WO2005081581A1 - Microphone condensateur directionnel de type parallelepipede - Google Patents

Microphone condensateur directionnel de type parallelepipede Download PDF

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Publication number
WO2005081581A1
WO2005081581A1 PCT/KR2004/002528 KR2004002528W WO2005081581A1 WO 2005081581 A1 WO2005081581 A1 WO 2005081581A1 KR 2004002528 W KR2004002528 W KR 2004002528W WO 2005081581 A1 WO2005081581 A1 WO 2005081581A1
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WO
WIPO (PCT)
Prior art keywords
square
pcb
ring
condenser microphone
case
Prior art date
Application number
PCT/KR2004/002528
Other languages
English (en)
Inventor
Cheong-Dam Song
Original Assignee
Bse Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd filed Critical Bse Co., Ltd
Priority to CN2004800013010A priority Critical patent/CN1706216B/zh
Publication of WO2005081581A1 publication Critical patent/WO2005081581A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • A—HUMAN NECESSITIES
    • A01—AGRICULTURE; FORESTRY; ANIMAL HUSBANDRY; HUNTING; TRAPPING; FISHING
    • A01K—ANIMAL HUSBANDRY; AVICULTURE; APICULTURE; PISCICULTURE; FISHING; REARING OR BREEDING ANIMALS, NOT OTHERWISE PROVIDED FOR; NEW BREEDS OF ANIMALS
    • A01K61/00—Culture of aquatic animals
    • A01K61/80—Feeding devices
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R31/00—Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor
    • H04R31/006—Interconnection of transducer parts
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones

Definitions

  • the present invention relates to a condenser microphone. More specifically, the present invention relates to a parallelepiped type condenser microphone wherein a sound hole is formed on a surface of a PCB.
  • a typical condenser microphone includes a voltage bias element, which is generally comprised of electrets, a pair of diaphragm/back plate forming capacity C that can be varied in response to sound pressure, and a JFET (Junction Field Effect Transistor) for buffering output signal.
  • Fig. 1 is a schematic view of a conventional general condenser microphone. As shown in Fig.
  • a typical condenser microphone 10 has a cylindrical metal case including a polar ring, a diaphragm, a spacer, a back plate, a first base which has a shape of a ring made of insulating material, a second base which is made of conductive material, and a PCB, etc., therein.
  • the typical condenser microphone has an appearance having a cylindrical shape and two connection terminals are formed in the PCB. Meanwhile, during a surface mounting process, terminals of the main PCB must be conectly connected with terminals of the condenser microphone.
  • the above-mentioned conventional cylindrical condenser microphone had a construction, which was not suitable for surface mounting device (SMD).
  • connection tenninals are inadequately connected under the condition that polarity of the connection terminals has been changed during the surface mounting process or that only a part of surfaces of the connection terminals is connected because the surface of the connection teiminal is deviated, and thus, a failure of connection is increased.
  • the present invention is intended to solve the problem as mentioned above. It is an object of the present invention to provide a parallelepiped type condenser microphone wherein direction of components can be easily confirmed and a sound hole is formed on a surface of PCB.
  • a condenser microphone comprises a case having an open surface and a closed bottom surface and formed in a square box shape, a metal ring insertable into the case, a back plate formed in a disk shape and having sound holes therethrough, a thin spacer formed in a ring shape, a cylindrical insulating ring having an open top and bottom portions, a diaphragm member insertable into the insulating ring and opposing to the back plate, and the spacer being positioned between the diaphragm member and the back plate, an annular conductive ring for electrically connecting the diaphragm member to a printed circuit board (PCB), and the PCB formed in a square plate shape, having components (IC, MLCC) mounted on one surface of the PCB and projecting terminals formed on the other surface thereof, and having a sound hole formed in a center portion thereof.
  • PCB printed circuit board
  • the metal ring, the back plate, the spacer, the insulating ring, the diaphragm member, the conductive ring, and the PCB are sequentially arranged in the case and then the condenser microphone is assembled by curling an end of the case.
  • Fig. 1 is a schematic view of a conventional general condenser microphone
  • Fig. 2 is a perspective view of a parallelepiped type condenser microphone according to the present invention
  • Fig. 3 is an exploded perspective view of a first embodiment of a condenser microphone according to the present invention
  • Fig. 4 is an exploded perspective view of a second embodiment of a condenser microphone according to the present invention
  • Fig. 5 is an exploded perspective view of a third embodiment of a condenser microphone according to the present invention
  • Fig. 1 is a schematic view of a conventional general condenser microphone
  • Fig. 2 is a perspective view of a parallelepiped type condenser microphone according to the present invention
  • Fig. 3 is an exploded perspective view of a first embodiment of a condenser microphone according to the present invention
  • Fig. 4 is an exploded perspective view of a second embodiment of a condenser microphone according to the present invention
  • Fig. 5
  • FIG. 6 is a side cross-sectional view of assemblies of the first, second and third embodiments of the present invention
  • Fig. 7 is an exploded perspective view of a fourth embodiment of a condenser microphone according to the present invention
  • Fig. 8 is an exploded perspective view of a fifth embodiment of a condenser microphone according to the present invention
  • Fig. 9 is an exploded perspective view of a sixth embodiment of a condenser microphone according to the present invention
  • Fig. 10 is a side cross-sectional view of assemblies of the fourth, fifth and sixth embodiments of the present invention.
  • Fig. 2 is a perspective view of a parallelepiped type condenser microphone according to the present invention.
  • the condenser microphones 100-600 according to the present invention includes a parallelepiped case into which components are inserted and is adapted to be connected to a main PCB through a projecting terminal formed on a surface of PCB thereof.
  • This condenser microphones 100-600 of the present invention is formed in a parallelepiped shape.
  • the direction of components can be easily adjusted upon surface mounting, and this can solve a problem that the connecting surface of connection terminals of the main PCB and the condenser microphone may be deviated or the direction thereof may be shifted.
  • the condenser microphones 100-600 of the present invention provide an advantage that an installation can be easily made by forming the sound hole on the surface of the PCB without forming the sound hole on the case, and then contacting the main PCB where the sound hole is formed.
  • the parallelepiped type condenser microphones of the present invention can be constructed by a variety of components. The first to sixth embodiments will be now described in detail.
  • Fig. 3 is an exploded perspective view of the first embodiment of a parallelepiped type condenser microphone according to the present invention.
  • the condenser microphone 100 according to the present invention comprises a case 102 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 103 formed in a ring shape and inserted into the case 102 for conducting a back plate 104 and the case 102; a back plate 104 formed in a disk shape and having sound holes 104a therethrough; a thin spacer 106 formed in a ring shape; a cylindrical insulating ring 108 having an open top and bottom portions; a diaphragm member 110; an annular conductive ring 112 for electrically connecting the diaphragm member 110 to a printed circuit board (PCB; 114); and a PCB 114 formed in a square plate shape, having components (IC, MLCC) mounted on one surface of the PCB and projecting terminals 116
  • PCB printed circuit board
  • the diaphragm member 110 includes a polar ring 110a for connecting electrically to the conductive ring 112 and a diaphragm 110b vibrated by sound pressure.
  • the back plate 104 comprises a metal plate to which an organic film formed with electrets is fused.
  • Fig. 4 is an exploded perspective view of the second embodiment of a parallelepiped type condenser microphone according to the present invention.
  • the condenser microphone 200 according to the present invention comprises a case 202 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 203 insertable into the square box shaped case 202 and having a square peripheral surface and a circular inner circumferential surface; a back plate 204 formed in a square shape and having sound holes 204a therethrough; a spacer 206 having a square peripheral surface and a circular inner circumferential surface; a square box shaped insulating ring 208 having an open top and bottom portions; a diaphragm member 210 insertable into the insulating ring 208 and facing the back plate 204, the spacer 206 being interposed between the diaphragm member 210 and the back plate 204; a conductive ring 212 for electrically connecting the diaphrag
  • the diaphragm member 210 includes a polar ring 210a for connecting electrically to the conductive ring 212 and a diaphragm 210b vibrated by sound pressure.
  • the back plate 204 comprises a metal plate to which an organic film formed with electrets is fused.
  • Fig. 5 is an exploded perspective view of the third embodiment of a parallelepiped type condenser microphone according to the present invention. ⁇ Refening to Fig.
  • the condenser microphone 300 comprises a case 302 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 303 insertable into the square box shaped case 302 and having a square peripheral surface and a square inner circumferential surface; a back plate 304 formed in a square shape and having sound holes 304a therethrough; a spacer 306 having a square peripheral surface and a square inner circumferential surface; a square box shaped insulating ring 308 having an open top and bottom portions; a diaphragm member 310 insertable into the insulating ring 308 and having a square peripheral surface and a square inner circumferential surface of a diaphragm thereof; a conductive ring 312 for electrically connecting the diaphragm member 310 to a PCB 314 and having a square peripheral surface and a square inner circumferential surface; and a PCB 314 formed in a square plate shape, having components (IC, MLCC) mounted
  • the diaphragm member 310 includes a polar ring 310a for connecting electrically to the conductive ring 312 and a diaphragm 310b vibrated by sound pressure.
  • the back plate 304 comprises a metal plate to which an organic film formed with electrets is fused.
  • Fig. 6 is a side cross-sectional view of assemblies of the first, second and third embodiments of the present invention. Reference numerals of the components are denoted using those of the first embodiment representatively.
  • the condenser microphones 100-300 of the first to the third embodiments have a square box shaped case 102, respectively, in which a metal ring 103, a back plate 104, a spacer 106, an insulating ring 108, a diaphragm member 1 10, a conductive ring 112, and a PCB 114 formed with a sound hole 114a are sequentially arranged.
  • the condenser microphones are assembled and const cted such that ends of the case are curled.
  • Projecting terminals are formed on an exposed surface of the PCB 114 and the projecting terminals of the PCB are projected than the curling surface such that the condenser microphones 100-300 can be attached to a main PCB formed with a sound hole, for example, a PCB of a cellular phone in SMD method.
  • These terminals 116 may be terminal for Vdd connection and ground terminal, and tenninals required according additional functions.
  • square components of the first to the third embodiments may have edges formed in a round shape which are in contact each other, depending on convenience of manufacture and assembly of the components.
  • IC mounted in the PCB includes a junction field effect transistor (JFET), an amplifier, an analog-digital (A/D) converter or an ASIC, which is an IC customizing the amplifier and the analog-digital (A/D) converter.
  • JFET junction field effect transistor
  • A/D analog-digital
  • ASIC analog-digital converter
  • the diaphragm 110b is electrically connected to the PCB 114 through the conductive ring 112 and the polar ring 1 10a, and the back plate 104 is electrically connected to the PCB 1 14 through the case 102.
  • a sound from an external sound source is flowed in an inside of the microphone through the sound hole 114a of the PCB and is transmitted to the diaphragm 1 10b.
  • the diaphragm 110b can be vibrated by the sound pressure. Then, a gap between the diaphragm 110b and the back plate 104 can be varied.
  • the electrostatic capacity produced by the diaphragm 110b and the back plate 104 will be varied and thus, a change of an electric signal (voltage) according to a sound wave can be attained.
  • This signal will be transmitted to the IC mounted in the PCB 114 along the above electrical connection path to be amplified and then outputted to an external circuit through the projecting terminals 116
  • Fig. 7 is an exploded perspective view of a fourth embodiment of a condenser microphone according to the present invention.
  • the condenser microphone 400 of the present invention comprises a case 402 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 403 formed in a ring shape and insertable into the square box shaped case 402; a back plate 404 formed in a disk shape and having sound holes 404a therethrough; a thin spacer 406 formed in a ring shape; an annular shield ring 408 for insulating a diaphragm member 410; a diaphragm member 410 inserted to the shield ring 408; an integrated base 412 having a conductive layer 412b for providing an electrical connection between the diaphragm member 410 and the PCB 414 and formed in an inner surface of a cylindrical insulating body 412a having open top and bottom portions; and a PCB 414 formed in a
  • the diaphragm member 410 includes a polar ring 410a for connecting electrically to the conductive layer 412b and a diaphragm 410b vibrated by sound pressure.
  • the back plate 404 comprises a metal plate to which an organic film formed with electrets is fused.
  • the integrated base 412 has a construction such that the hollow cylindrical insulating body 412a is used as a PCB using a PCB technique and then the conductive layer 412b of a metal plate having an outer diameter smaller than a peripheral outer diameter thereof is formed in both sides and an inner circumferential surface of the hollow cylindrical insulating body 412a.
  • the integrated base 412 is constructed such that a first base performing a conventional insulating function and a second base performing a conducting function can be comprised of one integral base.
  • the outer diameter of the metal plate should be smaller than an outer diameter of the insulating body so as not to be contacted to the case.
  • the insulating body may preferably be comprised of glass epoxy base, resin base, or PVC based insulating printed board.
  • the insulating body 412a performs an insulating function and also can provide a conductive function by forming a metal plated layer in one side thereof to be contacted to the diaphragm member 410 and the other side thereof to be contacted to the PCB 414 and then connecting the top and bottom metal plated layers with a through hole or via hole such that the metal plated layer can be electrically connected.
  • Fig. 8 is an exploded perspective view of a fifth embodiment of a condenser microphone according to the present invention.
  • the condenser microphone 500 of the present invention comprises a case 502 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 503 insertable into the square box shaped case 502 and having a square peripheral surface and a square inner circumferential surface of a diaphragm thereof; a back plate 504 formed in a square plate shape and having sound holes 504a therethrough; a spacer 506 having a square peripheral surface and a square inner circumferential surface; an square ring shaped shield ring 508 for insulating a diaphragm member 510; a diaphragm member 510 inserted to the shield ring 508 and having a square peripheral surface and a square inner circumferential surface of a diaphragm thereof; an integrated base 512 having a conductive layer 512b for providing an
  • the diaphragm member 510 includes a polar ring 510a for connecting electrically to the conductive layer 512b and a diaphragm 510b vibrated by sound pressure.
  • the back plate 504 comprises a metal plate to which an organic film formed with electrets is fused.
  • the integrated base 512 has a construction such that the hollow cylindrical insulating body 512a is used as a PCB using a PCB technique and then the conductive layer 512b of a metal plate having an outer diameter smaller than a peripheral outer diameter thereof is fonned in both sides and an inner circumferential surface of the hollow cylindrical insulating body 512a.
  • the integrated base 512 is constructed such that a first base perfonning a conventional insulating function and a second base performing a conducting function can be comprised of one integral base.
  • the outer diameter of the metal plate should be smaller than an outer diameter of the insulating body so as not to be contacted to the case.
  • the insulating body may preferably be comprised of glass epoxy base, resin base, or PVC based insulating printed board.
  • the insulating body 512a performs an insulating function and also can provide a conductive function by forming a metal plated layer in one side thereof to be contacted to the diaphragm member 510 and the other side thereof to be contacted to the PCB 514 and then connecting the top and bottom metal plated layers with a through hole or via hole such that the metal plated layer can be electrically connected.
  • Fig. 9 is an exploded perspective view of a sixth embodiment of a condenser microphone according to the present invention.
  • the condenser microphone 600 of the present invention comprises a case 602 having an open surface and a closed bottom surface and formed in a square box shape; a metal ring 603 insertable into the square box shaped case 602 and having a square peripheral surface and a circular inner circumferential surface; a back plate 604 formed in a disk shape and having sound holes 604a therethrough; a spacer 606 having a square peripheral surface and a circular inner circumferential surface; an circular shield ring 608 for insulating a diaphragm member 610 and having a square peripheral surface and a circular inner circumferential surface; a diaphragm member 610 inserted to the shield ring 608 and having a square peripheral surface and a circular inner circumferential surface of a diaphragm thereof; an integrated base 612 having a conductive layer 612b for
  • the diaphragm member 610 includes a polar ring 610a for connecting electrically to the conductive layer 612b and a diaphragm 610b vibrated by sound pressure.
  • the back plate 604 comprises a metal plate to which an organic film formed with electrets is fused.
  • the integrated base 612 has a construction such that the hollow cylindrical insulating body 612a is used as a PCB using a PCB technique and then the conductive layer 612b of a metal plate having an outer diameter smaller than a peripheral outer diameter thereof is formed in both sides and an inner circumferential surface of the hollow cylindrical insulating body 612a.
  • the integrated base 612 according to the present invention is constructed such that a first base performing a conventional insulating function and a second base perfonning a conducting function can be comprised of one integral base.
  • the outer diameter of the metal plate should be smaller than an outer diameter of the insulating body so as not to be contacted to the case.
  • the insulating body may preferably be comprised of glass epoxy base, resin base, or PVC based insulating printed board.
  • the insulating body 612a performs an insulating function and also can provide a conductive function by forming a metal plated layer in one side thereof to be contacted to the diaphragm member 610 and the other side thereof to be contacted to the PCB 614 and then connecting the top and bottom metal plated layers with a through hole or via hole such that the metal plated layer can be electrically connected.
  • Fig. 10 is a side cross-sectional view of assemblies of the fourth to sixth embodiments of the present invention. Reference numerals of components are denoted using those of the fourth embodiment representatively.
  • the condenser microphones 400-600 of the fourth to sixth embodiments have a square box shaped case 402, respectively, in which a metal ring 403, a back plate 404, a spacer 406, a shield ring 408, diaphragm members 410, a an integrated base 412, and a square plate shaped PCB formed with a sound hole 414a are sequentially arranged.
  • the condenser microphones are assembled and constructed such that ends of the case are curled.
  • Projecting terminals are formed on an exposed surface of the PCB 414 and the exposed surface of the PCB is projected than the curling surface such that the condenser microphones 400-600 can be attached to a main PCB, for example, a PCB of a cellular phone in SMD method.
  • These terminals 416 may be terminal for Vdd connection and ground terminal, and terminals required according additional functions.
  • square components of the fourth to the sixth embodiments may have edges fonned in a round shape which are in contact each other, depending on convenience of manufacture and assembly of the components.
  • IC mounted in the PCB includes a field effect transistor (JFET), an amplifier, a customized analog- digital (A/D) converter or amplifier and an analog-digital (A/D) converter (ASIC).
  • JFET field effect transistor
  • A/D analog-digital converter
  • ASIC analog-digital converter
  • the back plate 404 is electrically connected to the PCB 414 through the case 402 and the metal ring 403, and the diaphragm member 410 is electrically connected to the PCB 414 through the conductive layer 412b of the integrated base 412.
  • a sound from an external sound source is flowed in an inside of the microphone through the sound hole 414a of the PCB and is transmitted to the diaphragm 410b.
  • a sound of a back chamber is transmitted to the diaphragm 410b through the sound hole 404a of the back plate 404.
  • the diaphragm 410b can be vibrated by the sound pressure.
  • a gap between the diaphragm 410b and the back plate 404 can be varied.
  • the electrostatic capacity produced by the diaphragm 410b and the back plate 404 will be varied and thus, a change of an electric signal (voltage) according to a sound wave can be attained.
  • This signal will be transmitted to the IC mounted in the PCB 414 along the above electrical connection path to be amplified and then outputted to an external circuit through the projecting terminals 416
  • the condenser microphones of the present invention because a direction of components can be confi ⁇ ned during a process of a surface mounting device (SMD), the connection terminals of components can be easily adjusted each other. Accordingly, this can prevent connection surfaces of connection terminals of a main PCB and- connection terminals of the condenser microphone from being deviated, and also decrease a failure of connection that may be resulted from change of connection or direction (polarity) of the connection tenninals. Furthermore, the condenser microphones of the present invention provide an advantage that an installation can be easily made by forming the sound hole on the surface of the PCB, not on the surface of the case. While the present invention has been described above with reference to the prefened embodiments thereof, it can be understood by the person skilled in the art that various modifications or changes may be made without deviating from the scope and the concept of the present invention described in the accompanying claims.

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  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Environmental Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Zoology (AREA)
  • Animal Husbandry (AREA)
  • Biodiversity & Conservation Biology (AREA)
  • Marine Sciences & Fisheries (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

Un microphone condensateur de type parallélépipède dans lequel un orifice sonore est ménagé sur une surface d'un PCB. Le microphone condensateur comprend un boîtier, un anneau métallique, une plaque arrière, un espaceur mince, un anneau d'isolation cylindrique, un élément diaphragme, un anneau conducteur annulaire et un PCB. Et si, l'anneau métallique, la plaque arrière, l'espaceur, l'anneau d'isolation, l'anneau de diaphragme, l'anneau conducteur et le PCB, sont disposés séquentiellement dans le boîtier et le microphone condensateur est assemblé par bordage de l'extrémité du boîtier. Ainsi, en raison de la direction des composants confirmée pendant le procédé SMD, les composants peuvent être facilement insérés les uns dans les autres. Ceci permet d'éviter la déviation des surfaces de connexion des bornes de connexion d'un PCB principal et des bornes de connexion du microphone condensateur et de diminuer les pannes de connexion qui peuvent résulter de la modification de connexion ou de direction (polarité) des bornes de connexion.
PCT/KR2004/002528 2004-02-24 2004-10-01 Microphone condensateur directionnel de type parallelepipede WO2005081581A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2004800013010A CN1706216B (zh) 2004-02-24 2004-10-01 平行六面体型电容式传声器

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020040012309A KR100544282B1 (ko) 2004-02-24 2004-02-24 평행육면체형 콘덴서 마이크로폰
KR10-2004-0012309 2004-02-24

Publications (1)

Publication Number Publication Date
WO2005081581A1 true WO2005081581A1 (fr) 2005-09-01

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Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2004/002528 WO2005081581A1 (fr) 2004-02-24 2004-10-01 Microphone condensateur directionnel de type parallelepipede

Country Status (10)

Country Link
US (1) US7327851B2 (fr)
EP (1) EP1569498A3 (fr)
JP (1) JP3974918B2 (fr)
KR (1) KR100544282B1 (fr)
CN (1) CN1706216B (fr)
MX (1) MXPA05002088A (fr)
MY (1) MY137587A (fr)
SG (1) SG152043A1 (fr)
TW (1) TWI296891B (fr)
WO (1) WO2005081581A1 (fr)

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KR100675510B1 (ko) * 2005-04-25 2007-01-30 주식회사 비에스이 이중 베이스 및 이를 이용한 일렉트릿 콘덴서 마이크로폰
JP4698320B2 (ja) * 2005-07-26 2011-06-08 株式会社オーディオテクニカ コンデンサーマイクロホンユニットおよびコンデンサーマイクロホン
KR100650280B1 (ko) * 2005-09-15 2006-11-29 주식회사 비에스이 기판에 음향홀이 형성된 실리콘 콘덴서 마이크로폰
KR100740462B1 (ko) 2005-09-15 2007-07-18 주식회사 비에스이 지향성 실리콘 콘덴서 마이크로폰
KR20070031524A (ko) * 2005-09-15 2007-03-20 주식회사 비에스이 표면실장형 일렉트릿 콘덴서 마이크로폰 구조체
KR100753913B1 (ko) * 2006-04-11 2007-09-05 주식회사 씨에스티 마이크로폰 조립체
KR100797440B1 (ko) * 2006-09-05 2008-01-23 주식회사 비에스이 사각통 형상의 일렉트릿 콘덴서 마이크로폰
TWI370101B (en) 2007-05-15 2012-08-11 Ind Tech Res Inst Package and packaging assembly of microelectromechanical sysyem microphone
KR20090039376A (ko) * 2007-10-18 2009-04-22 주식회사 비에스이 기생용량을 줄인 콘덴서 마이크로폰 조립체
TWI398172B (zh) * 2008-12-17 2013-06-01 Goertek Inc Microphone vibration film and electret condenser microphone
SE534314C2 (sv) * 2009-11-10 2011-07-05 Goeran Ehrlund Elektroakustisk omvandlare
CN101893477B (zh) * 2010-07-01 2012-07-04 北京航空航天大学 一种测量传声器
US8375560B2 (en) * 2011-02-22 2013-02-19 Taiwan Carol Electronics Co., Ltd. Method for manufacturing a condenser microphone
USD868042S1 (en) * 2017-04-06 2019-11-26 Bing Yang Karaoke microphone
DE102018203098B3 (de) * 2018-03-01 2019-06-19 Infineon Technologies Ag MEMS-Sensor
USD880459S1 (en) * 2018-12-20 2020-04-07 Shenzhen Hua Sirui Technology Co. Ltd. Microphone
USD883961S1 (en) * 2018-12-30 2020-05-12 Shenzhen Hua Sirui Technology Co. Ltd. Microphone
US11671763B2 (en) 2021-02-24 2023-06-06 Shure Acquisition Holdings, Inc. Parylene electret condenser microphone backplate

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KR20050087092A (ko) 2005-08-31
JP3974918B2 (ja) 2007-09-12
US20050185811A1 (en) 2005-08-25
EP1569498A2 (fr) 2005-08-31
TWI296891B (en) 2008-05-11
TW200536414A (en) 2005-11-01
CN1706216A (zh) 2005-12-07
KR100544282B1 (ko) 2006-01-23
EP1569498A3 (fr) 2012-05-30
MXPA05002088A (es) 2005-09-08
US7327851B2 (en) 2008-02-05
CN1706216B (zh) 2011-05-11
MY137587A (en) 2009-02-27
JP2005244977A (ja) 2005-09-08
SG152043A1 (en) 2009-05-29

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