WO2005103319A2 - Dispositif permettant d'introduire une source d'arc electrique dans une chambre de revetement destinee a de grands substrats ou bandes - Google Patents
Dispositif permettant d'introduire une source d'arc electrique dans une chambre de revetement destinee a de grands substrats ou bandes Download PDFInfo
- Publication number
- WO2005103319A2 WO2005103319A2 PCT/EP2005/004243 EP2005004243W WO2005103319A2 WO 2005103319 A2 WO2005103319 A2 WO 2005103319A2 EP 2005004243 W EP2005004243 W EP 2005004243W WO 2005103319 A2 WO2005103319 A2 WO 2005103319A2
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- coating chamber
- vacuum
- vessel
- source
- connection
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32055—Arc discharge
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
Definitions
- the invention relates to a device for introducing an arc source, in particular melting electrodes for arc evaporation devices, into a coating chamber for large substrates or strips.
- Known devices for arc evaporation or ARC evaporation ignite an arc and regulate the electrical energy supplied to the arc in order to evaporate the material of the melting electrode in a vacuum chamber and thereby coat a substrate.
- Such devices are widely disclosed, for example in DE 195 21 419 C2.
- DE 42 23 592 C2, DE 101 27 013 A, DE 102 50 941 A1, DE 197 02 928 C2 and DE 41 09 213 C1 disclose arc sources which are secured in openings in the chamber wall and regulate the removal of the sacrificial electrode via magnetic fields .
- the patents DE 43 05 721 C1 and EP 0 516 425 B1 disclose sources with refilling of the sacrificial electrode located outside the vacuum chamber.
- the patent DE 34 13701 C2 discloses a device for holding arc sources.
- This bracket is designed as a door on a vacuum chamber.
- the previous devices have the disadvantage that they are fixed in place in openings in the vacuum chamber.
- the chamber thus has a fixed implementation for each source.
- this attachment cannot be used for processes in which the position of the source must be variable, for example when coating tapes of different widths. This disadvantage arises from the way such sources are operated.
- the arc is supplied with low-voltage DC voltage and the source is operated at a gas pressure of 10 "1 -10 '3 hPa.
- the gases used are said to burn one It is possible to use plasma to supply the arc with charge carriers, and the electrodes are usually cooled with water, and the application of such a source as disclosed in US Pat dc supply leads act as an unwanted plasma electrode and tend to evaporate during the coating process.
- the object of the present invention is to design a device of the type mentioned at the outset in such a way that it can be freely positioned in a vacuum chamber and the selected position can be changed without converting the vacuum chamber. Furthermore, the sources should be easy to maintain and have a long service life.
- Several sources can be attached to the plate (3).
- the plate (3) is connected in a vacuum-tight manner to a vacuum-tight, ventilated vessel (4), preferably sealed and screwed by means of a vacuum sealing ring.
- a screw connection with a sealing ring (9) allows the plate (3) to be removed for maintenance.
- the vessel (4) is connected to an opening in the vacuum chamber in a vacuum-tight manner via a ventilated, vacuum-tight connection (5). Through this connection (5), the electrical supply lines and preferably also the lines for the coolant of the source (1) are laid and are thus led out of the coating chamber to the supply source.
- the device according to the invention can preferably have a bellows (6) as part of the connection (5).
- This configuration of the invention makes it possible to change the position of the source easily.
- An embodiment is particularly preferred such that a part (7) of the connection (5) is made of an electrically non-conductive material, preferably rubber, between the vessel (4) and the vacuum chamber.
- the vessel (5) of the device according to the invention can preferably be attached to the vacuum chamber via electrically insulating plates or pins, preferably made of Teflon.
- This embodiment of the invention allows a method with a bias voltage, preferably as disclosed in DE 19754821 A1. It is also an advantageous embodiment of the invention that the vessel (4) together with the source (1) can be positioned as desired in the coating chamber.
- the vessel can also be attached to a movable device, preferably to a multi-axis manipulator that can be moved outside the coating chamber.
- Fig. 1 shows a cross section through the device according to the invention.
- the coating chamber is not shown for an overview.
- a commercially available arc source (1) with a separate igniter (2) is attached to a standard round flange plate (3) in a vacuum-tight manner using sealing rings (9).
- the plate (3) is flanged to a pipe flange (4).
- the tube flange (4) is welded to the plate (3) opposite side with a metal plate (10) and thus forms the vessel (4).
- a frusto-conical nozzle (11) is welded to the tube (4).
- the connection (5) then builds up via a rubber bellows (7) followed by a bellows (6).
- the entire device is positioned on the bottom of the coating system, in this example without special attachment.
- Example 2 The difference to example 1 is that the metal plate (10) of the vessel (4) is screwed to a Teflon plate. This in turn lies on the floor of the coating chamber and leads to the vessel and source being electrically insulated from the coating chamber.
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102004019060.7 | 2004-04-20 | ||
DE200410019060 DE102004019060B4 (de) | 2004-04-20 | 2004-04-20 | Vorrichtung zum Einbringen einer Lichtbogenquelle in eine Beschichtungsanlage für große Substrate oder Bänder |
Publications (2)
Publication Number | Publication Date |
---|---|
WO2005103319A2 true WO2005103319A2 (fr) | 2005-11-03 |
WO2005103319A3 WO2005103319A3 (fr) | 2006-04-13 |
Family
ID=34966915
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/EP2005/004243 WO2005103319A2 (fr) | 2004-04-20 | 2005-04-20 | Dispositif permettant d'introduire une source d'arc electrique dans une chambre de revetement destinee a de grands substrats ou bandes |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE102004019060B4 (fr) |
WO (1) | WO2005103319A2 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102009018874A1 (de) * | 2009-04-24 | 2010-11-04 | Systec System- Und Anlagentechnik Gmbh & Co.Kg | Nickelhaltiges Elektrodenmaterial |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0612859A1 (fr) * | 1993-02-25 | 1994-08-31 | VTD Vakuumtechnik Dresden GmbH | Evaporateur à décharge d'arc à basse tension ayant un dispositif d'alimentation et procédé utilisant l'évaporateur |
US20040069233A1 (en) * | 2000-12-18 | 2004-04-15 | Pavel Holubar | Apparatus for evaporation of materials for coating of objects |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3625848A (en) * | 1968-12-26 | 1971-12-07 | Alvin A Snaper | Arc deposition process and apparatus |
US5380415A (en) * | 1994-02-03 | 1995-01-10 | The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration | Vacuum vapor deposition |
-
2004
- 2004-04-20 DE DE200410019060 patent/DE102004019060B4/de not_active Expired - Fee Related
-
2005
- 2005-04-20 WO PCT/EP2005/004243 patent/WO2005103319A2/fr active Application Filing
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0612859A1 (fr) * | 1993-02-25 | 1994-08-31 | VTD Vakuumtechnik Dresden GmbH | Evaporateur à décharge d'arc à basse tension ayant un dispositif d'alimentation et procédé utilisant l'évaporateur |
US20040069233A1 (en) * | 2000-12-18 | 2004-04-15 | Pavel Holubar | Apparatus for evaporation of materials for coating of objects |
Also Published As
Publication number | Publication date |
---|---|
WO2005103319A3 (fr) | 2006-04-13 |
DE102004019060A1 (de) | 2005-11-24 |
DE102004019060B4 (de) | 2009-01-08 |
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