WO2009051317A1 - Boîtier de microphone à microsystème électromécanique - Google Patents

Boîtier de microphone à microsystème électromécanique Download PDF

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Publication number
WO2009051317A1
WO2009051317A1 PCT/KR2008/001862 KR2008001862W WO2009051317A1 WO 2009051317 A1 WO2009051317 A1 WO 2009051317A1 KR 2008001862 W KR2008001862 W KR 2008001862W WO 2009051317 A1 WO2009051317 A1 WO 2009051317A1
Authority
WO
WIPO (PCT)
Prior art keywords
mems microphone
metal case
pcb
chip
end portion
Prior art date
Application number
PCT/KR2008/001862
Other languages
English (en)
Inventor
Chung-Dam Song
Original Assignee
Bse Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd. filed Critical Bse Co., Ltd.
Publication of WO2009051317A1 publication Critical patent/WO2009051317A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/005—Electrostatic transducers using semiconductor materials
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H04R1/04—Structural association of microphone with electric circuitry therefor
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones

Definitions

  • the present invention relates to a micro electro mechanical system (MEMS) microphone package, and more particularly, to a MEMS microphone package that can directly attaches a metal case to a main board using an assembling process in which an end portion of the metal case is bent and clamped to shield a MEMS microphone chip from a nose, thereby significantly improving an acoustic quality and reducing manufacturing costs.
  • MEMS micro electro mechanical system
  • Typical condenser microphones include a diaphragm in which a flexible membrane is attached to one side electrode thereof and vibrated by an acoustic pressure and a back plate facing the diaphragm with a predetermined distance therebetween by a spacer.
  • the diaphragm and the back plate constitute parallel electrode plates of the condenser. A DC voltage is applied to the both electrode plates, or an electret is formed on one of the electrode plates to generate a charge therebetween.
  • Such a typical condenser microphone is assembled using a curling method in which the diaphragm, the spacer, a first base, the back plate, a second base, and a printed circuit board (PCB) on which an electronic circuit is mounted are successively stacked inside a cylindrical case, and an end portion of the case is bent toward the PCB and clamped.
  • PCB printed circuit board
  • a condenser microphone used in communication products denotes an electret condenser microphone in which the electret is formed on the back plate using a polymeric membrane.
  • the electret condenser microphone is manufactured at low cost, but it is difficult to miniaturize the electret condenser microphone.
  • a semiconductor manufacturing technique and a micromachining technique are applied to a silicon wafer to realize a capacitance structure with a die shape.
  • This chip is called a silicon condenser microphone chip or a MEMS microphone chip.
  • the MEMS microphone chip must be packaged to shield the chip from an external interference.
  • a MEMS microphone package technique uses a method in which a case 34 including a conductive layer or formed of a conductive material is attached to a printed circuit board (PCB) 32 using a conductive adhesive 36 to manufacture a housing.
  • a MEMS microphone chip 10 and an application specific integrated circuit (ASIC) chip 20 are mounted on the PCB 32, and a case 34 having an acoustic hole 34a is attached to the PCB 32 using the adhesive 36 to shield the MEMS microphone chip 10 disposed therein.
  • ASIC application specific integrated circuit
  • An object of the present invention is to provide a MEMS microphone package that can directly attaches a metal case of the MEMS microphone package to a main board when the metal case is mounted on the main board using a curling process in which an end portion of the metal case is bent and clamped in a condenser microphone assembly process to improve a noise shielding characteristic and manufacture the MEMS microphone package at low costs without requiring new machineries.
  • a typical condenser microphone has a circular shape.
  • a MEMS microphone package has square shape.
  • orientation is easily recognized in a process in which a main substrate is mounted using a surface mount technology (SMT).
  • SMT surface mount technology
  • components are inserted into a case, and then a curling process in which an end portion of the case is bent and clamped is easily performed.
  • the case is attached to the PCB using an adhesive or welded to the PCB.
  • an end portion of the metal case having a square shape is chamfered such that a curling process is performed in the microphone having a square shape.
  • a support member is disposed to provide a space between the PCB on which the MEMS microphone chip is mounted and the metal case.
  • a MEMS microphone package includes: a metal case in which edges of an opened end portion are chamfered to easily perform a curling process in a square box shape in which one surface is opened to insert components through the opened surface; a PCB on which a MEMS microphone chip and an application specific integrated circuit (ASIC) chip are mounted, the PCB being inserted into the metal case; and a support member supporting the PCB to provide a space between the metal case and the PCB.
  • ASIC application specific integrated circuit
  • the metal case may have the square box shape having the one opened surface, four edges of the opened surface of the metal case may be chamfered to prevent the end portion of each surface and an end portion of the metal case adjacent to the end portion from overlapping each other during curling, and an acoustic hole may be formed in a bottom surface of the metal case.
  • the PCB may have one surface on which the MEMS microphone chip and the ASIC chip are mounted and the other surface on which a conductive pattern to be connected to the metal case is disposed on a circumference portion thereof, and connection terminals such as a power source terminal Vdd, an output terminal OUTPUT, and a ground terminal GND may be disposed on a central portion of the PCB.
  • the MEMS microphone package may further include a metal mesh for preventing a foreign substance and an electromagnetic wave from being introduced through the acoustic hole of the metal case.
  • the bent end portion of the case can be directly connected to the main board in case where the microphone package is mounted on the main board to form a kind of Faraday cup structure and shield the MEMS microphone from the external noise, thereby significantly improving the acoustic quality.
  • the noise shielding performance can be improved to prevent the RF noise of the antenna from being introduced into the antenna even if the antenna is adjacent to a microphone, thereby maintaining the good acoustic quality property.
  • the packing process of the MEMS microphone chip can be performed at low costs without requiring additional machineries.
  • the curling process can be easily performed because the end portion of the case does not overlap with the end portion of the adjacent surface during curling. Also, it can be prevented that the form of the case from being deformed during curling due to the support member.
  • FIG. 1 is a side cross-sectional view of a conventional MEMS microphone package.
  • FIG. 2 is a perspective view of a MEMS microphone package in which a portion thereof is cut according to an embodiment of the present invention.
  • FIG. 3 is a side cross-sectional view of the MEMS microphone package according to an embodiment of the present invention.
  • FIG. 4 is a bottom view of the MEMS microphone package according to an embodiment of the present invention.
  • FIG. 5 is a perspective view of a case used in the MEMS microphone package according to an embodiment of the present invention.
  • FIG. 6 is a perspective view of a support member used in the MEMS microphone package according to an embodiment of the present invention.
  • FIG. 7 is a perspective view of a MEMS microphone package in which a portion thereof is cut according to another embodiment of the present invention.
  • FIG. 8 is a side cross-sectional view of the MEMS microphone package according to another embodiment of the present invention. Mode for the Invention
  • FIG. 2 is a perspective view of a MEMS microphone package in which a portion thereof is cut according to an embodiment of the present invention
  • FIG. 3 is a side cross-sectional view of the MEMS microphone package according to an embodiment of the present invention
  • FIG. 4 is a bottom view of the MEMS microphone package according to an embodiment of the present invention.
  • a condenser microphone having a square shape includes a metal case 102 in which edges 102b of an opened end portion 102c are chamfered to easily perform a curling process in the case 102 having a square box shape in which one surface thereof is opened to insert components through the opened surface, a PCB 106 on which a MEMS microphone chip 10 and an ASIC chip 20 are mounted, the PCB being inserted into the case 102, and a support member 104 supporting the PCB 106 to provide a space between the case 102 and the PCB.
  • the metal case 102 used in the microphone package of the present invention has a square box shape having an opened surface. Four edges of the opened surface are chamfered to prevent the end portion 102c of each surface and the end portion 102c of the case 102 adjacent to the end portion 102c from overlapping each other during curling.
  • An acoustic hole 102a is formed in a bottom surface of the case 102.
  • the acoustic hole 102a may be formed in the PCB 106, but the case 102, according to an acoustic inflow structure.
  • the support member 104 used in the microphone package of the present invention has a square ring shape and is disposed between the bottom surface of the case 102 and the PCB 106.
  • the support member 104 supports the PCB 106 when the end portion 102c of the case 102 is curled and provides an inner space.
  • the microphone package 100 according to the present invention can easily perform a curling process because the end portion 102c of the case 102 does not overlap with the end portion 102c of the adjacent surface during curling, as well as prevent a form of the case 102 from being deformed during curling due to the support member 104.
  • the PCB 106 used in the microphone package 100 of the present invention has one surface on which the MEMS microphone chip 10 and the ASIC chip 20 are mounted and the other surface on which a conductive pattern to be connected to the case 102 is disposed on a circumference portion thereof, and connection terminals such as a power source terminal Vdd, an output terminal OUTPUT, and a ground terminal GND are disposed on a central portion thereof.
  • connection terminals such as a power source terminal Vdd, an output terminal OUTPUT, and a ground terminal GND are disposed on a central portion thereof.
  • connection terminals 108 are provided in the embodiment of the present invention as an example, the present invention is not limited thereto. For example, two or more plurality of connection terminals may be provided according to application.
  • the MEMS microphone chip 10 has a structure in which a back plate is disposed on a silicon wafer using a MEMS technique to dispose a diaphragm between spacers.
  • the ASIC chip 20 includes a voltage pump and a buffer amplifier.
  • the voltage pump is connected to the MEMS microphone chip 10 to process an electrical signal and provides a bias voltage such that the MEMS microphone chip 10 operates as the condenser microphone.
  • the buffer amplifier amplifies or impedance-matches an electrical acoustic signal detected through the MEMS microphone chip 10 to provide the amplified or impedance- matched acoustic signal to the outside through a connection terminal 108.
  • the connection terminal 108 protrudes, and thus is easily surface-mounted on a main substrate 200.
  • the support member 104 having the square ring shape is inserted into the metal case 102 having the square box shape and one opened surface.
  • the PCB 106 on which the MEMS microphone chip 10 and the ASIC chip 20 are mounted is disposed on the support member 104.
  • the curling process in which the end portion 102c of the case 102 is bent toward the PCB 106 to closely attach the bent portion to the conductive pattern is performed to complete the assembly of the MEMS microphone package 100.
  • the support member 104 is inserted into the case 102.
  • the support member 104 supports the PCB 106 on which circuit components are mounted to provide an inner space.
  • the end portion 102c of the case 102 is closely attached to the PCB 106 using the curling process.
  • the MEMS microphone package 100 is mounted on the main substrate 200 using a surface mount technology (SMT) or a soldering method and connected to pads 204 of the main substrate 200 corresponding to the connection terminals 108 of the PCB 106.
  • SMT surface mount technology
  • the bent end portion of the case is connected to a ground pattern 202 of the main substrate 200 to electrically shield the whole microphone, thereby forming a kind of Faraday cup. As a result, it prevents the noise from being introduced into the microphone.
  • the microphone package 100 according to the present invention is used in a portable terminal, it can be prevented that a RF noise of an antenna is introduced into the antenna even if the antenna is adjacent to a microphone to maintain a good acoustic quality property.
  • an appropriate bias voltage generated by the voltage pump of the ASIC chip 20 is applied to the MEMS microphone chip 10 to generate a charge between the diaphragm of the MEMS microphone chip 10 and the back plate.
  • FIG. 7 is a perspective view of a MEMS microphone package in which a portion thereof is cut according to another embodiment of the present invention
  • FIG. 8 is a side cross-sectional view of the MEMS microphone package according to another embodiment of the present invention.
  • a MEMS microphone package includes a metal case 102 in which edges 102b of an opened end portion 102c are chamfered to easily perform a curling process in the case 102 having a square box shape in which one surface thereof is opened to insert components through the opened surface, a metal mesh 110 preventing a foreign substance from being introduced into the microphone through an acoustic hole 102a, a support member 104 supporting a PCB 106 to provide a space between the case 102 and the PCB, and a PCB on which a MEMS microphone chip 10 and an ASIC chip 20 are mounted, the PCB being inserted into the case 102.
  • the MEMS microphone package according to another embodiment of the present invention prevents the foreign substance form being introduced into the microphone through the acoustic hole 102a in the structure as illustrated in FIG. 2 and adds the metal mesh 110 for shielding the MEMS microphone from an external noise to further improve a shielding performance, thereby further improving a characteristic in which it is prevented that an RF noise as well as the foreign substance are introduced into the microphone through the acoustic hole 102a.
  • the microphone package according to another embodiment has the same construction as that according to the preceding embodiment, their description will be omitted.
  • the bent end portion of the case can be directly connected to the main board in case where the microphone package is mounted on the main board to form a kind of Faraday cup structure and shield the MEMS microphone from the external noise, thereby significantly improving the acoustic quality.
  • the noise shielding performance can be improved to prevent the RF noise of the antenna from being introduced into the antenna even if the antenna is adjacent to a microphone, thereby maintaining the good acoustic quality property.
  • the packing process of the MEMS microphone chip can be performed at low costs without requiring additional machineries.
  • the curling process can be easily performed because the end portion of the case does not overlap with the end portion of the adjacent surface during curling. Also, it can be prevented that the form of the case from being deformed during curling due to the support member.

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Details Of Audible-Bandwidth Transducers (AREA)
  • Pressure Sensors (AREA)

Abstract

La présente invention se rapporte à un boîtier de microphone à microsystème électromécanique (MEMS). Dans le boîtier de microphone à MEMS, une carte de circuit imprimé sur laquelle est montée une puce de microphone à MEMS, est insérée dans un boîtier métallique. Le boîtier métallique est fixé directement sur une carte principale en utilisant un procédé d'assemblage dans lequel une partie d'extrémité du boîtier métallique est pliée et fixée de manière à protéger la puce de microphone à MEMS du bruit, en améliorant de ce fait, de manière significative, la qualité acoustique et en réduisant les coûts de fabrication. La partie d'extrémité du boîtier métallique qui présente une forme carrée est chanfreinée, de sorte qu'un procédé de bordage soit exécuté dans le microphone qui présente une forme carrée. Un élément de support est disposé de manière à fournir un espace entre la carte de circuit imprimé, sur laquelle est montée la puce de microphone à MEMS, et le boîtier métallique. Un tel boîtier de microphone à MEMS comprend : un boîtier métallique dans lequel sont chanfreinés les bords d'une partie d'extrémité ouverte pour pouvoir exécuter facilement un procédé de bordage dans une forme de boîte carrée dans laquelle une surface est ouverte pour pouvoir insérer des composants à travers la surface ouverte ; une carte de circuit imprimé sur laquelle sont montées une puce de microphone à MEMS et une puce de circuit intégré à application spécifique (ASIC), la carte de circuit imprimé étant insérée dans le boîtier métallique ; et un élément de support qui supporte la carte de circuit imprimé de manière à fournir un espace entre le boîtier métallique et la carte de circuit imprimé.
PCT/KR2008/001862 2007-10-18 2008-04-03 Boîtier de microphone à microsystème électromécanique WO2009051317A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020070104981A KR100925558B1 (ko) 2007-10-18 2007-10-18 멤스 마이크로폰 패키지
KR10-2007-0104981 2007-10-18

Publications (1)

Publication Number Publication Date
WO2009051317A1 true WO2009051317A1 (fr) 2009-04-23

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Application Number Title Priority Date Filing Date
PCT/KR2008/001862 WO2009051317A1 (fr) 2007-10-18 2008-04-03 Boîtier de microphone à microsystème électromécanique

Country Status (8)

Country Link
EP (1) EP2051539A1 (fr)
JP (1) JP4777406B2 (fr)
KR (1) KR100925558B1 (fr)
CN (1) CN201195694Y (fr)
MY (1) MY150111A (fr)
SG (1) SG152176A1 (fr)
TW (1) TWM345339U (fr)
WO (1) WO2009051317A1 (fr)

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KR101320574B1 (ko) 2011-11-30 2013-10-23 주식회사 비에스이 멤스 마이크로폰
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KR101339909B1 (ko) * 2012-04-30 2013-12-10 전자부품연구원 마이크로폰 패키지
KR101224448B1 (ko) * 2012-04-30 2013-01-21 (주)파트론 센서 패키지 및 그의 제조 방법
KR101334578B1 (ko) * 2012-05-11 2013-11-28 한국기계연구원 개구부를 포함하는 전자기기 패키지
KR101493510B1 (ko) * 2014-01-03 2015-02-16 주식회사 비에스이 외부 회로와 연결되기 위한 단자가 두 개인 멤스 마이크로폰
KR20160127212A (ko) 2015-04-23 2016-11-03 (주)이미지스테크놀로지 멤스 마이크로폰 및 그 제조방법
KR101698312B1 (ko) 2016-06-24 2017-01-23 (주)이미지스테크놀로지 멤스 마이크로폰 및 그 제조방법
KR101700571B1 (ko) 2016-06-24 2017-02-01 (주)이미지스테크놀로지 멤스 마이크로폰
KR101949593B1 (ko) 2017-05-30 2019-02-18 서울대학교산학협력단 멤스 장치
KR101949594B1 (ko) 2017-05-30 2019-04-29 서울대학교산학협력단 멤스 트랜스듀서 패키지 및 이를 포함하는 멤스 장치
CN110278519A (zh) * 2019-08-01 2019-09-24 华景科技无锡有限公司 一种硅麦克风
CN110808240A (zh) * 2019-10-31 2020-02-18 北京燕东微电子有限公司 层叠封装结构及其制造方法
CN111050259A (zh) * 2019-12-26 2020-04-21 歌尔科技有限公司 麦克风封装结构以及电子设备
KR20240014979A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014980A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014978A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
KR20240014981A (ko) 2022-07-26 2024-02-02 엘지이노텍 주식회사 멤스 마이크로폰
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Publication number Priority date Publication date Assignee Title
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CN108282731B (zh) * 2018-03-07 2024-01-16 钰太芯微电子科技（上海）有限公司 一种声学传感器及微机电麦克风封装结构

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Publication number Publication date
JP2009100471A (ja) 2009-05-07
CN201195694Y (zh) 2009-02-18
TWM345339U (en) 2008-11-21
KR20090039375A (ko) 2009-04-22
KR100925558B1 (ko) 2009-11-05
EP2051539A1 (fr) 2009-04-22
MY150111A (en) 2013-11-29
SG152176A1 (en) 2009-05-29
JP4777406B2 (ja) 2011-09-21

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