CN100512511C - 封装硅传声器的微型装置 - Google Patents
封装硅传声器的微型装置 Download PDFInfo
- Publication number
- CN100512511C CN100512511C CNB2005100117904A CN200510011790A CN100512511C CN 100512511 C CN100512511 C CN 100512511C CN B2005100117904 A CNB2005100117904 A CN B2005100117904A CN 200510011790 A CN200510011790 A CN 200510011790A CN 100512511 C CN100512511 C CN 100512511C
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- electrode
- pedestal
- metal cap
- chip
- silicon microphone
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 20
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 20
- 239000010703 silicon Substances 0.000 title claims abstract description 20
- 238000012856 packing Methods 0.000 title description 2
- 229910052751 metal Inorganic materials 0.000 claims abstract description 57
- 239000002184 metal Substances 0.000 claims abstract description 57
- 239000003990 capacitor Substances 0.000 claims abstract description 3
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 32
- 238000003466 welding Methods 0.000 claims description 15
- 238000005516 engineering process Methods 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000004411 aluminium Substances 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000011152 fibreglass Substances 0.000 claims description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 3
- 239000010931 gold Substances 0.000 claims description 3
- 229910052737 gold Inorganic materials 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010956 nickel silver Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 238000005507 spraying Methods 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 230000015572 biosynthetic process Effects 0.000 claims description 2
- 238000005137 deposition process Methods 0.000 claims description 2
- 239000013212 metal-organic material Substances 0.000 claims description 2
- 238000005538 encapsulation Methods 0.000 abstract description 19
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 230000001755 vocal effect Effects 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 16
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 238000009411 base construction Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000011664 signaling Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
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Abstract
Description
Claims (8)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100117904A CN100512511C (zh) | 2005-05-26 | 2005-05-26 | 封装硅传声器的微型装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100117904A CN100512511C (zh) | 2005-05-26 | 2005-05-26 | 封装硅传声器的微型装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1870836A CN1870836A (zh) | 2006-11-29 |
CN100512511C true CN100512511C (zh) | 2009-07-08 |
Family
ID=37444364
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100117904A Active CN100512511C (zh) | 2005-05-26 | 2005-05-26 | 封装硅传声器的微型装置 |
Country Status (1)
Country | Link |
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CN (1) | CN100512511C (zh) |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100632694B1 (ko) * | 2005-08-20 | 2006-10-16 | 주식회사 비에스이 | 일렉트릿 콘덴서 마이크로폰 |
CN101247669B (zh) * | 2007-02-15 | 2012-09-05 | 歌尔声学股份有限公司 | 传声器模组 |
CN101150889B (zh) * | 2007-10-31 | 2011-05-25 | 日月光半导体制造股份有限公司 | 微机电麦克风封装结构及其方法 |
CN102275859A (zh) * | 2010-06-13 | 2011-12-14 | 苏州敏芯微电子技术有限公司 | Mems微传感器的封装结构及其制造方法 |
NO331979B1 (no) | 2010-09-17 | 2012-05-14 | Stiftelsen Norsar | System og metode for tidlig deteksjon av tog |
WO2015158008A1 (zh) * | 2014-04-18 | 2015-10-22 | 华为终端有限公司 | 一种屏蔽膜、屏蔽电路板及终端设备 |
CN104581588A (zh) * | 2014-11-18 | 2015-04-29 | 上海微联传感科技有限公司 | 一种高灵敏度高信噪比的mems硅麦克风 |
DE102018219133A1 (de) * | 2017-11-14 | 2019-05-16 | Knowles Electronics, Llc | Sensorvorrichtung mit Eindringschutz |
CN109030563B (zh) * | 2018-05-29 | 2021-07-02 | 苏州慧闻纳米科技有限公司 | 一种气体传感器及其制备方法 |
-
2005
- 2005-05-26 CN CNB2005100117904A patent/CN100512511C/zh active Active
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Publication number | Publication date |
---|---|
CN1870836A (zh) | 2006-11-29 |
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Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
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ASS | Succession or assignment of patent right |
Owner name: GOER TEK INC. Free format text: FORMER OWNER: QINGDAO GOERTEK ELECTRONICS CO., LTD. Effective date: 20071109 |
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C41 | Transfer of patent application or patent right or utility model | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20071109 Address after: 261031 Weifang Shandong high tech Zone East North Road head Applicant after: Goertek Inc. Address before: 266061 Shandong Qingdao hi tech Zone Venture Building 605 Applicant before: Geer Electronics Co., Ltd., Qingdao |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CP03 | Change of name, title or address |
Address after: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee after: GOERTEK Inc. Address before: 261031 Weifang Shandong high tech Zone East North Road head Patentee before: GOERTEK Inc. |
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CP03 | Change of name, title or address | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200730 Address after: 261031 building 10, Geer phase II Industrial Park, No. 102, Ronghua Road, Ronghua community, Xincheng street, high tech Zone, Weifang City, Shandong Province Patentee after: Weifang goer Microelectronics Co.,Ltd. Address before: 261031 Dongfang Road, Weifang high tech Industrial Development Zone, Shandong, China, No. 268 Patentee before: GOERTEK Inc. |