WO2005072041A1 - Dispositif d'encapsulation a table mobile, et procede d'encapsulation - Google Patents

Dispositif d'encapsulation a table mobile, et procede d'encapsulation Download PDF

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Publication number
WO2005072041A1
WO2005072041A1 PCT/NL2005/000044 NL2005000044W WO2005072041A1 WO 2005072041 A1 WO2005072041 A1 WO 2005072041A1 NL 2005000044 W NL2005000044 W NL 2005000044W WO 2005072041 A1 WO2005072041 A1 WO 2005072041A1
Authority
WO
WIPO (PCT)
Prior art keywords
encapsulating
carrier
displaceable
electronic component
encapsulating device
Prior art date
Application number
PCT/NL2005/000044
Other languages
English (en)
Inventor
Johannes Lambertus Martinus Dannenberg
Arthur Theodorus Johannes Reijmer
Eustachius Petrus Willibrordus Savenije
Original Assignee
Fico B.V.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fico B.V. filed Critical Fico B.V.
Publication of WO2005072041A1 publication Critical patent/WO2005072041A1/fr

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/03—Injection moulding apparatus
    • B29C45/04—Injection moulding apparatus using movable moulds or mould halves
    • B29C45/06—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction
    • B29C45/062—Injection moulding apparatus using movable moulds or mould halves mounted on a turntable, i.e. on a rotating support having a rotating axis parallel to the mould opening, closing or clamping direction carrying mould halves co-operating with fixed mould halves
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14008—Inserting articles into the mould
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Definitions

  • the invention relates to an encapsulating device for encapsulating electronic components mounted on a carrier, comprising: a frame, two mutually displaceable mould parts connected to the frame, drive means for mutually displacing the mould parts, and feed means for encapsulant connecting to at least one of the mould parts.
  • the invention also relates to a method for encapsulating electronic components mounted on a carrier.
  • the encapsulation of electronic components mounted on a carrier is applied on a large scale.
  • Use is generally made here of moulds consisting of two or more mould parts.
  • a carrier with electronic components for encapsulating is usually placed between the mould parts which are then closed such that they define one or more mould cavities.
  • Liquid encapsulant (epoxy) is subsequently fed under pressure into the mould cavities, for instance using a transfer mechanism wherein plungers exert pressure on pellets ,of encapsulant.
  • the drawback of existing encapsulating devices is that they are expensive and that the encapsulation of electronic components has a relatively long cycle time, whereby the capacity of an encapsulating device is limited.
  • the object of the present invention is to simplify the existing encapsulating devices and to increase the capacity of encapsulating devices.
  • one of the mould parts comprises a displaceable table.
  • the displaceable table is preferably rotatable.
  • the table can thus be formed by a substantially flat disc which co-acts with an opposite mould part placed opposite a flat side of the table.
  • the opposite mould part is herein positioned above the edge of the disc-like table.
  • the displaceable table is provided with at least one holder, but preferably at least two holders, for a carrier with electronic component.
  • the disc can optionally also comprise three, four or even more than four holders, wherein these holders lie in the same plane through the displaceable (rotatable) table.
  • a carrier with one or more components for encapsulating can now be laid on the displaceable table (or be connected in other manner to the displaceable table) and subsequently placed between co-acting mould parts by displacing the table.
  • the mould parts hereby only need to be moved apart over a relatively very short distance.
  • Complex and expensive manipulation means also referred to as handlers or loaders/offloaders
  • a short stroke length of the mould (encapsulating device) makes it possible to simplify the drive means for the relative displacement of the mould parts. It is thus possible for the stroke length of the encapsulating device to be less than a few centimetres, or even less than one centimetre.
  • a further advantage of the limited stroke length is that the time for relative displacement of the mould parts is limited, which results in shortening of the cycle time of an encapsulating operation.
  • positioning of the carrier relative to the displaceable table no longer forms part of the critical path of an encapsulating operation, this being particularly the case if the table is provided with a plurality of holders. This also results in a further shortening of the cycle time of an encapsulating operation.
  • the displaceable table is provided with heating means for heating a carrier with electronic component.
  • heating means for heating a carrier with electronic component.
  • the integration of heating means with the displaceable table limits the number of essential operations with a carrier compared to the situation where use is made of a separate preheating position.
  • the temperature of a carrier for processing can also be precisely controlled up to. the location of actual processing.
  • the displaceable table can also be provided with cleaning means (for instance brushing means and/or suction means optionally displaceable relative to the table) with which the less readily accessible mould parts can be cleaned when the table is displaced.
  • the displaceable table is provided with at least one segment movable in a direction perpendicularly of a plane through the table and connected to the table, which segment is provided with a holder for a carrier with electronic component.
  • a segment makes it possible to urge only the segment under a bias against an opposing mould part (in order to obtain the clamping force on the carrier required for the encapsulation) without the whole table being affected by this biasing force.
  • An advantage of such a construction is for instance that it results in a simplified drive of the displaceable table, since in this preferrecl embodiment the construction of the drive is not mechanically loaded during clamping of a carrier for processing. In addition, this can also be advantageous in compensating effects of expansion resulting from (local) heating of the displaceable table.
  • the frame is formed by a structure -which leaves clear an access to the space between the mould parts.
  • the displaceable table can thus for instance engage on one side of the frame and an access can be left clear through the frame on the opposite side of the displaceable table.
  • the frame can herein consist of a C-shaped construction wherein the opposite legs of the C engage on the separate mould parts.
  • Such an open construction makes it possible for the dispLaceable table to protrude outside the frame.
  • the table can hereby have a size which is optimized for the treatment process without this resulting in an extremely bulky frame.
  • This also has the advantage that the mould parts can be placed in the encapsulating device for exchange in relatively simple manner (for change-over of the device and/or maintenance or cleaning of the encapsulating device).
  • Another advantage is that the access to the displaceable table for loading and offloading thereof can be realized in more simple manner.
  • the open construction of the frame is also made possible by shortening of the cycle time resulting from use of the displaceable table.
  • the increased capacity enables the encapsulating. device to take a smaller form (fewer strips or carriers need be processed during a single processing cycle in order to nevertheless achieve the desired production capacity).
  • a smaller mould limits the forces required for clamping the carrier compared to larger encapsulating devices in which multiple carriers are processed simultaneously).
  • the drive means comprise a number of co-acting rotatable eccentrics. These eccentrics can be formed by a number of parallel rollers.
  • the feed of the products for processing using a displaceable table makes it possible for the operating stroke of the encapsulating device to be very limited., this as already described above.
  • the shorter stroke length now makes it possible to realize the relative displacement of the mould parts in economic manner while making use of a plurality of eccentrics.
  • the use of a plurality of eccentrics makes it possibLe to support the mould part for displacement (or mould parts for displacement) at multiple positions, whereby the chance of deformation of such an engaged mould part is reduced.
  • the possibility of applying a plurality of eccentrics in economically responsible manner in an encapsulating device arises now that the eccentrics only have to provide a relatively small displacement.
  • the eccentrics are thus advantageous and only take up a small , volume, whereby a plurality of (for instance cylindrical) parallel eccentrics can engage on a mould part.
  • the invention also provides a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) positioning on a displaceable table a carrier with electronic component for encapsulating, B) displacing the table between a position, wherein a carrier with electronic component for encapsulating positioned on the table is left clear by a mould part co-acting with the table, to a position wherein the mould part lies opposite the carrier with electronic component for encapsulating, C) reducing the mutual distance between the table and the mould part co-acting with the table such that the carrier with electronic component for encapsulating is enclosed therebetween, and D) feeding encapsulant to a mould cavity connecting to the carrier and the electronic component for encapsulating.
  • the table herein preferably comprises a rotating movement component during processing step B).
  • the advantages as described . above in respect of the encapsulating device according to the invention can be realized by means of this method.
  • the displacement of the table does not here need to form an additional operation compared to the prior art, and can moreover be advantageously combined with preheating of the carrier and/or cleaning of the encapsulating device.
  • the mutual distance between the table and the mould part co-acting with the table is reduced by rotating a number of eccentrics engaging on the mould part. It is noted that this method can of course also be reversed by having the eccentrics engage on the table, and thus displacing the table relative to the opposite mould part.
  • figure 1 A shows a schematic front view of an encapsulating device according to the present invention
  • figure IB shows a schematic side view of the encapsulating device of figure 1A
  • figure 2 shows a schematic perspective view of an alternative embodiment variant of the encapsulating device according to the present invention
  • figure 3 shows a cross-section through a part of an encapsulating device with a rotatable table provided with a displaceable segment
  • figure 4A shows a schematic top view of a two-fold rotatable table of an encapsulating device according to the invention
  • figure 4B shows a schematic top view of a four-fold rotatable table of an encapsulating device according to the invention.
  • Figure 1A shows a front view of an encapsulating device 1.
  • This latter is provided with a frame 2 on which supports a table 4 rotatable about a shaft 3.
  • a holder 5 Placed on rotatable table 4 is a holder 5 for supporting a carrier 6 with electronic components (not shown in this figure), such as semiconductor circuits in particular.
  • An upper mould part is located above rotatable table 4.
  • Both holder 5 and upper mould part 7 are normally provided with heating means which are not shown in this figure.
  • the upper mould part 7 is, connected to a displaceable block 8 on which four eccentrics 9 engage.
  • Figure IB shows encapsulating device 1 in side view.
  • rotatable table 4 is provided with a plurality of holders 5, which holders 5 are each individually adapted to support a carrier 6 with electronic components for encapsulating.
  • the substantially C-shaped configuration of frame 2 is also clearly visible.
  • Frame 2 is provided with a guide 14 along which the block 8 supporting upper mould part 7 is displaceable.
  • Upper mould part 7 is preferably embodied, although this is not shown in this figure, such that it can be readily exchanged. This is possible for instance by coupling mould part 7 releasably via a "drawer construction" to supporting block 8..
  • Figure 2 shows a perspective view of an encapsulating device 20 with a frame 21 on which an upper mould part 22 is mounted for displacement via an operating cylinder 23.
  • Upper mould part 22 engages on guides 24 forming part of frame 21.
  • a table 26 rotatable about a rotation shaft 25 is also mounted on frame 21.
  • Arranged on the tables are three holders 27 (although an even number of holders 27 would be more logical) for supporting leadframes or boards not shown in this figure.
  • Figure 3 shows a cross-section through the displaceable table 30 with a segment 31 which is releasable from the remaining part of table 30.
  • Segment 31 is provided with a holder position 32 for leadframes and with schematically represented heating means 33 with which a carrier supported by segment 31 can be heated.
  • a pusher plate 35 located under segment 31 can be moved upward by rotating the eccentrics 36.
  • Segment 31 is hereby moved toward upper mould part 34, while the position of the remaining part of the table does not change.
  • the product lying on segment 31 can thus be urged against upper mould part 34, whereafter encapsulant can be fed by means of the feed means 37, which are shown only very schematically.
  • Figure 4A shows a schematically represented rotatable table 41 such as forms part of an encapsulating device according to the invention.
  • Table 41 is provided with two holder positions 42 for leadframes 43, 44, wherein a first leadframe 43 has not yet been processed and a second leadframe 44 is provided with encapsulant 45.
  • Figure 4B likewise shows a schematic top view of a rotatable table 61 such as forms part of an encapsulating device according to the invention.
  • the rotatable table 61 is provided with four holder positions 62 for leadframes 43, 44, wherein the first leadframes 43 have not yet been processed in encapsulating device 60 and second leadframes 44 are provided with encapsulant 45.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

La présente invention se rapporte à un dispositif d'encapsulation de composants électroniques montés sur un support, comportant : un châssis, deux demi-moules reliés au châssis et montés mobiles l'un par rapport à l'autre, des moyens d'entraînement adaptés pour entraîner le déplacement des demi-moules l'un par rapport à l'autre, et des moyens d'alimentation en produit d'encapsulation reliés à l'un au moins des demi-moules. La présente invention se rapporte également à un procédé d'encapsulation de composants électroniques montés sur un support.
PCT/NL2005/000044 2004-01-22 2005-01-21 Dispositif d'encapsulation a table mobile, et procede d'encapsulation WO2005072041A1 (fr)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1025302 2004-01-22
NL1025302A NL1025302C2 (nl) 2004-01-22 2004-01-22 Omhulinrichting met verplaatsbare tafel en werkwijze voor omhullen.

Publications (1)

Publication Number Publication Date
WO2005072041A1 true WO2005072041A1 (fr) 2005-08-04

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ID=34806202

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/NL2005/000044 WO2005072041A1 (fr) 2004-01-22 2005-01-21 Dispositif d'encapsulation a table mobile, et procede d'encapsulation

Country Status (2)

Country Link
NL (1) NL1025302C2 (fr)
WO (1) WO2005072041A1 (fr)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107466159A (zh) * 2016-06-06 2017-12-12 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
JP2019520240A (ja) * 2016-06-06 2019-07-18 ▲寧▼波舜宇光▲電▼信息有限公司 撮像モジュールのモールド回路基板の製造装置およびその製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501550A2 (fr) * 1991-02-25 1992-09-02 Delco Electronics Corporation Système pour effectuer des travaux sur des pièces
US5272800A (en) * 1991-07-01 1993-12-28 Olin Corporation Method and apparatus for forming and positioning a preform on a workpiece

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0501550A2 (fr) * 1991-02-25 1992-09-02 Delco Electronics Corporation Système pour effectuer des travaux sur des pièces
US5272800A (en) * 1991-07-01 1993-12-28 Olin Corporation Method and apparatus for forming and positioning a preform on a workpiece

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107466159A (zh) * 2016-06-06 2017-12-12 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
JP2019520240A (ja) * 2016-06-06 2019-07-18 ▲寧▼波舜宇光▲電▼信息有限公司 撮像モジュールのモールド回路基板の製造装置およびその製造方法
EP3468316A4 (fr) * 2016-06-06 2020-02-19 Ningbo Sunny Opotech Co., Ltd. Carte de circuit imprimé moulée de module de caméra, équipement de fabrication et procédé de fabrication pour carte de circuit imprimé
EP3468315A4 (fr) * 2016-06-06 2020-02-19 Ningbo Sunny Opotech Co., Ltd. Carte de circuit imprimé moulée d'un module de caméra, et équipement et procédé de fabrication de ladite carte
US11161291B2 (en) 2016-06-06 2021-11-02 Ningbo Sunny Opotech Co., Ltd. Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board
CN107466159B (zh) * 2016-06-06 2022-07-19 宁波舜宇光电信息有限公司 摄像模组的模塑电路板及其制造设备和制造方法
US11745401B2 (en) 2016-06-06 2023-09-05 Ningbo Sunny Opotech Co., Ltd. Molded circuit board of camera module, manufacturing equipment and manufacturing method for molded circuit board

Also Published As

Publication number Publication date
NL1025302C2 (nl) 2005-07-25

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