WO2005076342A1 - 非接触搬送装置 - Google Patents
非接触搬送装置 Download PDFInfo
- Publication number
- WO2005076342A1 WO2005076342A1 PCT/JP2005/000491 JP2005000491W WO2005076342A1 WO 2005076342 A1 WO2005076342 A1 WO 2005076342A1 JP 2005000491 W JP2005000491 W JP 2005000491W WO 2005076342 A1 WO2005076342 A1 WO 2005076342A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- gas supply
- nozzle
- slit
- head
- contact
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G47/00—Article or material-handling devices associated with conveyors; Methods employing such devices
- B65G47/74—Feeding, transfer, or discharging devices of particular kinds or types
- B65G47/90—Devices for picking-up and depositing articles or materials
- B65G47/91—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers
- B65G47/911—Devices for picking-up and depositing articles or materials incorporating pneumatic, e.g. suction, grippers with air blasts producing partial vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
- B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
- B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
- B65G49/061—Lifting, gripping, or carrying means, for one or more sheets forming independent means of transport, e.g. suction cups, transport frames
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G2249/00—Aspects relating to conveying systems for the manufacture of fragile sheets
- B65G2249/04—Arrangements of vacuum systems or suction cups
- B65G2249/045—Details of suction cups suction cups
Definitions
- the present invention relates to a non-contact transport device that transports an object while holding the object in a non-contact state.
- a non-contact transfer device for transferring a semiconductor wafer or the like as a work, that is, an object to be transferred in a non-contact state, an annular holding surface is provided at a front end surface, and the holding surface is gently moved from the center toward the holding surface.
- a transfer head having a concave portion having a continuous gas guide surface, and a nozzle provided in the concave portion. Air is supplied from a slit formed between the disk-shaped nozzle head and the tip end surface of the transfer head.
- a device that discharges ink has been developed (see Patent Document 1).
- the gas discharged from the slit of the nozzle adheres to the gas guide surface and adheres to it, reaches the holding surface, and flows outward in the radial direction. Since a negative pressure state is always generated due to the airflow toward the front end surface, when the transported object is disposed in front of the transport head, the transported object approaches the transport head by the negative pressure. The transported object is prevented from coming into direct contact with the holding surface due to the airflow flowing along the surface, and the transported object is held by the transport head in a non-contact state. A conveyed object can be conveyed.
- Patent document 1 JP-A-10-181879
- the device including the nozzle may be periodically cleaned, and the cleaning liquid or the like may be contaminated during cleaning.
- the gas may enter the gas supply hole through the slit, and in that case, there is a problem that it takes time to remove the foreign matter that has entered.
- Another object of the present invention is to prevent foreign matter from entering from inside the slit when cleaning the transport head.
- a non-contact transfer device of the present invention is a non-contact transfer device for transferring an object to be transferred while holding the object in a non-contact state, wherein the gas supply surface is provided with an opening of a gas supply hole.
- a transfer head having an annular holding surface protruding from the gas supply surface and a gas guide surface connected to the holding surface from the gas supply surface at the tip end surface;
- a nozzle including a base to be mounted, a disk portion facing the gas supply surface and forming an annular gas discharge slit between the gas supply surface, and the transport head. And a nozzle moving member that moves in the axial direction to change the width of the slit.
- the nozzle moving member is a screw member attached to the nozzle and screwed to the transfer head, and the direction of increasing the width of the slit with respect to the nozzle.
- the transfer head is provided with an elastic member for applying the elastic force described above.
- a seal member is attached to an outer peripheral portion of the disk portion so as to face the gas supply surface, and when the slit is closed, foreign matter may enter the gas supply hole. It is characterized by preventing mixing.
- the air discharge slit formed between the nozzle and the transfer head The discharged gas such as air adheres to the gas guide surface and flows along the gas guide surface, and then adheres to the holding surface and flows along the same, and a gas layer is formed on the front end surface of the transport head.
- the front of the transport head is always in a negative pressure state.
- the transported object can be sucked and held on the transport head without directly contacting the transport head, and the transported object can be transported in a non-contact state by moving the transport head.
- the transported object can be transported while suspended on the transport head, or can be transported in a floating state.By adjusting the slit gap, the thickness of the gas layer can be adjusted according to the load on the transported object. Can be changed. Thus, a plurality of types of objects can be transported by one type of non-contact transport device.
- FIG. 1 is a cross-sectional view showing a non-contact transfer device according to an embodiment of the present invention.
- FIG. 2 is a cross-sectional view showing a state in which the state force of FIG. 1 also has a slit closed.
- FIG. 3 is a perspective view of the non-contact transfer device as viewed from the front end.
- FIG. 4 is an exploded perspective view of the non-contact transfer device.
- FIG. 5 is a cross-sectional view showing a non-contact transfer device according to another embodiment of the present invention.
- the non-contact transfer device 10 has a disc-shaped base plate 11 and a transfer head 12, and the transfer head 12 is attached to the base plate 11 by a plurality of bolts 13. Let's do it.
- a moving member not shown, is attached to the base plate 11, and the carrying head 12 is carried and moved by the moving member.
- FIG. 4 only one of the plurality of bolts 13 is shown!
- the base plate 11 is provided with a screw hole 14 into which an air supply pipe for supplying compressed air is screwed.
- a communication space 15 is formed by communicating with 14!
- a seal member 16 having a larger diameter than the communication space 15 is incorporated between the base plate 11 and the transfer head 12 to prevent air from leaking between the base plate 11 and the transfer head 12.
- a recess 17 is formed at the tip of the transfer head 12, and the bottom surface of the recess 17 is a gas supply surface 18.
- a plurality of gas supply openings formed in the transfer head 12 are opened to the gas supply surface 18.
- the hole 19 communicates with the communication space 15.
- An annular holding surface 21 protruding forward of the transfer head 12 from the gas supply surface 18 is formed on the distal end surface of the transfer head 12, and a gas supply surface 18 is provided between the gas supply surface 18 and the holding surface 21.
- a gas guide surface 22 is formed in a streamlined shape and continuously extending from the air toward the holding surface 21. Further, a tapered surface 23 inclined toward the base end of the transfer head 12 is formed between the outer peripheral surface of the transfer head 12 and the holding surface 21.
- a nozzle 24 having a base 24a and a disk portion 24b is mounted on the transfer head 12, and the disk portion 24b is opposed to the gas supply surface 18 so as to cover the same.
- the portion of the bottom surface of the concave portion 17 facing the disk portion 24b is the gas supply surface 18.
- a slit forming surface 26 for forming a gas discharge slit 25 between the gas supply surface 18 and the gas supply surface 18 is formed in an annular shape on an outer peripheral portion of the disk portion 24b.
- the air pocket 27 is formed radially inside the slit forming surface 26.
- the air that has entered the air pocket 27 through the plurality of gas supply holes 19 is discharged radially outward from the entire circumferential direction of the nozzle 24 through the slit 25 and is attached to the gas guide surface 22. After flowing and flowing radially outward along the flow, it flows in a state attached to the holding surface 21 and flows radially outward along the flow. Next, the flow passing through the holding surface 21 is attached to the tapered surface 23, is bent toward the base end side of the transfer head 12, and flows outward of the transfer head 12.
- the front surface of the transfer head 12 is attached to the front surface of the transfer head 12 and a flow is formed along the front surface thereof.
- a flow is generated from the front side of the front end face of the head 12 toward the front face, and the article W is sucked toward the front end face of the transfer head 12.
- an air layer is formed on the tip end surface of the transferred head W without directly contacting the tip end surface of the transfer head 12. It is in a state held through. Therefore, if the transport head 12 is arranged downward, the transported object W can be transported in a suspended state, and the transported object W can be transported with the transport head 12 facing upward.
- a mounting hole 31 is formed in the center of the transport head 12, and a support block 32 is incorporated in the mounting hole 31.
- the support block 32 is formed by a screw member 33 shown in FIGS. 3 and 4. Fixed to 12. However, the support block 32 may be pressed into the transfer head 12 and fixed, or the support block 32 may be formed integrally with the transfer head 12.
- a screw hole 34 is formed in the center of the support block 32, and a screw member 35 as a nozzle moving member is screwed into the screw hole 34.
- a rubber material 37 as an elastic member is incorporated between the support block 32 and the nozzle 24, and the rubber material 37 applies an elastic force to the nozzle 24 in a direction to increase the width of the slit 25. ing. Therefore, the width of the slit 25 can be adjusted by the screw member 35, and the nozzle 24 is fixed by the elastic force applied to the nozzle 24 by the rubber material 37, so that the width dimension of the slit 25 is kept constant.
- FIG. 1 shows a state in which the slit 25 has a predetermined width dimension by the screw member 35.When the nozzle 24 is moved until the slit forming surface 26 contacts the gas supply surface 18, the width dimension becomes zero. . Thus, the width dimension of the slit 25 can be adjusted within the range of zero force and a predetermined maximum value.
- the width of the slit 25 is adjusted in this manner, the flow rate flowing along the distal end surface of the transport head 12 can be adjusted, so that the thickness of the air layer can be changed, and It is possible to change the suspending ability when the transported object W is suspended and transported according to the load of the workpiece W, and the distance between the transport head 12 and the transported object W can be changed even when transporting by buoyancy. Can be adjusted.
- the nozzle 24 is rotated in the axial direction until the slit forming surface 26 contacts the gas supply surface 18 by rotating the screw member 35 as shown in FIG. Move.
- the width of the slit 25 becomes zero, and the gas supply hole 19 is closed by the disk portion 24b of the nozzle 24. In this state Thus, even if the cleaning liquid is sprayed on the transfer head 12 to clean the same, foreign matter such as the cleaning liquid is prevented from entering the air pocket 27 and the gas supply hole 19.
- the transport head 12 When the object W is transported using the above-described non-contact transport device, the transport head 12 is attached to a robot arm or a moving member that reciprocates vertically and horizontally at the base plate 11.
- Can be The transport mode of the transported object W may be a case where the transported object W is sucked under the transport head 12 and transported in a suspended state, or the transported object W is floated above the transport head 12 and transported.
- the transferred object W is transferred in a non-contact state without contacting the transfer head 12.
- a negative pressure air formed in front of the transport head 12 is formed.
- the transferred object W floats up, approaches the transfer head 12, and is attracted to the transfer head 12 in a non-contact manner.
- the air flowing along the distal end surface is attached to the tapered surface 23 and flows toward the base end side of the transfer head 12, so that the air separated from the transfer head 12 affects the transferred object W. Is prevented.
- This non-contact transfer device is thin and easily elastically deformed, and can transfer not only the transferred object W and the high rigidity, but also food such as cookies as the transferred object W as well as the transferred object W.
- the width of the slit 25 together with the air pressure in accordance with the type of the object W the object W can be conveyed while being held at an optimal suction force. The same applies to the case where the transported object W is lifted and transported.
- FIG. 5 is a cross-sectional view showing a non-contact transfer device according to another embodiment of the present invention.
- members common to the members in the above embodiment are denoted by the same reference numerals. Have been.
- a wave washer 37a is incorporated between the support block 32 and the nozzle 24 as an elastic member for increasing the elastic force in the direction of increasing the width of the slit 25 with respect to the nozzle 24.
- a metal spring material such as the wave washer 37a may be used, the rubber material 37 may be used as described above, or a spring may be used. good.
- a seal member 38 made of an annular rubber is attached to the inner surface of the nozzle 24 as shown in FIG. Therefore, slit 25 When the width is set to zero, the sealing member 38 comes into contact with the gas supply surface 18, so that it is possible to reliably prevent the cleaning liquid or foreign matter from entering the air pocket 27 and the gas supply hole 19 during cleaning. When the seal member 38 is provided in this manner, the surface of the seal member 38 becomes the slit forming surface 26.
- the present invention is not limited to the above-described embodiment, and can be variously modified without departing from the gist thereof.
- another gas such as a force inert gas that discharges compressed air from the slit 25 through the gas supply hole 19 may be supplied.
- the non-contact transfer device of the present invention is used to transfer a semiconductor wafer or the like as an object to be transferred to another position in a non-contact state.
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/588,742 US7452016B2 (en) | 2004-02-09 | 2005-01-17 | Non-contact carrying device |
EP05703728A EP1715514B1 (en) | 2004-02-09 | 2005-01-17 | Non-contact carrier device |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004032476A JP4342331B2 (ja) | 2004-02-09 | 2004-02-09 | 非接触搬送装置 |
JP2004-032476 | 2004-02-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005076342A1 true WO2005076342A1 (ja) | 2005-08-18 |
Family
ID=34836090
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2005/000491 WO2005076342A1 (ja) | 2004-02-09 | 2005-01-17 | 非接触搬送装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US7452016B2 (ja) |
EP (1) | EP1715514B1 (ja) |
JP (1) | JP4342331B2 (ja) |
WO (1) | WO2005076342A1 (ja) |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP4491340B2 (ja) * | 2004-12-28 | 2010-06-30 | 株式会社コガネイ | 搬送装置 |
JP2007324442A (ja) * | 2006-06-02 | 2007-12-13 | Smc Corp | 非接触搬送装置 |
JP4243766B2 (ja) * | 2006-10-02 | 2009-03-25 | Smc株式会社 | 非接触搬送装置 |
KR20100022491A (ko) * | 2007-05-25 | 2010-03-02 | 코닝 인코포레이티드 | 유리 시트를 취급하기 위한 장치 |
KR100859835B1 (ko) * | 2008-05-13 | 2008-09-23 | 한국뉴매틱(주) | 비접촉식 진공패드 |
JP5239564B2 (ja) * | 2008-07-04 | 2013-07-17 | セイコーエプソン株式会社 | チャック装置および吸引保持ハンド |
DE102009051565A1 (de) * | 2009-10-22 | 2011-04-28 | Alexander Borowski | Ansaug-Greifervorrichtung für flache Substrate |
JP5384305B2 (ja) * | 2009-11-18 | 2014-01-08 | 株式会社コガネイ | ワーク搬送装置 |
DE102009059937A1 (de) * | 2009-12-22 | 2011-06-30 | Strama-MPS Maschinenbau GmbH & Co. KG, 94315 | Greifer zur nahezu berührungslosen Aufnahme von flächigen Bauteilen wie siliziumbasierte Wafer |
DE102009059936A1 (de) * | 2009-12-22 | 2011-06-30 | Strama-MPS Maschinenbau GmbH & Co. KG, 94315 | Greifer zur nahezu berührungslosen Aufnahme von flächigen Bauteilen wie siliziumbasierte Wafer |
IT1398436B1 (it) * | 2010-01-27 | 2013-02-22 | Applied Materials Inc | Dispositivo di manipolazione di substrati mediante aria compressa |
JP5198499B2 (ja) * | 2010-03-17 | 2013-05-15 | 日本特殊陶業株式会社 | 配線基板の非接触搬送装置、配線基板の製造方法 |
JP5110480B2 (ja) * | 2010-05-11 | 2012-12-26 | Smc株式会社 | 非接触搬送装置 |
JP5817043B2 (ja) * | 2010-10-29 | 2015-11-18 | 国立研究開発法人産業技術総合研究所 | ノンコンタクト搬送パッド |
JP5198550B2 (ja) * | 2010-12-23 | 2013-05-15 | 日本特殊陶業株式会社 | 配線基板の非接触搬送装置、配線基板の製造方法 |
JP5198549B2 (ja) * | 2010-12-23 | 2013-05-15 | 日本特殊陶業株式会社 | 配線基板の非接触搬送装置、配線基板の製造方法 |
CN102332420B (zh) * | 2011-05-25 | 2013-01-02 | 湖南红太阳光电科技有限公司 | 超薄伞流式非接触硅片吸盘 |
CN102794773A (zh) * | 2011-05-26 | 2012-11-28 | 北京北方微电子基地设备工艺研究中心有限责任公司 | 用于抓取晶片的抓取组件和具有它的抓取装置 |
KR101190809B1 (ko) * | 2011-08-12 | 2012-10-12 | 이성일 | 정밀한 노즐 갭 유지가 가능한 비접촉 진공패드 |
JP5875294B2 (ja) * | 2011-08-29 | 2016-03-02 | 日本空圧システム株式会社 | 保持具 |
US8905680B2 (en) * | 2011-10-31 | 2014-12-09 | Masahiro Lee | Ultrathin wafer transport systems |
JP6018647B2 (ja) * | 2012-03-08 | 2016-11-02 | コーニング インコーポレイテッド | ロボットツーリング装置と案内装置を含むガラスリボン係合システム |
TWI542456B (zh) * | 2012-09-20 | 2016-07-21 | 鴻海精密工業股份有限公司 | 零件吸取裝置 |
JP6127728B2 (ja) * | 2013-05-30 | 2017-05-17 | 三星ダイヤモンド工業株式会社 | 脆性材料基板の搬送ヘッド |
JP5929947B2 (ja) * | 2014-02-28 | 2016-06-08 | 株式会社安川電機 | 吸着パッド、ロボットハンドおよびロボット |
JP5908136B1 (ja) * | 2015-03-03 | 2016-04-26 | 株式会社ハーモテック | 吸引装置 |
JP6814009B2 (ja) * | 2016-10-04 | 2021-01-13 | 株式会社ディスコ | 搬送パッド及びウエーハの搬送方法 |
JP6744630B2 (ja) * | 2016-12-16 | 2020-08-19 | 株式会社ハーモテック | 邪魔板 |
CN108735643B (zh) * | 2017-04-20 | 2020-05-15 | 上海新昇半导体科技有限公司 | 伯努利吸盘 |
US10391723B2 (en) * | 2017-08-31 | 2019-08-27 | The Boeing Company | Rotary compaction tool |
JP2022547920A (ja) * | 2019-09-10 | 2022-11-16 | アー オー フォルマフロン スイス アクチェンゲゼルシャフト | 吸引ユニット及び吸引装置 |
JP7219426B2 (ja) * | 2020-02-19 | 2023-02-08 | Smc株式会社 | 非接触搬送装置 |
JP2022112660A (ja) | 2021-01-22 | 2022-08-03 | 株式会社コガネイ | 非接触搬送装置 |
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GB748138A (en) | 1953-04-14 | 1956-04-25 | Kodak Ltd | Improved device for handling articles by suction |
JPH08118280A (ja) | 1994-10-26 | 1996-05-14 | Sony Corp | 真空ピンセット |
JPH10181879A (ja) | 1996-12-26 | 1998-07-07 | Koganei Corp | 搬送装置 |
JPH11515139A (ja) * | 1995-07-12 | 1999-12-21 | エスイーゼット・セミコンダクター−イクイプメント・ツベヘーア・フュア・ジ・ハルブライターフェルティグング・アーゲー | ウエファ状の物品、特にシリコンウエファ用の支持体 |
Family Cites Families (7)
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DE3036829A1 (de) * | 1980-09-30 | 1982-05-13 | Wacker-Chemitronic Gesellschaft für Elektronik-Grundstoffe mbH, 8263 Burghausen | Verfahren zum aufnehmen von kristallscheiben |
US5067762A (en) * | 1985-06-18 | 1991-11-26 | Hiroshi Akashi | Non-contact conveying device |
IT1214033B (it) * | 1987-02-03 | 1990-01-05 | Carlomagno Giovanni Maria | Procedimento e dispositivo per esercitare forze su lastre di vetro, in particolare ad elevata temperatura |
AT389959B (de) * | 1987-11-09 | 1990-02-26 | Sez Semiconduct Equip Zubehoer | Vorrichtung zum aetzen von scheibenfoermigen gegenstaenden, insbesondere von siliziumscheiben |
US5169196A (en) * | 1991-06-17 | 1992-12-08 | Safabakhsh Ali R | Non-contact pick-up head |
US6517130B1 (en) * | 2000-03-14 | 2003-02-11 | Applied Materials, Inc. | Self positioning vacuum chuck |
JP4491340B2 (ja) * | 2004-12-28 | 2010-06-30 | 株式会社コガネイ | 搬送装置 |
-
2004
- 2004-02-09 JP JP2004032476A patent/JP4342331B2/ja not_active Expired - Fee Related
-
2005
- 2005-01-17 US US10/588,742 patent/US7452016B2/en not_active Expired - Fee Related
- 2005-01-17 WO PCT/JP2005/000491 patent/WO2005076342A1/ja not_active Application Discontinuation
- 2005-01-17 EP EP05703728A patent/EP1715514B1/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB748138A (en) | 1953-04-14 | 1956-04-25 | Kodak Ltd | Improved device for handling articles by suction |
JPH08118280A (ja) | 1994-10-26 | 1996-05-14 | Sony Corp | 真空ピンセット |
JPH11515139A (ja) * | 1995-07-12 | 1999-12-21 | エスイーゼット・セミコンダクター−イクイプメント・ツベヘーア・フュア・ジ・ハルブライターフェルティグング・アーゲー | ウエファ状の物品、特にシリコンウエファ用の支持体 |
JPH10181879A (ja) | 1996-12-26 | 1998-07-07 | Koganei Corp | 搬送装置 |
Non-Patent Citations (1)
Title |
---|
See also references of EP1715514A4 |
Also Published As
Publication number | Publication date |
---|---|
EP1715514A1 (en) | 2006-10-25 |
JP4342331B2 (ja) | 2009-10-14 |
JP2005219922A (ja) | 2005-08-18 |
EP1715514A4 (en) | 2010-07-21 |
US20070131660A1 (en) | 2007-06-14 |
US7452016B2 (en) | 2008-11-18 |
EP1715514B1 (en) | 2012-11-21 |
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