporation) , Kapton (manufactured by Toray-DuPont Company), or UPILEX (manufactured by Ube Industries, Ltd.), may be used.
  • APICAL manufactured by Kaneka Corporation
  • Kapton manufactured by Toray-DuPont Company
  • UPILEX manufactured by Ube Industries, Ltd.
  • the resulting polyimide film exhibits low water absorption and low-dielectric characteristics.
  • the content of the acid dianhydride represented by general formula (1) is preferably 40 mole percent or more, and more preferably 50 mole percent or more, of the total acid dianhydride component. If the content is below the lower limit described above, in some cases, it may not possible to sufficiently obtain low water absorption and low-dielectric characteristics .
  • Examples of the acid dianhydride which may be used besides the acid dianhydride represented by general formula (1) include pyromellitic dianhydride, 2,3,6,7- naphthalenetetracarboxylic dianhydride, 3, 3', 4,4'- biphenyltetracarboxylic dianhydride, 1,2,5,6- naphthalenetetracarboxylic dianhydride, 2,2 ',3,3'- biphenyltetracarboxylic dianhydride, 3, 3', 4,4'- benzophenonetetracarboxylic dianhydride, 4 , 4 ' -oxyphthalic dianhydride, 2, 2-bis (3, 4-dicarboxyphenyl) propane dianhydride, 3, 4, 9, 10-perylenetetracarboxylic dianhydride, bis (3, -dicarboxyphenyl) propane dianhydride, l,l-bis(2,3- dicarboxyphenyl) ethane ' dian
  • Examples of the diamine include 4,4'- diaminodiphenylpropane, 4,4' -diaminodiphenylmethane, benzidine, 3, 3 ' -dichlorobenzidine, 3, 3 ' -dimethylbenzidine, 2, 2 ' -dimethylbenzidine, 3, 3 ' -dimethoxybenzidine, 2,2'- dimethoxybenzidine, 4 , 4 ' -diaminodip enylsulfide, 3,3'- diaminodiphenyl sulfone, 4 , 4 ' -diaminodiphenyl sulfone, 4, 4 ' -oxydianiline, 3, 3 ' -oxydianiline, 3, 4 ' -oxydianiline, 1, 5-diaminonaphthalene, 4,4' -diaminodiphenyldiethylsilane, 4,4' -diaminodiphenyls
  • a polyamic acid which is prepared by polymerization of the acid dianhydride component containing the acid dianhydride and the aromatic diamine component is formed into a film and imidized, and thereby, a polyimide film in accordance with an embodiment of the present invention is produced.
  • the apparatuses and conditions used in the polymerization, film formation, and imidization steps are not particularly limited, and commonly known apparatuses and conditions may be .used.
  • an inorganic or organic filler may be incorporated as a lubricant, and in order to improve adhesion strength, the surface of the film may be subjected to various types of treatment, such as corona treatment or plasma treatment.
  • the insulating layer (non-thermoplastic film + adhesive layer) has a dielectric constant of 3.4 or less and a dielectric loss tangent of 0.010 or less at 12.5 GHz.
  • the coefficient of water absorption of the insulating layer may be controlled.
  • the coefficient of water absorption of the insulating layer is preferably 1.6% or less, and particularly preferably 1.4% or less. If the coefficient of water absorption exceeds the upper limit described above, the amount of water absorbed into the insulating layer in the high-humidity environment increases, which may result in difficulty in exhibiting low-dielectric characteristics.
  • the influence of the environment can be reduced and stable low-dielectric characteristics can be achieved.
  • the insulating layer of each sample has a dielectric constant of 3.4 or less and a dielectric loss tangent of 0.010 or less. If the dielectric constant and the dielectric loss tangent exceed the above ranges in any one of the environments or in all the environments described above, it may become difficult to use the product stably in the high-frequency range.
  • the non-thermoplastic polyimide film is defined as a polyimide film that is not fused and retains the shape of the film when heated at about 450°C to 500°C.
  • the adhesive layer contains a thermoplastic polyimide from the standpoints of low-dielectric characteristics and excellent balance between low- dielectric characteristics and other physical properties, such as heat resistance.
  • a thermoplastic polyimide from the standpoints of low-dielectric characteristics and excellent balance between low- dielectric characteristics and other physical properties, such as heat resistance.
  • the thermoplastic polyimide to be contained in the adhesive layer include thermoplastic polyimides, thermoplastic polyamide-imides, thermoplastic polyetherimides, and thermoplastic polyesterimides.
  • thermoplastic polyesterimides containing ester bonds in their structures particularly preferred are particularly preferred.
  • the thermoplastic polyimide used for bonding the metal wiring layer and the insulating film is required to have compression set in a temperature range of 10°C to 400°C (heating rate: 10°C/min) in thermal mechanical analysis (TMA) using the compression mode (probe diameter: 3 mm, load: 5 g) .
  • the thermoplastic polyimide of an embodiment of the present invention has a glass transition temperature (Tg) in a range of 150°C to 300°C. If the Tg exceeds the above range, the temperature that develops adhesiveness also increases, and it may become difficult to perform working using the existing apparatus. If the Tg is below the above range, there is a possibility that the heat resistance of the adhesive layer may be decreased. Additionally, the Tg can be determined from the inflection point of the storage modulus measured by dynamic mechanical analyzer (DMA) .
  • DMA dynamic mechanical analyzer
  • the polyamic acid which is a precursor of the thermoplastic polyimide used in an embodiment of the present invention
  • commonly known apparatuses, reaction conditions, etc. may be used.
  • An inorganic or organic filler may be incorporated as required.
  • the printed wiring sheet used for the multilayer printed circuit board includes the insulating film, an adhesive layer containing a thermoplastic polyimide disposed on at least one surface of the insulating film, and a metal wiring layer disposed on the adhesive layer.
  • the metal wiring layer is produced by a method in which a metal foil is bonded to an insulating film with an adhesive layer therebetween, and then unwanted parts of the metal foil layer are removed by etching, or a method in which a metal layer for a circuit pattern is formed on a surface of an adhesive layer by electroless and electrolytic plating.
  • a process may be used in which, after a metal foil is bonded to the surface of the adhesive layer, the entire surface is etched, and the surface to which a roughed coarsened surface of the metal foil has been transferred is subjected to electroless and electrolytic plating.
  • the latter method can be preferably used for forming circuit patterns by the additive process, and particularly preferably used when fine wiring are required to be formed.
  • the metal foil is not particularly limited. In electronic device and electrical device applications, examples of the metal foil which may be used include foils composed of copper or copper alloys, stainless steel or alloys thereof, nickel or nickel alloys (including 42 alloys), and aluminum or aluminum alloys. Copper foils, such as rolled copper foils and electrolytic copper foils, are generally used for printed wiring sheets.
  • Such copper foils can also be preferably used in an embodiment of the present invention.
  • a rust preventive layer, a heat-resistant layer, or an adhesive layer may be provided by coating on the surface of the metal foil.
  • the thickness of the metal foil is not particularly limited, and the metal foil may be of any thickness as long as its function can be carried out sufficiently according to the application. With respect to etching conditions for the metal foil, those in any known method can be used.
  • Examples of the method for bonding a metal foil to an insulating film include a method in which a single-layer adhesive sheet is formed, and then an insulating film and a metal foil are laminated with the adhesive sheet, followed by thermocompression bonding; a method in which an adhesive layer is formed on a metal foil, and the resulting laminate and an insulating film are bonded to each other; and a method in which an adhesive layer is formed on an insulating film, and the resulting laminate and a metal foil are bonded to each other.
  • a polyamic acid which is a precursor of the thermoplastic polyimide contained in the adhesive layer
  • the solubility in an organic solvent may decrease, and thus it may become difficult for the adhesive layer to adhere to the metal foil or the insulating film.
  • a solution containing a polyamic acid, which is a precursor of the thermoplastic polyimide is prepared, the solution is applied to the metal foil or the insulating film, and then imidization is performed.
  • the imidization may be performed by a thermal cure method or a chemical cure method.
  • the heating conditions must be set so that a chemical conversion agent, etc., is removed without thermally degrading the adhesive layer. Therefore, the imidization by the thermal cure method is more preferable. This does not apply to a case in which a thermoplastic polyimide that is soluble in an organic solvent is used.
  • a thermoplastic polyimide that is soluble in an organic solvent is used.
  • an adjustment may be appropriately made so that the total thickness is set according to the application.
  • the total thickness of the non-thermoplastic polyimide film and the adhesive layer in the printed wiring sheet is 30 ⁇ m or less.
  • the coefficient of water absorption of the insulating layer is greatly influenced by the thickness ratio as well as by the coefficient of water absorption of each of the insulating film and the adhesive layer. Therefore, the thicknesses are preferably determined by taking these factors into account.
  • Examples of the apparatus used for bonding the metal foil include, but are not limited to, a single-platen press, a multi-platen press, a double belt press, and a thermal roll laminator. Conditions for bonding may be appropriately selected in consideration of the glass transition temperature of the adhesive layer, etc.
  • a material for the interlayer bonding member used in embodiments of the present invention is required to have low-dielectric characteristics in the high-frequency range, heat resistance, i.e., resistance to high-temperature treatment, such as a soldering step, dimensional stability, and flowability required for embedding wiring patterns . Therefore, the interlayer bonding member used in embodiments the present invention must contain a thermoplastic polyimide resin.
  • the interlayer bonding member of an embodiment of the present invention preferably comprises a thermosetting resin composition including a thermoplastic polyimide resin component (A) containing at least one thermoplastic polyimide resin, an epoxy resin component (B) containing at least one epoxy resin, and an epoxy curing agent component (C) containing at least one epoxy curing agent.
  • a thermosetting resin composition including a thermoplastic polyimide resin component (A) containing at least one thermoplastic polyimide resin, an epoxy resin component (B) containing at least one epoxy resin, and an epoxy curing agent component (C) containing at least one epoxy curing agent.
  • the compounding ratio of the thermoplastic polyimide resin component (A) to the total of the epoxy resin component (B) and the epoxy curing agent component (C) i.e., (A) /[(B) + (C) ] , by mass, is preferably 0.4 to 2.0, more preferably 0.70 to 1.35, and still more preferably 0.8 to 1.3.
  • thermoplastic polyimide resin component (A) containing at least one thermoplastic polyimide resin heat resistance is imparted to the thermosetting resin composition, and flexibility, excellent mechanical characteristics, and chemical resistance are imparted to a cured resin obtained by curing the thermosetting resin composition. Furthermore, excellent dielectric characteristics, i.e., iow-dielectric constant and low, dielectric loss tangent, in the high-frequency range can be imparted.
  • thermoplastic polyimide resin is not particularly limited, the thermoplastic polyimide resin must be soluble in an organic solvent in order to be mixed with the thermosetting resin and must have low-dielectric characteristics in order to compensate for increases in the dielectric constant and the dielectric loss tangent due to the incorporation of the thermosetting resin.
  • the process and conditions for producing the polyimide resin are not particularly limited, and any known process and conditions may be used.
  • the acid dianhydride component include pyromellitic dianhydride, 3, 3', ,4'- benzophenonetetracarboxylic dianhydride, 3, 3', 4,4'- biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8- naphthalenetetracarboxylic dianhydride, 2,3,6,7- naphthalenetetracarboxylic dianhydride, 3, 3 ', 4 , 4 ' -biphenyl ether tetracarboxylic dianhydride, 3, 3 ',4, 4'- dimethyldiphenylsilanetetracarboxylic dianhydride,
  • diamine component examples include p- phenylenediamine, m-phenylenediamine, 4,4'- diaminodiphenylmethane, 4, 4 ' -diaminodiphenylethane, 4,4'- diaminodiphenyl ether, 4 , 4 ' -diaminodiphenylsulfide, 4,4'- diaminodiphenyl sulfone, 1, 5-diaminonaphthalene, 3,3'- dimethyl-4, 4 ' -diaminobiphenyl, 5-amino-l- (4 ' -aminophenyl) - 1,3, 3-trimethylindane, 6-amino-l- ( 4 ' -aminophenyl) -1, 3 , 3- trimethylindane, 4 , 4 ' -diaminobenzanilide, 3, 5-diamino-3 ' - trifluoromethylbenzanilide,
  • epoxy resins include, but are not limited to, epoxy resins, such as bisphenol epoxy resins, bisphenol A novolac epoxy resins, biphenyl epoxy resins, phenol novolac epoxy resins, alkylphenol novolac epoxy resins, polyglycol epoxy resins, alicyclic epoxy resins, cresol novolac epoxy resins, glycidylamine epoxy resins, naphthalene epoxy resins, urethane-modified epoxy resins, rubber-modified epoxy resins, and epoxy-modified polysiloxanes; resins obtained by halogenating theses epoxy resins; and crystalline epoxy resins with melting points.
  • epoxy resins such as bisphenol epoxy resins, bisphenol A novolac epoxy resins, biphenyl epoxy resins, phenol novolac epoxy resins, alkylphenol novolac epoxy resins, polyglycol epoxy resins, alicyclic epoxy resins, cresol novolac epoxy resins, glycidylamine epoxy resins, naphthalen
  • epoxy resins described above more preferably used are epoxy resins having at least one aromatic ring and/or aliphatic ring in their molecular chains, biphenyl epoxy resins with the biphenyl skeleton, naphthalene epoxy resins with the naphthalene skeleton, and crystalline epoxy resins with melting points. These epoxy resins are readily available and highly compatible with the components (A) , (B) , and (C) , and can impart excellent heat resistance and insulating properties to the cured resin.
  • the epoxy resin used for the epoxy resin component (B) has high purity whatever epoxy resin is selected from the group described above. Thereby, in the resulting thermosetting resin composition and curable resin, highly reliable electrical insulation can be achieved.
  • the content of halogen and alkali metal in the epoxy resin is used as the basis for high purity.
  • the content of halogen and alkali metal in the epoxy resin is preferably 25 ppm or less, and more preferably 15 ppm or less, when extracted at 120°C and 2 atmospheric pressure. If the content of halogen and alkali metal is higher than 25 ppm, the reliability of electrical insulation is impaired in the cured resin.
  • any compound having at least two active hydrogen atoms per molecule can be used without limitation.
  • the active hydrogen source include an amino group, a carboxyl group, a phenolic hydroxyl group, an alcoholic hydroxyl group, and a thiol group.
  • a compound having such a functional group can be used as the epoxy curing agent component (C) of an embodiment of the present invention.
  • a ino group-containing amine epoxy curing agents and phenolic hydroxyl group- containing polyphenol epoxy curing agents can be preferably used in view of excellent balance of properties of the thermosetting resin composition of an embodiment of the present invention.
  • polyphenol epoxy curing agents examples include phenol novolac, xylylene novolac, bisphenol A novolac, triphenylmethane novolac, biphenyl novolac, and dicyclopentadienephenol novolac.
  • an amine epoxy curing agent can be preferably used as the epoxy curing agent component (C) .
  • the amine epoxy curing agent can impart good resin flowability to the thermosetting resin composition and good heat resistance to the cured resin.
  • the amine epoxy curing agent component used in an embodiment of the present invention is required to have at least one amine compound.
  • the amine epoxy curing agent component include, but are not limited to, monoamines, such as aniline, benzylamine, and aminohexane; various types of diamines; and polyamines, such as diethylenetriamine, tetraethylenepentamine, and pentaethylenehexamine .
  • monoamines such as aniline, benzylamine, and aminohexane
  • diamines such as diethylenetriamine, tetraethylenepentamine, and pentaethylenehexamine .
  • aromatic diamines are preferably used.
  • the interlayer bonding member according to an embodiment of the present invention may also contain other components (D) , as required, in addition to the components (A) to (C) .
  • the other components (D) are not particularly limited. Specific examples of the other components (D) include a curing accelerator (D-l) for accelerating the reaction between the epoxy resin composition and the epoxy curing agent composition, an inorganic filler (D-2), and a thermosetting resin component (D-3) .
  • the curing accelerator (D-l) used in an embodiment of the present invention is not particularly limited.
  • examples thereof include imidazole compounds; phosphine compounds, such as triphenylphosphine; amine compounds, such as tertiary amines, trimethanolamine, triethanolamine, and tetraethanolamine; and borate compounds, such as 1,8- diaza-bicyclo [5, 4, 0] -7-undecenium tetraphenyl borate.
  • These curing accelerators may be used alone or in combination of two or more.
  • imidazole compounds are preferable.
  • the imidazole compounds may be used alone or in combination of two or more.
  • the amount of use (mixing ratio) of the curing accelerator is not particularly limited as long as it is in a range that can accelerate the reaction between the epoxy resin component and the epoxy curing agent and that does not impair the dielectric characteristics of the curable resin.
  • the curing accelerator is used in an amount of preferably 0.01 to 10 parts by weight, and more preferably 0.1 to 5 parts by weight, relative to 100 parts by weight of the total amount of the epoxy resin component (C) .
  • the inorganic filler (D-2) is not particularly limited. Examples thereof include fused silica, crystalline silica, and alumina. These may be used alone or in combination. Among these, spherical fused silica can be preferably used because it does not substantially affect the resin flowability adversely, which is an advantage of one or more embodiments of the present invention, and it decreases the coefficient of thermal expansion entirely. In one or more embodiments, the inorganic filler may be preferably used in an amount of about 1 to 200 parts by weight, and more preferably about 30 to 100 parts by weight, relative to 100 parts by weight of the resin composition.
  • thermosetting component (D-3) is not particularly limited.
  • examples thereof include thermosetting resins, such as bismaleimide resins, bisallylnadimide resins, acrylic resins, methacrylic resins, hydrosilyl curable resins, allyl curable resins, and unsaturated polyester resins; and reactive side-chain group-containing thermosetting polymers which contain a reactive group, such as an allyl group, a vinyl group, an alkoxysilyl group, or a hydrosilyl group, at the side chain or at the terminus of the polymer chains .
  • thermosetting components may be used alone or in combination of two or more. By incorporating the thermosetting component, it is possible to improve characteristics, such as adhesiveness, heat resistance, and workability, of the resulting thermosetting resin composition and the cured resin.
  • the amount of use (mixing ratio) of the thermosetting component is not particularly limited as long as it is in a range that can exhibit the effect of improving the characteristics and that does not impair the dielectric characteristics of the curable resin.
  • interlayer bonding member of an embodiment of the present invention by appropriately adjusting the compositions and mixing ratio of the components as described above, excellent circuit embedding properties are shown during processing, and excellent dielectric characteristics are shown in the high-frequency range after curing.
  • the interlayer bonding member of an embodiment of the present invention may be supplied in the form of a solution, applied to the printed wiring sheet, and semi- cured for use. Alternatively, the interlayer bonding member may be preliminarily formed into a sheet and then supplied for use. In view of ease of laminating wiring sheets, the latter method is preferable.
  • a solution in which the components (A) to (C) , or (A) to (D) , depending on the case, are dissolved must be prepared.
  • the method for the preparation is not particularly limited.
  • the components each may be dissolved in a suitable solvent to form a solution, and the resulting solutions may be mixed.
  • Any solvent that can dissolve the thermosetting resin composition or the components (A) to (D) may be used without limitation.
  • the solvent has a boiling point of 150°C or less.
  • the solvent include ethers, such as cyclic ethers, e.g., tetrahydrofuran, dioxolane, and dioxane; and linear ethers, e.g., ethylene glycol dimethyl ether, triglyme, diethylene glycol, ethyl cellosolve, and methyl cellosolve.
  • ethers such as cyclic ethers, e.g., tetrahydrofuran, dioxolane, and dioxane
  • linear ethers e.g., ethylene glycol dimethyl ether, triglyme, diethylene glycol, ethyl cellosolve, and methyl cellosolve.
  • mixed solvents of these ethers and other solvents such as toluene, xylenes, glycols, N,N- dimethylformamide, N,N-dimethylacetamide, N- methylpyrrolidone, cyclic siloxane
  • the method for forming the sheet is not particularly limited. Usually, the solution is cast onto or applied to a surface of a film base (support), and then the resin solution is dried to form a film. In the sheet formed by this method, the thermosetting resin component is in a semi-cured state (stage B) . By peeling off the semi-cured sheet from the support, a sheet of the interlayer bonding member is obtained.
  • the film base used as the support is not particularly limited, and a known resin film may be suitably used. Furthermore, a support other than the film base may be used. As such a support, for example, a drum or endless belt may be used.
  • the thickness of the interlayer bonding member is not particularly limited and can be set appropriately depending on the application.
  • a multilayer printed circuit board in accordance with one or more embodiments of the present invention is produced by thermocompression bonding at least two printed wiring sheets described above with the interlayer bonding member therebetween.
  • the number of laminations is not particularly limited and can be selected appropriately depending on the application.
  • a printed wiring sheet other than the one described above may be partially used to an extent that does not impair the characteristics of the entire multilayer board.
  • the treatment temperature in the thermocompression bonding treatment is preferably in a range of 50°C to 250°C, more preferably in a range of 60°C to 200°C, and still more preferably in a range of 80°C to 180°C. If the treatment temperature exceeds 250°C, there may be a case in which the interlayer bonding member is cured during the thermocompression bonding treatment and lamination cannot be performed satisfactorily. If the treatment temperature is less than 50 °C, the flowability of the interlayer bonding member is decreased, resulting in difficulty in embedding conductive circuit patterns .
  • the interlayer bonding member serves as a protective material for protecting conductive circuit patterns or an interlayer insulating material in the multilayer printed circuit board. Therefore, preferably, after circuit patterns are embedded, the interlayer bonding member is completely cured by thermal curing or the like.
  • the specific method for thermal curing is not particularly limited. Thermal curing may be performed under the conditions which allow sufficient curing of the resin layer, i.e., the thermosetting resin composition.
  • post-heating treatment is preferably performed after the metal layer and the resin layer have been bonded to each other.
  • heat treatment is preferably performed in a temperature range of 150°C to 200°C for 10 minutes to 3 hours .
  • via-holes are formed by a known method, for example, using a laser, by mechanical drilling, or by punching, and electrical conduction is achieved by a known method, for example, by electroless plating, using conductive paste, or by direct plating.
  • Multilayer printed circuit boards produced by the materials and methods described above in accordance with one or more embodiments of the present invention have excellent low-dielectric characteristics in the high- frequency range and can cope with the increases in frequencies of electrical signals. Thus, it is possible to greatly contribute to the improvement in the processing ability of electronic devices .
  • the multilayer printed circuit board produced by combining the specific printed wiring sheets and the interlayer bonding member of an embodiment of the present invention can exhibit excellent resistance to soldering heat. Specifically, it is possible to produce a multilayer printed circuit board in which blistering, whitening, and delamination do not occur between the layers even if the circuit board is left to stand under the conditions of 40°C and 90% R.H. for 96 hours and then dipped in a solder bath at 250°C for 10 seconds.
  • interlayer bonding member Furthermore, excellent long-term heat resistance can be imparted to the interlayer bonding member. Specifically, it is possible to produce a multilayer printed circuit board in which the retention of interlayer adhesion strength is 70% or more after the multilayer printed circuit board is left to stand at 150°C for 500 hours.
  • the ratio of change in dimensions in the entire multilayer printed circuit board can be set in a range of - 0.20% to +0.20% after the multilayer printed circuit board is left to stand at 250°C for 30 minutes.
  • the multilayer printed circuit board of an embodiment of the present invention can be suitably used in the high-frequency, high-density mounting region.
  • applications are not limited to those described above.
  • the multilayer printed circuit boards of one or more embodiments of the present invention can also be used suitably in the applications requiring reliability with which conventional multilayer printed circuit boards cannot cope .
  • thermoplasticity or non- thermoplasticity of the polyimide was determined, measured, or evaluated by the methods described below.
  • thermoplasticity of a polyimide used for an adhesive layer of a printed wiring sheet was determined using TMA120C manufactured by Seiko Electronics Inc., in the compression mode (probe diameter: 3 mm) at a load of 5 g, in which a film was heated to 10°C to 400°C at 10°C/min and then cooled to 10°C to check whether or not compression set occurred. (Determination for thermoplasticity 2)
  • Thermoplasticity of a polyimide used for an interlayer bonding member was determined as in the determination for thermoplasticity 1 using TMA120C manufactured by Seiko Electronics Inc., in the compression mode (probe diameter: 3 mm) at a load of 5 g, in which a film was heated to 10°C to 400°C at 10°C/min and then cooled to 10°C to check whether or not compression set occurred. (Determination for non-thermoplasticity)
  • Non-thermoplasticity of a polyimide film used for a printed wiring sheet was determined by visually checking whether or not a film retains its shape without being fused after it was heated at 450°C for 1 minute. (Dielectric constant and dielectric loss tangent)
  • the dielectric constant and dielectric loss tangent were measured using a molecular orientation analyzer Model MOA-2012A manufactured by KS Systems Co., Ltd. under the conditions described below. Measured frequency: 12.5 GHz Measured angles: 0 degree, 45 degrees, 90 degrees [0079] The dielectric constant and the dielectric loss tangent were measured at the three angles and the average values thereof were determined as the dielectric constant and the dielectric loss tangent of the material measured. (Glass transition temperature)
  • the glass transition temperature was determined from the inflection point of the storage modulus measured with a DMS200 manufactured by Seiko Instruments Inc. at a heating rate of 3°C/min in a range from room temperature to 400 °C. (Melt viscosity)
  • a sheet of an interlayer bonding member (50 ⁇ m thick) was interposed between a circuit-forming surface of a printed wiring sheet having a circuit with a thickness of 18 ⁇ m, a circuit width of 50 ⁇ m, and a circuit spacing of 50 ⁇ m (refer to Synthesis Examples 8 and 9 below) and a glossy surface of a copper foil (Item No. BHY22BT, manufactured by Japan Energy Corporation) 18 ⁇ m in thickness, and heat and pressure were applied for one hour at 180°C and 3 MPa to produce a laminate.
  • the copper foil of the resulting laminate was chemically removed using an iron (III) chloride-hydrochloric acid solution.
  • the exposed surface of the resin sheet was visually observed using an optical microscope (magnification: 50 times) to check whether or not bubbles were included in the space between the circuits .
  • Laminability was evaluated according to the following criteria: Satisfactory (O) : No inclusion of bubbles (portions not filled with the resin) was observed in the space between the circuits. Unsatisfactory (x) : Inclusion of bubbles was observed. (Resistance to soldering heat)
  • the laminate which had absorbed moisture was dipped in a solder bath at 250°C for 10 seconds. After dipping, the wires in the outermost layer and the solder attached to the wires were removed by etching. The laminate after etching was visually checked and evaluated according to the following criteria: Satisfactory (O) : No appearance defect was observed in interlayer bonding member layer. Unsatisfactory (x) : Appearance defects, such as bubbling, whitening, and delamination, were observed in interlayer bonding member layer. (Long-term heat resistance)
  • a 50-mm-square laminate which was prepared as in the evaluation of resistance to soldering heat, was left to stand in an oven at 150°C for 500 hours.
  • the heated laminate was cut along the circuit into a strip with a width of 10 mm.
  • the insulating layers of the wiring sheets on both sides were each clamped with an air chuck, and a 180° peel test was carried out.
  • the laminate measured was left to stand in an oven at 150 °C for 30 minutes.
  • the average circuit pitch was calculated in the same manner as that described above.
  • the ratio of change in dimensions was calculated according to the expression below, where Dl is the average pitch before heating and D2 is the average pitch after heating.
  • Ratio of change in dimensions (D2 - Dl) /Dl x 100 (%)
  • a 2,000-mL glass flask was charged with 780 g of DMF and 117.2 g of bis [4- (4-aminophenoxy) phenyl] sulfone (hereinafter also referred to as "BAPS"), and 71.7 g of 3, 3 ' , 4, 4 ' -biphenyltetracarboxylic dianhydride (hereinafter also referred to as "BPDA”) was gradually added thereto under stirring in a nitrogen atmosphere.
  • BAPS bis [4- (4-aminophenoxy) phenyl] sulfone
  • BPDA 3, 3 ' , 4, 4 ' -biphenyltetracarboxylic dianhydride
  • TMEG 3, 3 ', 4, 4 ' -ethylene glycol dibenzoate tetracarboxylic dianhydride
  • the resulting polyamic acid solution was cast onto a 25- ⁇ m-thick PET film (Cerapeel HP, manufactured by Toyo Metallizing Co., Ltd.) so as to have a final thickness of 20 ⁇ m, and drying was performed at 120 °C for 5 minutes.
  • the dried self-supporting film was separated from the PET and fixed on a metal pin frame, and drying was performed at 150°C for 5 minutes, at 200°C for 5 minutes, at 250°C for 5 minutes, and at 350°C for 5 minutes.
  • the resulting single-layer sheet had thermoplasticity.
  • the glass transition temperature of the single-layer sheet was measured to be 270°C.
  • TMEG 3, 3 ', 4, 4 ' -ethylene glycol dibenzoate tetracarboxylic dianhydride
  • the resulting polyamic acid solution was cast onto a 25- ⁇ m-thick PET film (Cerapeel HP, manufactured by Toyo Metallizing Co., Ltd.) so as to have a final thickness of 20 ⁇ m, and drying was performed at 120°C for 5 minutes.
  • the dried self-supporting film was separated from the PET and fixed on a metal pin frame, and drying was performed at 150°C for 5 minutes, at 200°C for 3 minutes, at 250°C for 3 minutes, and at 300 °C for 2 minutes.
  • the resulting single-layer sheet had thermoplasticity.
  • the glass transition temperature of the single-layer sheet was measured to be 190°C.
  • the DMF solution was stirred under cooling in an ice bath, and 1 equivalent of 4, 4 '-(4, 4'- isopropylidenediphenoxy) bisphthalic anhydride (hereinafter also referred to as "IPBP") was added thereto. Stirring was further performed for 3 hours, and thereby a polyamic acid solution was prepared.
  • the amount of DMF used was set so that the charge ratio of APB, HAB, and IPBP monomers was 30% by weight.
  • the polyamic acid solution in an amount of 300 g was transferred to a pan coated with fluororesin, reduced pressure heating was performed in a vacuum oven for 3 hours at 200°C and 5 mmHg (about 0.007 atmospheric pressure, about 5.65 hPa) , and thereby a polyimide resin was obtained.
  • the resulting polyimide resin was dissolved in dioxolane so as to have an SC of 30%.
  • the resulting solution was cast onto a PET film (Cerapeel HP, manufactured by Toyo Metallizing Co., Ltd.) and dried at 80°C for 5 minutes.
  • the dried sheet was separated from the PET and fixed on a metal frame, and drying was performed at 120°C for 5 minutes, at 150°C for 5 minutes, and at 200°C for 5 minutes. Thereby, a film with a thickness of 20 ⁇ m was obtained.
  • the resulting single-layer sheet had thermoplasticity.
  • the glass transition temperature of the single-layer sheet was measured to be 160°C.
  • 4,4'- diaminodiphenyl ether (hereinafter also referred to as "4,4'-ODA”) in an amount of 50 mole percent and para- phenylenediamine (hereinafter also referred to as "p-PDA”) in an amount of 50 mole percent were added to N,N'- dimethylacetamide (hereinafter also referred to as "DMAc”) , followed by stirring for 30 minutes.
  • p-phenylene bis (trimellitic acid monoester anhydride) (hereinafter also referred to as "TMHQ”) in an amount of 50 mole percent was added thereto, and stirring was performed for 30 minutes.
  • TMHQ p-phenylene bis (trimellitic acid monoester anhydride)
  • PMDA pyromellitic dianhydride
  • the polymerization solution was cooled to about 0°C.
  • An imidization accelerator was added thereto in an amount of 45% by weight to the polyamic acid solution, the imidization accelerator comprising 2 mole percent of acetic anhydride, 1 mole percent of isoquinoline, and 4 mole percent of DMAc relative to 1 mole of polyamic acid of the polyamic acid solution.
  • Continuous stirring was performed with a mixer, and the mixture was extruded from a T-die and cast onto a stainless steel endless belt travelling 20 mm below the die.
  • the resin film was heated at 130°C for 100 seconds and separated from the endless belt. A self- supporting gel film was thereby obtained (volatile content: 54% by weight) .
  • the resulting resin solution was cast onto a surface of a 125- ⁇ m-thick PET film (trade name: Cerapeel HP, manufactured by Toyo Metallizing Co., Ltd.) functioning as a support. Drying was performed by heating with a hot-air oven at 60°C, 80°C, 100°C, 120°C, and 140°C, each for 3 minutes . A double layer sheet including the PET film as a film base was thereby formed. By separating the PET film from the double layer sheet, a single-layer sheet (resin sheet before thermal curing) was obtained. The thickness of the resin sheet was 50 ⁇ m.
  • thermoplastic polyimide precursor solution prepared in Synthesis Example 1 was diluted with DMF to 7% solid content, and then applied to both surfaces of the polyimide film produced in Synthesis Example 4 so as to have a final thickness of 4 ⁇ m, followed by drying at 140°C for 1 minute.
  • thermoplastic polyimide precursor was imidized by passing the film, at a rate of 2.5 m/min, through a far-infrared oven controlled at 410°C. A double- sided adhesive film was thereby obtained.
  • Thermal lamination was continuously performed with the tension of the adhesive film being set at 0.4 N/cm, and at a lamination temperature of 390°C, a lamination pressure of 196 N/cm (20 kgf/cm) , and a laminating speed of 2.5 m/min. After lamination, the protective films were separated from both sides, and thereby a copper-clad laminate was produced.
  • thermoplastic polyimide precursor solution prepared in Synthesis Example 2 was diluted with DMF to 7% solid concentration, and then applied to both surfaces of the polyimide film produced in Synthesis Example 4 so as to have a final thickness of 4 ⁇ m, followed by drying at 140 °C for 1 minute .
  • thermoplastic polyimide precursor was imidized by passing the film, at a rate of 2.5 m/min, through a far-infrared oven controlled at 330°C. A double- sided adhesive film was thereby obtained.
  • a rolled copper foil (BHY-22B-T, manufactured by Japan Energy Corporation) with a thickness of 18 ⁇ m was disposed on each surface of the resulting double-sided adhesive film, and a polyimide film (APICAL 125NPI, manufactured by Kaneka Corporation) as a protective film was further disposed on each side of the copper foil.
  • Thermal lamination was continuously performed with the tension of the adhesive film being set at 0.4 N/cm, and at a lamination temperature of 320°C, a lamination pressure of 196 N/cm (20 kgf/cm), and a laminating speed of 2.5 m/min. After lamination, the protective films were separated from both sides, and thereby a copper-clad laminate was produced.
  • An epoxy resin solution was prepared by dissolving 30 g of an epoxy resin (Epikote 1032H60, manufactured by Yuka Shell Epoxy Co., Ltd.) in 70 g of dioxolane. The resulting solution was cast onto a surface of a 25- ⁇ m-thick polyimide film (APICAL 25NPP, manufactured by Kaneka Corporation) so as to have a coating thickness of 5 ⁇ m after drying, and drying was performed at 80°C for 2 minutes. The other surface of the polyimide film was similarly treated, and drying was performed at 120 °C for 2 minutes. An adhesive film was there by obtained.
  • an epoxy resin Epikote 1032H60, manufactured by Yuka Shell Epoxy Co., Ltd.
  • a rolled copper foil (BHY-22B-T, manufactured by Japan Energy Corporation) with a thickness of 18 ⁇ m was disposed on each surface of the resulting adhesive film, and a polyimide film (APICAL 125NPI, manufactured by Kaneka Corporation) as a protective film was further disposed on each polyimide film. Pressing was performed at 200 °C and 3 MPa for 5 minutes. Post-curing treatment was then performed at 180°C for 3 hours. A copper-clad laminate was thereby produced.
  • insulating layers obtained by removing wiring layers by etching from the printed wiring sheets shown in Table 3 were laminated with the interlayer bonding member therebetween, and a laminate was produced by application of heat and pressure at 180°C and 3 MPa for one hour. The dielectric constant and the dielectric loss tangent of the resulting laminate were measured.
  • Table 1 shows the components and their mixing ratio with respect to the interlayer bonding member produced in each Synthesis Example.
  • Table 2 shows the measurement results of the melt viscosity and dielectric characteristics of the interlayer bonding member and the dielectric characteristics of the insulating layer of the printed wiring sheet in each Synthesis Example.
  • Table 3 shows the evaluation results of the characteristics of the multilayer printed circuit board produced in each of Examples and Comparative Examples.
  • DDS 4,4'-diaminodiphenylsulfone, manufactured by Wakayama Seika Kogyo Co., Ltd.
  • BAPS-M bis[4-(3-aminophenoxy)phenyl]sulfone, manufactured by Wakayama Seika Kogyo Co., Ltd.
  • a total thickness of the non-thermoplastic polyimide film and the adhesive layer in the printed wiring sheet is 30 ⁇ m or less, and the thickness of the interlayer bonding member is 50 ⁇ m or less.
  • the multilayer printed circuit board is used at 10 GHz.
  • the non-thermoplastic polyimide film is a polyimide film produced by reacting an acid dianhydride component containing an acid dianhydride represented by general formula (1) presented above.
  • the interlayer bonding member includes a thermosetting resin composition including a polyimide resin component (A) containing at least one polyimide resin, an epoxy resin component (B) containing at least one epoxy resin, and an epoxy curing agent component (C) containing at least one epoxy curing agent.
  • a polyimide resin component (A) containing at least one polyimide resin
  • an epoxy resin component (B) containing at least one epoxy resin
  • an epoxy curing agent component (C) containing at least one epoxy curing agent.
  • at least one polyimide resin contained in the polyimide resin component (A) is produced by reacting an acid dianhydride component containing an acid dianhydride represented by general formula (2) presented above .
  • the interlayer bonding member has a minimum melt viscosity in a range of 10 Pa • s to 10,000 Pa-s in a semi-cured state and in a temperature range of 60°C to 200°C, and has a dielectric constant of 3.4 or less and a dielectric loss tangent of 0.025 or less when measured at 12.5 GHz after curing.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Laminated Bodies (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Adhesives Or Adhesive Processes (AREA)

Abstract

L'invention concerne une carte imprimée multicouche pouvant être utilisée dans les applications haute fréquence, peu affectée par les modifications environnementales, et ayant des caractéristiques diélectriques stables. On décrit ainsi une carte qui comprend au moins deux feuilles de câblage imprimé laminées avec un élément de liaison intercouche intercalé. Au moins une des feuilles comprend un film isolant, une couche adhésive à polyimide thermoplastique qui repose sur au moins une surface du film isolant, et une couche de câblage métallique sur la couche adhésive. L'élément de liaison intercouche renferme un polyimide thermoplastique.
PCT/US2005/014360 2004-04-27 2005-04-27 Carte imprimee multicouche WO2005107344A1 (fr)

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US11/587,771 US20080032103A1 (en) 2004-04-27 2005-04-27 Multilayer Printed Circuit Board
JP2007510908A JP2007535179A (ja) 2004-04-27 2005-04-27 多層プリント配線板

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TWI460249B (zh) * 2006-02-16 2014-11-11 Shinetsu Chemical Co 黏合組成物、黏合膜及製造半導體元件的方法
EP2191701B1 (fr) 2007-09-28 2013-03-20 Tri-Star Laminates, Inc. Feuille d'entrée, son procédé de fabrication et procédés de perçage de trous dans des cartes à circuit imprimé
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KR100924151B1 (ko) * 2007-12-07 2009-10-28 조인셋 주식회사 적층 탄성 전기전도체 및 그 제조방법
WO2011056455A2 (fr) * 2009-11-06 2011-05-12 3M Innovative Properties Company Materiau dielectrique a agent de durcissement non halogene
CN101934619A (zh) * 2010-07-06 2011-01-05 广东生益科技股份有限公司 聚酰亚胺复合膜及使用其制作的埋容电路用双面挠性覆铜板
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CN106459411B (zh) * 2014-06-10 2021-01-22 延世大学校原州产学协力团 将水用作分散介质的聚酰亚胺的制备方法及水的回收方法
CN106113803A (zh) * 2016-06-16 2016-11-16 常州市超顺电子技术有限公司 一种铝基覆铜板及其用途和制备方法
CN110859029B (zh) * 2018-08-23 2022-04-01 鹏鼎控股(深圳)股份有限公司 柔性电路板及该柔性电路板制作方法
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