WO2007024047A1 - Microphone a condensateur electret - Google Patents

Microphone a condensateur electret Download PDF

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Publication number
WO2007024047A1
WO2007024047A1 PCT/KR2006/000387 KR2006000387W WO2007024047A1 WO 2007024047 A1 WO2007024047 A1 WO 2007024047A1 KR 2006000387 W KR2006000387 W KR 2006000387W WO 2007024047 A1 WO2007024047 A1 WO 2007024047A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
pcb
back plate
insulating base
plate
Prior art date
Application number
PCT/KR2006/000387
Other languages
English (en)
Inventor
Chung-Dam Song
Original Assignee
Bse Co., Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd filed Critical Bse Co., Ltd
Publication of WO2007024047A1 publication Critical patent/WO2007024047A1/fr

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Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/01—Electrostatic transducers characterised by the use of electrets
    • H04R19/016—Electrostatic transducers characterised by the use of electrets for microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention relates to an electret condenser microphone, and, more particularly, to an electret condenser microphone for preventing deformation of parts upon a curling process and enhancing a high temperature characteristic.
  • a typical condenser microphone consists of a voltage bias element which is generally made of electret, a pair of a vibration membrane and a back plate for forming a capacitor which is changed corresponding to a sound pressure, and a JFET for buffering an output signal.
  • the electret condenser microphone is formed with an electret on any one of the vibration membrane and the back plate thereof, wherein an electret which is formed on the vibration membrane is called a front electret, and an electret which is formed on the back plate is called a back electret.
  • the electret is formed by forcibly applying electric charges into an organic film.
  • Fig. 1 is a sectional side view of a condenser microphone assembly using a conventional case.
  • the conventional microphone assembly has a case 10 which is formed with a sound hole 10c on a bottom surface thereof.
  • the case 10 is provided with a vibration plate 12 which is consisted of a vibration membrane 12a and a polar ring 12b, a spacer 13, an insulating base 14, a back plate 15, a conductive base 16 and a PCB 18 therein.
  • An opened end 10b of the case 10 is curled on the PCB 18.
  • the conductive base 16 serves not only to transfer an electric signal generated from a microphone unit (that is, the vibration/back plate electret) to a JFET, an amplifier or elements having an amplifier and an AD converter, but also to mechanically fix parts inserted into the case.
  • an object of the present invention is to provide a condenser microphone for enhancing a temperature characteristic by allowing an insulation base to surround a pair of a vibration plate and a back plate and for preventing the deformation of parts by allowing a conductive base having a broad supporting surface which is formed by a shape of "D" to support the PCB upon a curling process.
  • an electret condenser microphone comprising: a case which is formed with a sound hole on a bottom surface thereof; an insulating base which is mounted in the case to contact the bottom surface of the case for electrically insulating the case and parts within the case; a vibration plate which is mounted within the insulating base and is electrically connected with the bottom surface of the case and is vibrated according to a sound pressure inputted through the sound hole; a spacer which is mounted within the insulating base to form a gap; a back plate which is mounted within the insulating base and faces the vibration plate with the spacer interposed therebetween, the back plate having an electret which is formed by adhering a high molecular film to an external side of a metal plate; a conductive base including a cylindrical body having both sides which are opened and a supporting part having a broad supporting area by allowing an upper surface of the body to be projected to the outside, thereby conducting the back plate and allowing the supporting part
  • FIG. 1 is a sectional side view of a conventional condenser microphone assembly
  • FIG. 2 is a view showing to explain a spirit of the present invention
  • FIG. 3 is a sectional view showing a conductive base of a condenser microphone according to the present invention.
  • FIG. 4 is a sectional side view of a condenser microphone assembly according to the present invention.
  • FIG. 5 is a sectional side view of a condenser microphone assembly having projecting terminals according to the present invention
  • FIG. 6 is an external view of a condenser microphone assembly shown in Fig. 5;
  • FIG. 7 is a sectional side view of another embodiment according to the present invention.
  • FIG. 8 is a flow diagram for assembling a condenser microphone according to the present invention. Best Mode for Carrying Out the Invention
  • FIG. 2 is a view showing to explain a spirit of the present invention.
  • a first enlarged drawing within a circle conceptually shows that a PCB 18 within a conventional condenser microphone is bent upon a curling process.
  • a second enlarged drawing within a circle conceptually shows that a PCB 114 is prevented from being bent by allowing a conductive base 112 having a shape of "D" to support the PCB 114 upon a curling process according to the present invention.
  • PCB 18 as shown in the first enlarged drawing, has a linear upper end portion, an end surface area for supporting the PCB 18 is narrow, whereby an end of the PCB 18 is bent inward by a pressing force in the curling process of folding an opened end 10b of the case and bending toward the PCB 18.
  • an acoustic path is changed, whereby a sound quality is deteriorated.
  • the parts which are mounted within the case are damaged.
  • an upper supporting surface which contacts a surface of a PCB 114 is projected outwardly in a shape of "D", thereby broadly supporting the surface of PCB 114 upon curling an opened end 102b of the case. As a result, the PCB 114 is prevented from being bent.
  • FIG. 3 is a sectional view showing a conductive base of a condenser microphone ac cording to the present invention.
  • the conductive base 112 includes a body 112a which has a cylindrical shape having both sides which are opened, and a supporting part 112b which forms a broad flat area for supporting the PCB 114 by projecting an upper surface of the body 112a outwardly to has a left sectional shape of "D" and a right sectional shape of " p"
  • the supporting part 112b for supporting the PCB 114 is broadly expanded compared with the body 112a, thereby enlarging a supporting area in the curling process and thus preventing the PCB 114 from being bent.
  • FIG. 4 is a sectional side view of an electret condenser microphone assembly according to the present invention.
  • the insulating base 110 has a structure for inserting the insulating base 110 into the hollow case 102 having an opened side and a bottom side which is formed with the sound hole 102a, inserting a vibration plate 104 having a polar ring 104a and a vibration membrane 104b to be served as a movable electrode, a spacer 106 for forming a gap, a back plate 108 which is formed with a sound hole 108a and is served as a fixing electrode, and a conductive base 112 for providing a conductive function to the back plate 108 into the insulating base 110, and then curling the opened end 102b of the case after inserting the PCB 114 which is mounted with parts.
  • the back plate 108 is formed with an electret by pressing an organic film 108b on a metal plate 108b and forcibly injecting electric charges to the organic film 108b.
  • the insulating base 110 is longer than the conventional base to reach a bottom surface of the case 102.
  • the vibration plate 104 faces the back plate 108 with the spacer 106 interposed between the vibration plate 104 and the back plate 108 in the insulating base 110.
  • the insulating base 110 surrounds the vibration plate 104 and the back electret, thereby protecting the electret upon the reflow process in a high temperature for a SMT.
  • the insulating base 110 preferably, is made of a material having thermal resistance and tolerance such as fluoroplastic series, polymer series or plastic series.
  • FIG. 5 is a sectional side view of a condenser microphone assembly having projecting terminals according to the present invention.
  • the projecting terminals 114a and 114b are projected from an exposed surface of the PCB 114 higher than the curled surface 102b
  • the connecting terminals 114a and 114b which is projected from the exposed surface of the PCB 114 higher than the curled surface 102b of the case 102 allows the microphone 100 to be bonded to another PCB (for example, PCB of a mobile phone) in the SMD process.
  • the connecting terminals 114a and 114b as shown in Fig. 6, are consisted of the circular terminal 114a for a Vdd connection which is positioned inside of the PCB 114 and the circular ground terminal 114b which is spaced from the terminal 114a to the outside.
  • the ground terminal 114b may be separated by a gas discharging recess to discharge a gas generated when bonding in the SMD process.
  • the condenser microphone 100 of the present invention if air is flown through the sound hole 102a of the case 102 into the microphone by an external sound wave, the vibration membrane 104b is vibrated by a sound pressure and then the air is flown through through-holes 108a of the back plate 108 into a back chamber which is formed between the PCB 114 and the back plate.108. At this time, if the vibration membrane 104b is vibrated by the sound pressure which is applied through the sound hole 102a, a gap between the vibration membrane 104b and the back plate 108 is changed.
  • the gap is changed by the sound pressure, electrostatic capacity which is formed by the vibration plate 104b and the back plate 108 is changed, thereby obtaining a change of an electrical signal (that is, voltage) according to the sound wave.
  • the electrical signal is transferred to an IC, for example, JFET and so on which are mounted on the PCB 114, and then is amplified. Finally, the amplified signal is transferred through a connecting terminal (not shown) to the outside.
  • Fig. 7 is a sectional side view of another embodiment according to the present invention, wherein the position of the vibration plate 104 and the back plate 108 within the insulating base 110 is reversed with the spacer interposed between them when comparing with the structure in Fig. 4.
  • the insulating base 110 is longer than the conventional base to reach a bottom surface of the case 102.
  • the vibration plate 104 faces the back plate 108 with the spacer 106 interposed between the vibration plate 104 and the back plate 108 in the insulating base 110.
  • the insulating base 110 surrounds the electret, thereby protecting the electret upon the reflow process in a high temperature for a SMT.
  • the insulating base preferably, is made of a material having thermal resistance and tolerance such as fluo- roplastic series, polymer series or plastic series.
  • Fig. 8 is a flow diagram for assembling a condenser microphone according to the present invention.
  • an assembling process including the steps of preparing the case 102 (Sl), inserting the insulating base 110 into the case 102 (S2), inserting the vibration plate 104, the spacer 106 and the back plate 108 in turn into the insulating base 110 in case of a first structure shown in Fig.4 or inserting the back plate 108, the spacer 106, and the vibration plate 104 in turn into the insulating base 110 in case of a second structure shown in Fig. 7 (S6 to S8), inserting a T typed metal base (that is, conductive base 112) (S9), inserting the PCB 114 (SlO), and curling the case 102 (SI l).
  • the microphone for allowing the conductive base having the wide supporting surface to broadly support the PCB in the process for curling the opened end of the case, thereby preventing the PCB from being bent or preventing the other parts to be deformed due to a stress on the other parts and thus providing a superior acoustic characteristic.
  • the insulating base surrounds the pair of the vibration plate and the back plate, thereby preventing the electret characteristic from being deteriorated upon the reflow process in a high temperature.

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)

Abstract

L’invention concerne un microphone à condensateur électret, comprenant : un boîtier au fond duquel est ménagé un trou sonore ; un socle isolant monté dans le boîtier de manière à être au contact du fond du boîtier ; une plaque vibratoire raccordée électriquement au fond du boîtier et vibrant en fonction d’une pression sonore appliquée par le trou sonore ; un écarteur servant à former un espace ; une plaque arrière en regard de la plaque vibratoire et séparée de celle-ci par l’écarteur, la plaque arrière comportant un électret formé par adhésion d’une couche de poids moléculaire élevé sur un côté externe d’une plaque métallique ; un socle conducteur couplé à la plaque arrière et permettant à une pièce de soutien de soutenir une carte à circuit imprimé lors d’un processus de bordage, en vertu de quoi le socle conducteur soutient la carte à circuit imprimé par bordage d’une extrémité ouverte du boîtier après insertion des différents composants dans le boîtier.
PCT/KR2006/000387 2005-08-20 2006-02-03 Microphone a condensateur electret WO2007024047A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050076520A KR100632694B1 (ko) 2005-08-20 2005-08-20 일렉트릿 콘덴서 마이크로폰
KR10-2005-0076520 2005-08-20

Publications (1)

Publication Number Publication Date
WO2007024047A1 true WO2007024047A1 (fr) 2007-03-01

Family

ID=37626018

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2006/000387 WO2007024047A1 (fr) 2005-08-20 2006-02-03 Microphone a condensateur electret

Country Status (3)

Country Link
KR (1) KR100632694B1 (fr)
CN (1) CN1917720B (fr)
WO (1) WO2007024047A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051317A1 (fr) * 2007-10-18 2009-04-23 Bse Co., Ltd. Boîtier de microphone à microsystème électromécanique
US8438833B2 (en) 2009-02-13 2013-05-14 General Electric Company Partial filling of a pulse detonation combustor in a pulse detonation combustor based hybrid engine
EP2584793A3 (fr) * 2011-10-18 2014-05-21 Hosiden Corporation Microphone de condensateur à électret
EP3373597A1 (fr) * 2017-03-07 2018-09-12 G.R.A.S. Sound & Vibration A/S Microphone à montage en surface à profil bas

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101150889B (zh) * 2007-10-31 2011-05-25 日月光半导体制造股份有限公司 微机电麦克风封装结构及其方法
CN102238455A (zh) * 2010-04-23 2011-11-09 安国国际科技股份有限公司 具有电磁波接收器的声音感测器
KR101276353B1 (ko) * 2011-12-09 2013-06-24 주식회사 비에스이 다기능 마이크로폰 조립체 및 그 제조방법
US9210516B2 (en) 2012-04-23 2015-12-08 Infineon Technologies Ag Packaged MEMS device and method of calibrating a packaged MEMS device
US20140291783A1 (en) * 2013-03-21 2014-10-02 Knowles Electronics, Llc Cover for a mems microphone
CN106841396B (zh) * 2015-12-03 2019-05-28 中国科学院上海微系统与信息技术研究所 硅基电容式声发射传感器及其制备方法
CN106604190A (zh) * 2017-01-13 2017-04-26 无锡红光微电子股份有限公司 一种mems麦克风封装结构
US10728674B2 (en) * 2018-08-27 2020-07-28 Solid State System Co., Ltd. Microphone package
CN110085580B (zh) * 2019-05-27 2024-05-24 星科金朋半导体（江阴）有限公司 一种植入阻尼器的芯片封装结构及其封装方法
US11897390B2 (en) * 2019-11-27 2024-02-13 Harman International Industries, Incorporated Techniques for constructing and controlling a vehicle light assembly

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261295A (ja) * 1984-06-08 1985-12-24 Matsushita Electric Ind Co Ltd エレクトレツトコンデンサマイクロホン
EP1109422A2 (fr) * 1999-12-13 2001-06-20 Won-Il Communics Co., Ltd Microphone à condensateur
US6323049B1 (en) * 2000-05-22 2001-11-27 Won-Il Communics Co., Ltd. Method for manufacturing condenser microphone
JP2002078091A (ja) * 2000-08-31 2002-03-15 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100512511C (zh) * 2005-05-26 2009-07-08 歌尔声学股份有限公司 封装硅传声器的微型装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60261295A (ja) * 1984-06-08 1985-12-24 Matsushita Electric Ind Co Ltd エレクトレツトコンデンサマイクロホン
EP1109422A2 (fr) * 1999-12-13 2001-06-20 Won-Il Communics Co., Ltd Microphone à condensateur
US6323049B1 (en) * 2000-05-22 2001-11-27 Won-Il Communics Co., Ltd. Method for manufacturing condenser microphone
JP2002078091A (ja) * 2000-08-31 2002-03-15 Matsushita Electric Ind Co Ltd エレクトレットコンデンサマイクロホン

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009051317A1 (fr) * 2007-10-18 2009-04-23 Bse Co., Ltd. Boîtier de microphone à microsystème électromécanique
US8438833B2 (en) 2009-02-13 2013-05-14 General Electric Company Partial filling of a pulse detonation combustor in a pulse detonation combustor based hybrid engine
EP2584793A3 (fr) * 2011-10-18 2014-05-21 Hosiden Corporation Microphone de condensateur à électret
EP3373597A1 (fr) * 2017-03-07 2018-09-12 G.R.A.S. Sound & Vibration A/S Microphone à montage en surface à profil bas
WO2018162263A1 (fr) * 2017-03-07 2018-09-13 G.R.A.S. Sound & Vibration A/S Microphone à montage en surface discret
US11297440B2 (en) 2017-03-07 2022-04-05 G.R.A.S. Sound And Vibration A/S Low profile surface mount microphone

Also Published As

Publication number Publication date
CN1917720B (zh) 2012-08-22
CN1917720A (zh) 2007-02-21
KR100632694B1 (ko) 2006-10-16

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