M335901 八、新型說明： 【新型所屬之技術領域】 本新型關於一種電容傳聲器，更具體而言，係關於 種具有附加背音室的定向矽電容傳聲器。 【先前技術】 通常，在行動通信終端和音頻系統中廣泛使用的電容 傳聲器包括偏壓元件、用於構成根據聲壓變化的電容器c 的一對隔膜/背板、以及用於緩衝輸出信號的JFET (接面 場效應電晶體）。透過在殼體中順序地插入振動板、間隔 環、絕緣環、背板和導電環，最後插入PCB並將殼體的端 部朝向PCB捲曲而組裝傳統的電容傳聲器。 近來，提出了使用微機械加工的半導體處理技術作為 用於集成微裝置的技術。公知為MEMS (微機電系統）的 技術採用半導體製造工藝，尤其是積體電路技術來製造尺M335901 VIII. New description: [New technical field] The present invention relates to a condenser microphone, and more particularly to an directional condenser microphone having an additional back chamber. [Prior Art] Generally, a condenser microphone widely used in a mobile communication terminal and an audio system includes a biasing element, a pair of diaphragms/back plates for constituting a capacitor c according to a change in sound pressure, and a JFET for buffering an output signal. (Connecting field effect transistor). A conventional condenser microphone is assembled by sequentially inserting a vibrating plate, a spacer ring, an insulating ring, a back plate, and a conductive ring in the casing, finally inserting the PCB, and crimping the end of the casing toward the PCB. Recently, semiconductor processing technology using micromachining has been proposed as a technique for integrating micro devices. The technology known as MEMS (Micro Electro Mechanical Systems) uses semiconductor manufacturing processes, especially integrated circuit technology to manufacture rulers.
寸以為單位的微感測器、致動器和機電結構。根據透 過微機械加工技術製造的MEMS晶片傳聲器，傳聲器的諸 板、間隔環、絕緣環、背板和導電環的傳統:件可 亚集成，並且可透過高精密微加工而具有高性能、 夕功爿b、向穩定性和高可靠性。 圖是例示在石夕電容傳聲器中使用的傳統Μ祕晶 圖。參照第一圖，MEMS晶片ι〇具有這樣的結 :佈置技物晶片14上形成背板13，並 振動板n，在背板13與振動板u之間具有_件 M335901 12 °背板13包括在其中形成的聲孔13a，ϋ且通常透過微 機械加工技術和半導體晶片製造技術來製造]VtEMS晶片 10 〇 第二圖是顯示出採用MEMS晶片的傳統的石夕電容傳聲 器的侧剖面圖。參照第二圖，透過將MEMS晶片1〇和ASIC (專用積體電路）晶片20安裝在PCB 40上並將它們插入在 其中形成有聲孔30a的PCB30而組裝傳統的石夕電容傳聲器1 。然而、如第二圖所示，因為傳統的矽電容傳聲器1的背音 室15由MEMS晶片10形成，所以由於作為半導體晶片的 MEMS晶片10尺寸原因，背音室15的空間特別小。因此， 傳聲器的音質降低。 【新型内容】 本新型的目的在於提供一種具有附加背音室從而改進 聲學特性的定向矽電容傳聲器。 為了實現上述目的，提供了 一種定向石夕電容傳聲器， 該定向矽電容傳聲器包括：殼體，該殼體具有用於供前聲 透過的前聲孔；聲延遲裝置，該聲延遲裝置用於延遲聲音 的相位；基底，該基底包括音室殼體、具有由該音室殼體 形成的附加背音室的MEMS晶片、用於操作該MEMS晶片 的ASIC晶片、用於將所述基底結合到該殼體的導電圖案、 以及用於供後聲透過的後聲孔；固定部件，該固定部件用 於將該殼體固定至該基底；以及黏接劑，該黏接劑用於結 合該殼體和該基底，其中所述黏接劑塗覆到透過該固定部 M335901 件固定的該毅體和該基底的整個結合表面。 如上所述，本新型包括用於在MEMS晶片下方形成附 加背音室從而增加MEMS晶片的背音室空間的音室殼體 從而改進了靈敏度並改進了諸如THD (總諳波失真）的^ 音問題。 , 此外，根據本新型的定向矽電容傳聲器可透過各種 法安裝到主PCB上。因此，安裝空間可較小。而且，因: φ .該殼體透過鐳射焊固定到PCB並透過黏接劑結合，所以ς 殼體在結合期間固定以防止產生缺陷，並且由於高纟士人、 度而改進了機械堅固性。從而根據本新型的矽電容^= 耐外部噪音並且降低了加工成本和製造成本。 耳。。 雖然已經參照其較佳實施方式具體示出並描述了 =，但本領域技術人貞會理解在不絲接型的 = 圍的情況下可在本新财進行各種形式和細節的改變。耗 【實施方式】 目 下面將參照附圖詳細描述本新型的上述目的和其 的以及特性和優點。 施方向電容傳聲器包括聲延遲裝置。本新型的實 聲：ΐ 分成兩個實施例進行描述，在-個實施例中 另—:衣置料在殼體的用於供前聲透過的前聲孔處，在 第-圖 <顯示出根據本新型第_實施方式的具有附加 M335901 月曰至的疋向發電谷傳聲裔的侧剖面圖，其中聲延遲裝置 170文裝在殼體的用於供前聲透過的前聲孔l3〇a處。 芩照第三圖，根據第一實施方式的具有附加背音室15 2 的定向矽電容傳聲器1〇〇具有這樣的結構，其中在具有導電 圖案141以及連接端子142和144的pCB基底14〇上佈置用於 屯成附加月音室152的音室殼體150以及用於驅動memS晶 片110的電信號的ASIC晶片120，在音室殼體150上佈置 MEMS晶片11〇，並在PCB基底14〇處附接具有用於供前聲 透過的前聲孔130a的殼體130。在殼體内在前聲孔13〇a處附 接聲延遲裝置170,並透過通孔146將導電圖案141和接地連 接端子144連接。 音室殼體150增加了 MEMS晶片11〇的背音室的空間以 改進靈敏度並改進了諸如THD(總諧波失真）的噪音問題， 其中在音室殼體150的上表面上佈置用於將由MEMS晶片 110形成的背音室15與附加背音室152連接的通孔i5〇a，並 且MEMS晶片110具有這樣的結構，其中使用MEMS技術在 矽晶片14上形成背板13，並且形成振動板丨丨，在背板13與 振動板11之間具有間隔件12,如第一圖所示。音室殼體15〇 可具有方柱或圓柱的形狀，並且可使用金屬或成型樹脂製 造。此外，雖然未顯示出，但在音室殼體15〇上佈置電佈線， 從而將MEMS晶片110的電信號傳送至ASIC晶片120。 在PCB基底140上佈置有：上表面上具有通孔丨5〇a的音 室殼體150，該音室殼體用於形成附加背音室；MEMS晶片 Π0 ’該晶片附接到音室殼體丨5〇的通孔15〇a上以擴展背音 M335901 室；以及ASIC晶片120，導電圖案141佈置在PCB基底140 的與殼體130接觸的部分上。此外，在pcB基底140的安裝 音室殼體150的部分處佈置用於供後聲透過的後聲孔14〇a。 還可在PCB基底140的後聲孔140a周圍佈置密封焊盤148， 密封焊盤148透過釺焊來進行對聲孔14〇a的孔密封，以防止 聲波的失真。附圖標記148a表示由密封焊盤148形成的聲孔 〇 殼體130是具有一個開口表面的金屬殼體，其中殼體 130具有圓柱或方柱的形狀。殼體13〇具有與pcb基底140 的導電圖案141接觸的端部並且在其底面還具有用於供外 部前聲透過的前聲孔130a。透過使金屬殼體no對準在形成 於PCB基底140上的導電圖案141上，然後透過鐳射焊或點 焊對至少兩點進行點焊’然後利用諸如環氧樹脂的黏接劑 164密封殼體130和PCB基底140的接觸部，從而將殼體13〇 附接至PCB基底140。附圖標記162表示焊接點。 根據用於製造弟'^貫施方式的定向發電容傳聲哭1 〇 〇 的方法，在安裝ASIC晶片120的同時附接音室殼體15〇使得 將PCB基底140的後聲孔140a定位在附加背音室152内，之 後將MEMS晶片110附接至音室殼體150 ,使得音室殼體15〇 的通孔150a定位在MEMS晶片110的背音室15内。 之後，將聲延遲裝置170附接至具有圓柱或方柱形狀的 设體130的前聲孔130a’並透過錯射谭將具有圓柱或方柱开， 狀的殼體130固定至PCB基底140的導電圖案141。透過黏接 劑164將殼體130結合至PCB基底140。黏接劑164可以^導 M335901 電環氧樹脂、非導電環氧樹脂、銀膏、矽、氨基曱酸乙酯、 丙稀和焊糊。 參照第三圖，將ASIC晶片120和具有由音室殼體150形 成的附加背音室152的MEMS晶片110佈置在PCB基底140 上，並將方形或圓形導電圖案141佈置在與具有圓柱或方柱 形狀的殼體130接觸的部分。 因為PCB基底140的尺寸大於具有圓柱或方柱形狀的 殼體130的尺寸，所以可在較大的PCB基底上自由地佈置用 於連接到外部裝置的連接焊盤或連接端子，並可透過利用 傳統的PCB製造工藝佈置銅膜然後鍍鎳或金來製造導電圖 案141。可使用陶瓷基底、fpcb基底或金屬PCB來代替PCB 基底140 〇 具有圓柱或方柱形狀的殼體13〇與PCB基底140接觸的 表面敵開，使得晶片元件可容納在内部，其中在殼體 上佈置用於供前聲透過的前聲孔13〇a。殼體13〇可使用黃銅 、銅、不銹鋼、鋁或鎳合金製造並且可鍍有金或銀。 在將殼體130對準PCB基底140的導電圖案141之後，使 用錯射焊機（未示出）用鐳射來焊接作為接觸部的一部分 的焊接點162以將殼體130固定至PCB基底14〇。之後，透過 向整個接觸部塗覆黏接劑164完成傳聲器的組裝。焊接指的 疋對一個以上的點（較佳為兩個或四個點）進行點焊從而 將设體130固疋至PCB基底140，而不是焊接殼體13(^pCB 基底MG的整個接觸表面。透過該焊接在殼體⑽與㈣基 底140之卩成的結合點稱為焊接點162。殼體⑽透過谭接 M335901 點162固定至PCB基底14〇，使得殼體13〇在使用黏接劑i64 結合或者固化工藝期間不會行動從而在適當位置結合。此 外，導電圖案141透過通孔146連接到接地連接端子144，並 且在結合殼體130時，阻擋了外部噪音以除去噪音。 可在PCB基底140的底面處形成至少兩到八個用於連 接到外部裝置的連接端子142和144，並且連接端子142和 144的每一個都透過通孔電連接到晶片元件侧。具體而言， 根據本新型的實施方式，當連接端子丨42和i44圍繞pcB基 底140延伸時，可透過對露出表面使用電焊料而有利於再加 JL 〇 根據本新型的實施方式，雖然鐳射焊例示為用於將殼 體130固定至PCB基底140的方法，但也可使用釺焊或衝壓 來將殼體130固定至PCB基底14〇，並且可使用導電環氡樹 脂、非導電環氧樹脂、銀膏、矽、氨基甲酸乙酯、丙烯或 焊糊作為黏接劑164 〇 第四圖是顯示出根據本新型第二實施方式的具有附加 月曰至的疋向石夕電谷傳聲器1 〇〇’的侧剖面圖。如上所述， 第一實施方式的矽電容傳聲器100與第二實施方式的矽電 容傳聲器100’的區別在於聲延遲裝置170的位置，其中聲 延遲裝置170在第一實施方式中附接至殼體13〇的用於供前 聲透過的前聲孔130a，而在第二實施方式中附接至pcB的 用於供後聲透過的後聲孔14〇a。 因此，在第一實施方式中來自外部聲源的透過殼體的 前聲孔130a的前聲受到聲延遲裝置17〇的相位延遲而到達 M335901 Μ簡W而在第二實施方式中來自外部聲源的透過 PCB基底14〇的後聲孔140a的後聲受到聲延遲裝置17〇的相 位延遲而到達MEMS晶片110。 因為除了聲延遲裝置170的位置之外，根據第二實施方 式的石夕電容傳聲器的結構與第一實施方式的石夕電容傳聲器 的結構相同，所以省去對其的附加詳細描述。 第五圖5是例示根據本新型呈方柱形式的附加背音室 的圖，第六圖是例示极據本新型呈圓柱形式的附加背音室 的圖。 如第五圖和第六圖所示，用於形成附加背音室152的音 室殼體150可具有方柱150’和圓柱15〇”的形狀，並且在方 柱150或圓柱15〇的上部上佈置通孔i5〇a以形成與 MEMS晶片110的背音室15的路徑。 可透過將具有各種形狀的殼體13〇附接在PCB基底14〇 上來製造具有各種形狀的石夕電容傳聲器100。在PCB基底 140上安裝ASIC晶片120和MEMS晶片11〇。MEMS晶片110 包括由音室殼體150形成的附加背音室152。例如，該殼體 可具有圓柱、方柱、在其端部具有翼的圓柱或者在其端部 具有翼的方柱的形狀。 如第七圖所示，根據安裝在主PCB 310上的定向石夕電 容傳聲器，主PCB 310的連接焊盤320透過釺焊接合到連接 端子142和144，並且將在PCB基底140的中央突出的殼體 130插入主PCB 310的插入孔310a。Micro-sensors, actuators, and electromechanical structures. According to the MEMS wafer microphone manufactured by micromachining technology, the traditional components of the microphone plate, spacer ring, insulating ring, back plate and conductive ring can be sub-integrated, and can achieve high performance and high performance through high precision micromachining.爿b, stability and high reliability. The figure is an illustration of a conventional enamel crystal used in a Shixi condenser microphone. Referring to the first figure, the MEMS wafer has a junction in which the backing plate 13 is formed on the arrangement technology wafer 14, and the plate n is vibrated, and between the back plate 13 and the vibration plate u, there is a piece M335901. The back plate 13 is included. The acoustic holes 13a formed therein, and typically fabricated by micromachining techniques and semiconductor wafer fabrication techniques] VtEMS wafers 10 〇 The second figure is a side cross-sectional view showing a conventional Shishi condenser microphone employing MEMS wafers. Referring to the second figure, a conventional Shishi condenser microphone 1 is assembled by mounting a MEMS wafer 1 and an ASIC (Dedicated Integrated Circuit) wafer 20 on a PCB 40 and inserting them into a PCB 30 in which a sound hole 30a is formed. However, as shown in the second figure, since the back sound chamber 15 of the conventional tantalum condenser microphone 1 is formed of the MEMS wafer 10, the space of the back sound chamber 15 is extremely small due to the size of the MEMS wafer 10 as a semiconductor wafer. Therefore, the sound quality of the microphone is lowered. [New content] The purpose of the novel is to provide a directional capacitance condenser microphone having an additional back chamber for improving acoustic characteristics. In order to achieve the above object, a directional chi-electric condenser microphone is provided, the directional condenser microphone comprising: a housing having a front acoustic aperture for front sound transmission; an acoustic delay device for delaying a phase of the sound; the substrate comprising a sound chamber housing, a MEMS wafer having an additional back chamber formed by the sound chamber housing, an ASIC wafer for operating the MEMS wafer, for bonding the substrate to the a conductive pattern of the housing, and a rear sound hole for transmitting the rear sound; a fixing member for fixing the housing to the base; and an adhesive for bonding the housing And the substrate, wherein the adhesive is applied to the body and the entire bonding surface of the substrate fixed through the fixing portion M335901. As described above, the present invention includes a chamber housing for forming an additional back chamber below the MEMS wafer to increase the back chamber space of the MEMS wafer, thereby improving sensitivity and improving the sound such as THD (Total Chopper Distortion) problem. In addition, the directional capacitance condenser microphone according to the present invention can be mounted to the main PCB by various methods. Therefore, the installation space can be small. Moreover, because: φ. The case is fixed to the PCB by laser welding and bonded through the adhesive, so that the case is fixed during the bonding to prevent the occurrence of defects, and the mechanical robustness is improved due to the gentleman. Thus, the tantalum capacitor according to the present invention is resistant to external noise and reduces processing costs and manufacturing costs. ear. . Although it has been specifically shown and described with reference to the preferred embodiments thereof, it will be understood by those skilled in the art that various changes in form and detail may be made in the present invention without the splicing type. [Embodiment] The above object and its features and advantages of the present invention will be described in detail below with reference to the accompanying drawings. The directional condenser microphone includes an acoustic delay device. The actual sound of the present invention: 分成 is described in two embodiments. In another embodiment, the clothing is placed at the front sound hole of the casing for the front sound transmission, and is shown in the first figure. A side cross-sectional view of a transcendental power generation valley with an additional M335901, according to the first embodiment of the present invention, wherein the acoustic delay device 170 is mounted on the front sound hole for the front sound transmission through the housing. At the office. Referring to the third diagram, the directional capacitance condenser microphone 1 having the additional back chamber 15 2 according to the first embodiment has a structure in which the pCB substrate 14 has a conductive pattern 141 and connection terminals 142 and 144. An ASIC wafer 120 for splicing the sound chamber housing 150 of the additional moon chamber 152 and an electrical signal for driving the memS wafer 110 is disposed, and the MEMS wafer 11 is disposed on the sound chamber housing 150 and is disposed on the PCB substrate 14 A housing 130 having a front sound hole 130a for front sound transmission is attached. The acoustic delay device 170 is attached to the front acoustic hole 13a in the casing, and the conductive pattern 141 is connected to the ground connection terminal 144 through the through hole 146. The chamber housing 150 increases the space of the back chamber of the MEMS wafer 11 to improve sensitivity and improve noise problems such as THD (Total Harmonic Distortion), which is arranged on the upper surface of the chamber housing 150 for The back surface of the MEMS wafer 110 is connected to the through hole i5〇a of the additional back chamber 152, and the MEMS wafer 110 has a structure in which the back sheet 13 is formed on the silicon wafer 14 using MEMS technology, and a vibration plate is formed. That is, there is a spacer 12 between the back plate 13 and the vibration plate 11, as shown in the first figure. The sound chamber housing 15A may have a square column or a cylindrical shape and may be made of metal or molding resin. Further, although not shown, electrical wiring is disposed on the chamber housing 15A to transfer electrical signals of the MEMS wafer 110 to the ASIC wafer 120. Arranged on the PCB substrate 140 is: a sound chamber housing 150 having a through hole 丨5〇a on the upper surface, the sound chamber housing for forming an additional back sound chamber; the MEMS wafer Π0' the wafer attached to the sound chamber housing The through hole 15〇a of the body 5丨 is extended to extend the back M335901 room; and the ASIC wafer 120 is disposed on a portion of the PCB substrate 140 that is in contact with the case 130. Further, a rear sound hole 14〇a for the rear sound transmission is disposed at a portion of the pcB substrate 140 where the sound chamber housing 150 is mounted. A sealing pad 148 may also be disposed around the rear sound hole 140a of the PCB substrate 140, and the sealing pad 148 is subjected to hole sealing of the sound hole 14A by soldering to prevent distortion of sound waves. Reference numeral 148a denotes a sound hole formed by the sealing pad 148. The case 130 is a metal case having an open surface, wherein the case 130 has a shape of a cylinder or a square column. The housing 13A has an end portion in contact with the conductive pattern 141 of the pcb substrate 140 and also has a front acoustic hole 130a for the front portion to transmit sound to the outside. By aligning the metal casing no on the conductive pattern 141 formed on the PCB substrate 140, then spot welding at least two points by laser welding or spot welding 'and then sealing the casing with an adhesive 164 such as epoxy resin The contact portion of the 130 and the PCB substrate 140 thereby attaches the housing 13A to the PCB substrate 140. Reference numeral 162 denotes a solder joint. According to the method for manufacturing the directional capacitance squealing crying, the sound chamber housing 15 is attached while the ASIC wafer 120 is mounted such that the rear sound hole 140a of the PCB substrate 140 is positioned at Within the additional back chamber 152, the MEMS wafer 110 is then attached to the chamber housing 150 such that the through holes 150a of the chamber housing 15 are positioned within the back chamber 15 of the MEMS wafer 110. Thereafter, the acoustic delay device 170 is attached to the front acoustic hole 130a' of the housing 130 having a cylindrical or square column shape and the housing 130 having the cylindrical or square pillar-opened shape is fixed to the PCB substrate 140 through the misalignment tan. Conductive pattern 141. The housing 130 is bonded to the PCB substrate 140 through the adhesive 164. Adhesive 164 can be used to control M335901 epoxy, non-conductive epoxy, silver paste, bismuth, ethyl amino decanoate, propylene and solder paste. Referring to the third figure, the ASIC wafer 120 and the MEMS wafer 110 having the additional back chamber 152 formed by the sound chamber housing 150 are disposed on the PCB substrate 140, and the square or circular conductive pattern 141 is disposed with and without a cylinder or The portion of the square pillar-shaped housing 130 that is in contact. Since the size of the PCB substrate 140 is larger than the size of the housing 130 having a cylindrical or square pillar shape, connection pads or connection terminals for connection to an external device can be freely arranged on a larger PCB substrate, and can be utilized. The conventional PCB manufacturing process arranges a copper film and then plated with nickel or gold to fabricate the conductive pattern 141. A ceramic substrate, an fpcb substrate, or a metal PCB may be used instead of the PCB substrate 140. The surface of the housing 13 having a cylindrical or square pillar shape is in contact with the surface of the PCB substrate 140 so that the wafer component can be housed inside, on the housing. A front sound hole 13〇a for transmitting the front sound is arranged. The housing 13 can be made of brass, copper, stainless steel, aluminum or a nickel alloy and can be plated with gold or silver. After the housing 130 is aligned with the conductive pattern 141 of the PCB substrate 140, a solder joint 162 as a part of the contact portion is laser-welded using a misalignment welder (not shown) to fix the housing 130 to the PCB substrate 14 . Thereafter, the assembly of the microphone is completed by applying an adhesive 164 to the entire contact portion. The 指 of the soldering finger is spot-welded to more than one point (preferably two or four points) to fix the mounting body 130 to the PCB substrate 140 instead of the soldering housing 13 (the entire contact surface of the ^pCB substrate MG) The joint between the casing (10) and the (4) substrate 140 through the welding is referred to as a solder joint 162. The casing (10) is fixed to the PCB substrate 14 through the tandem M335901 point 162, so that the casing 13 is in use with an adhesive. The i64 bonding or curing process does not act to bond in place. Further, the conductive pattern 141 is connected to the ground connection terminal 144 through the through hole 146, and when combined with the housing 130, external noise is blocked to remove noise. At least two to eight connection terminals 142 and 144 for connecting to an external device are formed at the bottom surface of the substrate 140, and each of the connection terminals 142 and 144 is electrically connected to the wafer element side through the through hole. Specifically, according to the present invention The novel embodiment, when the connection terminals 42 and i44 extend around the pcB substrate 140, can facilitate the addition of JL by using an electric solder to the exposed surface, according to an embodiment of the present invention, although laser Illustrated as a method for securing the housing 130 to the PCB substrate 140, but it is also possible to use a solder or stamp to secure the housing 130 to the PCB substrate 14 and a conductive ring resin, a non-conductive epoxy, Silver paste, enamel, urethane, propylene or solder paste as the adhesive 164 〇 The fourth figure shows the 石 石 夕 电 谷 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 具有 石 石 石 石A side cross-sectional view of the same. As described above, the tantalum condenser microphone 100 of the first embodiment is different from the tantalum condenser microphone 100' of the second embodiment in the position of the acoustic delay device 170, wherein the acoustic delay device 170 is in the first embodiment. The front sound hole 130a for the front sound transmission is attached to the casing 13〇, and the rear sound hole 14〇a for the rear sound transmission is attached to the pcB in the second embodiment. In the first embodiment, the front sound of the front sound hole 130a of the transmission case from the external sound source is delayed by the phase delay of the sound delay device 17A to reach the M335901, and in the second embodiment, the transmission PCB from the external sound source Subsequent sound hole 140 of substrate 14 The rear sound of a is delayed by the phase delay of the acoustic delay device 17A to reach the MEMS wafer 110. Because the structure of the Shishi condenser microphone according to the second embodiment is different from that of the first embodiment, except for the position of the acoustic delay device 170 The structure of the condenser microphone is the same, so an additional detailed description thereof will be omitted. Fig. 5 is a view illustrating an additional back sound chamber in the form of a square column according to the present invention, and the sixth figure is an example of a cylindrical shape according to the present invention. A diagram of the additional back chamber. As shown in the fifth and sixth figures, the sound chamber housing 150 for forming the additional back chamber 152 may have the shape of a square column 150' and a cylinder 15", and in a square column A through hole i5〇a is disposed on the upper portion of the 150 or the cylinder 15〇 to form a path with the back chamber 15 of the MEMS wafer 110. The Shishi condenser microphone 100 having various shapes can be manufactured by attaching a housing 13 having various shapes to the PCB substrate 14A. The ASIC wafer 120 and the MEMS wafer 11 are mounted on the PCB substrate 140. The MEMS wafer 110 includes an additional back chamber 152 formed by the chamber housing 150. For example, the housing may have a cylindrical shape, a square column, a cylinder having a wing at its end, or a square column having a wing at its end. As shown in the seventh diagram, the connection pads 320 of the main PCB 310 are bonded to the connection terminals 142 and 144 by meandering according to the directional shi capacitors mounted on the main PCB 310, and will protrude in the center of the PCB substrate 140. The housing 130 is inserted into the insertion hole 310a of the main PCB 310.
因此’根據本新型的安裝方法，因為將在傳聲器的PCB 12 M335901 基底上突出的殼體130插入主PCB 310的插入孔3i〇a，所以 在安裝後的總高度小於傳統的傳聲器，從而有效地利用安 裝產品所需的空間，在傳統的傳聲器中連接端子形成在供 安裝主PCB的元件侧的相對侧上。 【產業利用性】 本新型包括用於在MEMS晶片下方形成附加背音室 從而增加MEMS晶片的背音室空間的音室殼體，從而改進 了靈敏度並改進了諸如THD ( _波失真）肩音問題。 【圖式簡單說明】Therefore, according to the mounting method of the present invention, since the housing 130 protruding on the substrate of the microphone 12 M335901 of the microphone is inserted into the insertion hole 3i〇a of the main PCB 310, the total height after mounting is smaller than that of the conventional microphone, thereby effectively With the space required for mounting the product, the connection terminals are formed on the opposite sides of the component side for mounting the main PCB in the conventional microphone. [Industrial Applicability] The present invention includes a sound chamber housing for forming an additional back sound chamber under the MEMS wafer to increase the back sound chamber space of the MEMS wafer, thereby improving sensitivity and improving shoulder sound such as THD (wave distortion) problem. [Simple description of the map]
S 晶片=示在”容傳聲器中使用的傳一 電容傳聲 时第二圖是顯示出採用MEMSU的傳統 态的側剖面圖。 附加 附加 是赫出根據本新型第—實施 …的定向石夕電容傳聲器的側剖面圖。的，、有 第四圖是顯示出根據本新 背音室的定向.電容傳聲器的::二"方式的具有 圖。第五圖是例轉據本新❹方㈣式的㈣背音室的 圖。第六圖是例示根據本新型呈圓柱形式的心背音室的 第七圖是Μ根據本新型實施方式的其中在主PCB上 13 M335901 安裝定向矽電容傳聲器的實施例的立體圖。 【主要元件符號說明】 1 矽電容傳聲器 10 MEMS晶片 11 振動板 12 間隔件 13 背板 13a 聲孔 14 梦晶片 15 背音室 20 ASIC晶片 30 PCB 30a 聲孔 40 PCB 100 定向矽電容傳聲器 100， 定向矽電容傳聲器 110 MEMS晶片 120 ASIC晶片 130 殼體 130a 前聲孔 140 PCB基底 140a 後聲孔 141 導電圖案 14S-wafer = The side view showing the conventional state of the MEMSU is shown in the transmission of a capacitor used in the "microphone". The additional addition is the directional Shishi capacitor according to the first implementation of the present invention. The side cross-sectional view of the microphone, and the fourth picture shows the orientation according to the new back sound chamber. The condenser microphone has a diagram of the "two" mode. The fifth figure is an example of the transfer of the new square (four) (4) A diagram of a back sound chamber. The sixth figure is a seventh diagram illustrating a cylindrical heart chamber according to the present invention. According to an embodiment of the present invention, a 13 M335901 mounted directional capacitance condenser microphone is mounted on the main PCB. 3D illustration of the embodiment. [Main component symbol description] 1 Tantalum condenser microphone 10 MEMS wafer 11 Vibrating plate 12 Spacer 13 Back plate 13a Sound hole 14 Dream wafer 15 Back chamber 20 ASIC wafer 30 PCB 30a Sound hole 40 PCB 100 Orientation 矽Capacitor microphone 100, directional tantalum condenser microphone 110 MEMS wafer 120 ASIC wafer 130 housing 130a front sound hole 140 PCB substrate 140a rear sound hole 141 conductive pattern 14