WO2007126179A1 - Microphone à condensateur au silicium comprenant une chambre arrière additionnelle - Google Patents

Microphone à condensateur au silicium comprenant une chambre arrière additionnelle Download PDF

Info

Publication number
WO2007126179A1
WO2007126179A1 PCT/KR2006/003093 KR2006003093W WO2007126179A1 WO 2007126179 A1 WO2007126179 A1 WO 2007126179A1 KR 2006003093 W KR2006003093 W KR 2006003093W WO 2007126179 A1 WO2007126179 A1 WO 2007126179A1
Authority
WO
WIPO (PCT)
Prior art keywords
case
substrate
accordance
microphone
chamber
Prior art date
Application number
PCT/KR2006/003093
Other languages
English (en)
Inventor
Chungdam Song
Original Assignee
Bse Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bse Co., Ltd. filed Critical Bse Co., Ltd.
Publication of WO2007126179A1 publication Critical patent/WO2007126179A1/fr

Links

Classifications

    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R19/00—Electrostatic transducers
    • H04R19/04—Microphones
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/02—Casings; Cabinets ; Supports therefor; Mountings therein
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00—Details of transducers, loudspeakers or microphones
    • H04R1/06—Arranging circuit leads; Relieving strain on circuit leads
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00—Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/02—Details casings, cabinets or mounting therein for transducers covered by H04R1/02 but not provided for in any of its subgroups

Definitions

  • the present invention relates to a condenser microphone, and more particularly to a silicon condenser microphone having an additional back chamber.
  • a condenser microphone widely used in a mobile communication terminal and an audio system comprises a voltage bias element, a pair of a diaphragm/ backplate for constituting a capacitor C varying according to a sound pressure, and a JFET (Junction Field Effect Transistor) for buffering an output signal.
  • the conventional condenser microphone is assembled by sequentially inserting a vibrating plate, a spacer ring, an insulation ring, a backplate and a conductive ring in a case, and finally inserting a PCB and curling an end portion of the case toward the PCB.
  • a semiconductor processing technique using a micromachining is proposed as a technique for integrating a microscopic device.
  • the technique also known as a MEMS (Micro Electro Mechanical System) technology employs a semiconductor manufacturing process, an integrated circuit technology in particular, to manufacture a microscopic sensor, an actuator and an electromechanical structure having a size in a unit of ?m.
  • MEMS Micro Electro Mechanical System
  • conventional components of the microphone such as the vibrating plate, the spacer ring, the insulation ring, the backplate and the conductive ring may be miniaturized and integrated, and may have a high performance, a multi-function, a high stability and a high reliability through a high precision microscopic process.
  • Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone.
  • a MEMS chip 10 has a structure wherein a backplate 13 is formed on a silicon wafer 14 using a MEMS technology and a vibrating plate 11 is disposed having a spacer 12 therebetween.
  • the backplate 13 includes a sound hole 13a formed therethrough, and the MEMS chip 10 is generally manufactured by the micromachining technology and a semiconductor chip manufacturing technology.
  • FIG. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing the MEMS chip.
  • a conventional silicon condenser microphone 1 is assembled by mounting the MEMS chip 10 and a ASIC (application specific integrated circuit) chip 20 on a PCB 40 and inserting the same in a case 30 having a sound hole 30a formed therethrough.
  • ASIC application specific integrated circuit
  • a silicon condenser microphone comprising: a case having a sound hole; a substrate including a chamber case, a MEMS chip having an additional back chamber formed by the chamber case, a ASIC chip for operating the MEMS chip, and a conductive pattern for bonding to the case; a fixing means for fixing the case to the substrate; and an adhesive for bonding the case and the substrate, wherein the adhesive is applied to an entirety of a bonding surface of the case and the substrate fixed by the fixing means.
  • the present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise characteristic such as a THD (Total Harmonic Distortion).
  • a THD Total Harmonic Distortion
  • the silicon condenser microphone in accordance with the present invention is robust to the external noise, and reduces a processing cost and the manufacturing cost.
  • Fig. 1 is a diagram exemplifying a conventional MEMS chip structure used in a silicon condenser microphone.
  • FIG. 2 is a lateral cross-sectional view illustrating a conventional silicon condenser microphone employing a MEMS chip.
  • FIG. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber in accordance with a first embodiment of the present invention.
  • FIG. 4 is a diagram exemplifying an additional back chamber in a form of a square pillar in accordance with the present invention.
  • FIG. 5 is a diagram exemplifying an additional back chamber in a form of a cylinder in accordance with the present invention.
  • FIG. 6 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a first embodiment of the present invention.
  • FIG. 7 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a second embodiment of the present invention.
  • FIG. 8 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a third embodiment of the present invention.
  • FIG. 9 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a fourth embodiment of the present invention.
  • FIG. 10 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a fifth embodiment of the present invention. Best Mode for Carrying Out the Invention
  • FIG. 3 is a lateral cross-sectional view illustrating a silicon condenser microphone having an additional back chamber in accordance with a first embodiment of the present invention.
  • the silicon condenser microphone 100 having an additional back chamber 152 in accordance with the first embodiment has a structure wherein a chamber case 150 for forming the additional back chamber 152 and an ASIC chip 120 for driving an electrical signal of a MEMS chip 110 are disposed on a PCB substrate 140 having a conductive pattern 141 and connection terminals 142 and 144, a MEMS chip 110 is disposed on the chamber case 150, and a case 130 is attached to the PCB substrate 140.
  • the conductive pattern 141 and the ground connection terminal 144 are connected via a through-hole 146.
  • the chamber case 150 increases a space of the back chamber of the MEMS chip
  • a through-hole 150a for connecting a back chamber 15 formed by the MEMS chip 110 with the additional back chamber 152 is disposed on an upper surface of the chamber case 150, and the MEMS chip 110 has a structure wherein the backplate 13 is formed on the silicon wafer 14 using the MEMS technology and the vibrating plate 11 is formed to have the spacer 12 therebetween as shown in Fig. 1.
  • the chamber case 150 may have a shape of a square pillar or a cylinder, and may be manufactured using a metal or a mold resin.
  • an electrical wiring is disposed on the chamber case 150 so as to transmit the electrical signal of the MEMS chip 110 to the ASIC chip 120.
  • the case 130 includes a sound hole 130a for passing through an external sound, and the case 130 is attached to the PCB substrate 140 by aligning the metal case 130 on the conductive pattern 141 formed on the PCB substrate 140 and then spot- welding at least two points by a laser welding or a spot welding and then sealing a contacting portion of the case 130 and the PCB substrate 140 with an adhesive 164 such as an epoxy.
  • a reference numeral 162 denotes a welding point.
  • Fig. 4 is a diagram exemplifying an additional back chamber in a form of a square pillar in accordance with the present invention
  • Fig. 5 is a diagram exemplifying an additional back chamber in a form of a cylinder in accordance with the present invention.
  • the chamber case 150 for forming the additional back chamber 152 may have the shape of the square pillar 150' and the cylinder 150", and the through-hole 150a is disposed on an upper portion of the square pillar 150' or the cylinder 150" to form a path with the back chamber 15 of the MEMS chip 110.
  • the silicon condenser microphone 100 having various shapes may be manufactured by attaching the case 130 having various shapes on the PCB substrate 140.
  • the ASIC chip 120 and the MEMS chip 110 are mounted on the PCB substrate 140.
  • the MEMS chip 110 includes the additional back chamber 152 by the chamber case 150.
  • the present invention will now be described by dividing the embodiments of the present invention into the first embodiment wherein the case has the shape of the cylinder 131, the second embodiment wherein the case has the shape of the square pillar 132, a third embodiment wherein the case has the shape of the cylinder 1330 having a wing at an end portion thereof, a fourth embodiment wherein the case has the shape of the square pillar 134 having a wing at an end portion thereof, and a fifth embodiment wherein the connection terminal is formed on the mounting surface of the microphone so that the microphone is mounted on the main PCB 300 of an electronic device.
  • Mode for the Invention is
  • Fig. 6 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a first embodiment of the present invention.
  • the case 131 having the shape of the cylinder is fixed to the PCB substrate 140 having the MEMS chip 110 including the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 by the laser welding, the case 131 having the shape of the cylinder is bonded to the PCB substrate 140 by the adhesive 164.
  • the adhesive 164 may be a conductive epoxy, a non- conductive epoxy, a silver paste, a silicon, a urethane, an acryl or a cream solder.
  • the MEMS chip 110 having the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the circular conductive pattern 141 is disposed on the PCB substrate 140 at a contacting portion with the case 131 having the shape of the cylinder.
  • a connection pad or the connection terminal for connecting to an external device may be freely disposed on the large PCB substrate, and the conductive pattern 141 may be manufactured by disposing a copper film via a conventional PCB manufacturing process and then plating a nickel or a gold.
  • a ceramic substrate, a FPCB substrate or a metal PCB may be used instead of the PCB substrate 140.
  • the case 131 having the shape of the cylinder has a contacting surface with the
  • PCB substrate 140 open such that chip components may be housed inside, wherein an upper surface thereof has a sound hole 131a for passing through the external sound.
  • the case 131 having the shape of the cylinder may be manufactured using a brass, a copper, a stainless steel, an aluminum or a nickel alloy and may be plated with gold or silver.
  • a welding point 162 which is a portion of the contacting portion is welded with the laser using a laser welder (not shown) to fix the case 131 having the shape of the cylinder to the PCB substrate 140.
  • an assembly of the microphone is complete by applying the adhesive 164 to the entire contacting portion.
  • the welding refers to spot- welding one or more points (preferably two or four points) in order to fix the case 131 having the shape of the cylinder to the PCB substrate 140 rather than welding an entire contacting surface of the case 131 having the shape of the cylinder and the PCB substrate 140.
  • a bonding point formed between the case 131 having the shape of the cylinder and the PCB substrate 140 through such welding is referred to as the welding point 162.
  • the case 131 having the shape of the cylinder is fixed to the PCB substrate 140 by the welding point 162 such that the case 131 having the shape of the cylinder is not moved during a bonding using the adhesive 164 or a curing process for bonding at a proper position.
  • the conductive pattern 141 is connected to the ground connection terminal 144 through the through-hole 146, and when the case 131 having the shape of the cylinder is bonded, an external noise is blocked to remove the noise.
  • the case 131 having the shape of the cylinder is bonded to the PCB substrate 140 by the adhesive 164.
  • the back chamber 15 of the MEMS chip 110 is extended to the additional back chamber 152 by the chamber case 150 having the shape of the cylinder or the square pillar to improve the sensitivity and the noise characteristic such as the THD (Total Harmonic Distortion).
  • connection terminals 142 and 144 for connecting to the external device may be formed at a bottom surface of the PCB substrate 140, and each of the connection terminals 142 and 144 is electrically connected to a chip component side through the through-hole.
  • the connection terminal2 142 and 144 extends about the PCB substrate 140, the rework may be facilitated by using an electric solder through an exposed surface.
  • the laser welding is exemplified as a method for fixing the case 131 having the shape of the cylinder to the PCB substrate 140
  • a soldering or a punching may be used for fixing the case 131 having the shape of the cylinder to the PCB substrate 140
  • the conductive epoxy, the non-conductive epoxy, the silver paste, the silicon, the urethane, the acryl or the cream solder may be used as the adhesive 164.
  • FIG. 7 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a second embodiment of the present invention.
  • the case 132 having the shape of the square pillar is fixed to the PCB substrate 140 by the laser welding, the case 132 having the shape of the square pillar is bonded and cured using the adhesive 164.
  • the MEMS chip 110 having the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the square conductive pattern 141 is disposed on the PCB substrate 140 at a contacting portion with the case 132 having the shape of the square pillar.
  • the conductive pattern 141 is formed by a copper film via the conventional PCB pattern technique.
  • PCB substrate 140 is open, wherein a sound hole 132a for passing through a sound is formed on an upper surface thereof.
  • a welding point 162 which is a portion of the contacting portion is welded with the laser using a laser welder (not shown) to fix the case 132 having the shape of the square pillar to the PCB substrate 140.
  • a laser welder not shown
  • an assembly of the microphone is complete by applying the adhesive 164 to the entire contacting portion.
  • the conductive pattern 141 is connected to the ground connection terminal, and when the case 132 having the shape of the square pillar is welded, an external noise is blocked to remove the noise.
  • Fig. 8 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a third embodiment of the present invention. A case
  • the MEMS chip 110 having the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the circular conductive pattern 141 is disposed on the PCB substrate 140 at a contacting portion with the case 131 having the shape of the cylinder. Since the size of the PCB substrate 140 is larger than that of the case having the shape of the cylinder, the connection pad or the connection terminal for connecting to the external device may be freely disposed on the large PCB substrate, and the conductive pattern 141 may be manufactured by disposing a copper film via a conventional PCB manufacturing process and then plating the nickel or the gold. It is preferable that the conductive pattern 141 in accordance with the third embodiment of the present invention is larger than that of the first embodiment so as to correspond to the wing 133c formed in the case 133 having the shape of the cylinder.
  • a contacting surface of the case 133 having the shape of the cylinder with the PCB substrate 140 is open, wherein a sound hole 133a for passing through the sound is formed on an upper surface thereof.
  • the case 133 having the shape of the cylinder and the PCB substrate 140 are fixed using the laser welding and the adhesive 164 is then applied to complete a packaging.
  • Fig. 9 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a fourth embodiment of the present invention. A case
  • the MEMS chip 110 having the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140, and the square conductive pattern 141 is disposed on the PCB substrate 140 at a contacting portion with the case 131 having the shape of the cylinder. Since the size of the PCB substrate 140 is larger than that of the case having the shape of the square pillar, the connection pad or the connection terminal for connecting to the external device may be freely disposed on the large PCB substrate, and the conductive pattern 141 may be manufactured by disposing a copper film via a conventional PCB manufacturing process and then plating the nickel or the gold.
  • the conductive pattern 141 in accordance with the third embodiment of the present invention is larger than that of the second embodiment so as to correspond to the wing 134c formed at an end portion of a body 134b of the case 134 having the shape of the square pillar.
  • PCB substrate 140 is open, wherein a sound hole 134a for passing through the sound is formed on an upper surface thereof, and the wing 134c extruding outward is formed at the end of the case body 134b.
  • the case 134 having the shape of the square pillar and the PCB substrate 140 are fixed using the laser welding and the adhesive 164 is then applied to complete a packaging.
  • FIG. 10 is a perspective view illustrating a disassembled silicon condenser microphone in accordance with a fifth embodiment of the present invention.
  • the silicon condenser microphone 100 in accordance with the fifth embodiment of the present invention includes the case 130 having the shape of the cylinder or the square pillar is fixed to the PCB substrate 140 larger than the case by the welding and bonded by the adhesive 164.
  • the connection terminals 142 and 144 for connecting to the connection pad 320 of the main PCB 310 of the product for which the microphone is used are disposed on the component side 140a of the PCB substrate. While the fifth embodiment of the present invention exemplifies four connection terminals, at least two and up to eight connection terminals may be formed.
  • the reference numeral 162 denotes the welding point.
  • connection terminal extends to a sidewall of the substrate or extends to an opposite surface of the component side in addition to the sidewall, a heat transfer of the electric solder is improved to facilitate the rework.
  • the main PCB 310 of the product on which the silicon condenser microphone in accordance with the fifth embodiment is mounted comprises a circular or a square inserting hole 310a in order to mount the case 130 of the silicon condenser microphone.
  • the connection pad 320 corresponding to the connection terminals 142 and 144 disposed on the PCB substrate 140 of the microphone are disposed.
  • connection pad 320 of the main PCB 310 is coupled to the connection terminals 142 and 144 by a soldering 330 as well as the case 130 extruding at a center of the component side 140a of the substrate 140 is inserted the inserting hole 310a of the main PCB 310.
  • the MEMS chip 110 having the additional back chamber 152 by the chamber case 150 and the ASIC chip 120 are mounted on the PCB substrate 140 inside the case of the microphone, and the circular or square conductive pattern 141 is disposed on the PCB substrate 140 at a contacting portion with the case 130.
  • a ceramic substrate, a FPCB substrate or a metal PCB may be used instead of the
  • the case 130 includes the sound hole 130a for passing through the external sound.
  • the case 130 may be manufactured using a brass, a copper, a stainless steel, an aluminum or a nickel alloy and may be plated with gold or silver.
  • the present invention includes a chamber case for forming an additional back chamber under a MEMS chip in order to increase a back chamber space of the MEMS chip, thereby improving a sensitivity and a noise problem such as a THD (Total Harmonic Distortion).
  • a THD Total Harmonic Distortion

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Electrostatic, Electromagnetic, Magneto- Strictive, And Variable-Resistance Transducers (AREA)
  • Micromachines (AREA)

Abstract

La présente invention concerne un microphone à condensateur, et plus particulièrement un microphone à condensateur au silicium comprenant une chambre arrière additionnelle. Le microphone à condensateur au silicium comporte un boîtier comprenant une rosace; un substrat comprenant un boîtier de chambre; une puce de systèmes mécaniques microélectriques comprenant une chambre arrière additionnelle formée par le boîtier de chambre, une puce à circuit intégré à application spécifique (ASIC); et une impression conductrice pour être relié au boîtier; un moyen de fixation pour fixer le boîtier au substrat; et un adhésif pour relier le boîtier et le substrat, l'adhésif étant appliqué à l'intégralité d'une surface de liaison du boîtier et le substrat étant fixé par les moyens de fixation.
PCT/KR2006/003093 2006-05-03 2006-08-07 Microphone à condensateur au silicium comprenant une chambre arrière additionnelle WO2007126179A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020060040171A KR100722689B1 (ko) 2006-05-03 2006-05-03 부가적인 백 챔버를 갖는 실리콘 콘덴서 마이크로폰
KR10-2006-0040171 2006-05-03

Publications (1)

Publication Number Publication Date
WO2007126179A1 true WO2007126179A1 (fr) 2007-11-08

Family

ID=38278477

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2006/003093 WO2007126179A1 (fr) 2006-05-03 2006-08-07 Microphone à condensateur au silicium comprenant une chambre arrière additionnelle

Country Status (2)

Country Link
KR (1) KR100722689B1 (fr)
WO (1) WO2007126179A1 (fr)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102045632A (zh) * 2009-10-19 2011-05-04 宝星电子股份有限公司 具有附加背腔的硅电容式传声器及其制造方法
TWI504279B (zh) * 2011-12-01 2015-10-11 Ind Tech Res Inst Ｍｅｍｓ音波感測器及其製造方法
JP2016058880A (ja) * 2014-09-09 2016-04-21 晶▲めい▼電子股▲ふん▼有限公司 ノイズカップリングの影響を低減させるマイクロフォン装置
US9491531B2 (en) 2014-08-11 2016-11-08 3R Semiconductor Technology Inc. Microphone device for reducing noise coupling effect
CN108807286A (zh) * 2018-07-06 2018-11-13 武汉耐普登科技有限公司 传感器lga封装结构
CN109095434A (zh) * 2018-07-09 2018-12-28 武汉耐普登科技有限公司 传感器结构件及其制造方法
WO2022000644A1 (fr) * 2020-06-30 2022-01-06 瑞声声学科技(深圳)有限公司 Microphone

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200448302Y1 (ko) 2007-05-26 2010-03-30 고어텍 인크 실리콘 콘덴서 마이크로 폰
KR100904285B1 (ko) * 2007-06-04 2009-06-25 주식회사 비에스이 콘덴서 마이크로폰

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004200766A (ja) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi コンデンサーマイクロホン及びその製造方法
US20050018864A1 (en) * 2000-11-28 2005-01-27 Knowles Electronics, Llc Silicon condenser microphone and manufacturing method
WO2005086535A1 (fr) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Microphone a condensateur a electret

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09199824A (ja) * 1995-11-16 1997-07-31 Matsushita Electric Ind Co Ltd プリント配線板とその実装体
JP3378197B2 (ja) 1998-05-11 2003-02-17 ホシデン株式会社 半導体エレクトレットコンデンサーマイクロホン
US7166910B2 (en) 2000-11-28 2007-01-23 Knowles Electronics Llc Miniature silicon condenser microphone
KR100543972B1 (ko) * 2003-02-08 2006-01-20 송기영 콘덴서 마이크로폰의 케이스 접합 구조 및 그의 제조 방법
KR100648398B1 (ko) 2005-07-07 2006-11-24 주식회사 비에스이 실리콘 콘덴서 마이크로폰의 패키징 구조 및 그 제조방법

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050018864A1 (en) * 2000-11-28 2005-01-27 Knowles Electronics, Llc Silicon condenser microphone and manufacturing method
JP2004200766A (ja) * 2002-12-16 2004-07-15 Karaku Denshi Kofun Yugenkoshi コンデンサーマイクロホン及びその製造方法
WO2005086535A1 (fr) * 2004-03-09 2005-09-15 Matsushita Electric Industrial Co., Ltd. Microphone a condensateur a electret

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102045632A (zh) * 2009-10-19 2011-05-04 宝星电子股份有限公司 具有附加背腔的硅电容式传声器及其制造方法
JP2012517183A (ja) * 2009-10-19 2012-07-26 ビーエスイー カンパニー リミテッド 付加的なバックチャンバーを有するシリコンコンデンサマイクロホン及びその製造方法
EP2493214A4 (fr) * 2009-10-19 2017-08-16 BSE Co., Ltd. Microphone à condensateur au silicium ayant une chambre arrière additionnelle et procédé de fabrication associé
TWI504279B (zh) * 2011-12-01 2015-10-11 Ind Tech Res Inst Ｍｅｍｓ音波感測器及其製造方法
US9236275B2 (en) 2011-12-01 2016-01-12 Industrial Technology Research Institute MEMS acoustic transducer and method for fabricating the same
US9491531B2 (en) 2014-08-11 2016-11-08 3R Semiconductor Technology Inc. Microphone device for reducing noise coupling effect
JP2016058880A (ja) * 2014-09-09 2016-04-21 晶▲めい▼電子股▲ふん▼有限公司 ノイズカップリングの影響を低減させるマイクロフォン装置
CN108807286A (zh) * 2018-07-06 2018-11-13 武汉耐普登科技有限公司 传感器lga封装结构
CN109095434A (zh) * 2018-07-09 2018-12-28 武汉耐普登科技有限公司 传感器结构件及其制造方法
WO2022000644A1 (fr) * 2020-06-30 2022-01-06 瑞声声学科技(深圳)有限公司 Microphone

Also Published As

Publication number Publication date
KR100722689B1 (ko) 2007-05-30

Similar Documents

Publication Publication Date Title
EP1875773B1 (fr) Microphone a condensateur de silicium a chambre dorsale additionnelle et trou de passage du son dans le pcb
EP2178312B1 (fr) Microphone directionnel à condensateur de silicium et à chambre arrière additionnelle
KR100675023B1 (ko) 콘덴서 마이크로폰 및 이를 위한 패키징 방법
US8126166B2 (en) Condenser microphone and packaging method for the same
CN101053279B (zh) 指向性硅电容传声器
US7903831B2 (en) Silicon based condenser microphone and packaging method for the same
WO2007126179A1 (fr) Microphone à condensateur au silicium comprenant une chambre arrière additionnelle
CN1917720B (zh) 硅基电容传声器
KR100650280B1 (ko) 기판에 음향홀이 형성된 실리콘 콘덴서 마이크로폰
KR100737730B1 (ko) 멤스 마이크로폰 패키징 구조
JP2008067383A (ja) シリコンコンデンサマイクロホン
WO2007024048A1 (fr) Microphone a condensateur au silicium
WO2007015593A1 (fr) Microphone à condensateur basé sur du silicium et son procédé d'emballage
TWM335901U (en) Directional silicon condenser microphone having additional back chamber

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 06783528

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 06783528

Country of ref document: EP

Kind code of ref document: A1