TW200541433A - Multilayer wiring boards and manufacturing process thereof - Google Patents

Multilayer wiring boards and manufacturing process thereof Download PDF

Info

Publication number
TW200541433A
TW200541433A TW94108587A TW94108587A TW200541433A TW 200541433 A TW200541433 A TW 200541433A TW 94108587 A TW94108587 A TW 94108587A TW 94108587 A TW94108587 A TW 94108587A TW 200541433 A TW200541433 A TW 200541433A
Authority
TW
Taiwan
Prior art keywords
wiring
substrate
wiring board
substrates
double
Prior art date
Application number
TW94108587A
Other languages
English (en)
Chinese (zh)
Inventor
Masanao Watanabe
Original Assignee
Sony Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Chemicals Corp filed Critical Sony Chemicals Corp
Publication of TW200541433A publication Critical patent/TW200541433A/zh

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
    • H05K3/462—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination characterized by laminating only or mainly similar double-sided circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09536—Buried plated through-holes, i.e. plated through-holes formed in a core before lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/096—Vertically aligned vias, holes or stacked vias
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10234—Metallic balls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1189—Pressing leads, bumps or a die through an insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4623—Manufacturing multilayer circuits by laminating two or more circuit boards the circuit boards having internal via connections between two or more circuit layers before lamination, e.g. double-sided circuit boards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Combinations Of Printed Boards (AREA)
TW94108587A 2004-03-25 2005-03-21 Multilayer wiring boards and manufacturing process thereof TW200541433A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004088236A JP4351939B2 (ja) 2004-03-25 2004-03-25 多層配線基板及びその製造方法

Publications (1)

Publication Number Publication Date
TW200541433A true TW200541433A (en) 2005-12-16

Family

ID=35056593

Family Applications (1)

Application Number Title Priority Date Filing Date
TW94108587A TW200541433A (en) 2004-03-25 2005-03-21 Multilayer wiring boards and manufacturing process thereof

Country Status (3)

Country Link
JP (1) JP4351939B2 (fr)
TW (1) TW200541433A (fr)
WO (1) WO2005094148A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422289B (zh) * 2007-10-12 2014-01-01 Shinko Electric Ind Co 佈線基板及其製造方法

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI809284B (zh) * 2015-01-13 2023-07-21 日商迪睿合股份有限公司 異向導電膜、連接構造體及連接構造體之製造方法
JP2016131245A (ja) * 2015-01-13 2016-07-21 デクセリアルズ株式会社 多層基板

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5895894A (ja) * 1981-12-02 1983-06-07 シャープ株式会社 多層回路配線基板の製造方法
JP3535746B2 (ja) * 1998-08-20 2004-06-07 ソニーケミカル株式会社 フレキシブル基板製造方法
JP2001077534A (ja) * 1999-09-08 2001-03-23 Sony Corp 積層配線基板ならびにその製造方法および製造装置
JP2002305382A (ja) * 2001-02-05 2002-10-18 Denso Corp プリント基板およびその製造方法
JP2003218526A (ja) * 2002-01-18 2003-07-31 Sumitomo Metal Mining Co Ltd 第一配線基材と第二配線基材間における配線層の接続方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI422289B (zh) * 2007-10-12 2014-01-01 Shinko Electric Ind Co 佈線基板及其製造方法

Also Published As

Publication number Publication date
WO2005094148A1 (fr) 2005-10-06
JP2005277112A (ja) 2005-10-06
JP4351939B2 (ja) 2009-10-28

Similar Documents

Publication Publication Date Title
TW522772B (en) Double-sided circuit board and multilayer wiring board comprising the same and process for producing double-sided circuit board
TWI242398B (en) Printed circuit board and method of manufacturing the same
JP4341588B2 (ja) 多層基板及びその製造方法
US8178191B2 (en) Multilayer wiring board and method of making the same
US20080121416A1 (en) Multilayer Printed Wiring Board And Manufacturing Method For Same
JP3867593B2 (ja) プリント基板の製造方法およびその製造方法によって形成されるプリント基板
JP2003023250A (ja) 多層基板のおよびその製造方法
JP4201436B2 (ja) 多層配線基板の製造方法
JPWO2004049772A1 (ja) 回路基板、多層配線板、回路基板の製造方法および多層配線板の製造方法
JP2009290135A (ja) プリント配線板の製造方法および導電性接合剤
JP2008103640A (ja) 多層配線基板
JP2002076637A (ja) チップ部品内蔵基板及びその製造方法
JP3989974B2 (ja) 多層印刷配線板及びその製造方法
JPH07263828A (ja) プリント配線基板及びその製造方法
TW200541433A (en) Multilayer wiring boards and manufacturing process thereof
JP2002151853A (ja) 多層配線基板とその製造方法
JP4899409B2 (ja) 多層プリント配線基板及びその製造方法
JPH11251703A (ja) 回路基板、両面回路基板、多層回路基板及び回路基板の製造方法
JP3695844B2 (ja) 多層プリント配線基板の製造方法
JP4892924B2 (ja) 多層プリント配線基板及びその製造方法
JP3694708B2 (ja) 印刷配線板の製造方法および印刷配線板
JP3474896B2 (ja) 印刷配線板およびその製造方法
JP4200664B2 (ja) 積層基板およびその製造方法
JP3955799B2 (ja) 配線基板の製造方法
JP2004179171A (ja) 配線基板