WO2005094148A1 - Circuit imprimé à couches multiples et méthode de fabrication de celui-ci - Google Patents

Circuit imprimé à couches multiples et méthode de fabrication de celui-ci Download PDF

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Publication number
WO2005094148A1
WO2005094148A1 PCT/JP2005/005343 JP2005005343W WO2005094148A1 WO 2005094148 A1 WO2005094148 A1 WO 2005094148A1 JP 2005005343 W JP2005005343 W JP 2005005343W WO 2005094148 A1 WO2005094148 A1 WO 2005094148A1
Authority
WO
WIPO (PCT)
Prior art keywords
wiring board
wiring
multilayer
boards
multilayer wiring
Prior art date
Application number
PCT/JP2005/005343
Other languages
English (en)
Japanese (ja)
Inventor
Masanao Watanabe
Original Assignee
Sony Chemicals Corp.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp. filed Critical Sony Chemicals Corp.
Publication of WO2005094148A1 publication Critical patent/WO2005094148A1/fr

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Definitions

  • the present invention relates to a multilayer wiring board configured using, for example, a flexible substrate and a method for manufacturing the same.
  • a through-hole is formed by drilling a laminated plate in which a conductor layer and an insulating layer are laminated, and the inner wall of the through-hole is subjected to a plating process using a conductive material. Connection between layers is performed.
  • a hole is formed on the insulating layer side of a laminated plate in which a conductor layer and an insulating layer are laminated, up to a position where the conductor surface is exposed, and the insulation including the hole is formed.
  • the whole layer is subjected to a plating process using a conductive material to make connection between the layers.
  • a bump is formed on a conductor layer by etching, plating, printing, or the like, and the conductor layer is laminated on the bump by pressing or the like, thereby connecting layers.
  • a so-called implant method is also known in which a hole is opened in a double-sided substrate with a mold, and a conductor is buried inside the hole by using a mold to connect between layers.
  • a through hole formed in a base material is filled with a conductive resin composed of metal particles and an aggregate thereof to perform connection between layers.
  • Patent Document 1 JP 2001-144398 A
  • the present invention has been made to solve such problems of the conventional technology, and an object of the present invention is to reduce the number of processes, efficiently manufacture in a short time, and use expensive materials and the like.
  • An object of the present invention is to provide a multilayer wiring board and a method for manufacturing the same, which can reduce the cost without using the same.
  • the present invention made to achieve the above object includes a plurality of wiring boards provided with a connection terminal portion of a wiring pattern at an edge of a predetermined opening, and the plurality of wiring boards arranged to face each other. Predetermined conductive particles are sandwiched between the edges of the opening of the board, the connection terminal portions of the wiring board are electrically connected to each other, and the plurality of wiring boards are adhered by an insulating adhesive.
  • This is a multilayer wiring board.
  • the size of the conductive particles is set to be 105 to 500% of the diameter of the opening of the wiring board.
  • a double-sided wiring substrate having a wiring pattern formed on both surfaces of a sheet-shaped insulating base material and having plated through holes may be provided as the wiring substrate.
  • a single-sided wiring board in which a wiring pattern is formed on one side of a sheet-shaped insulating base material can be provided as the wiring board.
  • a wiring pattern is formed on both sides of a sheet-shaped insulating base material, and a double-sided wiring board having plated through holes, and a wiring pattern is formed on one side of the sheet-shaped insulating base material. It can also be configured in combination with a single-sided wiring board.
  • a single-sided wiring board in which a wiring pattern is formed on one side of a sheet-shaped insulating substrate can be combined with each other.
  • a wiring board having a smaller size V than the wiring board may be stacked in a plurality of regions on one wiring board.
  • the present invention relates to a method for manufacturing a multilayer wiring board, which is provided at an edge of a predetermined opening.
  • a plurality of wiring boards provided with connection terminal portions of a line pattern are prepared, the plurality of wiring boards are arranged so that the openings face each other, and an insulating adhesive is arranged between the plurality of wiring boards.
  • the method further includes a step of electrically connecting the connection terminal portions of the wiring board by pressing the conductive particles while holding the predetermined conductive particles between the edges of the opening of the wiring board.
  • heating can be performed when the wiring board is pressed.
  • a plurality of wiring boards provided with openings are opposed to each other, and pressure bonding with an insulating adhesive is carried out in a state where the conductive particles are sandwiched between the edges of these openings, thereby forming a multilayer board. Therefore, the number of steps can be greatly reduced as compared with the conventional technology, and thereby, a multilayer wiring board can be efficiently manufactured in a short time at low cost.
  • multilayer wiring substrates having different numbers of layers are separately and independently stacked in different regions on the base substrate. Since it is also possible to eliminate the need for each substrate material conventionally required, it is possible to achieve weight reduction, space saving and cost reduction of the substrate.
  • the number of steps can be significantly reduced as compared with the related art, and a multilayer wiring board can be efficiently manufactured in a short time at low cost.
  • partial multi-layering can be performed on the substrate, so that the substrate can be reduced in weight, space, and cost.
  • FIG. 1 (a)-(f) A cross-sectional view showing a step of manufacturing a flexible multilayer wiring board having a four-layer wiring pattern in the embodiment of the present invention.
  • FIG. 2 (a)-(b): cross-sectional views showing steps of manufacturing a flexible multilayer wiring board having six-layer wiring patterns in another embodiment of the present invention.
  • FIG. 3 is a sectional view showing a configuration of still another embodiment of the present invention.
  • FIG. 4 is a cross-sectional view showing a configuration of still another embodiment of the present invention.
  • FIG. 5 is a cross-sectional view showing a configuration of still another embodiment of the present invention.
  • FIG. 6 is a cross-sectional view showing a configuration of still another embodiment of the present invention.
  • Substrate for double-sided wiring board 2 ... Insulating substrate 3 ... Metal foil 4 ... Through hole (opening) 5 ... Connection terminal layer (connection terminal section) 10 Double-sided wiring board 11 Conductive particles 12 Insulating adhesive layer 20 Multi-layer wiring board 30 Land (wiring pattern)
  • 1 (a) to 1 (f) are cross-sectional views showing steps of manufacturing a flexible multilayer wiring board having four wiring patterns according to an embodiment of the present invention.
  • a double-sided wiring board base material 1 in which a metal foil 3 is laminated on both sides of a sheet-shaped insulating base material 2 is prepared.
  • the substrate 1 for a double-sided wiring board for example, a copper-clad laminate in which copper foil is laminated on both sides of an insulating substrate 2 made of polyimide can be used.
  • the thickness of the insulating base material 2 is not particularly limited, but a thickness of 12 to 38 ⁇ m can be suitably used, and the thickness of the metal foil 3 is also not particularly limited. An unlimited force of 8 to 35 ⁇ m can be suitably used.
  • a circular through hole (opening) 4 is formed in a predetermined portion of the base material 1 for a double-sided wiring board, for example, by NC drilling.
  • the diameter of the through hole 4 is not particularly limited.
  • connection terminal layer (connection terminal portion) 5 To form
  • the thickness of the connection terminal layer 5 is not particularly limited, but is preferably 5 to 20 ⁇ m from the viewpoint of ensuring conduction reliability.
  • pattern jungling is performed by a known lithography method to form, for example, a land portion (wiring pattern) 30 around the through hole 4, thereby forming a double-sided wiring substrate 10 Get.
  • FIG. 1 the edge (connection terminal layer 5a) of the through hole 4a of the wiring board 10a.
  • the size of the conductive particles 11 is not particularly limited. However, in consideration of securing connection reliability and the thickness after forming the substrate, the outer diameter of the conductive particles 11 is equal to the hole diameter of the through hole 4. More specifically, it is preferable to use a through hole 4 (4a, 4b) having a hole diameter of 105 to 500%, more preferably 105 to 200%.
  • the type of the conductive particles 11 is not particularly limited, from the viewpoint of ensuring long-term conduction reliability, for example, particles made of metal such as copper (Cu) or divinylbenzene are used.
  • particles obtained by applying SnZAg plating to the surface of resin particles composed of a resin can be preferably used.
  • an insulating adhesive layer 12 is formed on one surface of the second double-sided wiring board 10b by, for example, application.
  • the thickness of the insulating adhesive layer 12 is not particularly limited. However, in consideration of securing the connection reliability and the thickness after forming the substrate, the first and second insulating adhesive layers 12 may be formed after the pressure welding. It is preferable that the distance between the surfaces of 10a and 10b between the double-sided wiring boards of 2 is 20 to 500 ⁇ m.
  • the type of insulating adhesive is not particularly limited, but the viewpoint of heat resistance and workability is mainly based on thermosetting epoxy resin or thermoplastic polyimide. Those containing a resin as a main component can be suitably used.
  • thermoplastic polyimide resin having a glass transition point of 150 ° C. to 300 ° C. from the viewpoint of heat resistance and workability.
  • the two through holes 4a and 4b are aligned.
  • the first and second double-sided wiring boards 10a are hot-pressed (not shown), for example.
  • the conductive particles 11 are formed by the edges of the through holes 4a, 4b of the first and second double-sided wiring boards 10a, 10b, ie, the connection terminal layers 5a, 5b.
  • the land portions 30a, 30b of the first and second double-sided wiring boards 10a, 10b are electrically connected via the conductive particles 11, and the first and second wiring boards 10a, 10b Are bonded to obtain a desired four-layered multilayer wiring board 20.
  • the first and second wiring boards 10a and 10b provided with the through holes 4a and 4b are opposed to each other, and are guided by the edges of the through holes 4a and 4b.
  • the number of steps can be significantly reduced compared to the conventional technology, because the board can be multi-layered in a small number of steps.
  • the multilayer wiring board 20 can be efficiently and inexpensively manufactured in a short time.
  • FIGS. 2 (a) and 2 (b) are cross-sectional views showing steps of manufacturing a flexible multilayer wiring board having a wiring pattern of six layers according to another embodiment of the present invention.
  • portions corresponding to the above-described embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
  • the multilayer wiring board 20 obtained by the steps shown in FIGS. — Prepare the third double-sided wiring board 10c obtained by the step shown in (d).
  • one conductive particle 11 is placed on the edge (connection terminal layer 5c) of through hole 4c of third double-sided wiring board 10c.
  • the insulating adhesive layer 12 is formed on the outer surface of the first double-sided wiring board 10a by, for example, coating.
  • the two through holes 4c and 4a are aligned. Then, as in the above embodiment, they are pressed while being heated.
  • the conductive particles 11 are formed by the edges of the through holes 4a, 4c of the first and third double-sided wiring boards 10a, 10c, ie, the connection terminal layers 5a, 5c. Is pinched, Thus, the land portions 30a, 30c of the first and third double-sided wiring boards 10a, 10c are electrically connected via the conductive particles 11, and the first and third wiring boards 10a, 10c are bonded. .
  • the number of steps can be significantly reduced as compared with the related art, and multilayering can be performed efficiently and in a short time.
  • Other configurations and operational effects are the same as those of the above-described embodiment, and thus detailed description thereof is omitted.
  • FIGS. 3 to 6 show still another embodiment of the present invention.
  • portions corresponding to those in the above embodiment are denoted by the same reference numerals, and detailed description thereof will be omitted.
  • the multilayer wiring board 20A shown in FIG. 3 includes a double-sided wiring board 10 obtained by the steps shown in FIGS. 1 (a) to (d) and a land portion 30d or the like on one surface of the insulating base material 2. This is a combination with a single-sided wiring board 13 on which a wiring pattern is formed.
  • an opening 4 d is formed in the insulating base material 2 of the single-sided wiring board 13 so as to correspond to the through hole 4 of the double-sided wiring board 10, and the above-described connection terminal layer is formed in the inner side wall thereof. 5d is provided.
  • conductive particles 11 placed on connection terminal layer 5d at the edge of opening 4d on single-sided wiring board 13 and double-sided wiring board 10a The opening 4d and the through-hole 4a are aligned with the formed insulating adhesive layer 12 being opposed to each other, and press-contact is performed while heating these.
  • a multilayer wiring board 20 B shown in FIG. 4 is a combination of the single-sided wiring board 13 described above and a double-sided wiring board 10 e smaller in size than the single-sided wiring board 13.
  • a multilayer wiring board 20 C shown in FIG. 5 is a combination of the single-sided wiring boards 13 described above.
  • the external connection terminal portions 31 and 32 are configured to be exposed, You can easily connect to the terminals!
  • the multilayer wiring board 50 shown in FIG. 6 is formed by laminating a plurality of double-sided wiring boards lOe smaller than the single-sided wiring board 13 on the single-sided wiring board 13 by using the above-described process. 11 is connected.
  • the number of double-sided wiring boards lOe to be laminated is different in a plurality of regions on single-sided wiring board 13 (for example, two and four).
  • the number of steps can be significantly reduced as compared with the related art, and a multilayer wiring board can be manufactured efficiently and in a short time at low cost, and can be applied to various electronic devices.
  • Various possible multilayer wiring boards can be obtained.
  • multi-layer wiring boards having different numbers of layers can be separately and independently laminated in different regions on the base substrate, thereby making it possible to obtain the conventional wiring boards. Since unnecessary substrate materials are no longer required, it is possible to further reduce the weight, space, and cost of the substrate.
  • the conductive particles are sandwiched between the connection terminals formed at the edges of the opening of the wiring board.
  • the connection terminals are not formed and the edge of the opening is formed. It is also possible to directly sandwich the conductive particles by the wiring pattern located in the portion.
  • the conductive particles can be fixed on the wiring substrate by performing reflow after arranging the conductive particles on the edge of the opening of the wiring substrate, so that the substrate can be fixed in a later step. There is a merit that the handling becomes easier!
  • the heating is performed when the wiring boards are pressed against each other.
  • the pressure may be pressed at room temperature without heating. It is possible.
  • a double-sided wiring board and a single-sided wiring board can be arbitrarily combined to form a multilayer wiring board as long as openings for sandwiching conductive particles can be arranged to face each other.
  • the present invention can form a multilayer wiring board using only a flexible substrate.
  • the present invention can be applied to a rigid substrate or a multilayer wiring board in which a rigid substrate and a flexible substrate are mixed. Can be.
  • a 200- ⁇ m-thick through-hole is formed in a copper-clad laminate with 12-m-thick copper foil laminated on both sides of a 25-m-thick insulating base material made of polyimide. After copper plating, a 10 m thick connection terminal layer was formed on the surface by electrolytic copper plating.
  • Conductive particles having a diameter of 250 ⁇ m are placed on the edge (connection terminal layer) of the through hole of the first double-sided wiring board, and a thermosetting type is placed on one surface of the second double-sided wiring board.
  • An epoxy resin adhesive was applied to a thickness of about 130 ⁇ m.
  • thermocompression bonding was performed by a hot press (temperature: 180 ° C, pressure: 10 kgZcm, time: 15 minutes) to form a four-layer multilayer.
  • a wiring board was created.
  • a through-hole with a hole diameter of 150 ⁇ m is formed in a copper-clad laminate made by laminating a 9- ⁇ m-thick copper foil on both sides of a 25- ⁇ m-thick insulating base material made of polyimide. After the carbon treatment, a 7 m-thick connection terminal layer was formed on the surface by electrolytic copper plating, followed by patterning to create a double-sided wiring board.
  • Example 1 Using the multilayer wiring boards of Example 1 and Example 2, a hot oil test (25.C, 30 seconds ⁇ 260.C, 10 seconds) was performed for 50, 100, and 150 cycles using a 20-hole daisy chain pattern. After that, the resistance value of the interlayer junction was measured. The results are shown in Table 1.
  • the adhesive strength between layers bonded by a thermosetting epoxy resin-based adhesive was measured (50, 100 cycles). In this case, the peeling angle was 90 degrees and the peeling speed was 50 mmZ.
  • the present invention can be used not only for a flexible board and a rigid board, but also for a multilayer wiring board in which a rigid board and a flexible board are mixed.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

Un circuit imprimé à couches multiples, qui peut être fabriqué efficacement avec un petit nombre de procédés en un temps court, et de plus, n’utilise pas de matériaux coûteux et similaires et réduit les coûts, et une méthode pour fabriquer ces circuits imprimés à couches multiples. Un premier et un second circuit imprimé à double face (10a, 10b) sont préparés. Sur les circuits, des couches de bornes de raccordement (5a, 5b) d’un modèle de câblage sont prévues aux périphéries de trous traversants (4a, 4b). Le premier et le second circuit imprimé à double face (10a, 10b) sont arrangés pour que les trous traversants (4a, 4b) se fassent face les uns les autres. Un adhésif isolant est arrangé entre le premier et le second circuit imprimé à double face (10a, 10b). Une particule conductrice (11) est amenée au contact avec pression en étant prise en sandwich entre les périphéries des trous traversants (4a, 4b), et donc, les couches de bornes de raccordement (5a, 5b) du premier et du second circuit imprimé double face (10a, 10b) sont raccordées électriquement.
PCT/JP2005/005343 2004-03-25 2005-03-24 Circuit imprimé à couches multiples et méthode de fabrication de celui-ci WO2005094148A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004088236A JP4351939B2 (ja) 2004-03-25 2004-03-25 多層配線基板及びその製造方法
JP2004-088236 2004-03-25

Publications (1)

Publication Number Publication Date
WO2005094148A1 true WO2005094148A1 (fr) 2005-10-06

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JP (1) JP4351939B2 (fr)
TW (1) TW200541433A (fr)
WO (1) WO2005094148A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4904242B2 (ja) * 2007-10-12 2012-03-28 新光電気工業株式会社 配線基板及びその製造方法
JP2016131246A (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 多層基板
US10199358B2 (en) * 2015-01-13 2019-02-05 Dexerials Corporation Multilayer substrate

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895894A (ja) * 1981-12-02 1983-06-07 シャープ株式会社 多層回路配線基板の製造方法
JP2000068624A (ja) * 1998-08-20 2000-03-03 Sony Chem Corp フレキシブル基板製造方法
JP2001077534A (ja) * 1999-09-08 2001-03-23 Sony Corp 積層配線基板ならびにその製造方法および製造装置
JP2002305382A (ja) * 2001-02-05 2002-10-18 Denso Corp プリント基板およびその製造方法
JP2003218526A (ja) * 2002-01-18 2003-07-31 Sumitomo Metal Mining Co Ltd 第一配線基材と第二配線基材間における配線層の接続方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895894A (ja) * 1981-12-02 1983-06-07 シャープ株式会社 多層回路配線基板の製造方法
JP2000068624A (ja) * 1998-08-20 2000-03-03 Sony Chem Corp フレキシブル基板製造方法
JP2001077534A (ja) * 1999-09-08 2001-03-23 Sony Corp 積層配線基板ならびにその製造方法および製造装置
JP2002305382A (ja) * 2001-02-05 2002-10-18 Denso Corp プリント基板およびその製造方法
JP2003218526A (ja) * 2002-01-18 2003-07-31 Sumitomo Metal Mining Co Ltd 第一配線基材と第二配線基材間における配線層の接続方法

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TW200541433A (en) 2005-12-16
JP4351939B2 (ja) 2009-10-28
JP2005277112A (ja) 2005-10-06

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