WO2005045752A1 - カード装置 - Google Patents
カード装置 Download PDFInfo
- Publication number
- WO2005045752A1 WO2005045752A1 PCT/JP2004/013541 JP2004013541W WO2005045752A1 WO 2005045752 A1 WO2005045752 A1 WO 2005045752A1 JP 2004013541 W JP2004013541 W JP 2004013541W WO 2005045752 A1 WO2005045752 A1 WO 2005045752A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- circuit board
- main body
- card
- card case
- case main
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
- G06K19/07735—Physical layout of the record carrier the record carrier comprising means for protecting against electrostatic discharge
Definitions
- the present invention relates to a card device such as a PC card and a CF card.
- CF Compact Flash
- CF Compact Flash
- Fig. 10a is a simplified perspective view showing an example of the external appearance of a card device
- Fig. 10b is a schematic exploded view of the card device shown in Fig. 10a.
- the card device 40 has a circuit board 41, which is fitted in a frame 42.
- a front panel 43 is disposed on the front side of the frame 42 in which the circuit board 41 is fitted, and a rear panel 44 is disposed on the back side of the frame 42. , Covered by a front panel 43 and a back panel 44.
- the frame 42, the front panel 43, and the back panel 44 are connected and integrated.
- Patent Document 1 Japanese Patent Application Laid-Open No. 2001-243436
- the two panels 43 and 44 respectively disposed on the front and back of the frame 42 are formed of metal such as stainless steel, for example, so that the price is high and the low cost of the card device 40 is low. There is a problem that hinders the dagger.
- the card device 40 is used by being inserted and fitted into a card mounting portion of an electronic device such as a personal computer, for example, and is inserted and fitted into the card mounting portion as one of the card devices 40.
- an electronic device such as a personal computer
- the card mounting portion is inserted and fitted into the card mounting portion as one of the card devices 40.
- extend type which has a card attachment portion that protrudes out (etaste portion).
- An object of the present invention is to provide a card device of the extended type that can be easily reduced in cost and resistant to external stress.
- One configuration of the present invention includes a circuit board housing portion having a single-sided opening for housing a circuit board, A card case main body having an extended portion formed by extending the circuit board housing portion, and a cover for covering the circuit board housed in the card case main body on one side opening side. Further, the circuit board housing portion and the extend portion are formed as an integrally formed body made of the same resin material, and the cover is made of metal.
- a card case main body portion having a circuit board housing portion having a single-sided opening for housing a circuit board, and an extend portion formed by extending the force of the circuit board housing portion.
- the card case main body is configured to have a circuit board housing portion and a flat plate portion serving as a base of the extend portion, and the surface of the extend portion constituting portion of the flat plate portion is covered with an extend portion cover,
- a force bar composed of a metal force covering the circuit board housed in the circuit board housing portion is arranged, and the card case main body is made of a resin material. It is characterized by being composed of
- the card case body having a single-sided opening for accommodating the circuit board is made of a resin material, and the card case body has The cover that covers the housed circuit board is made of metal.
- the amount of metal plates used can be reduced, and resin materials are less expensive than metal plates.
- the material cost required for manufacturing the card device can be reduced.
- the stained-type card device has an eta-stained portion, so it is difficult to reduce the material cost and the cost of the card device is not easy to reduce, as compared with a card device without an extended portion. By providing the card device, even an extended-type card device can be easily manufactured at low cost.
- the card case main body is formed of the circuit board housing portion and the extend portion as a body, the card case main body portion is different from the structure in which the circuit board housing portion and the extend portion are separate bodies. Therefore, the strength against bending deformation can be increased. Furthermore, even if the card case main body for housing the circuit board is made of a resin material, the card case main body is housed in the card case main body. Since the cover that covers the placed circuit board is made of metal, it is possible to suppress a decrease in mechanical strength of the extend-type card device.
- the card case main body is an integrally formed body having a flat plate portion and an edge frame formed by making the edge portion of the flat plate portion thick, and the cover is formed in a flat plate shape.
- the card case main body is inevitably considered in consideration of the thickness of the circuit board and the height of the components mounted on the circuit board.
- the thickness of the portion of the cover facing the circuit board surface is extremely thin. This thin-walled component tends to dent toward the circuit board, and cracks and the like tend to occur due to the dent deformation.
- the portion of the card case main body or the cover facing the circuit board surface is in close contact or close proximity to the tallest component among the components provided on the facing circuit board surface.
- the card case main body made of a resin material has a thin portion as described above, some resin materials cannot be used as a product when the card case main body is manufactured. Large warpage occurred and it was easy. On the other hand, by making the resin material forming the card case main body an amorphous resin, the warping of the card case main body can be suppressed to be small.
- the boundary portion between the edge frame portion of the flat plate portion of the card case main body portion and the thin portion other than the edge frame portion of the flat plate portion continuously increases in thickness toward the edge frame portion thin portion.
- the effect of strengthening the strength of the boundary can be obtained. This is because For such reasons.
- a resin material in a molten state is poured into a cavity inside a mold for molding a card case main body using a molding force for manufacturing the card case main body using a molding technique, the injected resin is used.
- the fat material flows, for example, through the cavity portion corresponding to the thick edge frame portion, and then flows into the cavity portion corresponding to the thin portion of the flat plate portion.
- the metal mold cavity corresponding to the boundary portion has a key portion.
- the magnitude of the activity will change discontinuously. For this reason, when the resin material flowing through the cavity portion corresponding to the thick edge frame portion enters the cavity portion corresponding to the thin portion, a large pressure is suddenly applied to the resin material. Due to this rapid pressure change, the adhesion between the resin material and the mold is deteriorated at the boundary between the edge frame portion and the thin-walled portion, and defects such as shininess are likely to appear on the appearance. In addition, when stress is applied to the card, the force is concentrated and the boundary portion is easily broken, which is a disadvantage.
- the thickness is continuously reduced from the edge frame portion to the thin portion.
- the magnitude of the cavity changes continuously in the mold cavity corresponding to the boundary.
- the resin material flowing through the cavity portion corresponding to the thicker frame portion enters the cavity portion corresponding to the thinner portion, it is possible to reduce a sudden change in the pressure applied to the resin material. it can.
- the adhesion between the resin material and the mold is improved, so that the shine disappears, and the strength of the boundary between the edge frame portion and the thin portion can be enhanced.
- the gas vent pin having the gas vent hole is inserted into the metal case. Set in the mold. Then, as the resin material in the cavity inside the mold progresses, the air or gas in the cavity of the mold is discharged to the outside through the gas vent hole of the gas vent pin. And other problems can be prevented.
- traces of the gas release pins are left on the card case main body.
- the label of the flat plate is used.
- the trace of the gas vent pin is attached to the label attaching area of the flat plate portion. Since the trace can be hidden by the label, it is possible to prevent the appearance from being deteriorated.
- a gas vent groove is formed at each boundary between the plurality of blocks constituting the mold. Then, in the molding process of the card case main body, a manufacturing method is used in which a resin material is injected into the mold while sucking air or gas inside the mold. By molding the card case body by such a manufacturing method, a mold parting line appears at a position corresponding to the mold division position on the card case body, but it is caused by air and gas inside the mold. It is possible to avoid problems such as burned gas.
- one side of the card case body and the cover is provided with an assembly hook portion, and the other side is provided with a hook receiving portion for hooking and fixing the hook portion.
- FIG. 1 is a model diagram showing a plan view of the card device of the first embodiment.
- FIG. Lb is a model diagram schematically showing a cross section of the ⁇ - ⁇ portion shown in FIG. La.
- FIG. 2 is an exploded view of the card device of the first embodiment.
- FIG. 3a is a view for explaining a configuration example of a card case main body constituting the card device of the first embodiment.
- FIG. 3b is a view, together with FIG. 3a, for explaining a configuration example of a card case main body.
- FIG. 4 is a schematic cross-sectional view for explaining a configuration example for electrically connecting an antenna to a circuit on a circuit board.
- FIG. 5 is a perspective view schematically showing the power supply terminal shown in FIG. 4 extracted therefrom.
- FIG. 6 is a view for explaining a card device of a second embodiment.
- FIG. 7 is an exploded view of the card device of the second embodiment.
- FIG. 8a is a model diagram showing an example of a form of a characteristic component in the card device of the third embodiment.
- FIG. 8b is a model diagram showing another example of the characteristic components of the card device of the third embodiment.
- FIG. 9 is a model diagram for explaining a fourth embodiment.
- FIG. 10a is an external view for explaining a conventional example of a card device.
- FIG. 10b is an exploded view of the card device shown in FIG. 10a.
- FIG. La shows a schematic plan view of the card device of the first embodiment
- FIG. Lb shows a schematic sectional view of the ⁇ - ⁇ portion shown in FIG. La
- FIG. 2 is a schematic exploded view of the card device of the first embodiment.
- the card device 1 of the first embodiment has a single-sided opening (see FIG. 2, an opening on the back side), a cover 3 for closing the opening of the card case main body 2, a circuit board 5 housed and arranged in the card case main body 2, and a card case main body. It has an antenna 7 that is rotatably arranged outside the part 2 and is formed on a circuit board 5 and is electrically connected to a circuit 6 and has a wireless communication function. You.
- the card device 1 is used by being fitted and inserted into a card mounting portion of an electronic device such as a personal computer, for example. When the card device 1 is fitted and inserted into a card mounting portion of an electronic device, the card device 1 is used.
- Card-mounting unit power An extended-type card device having an extended portion E that protrudes.
- the card case main body 2 accommodates and arranges the circuit board 5, and the circuit board accommodating portion M and the extend portion E extended from the circuit board accommodating portion M are provided. It is an integral molded body made of the same resin material.
- the card case body 2 includes a flat plate portion 11 serving as a base of the circuit board housing portion M and the extended portion E, and an edge frame portion 10 formed by thickening an edge portion of the flat plate portion 11. It has a form to have.
- the circuit board 5 is provided with a connector 8 for connecting a circuit 6 formed on the circuit board 5 to the outside, and the edge frame 10 of the card case main body 2 is provided with the connector 8 The part corresponding to the position is opened!
- the thickness D of the circuit board housing portion M of the card device 1 is determined by a standard. Considering the thickness of the circuit board 5 and the height of the components 4 mounted on the circuit board 5, a thin portion T (i.e., Inevitably, the thickness of the opposing portion is extremely thin, for example, about 0.5 mm. Further, the thin portion T of the flat plate portion 11 has a wide area which is almost the same as the circuit board 5. As described above, when the card case body 2 having the thin portion T having a large area is made of a crystalline resin such as PBT (Polybutylene-terephthalate), warpage and other distortions occur. It could not be used as
- the present inventor tried molding the card case main body 2 for various resin materials, and found an appropriate resin material for the card case main body 2. That is, in the first embodiment, the card case main body 2 is made of an amorphous material that can suppress warpage or the like. It is composed of fat. Examples of the amorphous resin include polycarbonate and ABS resin. In addition, the card case main body 2 may be manufactured using an amorphous resin having a higher mechanical strength by mixing glass fiber with such an amorphous resin. Producing the card case main body 2 with such an amorphous resin is particularly effective when the thickness d of the thin portion T of the flat plate portion 11 is in the range of 0.15 mm ⁇ d ⁇ 0.7 mm.
- the thickness d of the thin portion T of the flat plate portion 11 is 0.7 mm or less, it is difficult to suppress warpage and the like with resin materials other than amorphous resin, and 0.15 mm is a manufacturing limit. is there. Therefore, when the thickness d of the thin portion T of the flat plate portion 11 is within the range of 0.15 mm ⁇ d ⁇ 0.7 mm, the card case main body 2 is warped by being made of amorphous resin. In particular, the effect of being able to suppress the occurrence of a small amount is exhibited.
- a label is attached to the surface of the flat plate portion 11 (in other words, the surface opposite to the surface facing the circuit board 5), for example, in the hatched portion Zm in FIG. I have.
- the card case main body 2 is manufactured by a resin molding technique. For this reason, the card case body 2 has a problem that weld lines, gas burns, pinholes, etc., which are caused by resin molding, are likely to be generated, resulting in a poor appearance and a decrease in mechanical strength. Occurs.
- the following measures are taken.
- the focus is on the label affixing area Zm of the flat plate portion 11, and the partial force at which the probability of occurrence of well line gas scorching, pinholes, and the like increases is located in the label affixing area Zm.
- the position of the mold gate for manufacturing the card case main body 2 is designed.
- the gate is an injection port for injecting a molten resin material into the cavity inside the mold for molding the card case body.
- the position of the gate can predict the traveling path of the resin material injected into the cavity inside the mold from the gate, so that by adjusting the position of the gate, the weld line, gas burn, etc. can be predicted. The generation position can be almost adjusted.
- the molding die of the card case body 2 constituting the card device of the first embodiment is provided at a plurality of positions corresponding to the G portions of the card case body 2 as shown in FIG. Each has a gate.
- FIG. 3a shows the card case body 2 as viewed from below shown in FIG. It is the typical top view.
- the card case main body 2 has a label affixing area as shown in the model diagram of Fig. 3b.
- a clear weld line W that can be visually recognized can be located at Zm. Since the edge line W is hidden by the label, the appearance can be avoided.
- the mechanical strength of the label application area Zm is slightly reduced due to the formation of the weld line W, the label application area Zm is reinforced by the application of the label, and thus the label application area Zm is formed by the formation of the weld line W. The strength deterioration of Zm can be covered.
- the label affixing area Zm of the flat plate portion 11 of the card case main body 2 is provided in the gas vent hole of the gas vent pin provided in the card case main body forming die. It has a communicating surface part P.
- the mold is equipped with a gas vent pin with a gas vent hole for discharging the air or gas at that position to the outside.
- the surface portion P in the label attaching region Zm of the flat plate portion 11 of the card case main body 2 is a portion connected to the gas vent hole of the gas vent pin, and the surface portion P has a trace of the gas vent pin. Is left.
- the cover 3 is a plate-like member made of a metal plate such as stainless steel, for example.
- the cover 3 is attached to the outer wall surface of the side wall of the card case body 2 (that is, the edge frame 10).
- Extension walls 3a and 3b are formed to extend along. The distal end of each of the extension walls 3a and 3b is bent to form a hook F.
- the card case main body 2 is provided with a hook receiving portion 9 for hooking and fixing the hook portion F.
- an adhesive or the like is applied to an edge portion (for example, a hatched portion Za shown in FIG. 2) of the bottom surface force cover 3 of the edge frame portion 10 of the card case main body portion 2.
- the hook part F of the cover 3 is hooked and fixed to the hook receiving part 9 of the card case main body 2 while being bonded by an adhesive material such as a double-sided tape, so that the card case main body 2 and the cover 3 are assembled. Can stand.
- the circuit board 5 is a single-sided mounting type in which the component 4 is provided only on the front side of the front side and the back side, and the back side of the circuit board 5 has a double-sided tape or an adhesive on the cover 3.
- the cover 3 is fixed to the cover 3 by a force fixed by an adhesive material such as, or by thermocompression bonding.
- the circuit 6 formed on the circuit board 5 includes a high-frequency circuit portion through which a high-frequency current flows, and the high-frequency circuit is provided by the shield case 4 (4H). They are covered.
- the tallest component having the largest area is the shield case 4 (4H).
- the thin portion T (the portion facing the circuit board surface) of the flat plate portion 11 of the card case main body 2 is, for example, as shown in the sectional view of FIG. Lb, in close contact with or close to the shield case 4 (4H).
- the largest area is the shield case 4 (4H)
- the shield case 4 (4H) has a high degree of design freedom. Therefore, in the first embodiment, the height of the shield case 4 (4H) is set so that the shield case 4 (4H) can be placed in close contact with or close to the thin portion T of the flat plate portion 11 of the force case body 2. Is designed.
- the thin portion T of the flat plate portion 11 is in close contact with the shield case 4 (4H)! / Is arranged close to the thin portion T, which has a large area. Even if it does, the dent deformation of the thin portion T is prevented by the shield case 4 (4H). Thereby, the occurrence of breakage of the thin portion T due to the dent deformation can be suppressed.
- the antenna 7 is made of, for example, a resin material (eg, amorphous resin).
- the antenna 7 is provided with a protective case 7a, which is housed and disposed inside the protective case 7a to transmit and receive radio waves.
- An antenna rotating shaft 12 made of a conductive material electrically connected to the antenna main body is provided on the base end side of the antenna 7.
- FIG. 4 schematically shows a cross-sectional view taken along the line AA of FIG. This is shown in Figure 4.
- the through-hole 13 for inserting the antenna rotating shaft is formed in the edge frame 10 of the card case main body 2.
- the through hole 13 is for inserting the antenna rotating shaft 12 from the outside to the inside of the card case main body 2 in a direction along the board surface of the circuit board 5.
- the through-hole 13 has a fitting portion 13A through which the antenna rotating shaft 12 is inserted with almost no gap, and a diameter-enlarging portion 13B larger in diameter than the fitting portion 13A. And the enlarged diameter portion 13B are sequentially arranged from the inside to the outside of the card case body 2 in the direction of the force.
- a projecting portion 12A that fits into the enlarged diameter portion 13B of the through hole 13 is formed.
- the washer 14 contacts the step D in the through-hole 13
- the washer 14 contacts the O-ring 15, and the O-ring 15 contacts the protrusion 12 A of the antenna rotating shaft 12. The locking stops the insertion of the antenna rotating shaft 12.
- a washer 17 is passed through the antenna rotation shaft 12 with respect to the internal force of the card case main body 2 and an E-ring 16 is attached.
- the E-ring 16 is engaged with the opening edge of the through hole 13 via the washer 17 to prevent the antenna rotating shaft 12 from coming off.
- the through holes 13, washers 14, 17, O-ring 15, and E-ring 16 allow the antenna rotating shaft 12 to be attached to the card case body 2 in a rotatable state.
- the O-ring 15 and the overhanging portion 12A of the antenna rotating shaft 12 hold the rotation adjustment position of the antenna 7 by the frictional force generated at the contact portion between the O-ring 15 and the overhanging portion 12A.
- the antenna rotation position holding means is configured.
- the frictional force between the overhanging portion 12A of the antenna rotation shaft 12 and the O-ring 15 does not prevent the antenna 7 from rotating smoothly, and can maintain the rotation adjustment position of the antenna 7.
- the surface of the O-ring 15 is coated with a lubricating material to adjust the frictional force.
- a washer 14 is interposed between the step D in the through-hole 13 and the O-ring 15, and the opening edge of the through-hole 13 (the inner side wall of the edge frame 10) and the E-ring
- a washer 17 is interposed between the washer 16.
- An antenna rotating shaft support 18 is provided on the inner wall surface of the card case main body 2 at a position where the tip of the antenna rotating shaft 12 is arranged.
- the antenna rotating shaft supporting portion 18 has a form in which a hole 18b for inserting the antenna rotating shaft is provided on a plate-shaped projecting piece 18a in which the inner wall surface force of the card case main body 2 is also formed. I have.
- the tip of the antenna rotating shaft 12 is inserted into the hole 18b of the antenna rotating shaft support portion 18, so that the antenna rotating shaft 12 is rotatably supported on the card case main body 2 while floating from the circuit board 5. It is a configuration that can be done.
- the antenna rotating shaft portion disposed between the portion of the edge frame portion 10 provided with the through hole 13 and the antenna rotating shaft support portion 18 and the circuit board 5 facing the antenna rotating shaft portion
- a power supply terminal 20 made of a conductive material is interposed therebetween.
- the power supply terminal 20 has, for example, a form as shown in the perspective view of FIG. 5 and has elasticity for applying a biasing force to the antenna rotation shaft 12.
- the portion where the power supply terminal 20 is provided (in other words, the portion where the antenna rotation axis 12 faces) is used as an antenna connection portion of the circuit 6 provided on the circuit board 5.
- a functioning antenna connection land (not shown) is provided.
- the power supply terminal 20 is joined to the antenna connection land by, for example, solder, and is electrically connected to the circuit 6 of the circuit board 5 and fixed to the circuit board 5.
- the circuit board 5 is fixed to the cover 3 as described above, and the antenna rotation shaft 12 is attached to the card case body 2.
- the feed terminal 20 fixed to the circuit board 5 is connected to the antenna rotation axis 12. It is configured to make pressure contact.
- a general-purpose component called an earth terminal / ground terminal.
- the power supply terminal 20 may be designed and manufactured as a component dedicated to the card device, and may be incorporated in the card device 1, but the general-purpose component may be employed as the power supply terminal 20.
- the power supply terminal 20 is fixed to the circuit board 5 and electrically connected to the circuit 6 of the circuit board 5 at the same position. A portion that is in contact with and connected to the circuit board and a portion that is connected to the circuit 6 of the circuit board 5 are vertically arranged. For this reason, the power supply terminal 20 can easily reduce the area occupied by the power supply terminal 20 in the card device 1 as compared with a power supply terminal having a configuration in which an antenna rotation axis connection portion and a circuit connection portion are arranged side by side. Become.
- the power supply terminal 20 is fixed to the antenna connection land of the circuit 6 of the circuit board 5 by a bonding material such as solder, for example, current flows between the antenna 7 and the circuit 6 of the circuit board 5 In the signal conduction path, there can be only one contact connection between the conductors at the contact connection between the power supply terminal 20 and the antenna rotating shaft 12.
- the contact connection portion between the conductors can be reduced in the signal conduction path, it is possible to suppress the occurrence of a conduction failure due to the contact connection and an increase in signal loss.
- the reliability of the electrical connection (signal connection) between the antenna 7 and the circuit 6 of the circuit board 5 can be improved, and the reliability of the wireless communication performance of the card device 1 can be improved.
- the antenna rotation position holding means uses a force that utilizes the O-ring 15.
- a wave washer is provided to The moving position holding means may be configured to hold the rotation adjustment position of the antenna 7 by using a frictional force between the wave washer and the protruding portion 12A of the antenna rotating shaft 12.
- the antenna rotation position holding means may be configured to use a spring.
- the mechanism for holding the rotation adjustment position of the antenna 7 has various components S, and any of the configurations may be adopted as the antenna rotation position holding means.
- the antenna rotating shaft support 18 is provided with only one force.
- a plurality of antenna rotating shaft supports 18 are provided at intervals from each other.
- the antenna rotation shaft 12 inserted into the antenna rotation shaft 12 may be supported at a plurality of positions by the plurality of antenna rotation shaft support portions 18.
- the above-described configuration example is shown as an example of a configuration for electrically connecting the antenna rotation axis 12 of the antenna 7 and the circuit 6 of the circuit board 5.
- the antenna rotation axis 12 of the antenna 7 and the circuit 6 of the circuit board 5 may be electrically connected by another configuration.
- FIG. 6 is a schematic plan view of the card device according to the second embodiment when viewed from four directions, ie, the front side, the back side, the side surface, and the end surface side.
- FIG. 7 is a schematic exploded view of the card device of the second embodiment. Note that the card device 1 of the second embodiment also has a wireless communication function similarly to the first embodiment, and is provided with an antenna 7 similar to that of the first embodiment. 6 and FIG. 7, illustration of the antenna 7 is omitted.
- the card device 1 of the second embodiment is also an extend-type card device 1 having an extend portion E, similarly to the card device 1 of the first embodiment, and is a force case for housing and arranging the circuit board 5. It has a main body 2.
- the card case main body 2 is made of the same resin material (amorphous resin) in which the circuit board accommodating portion M and the extend portion E extended from the circuit board accommodating portion M are the same. ).
- the card case main body 2 includes a flat plate portion 11 serving as a base of the circuit board housing portion M and the extended portion E, and an edge frame portion 10 formed by thickening an edge portion of the flat plate portion 11. It has become.
- the edge frame portion 10 has a mode in which a portion where the connector 8 of the circuit board 5 is disposed is opened.
- the circuit board 5 is accommodated and arranged in the card case main body 2 with the front side facing the flat plate portion 11, whereas in the second embodiment, the circuit board 5 is provided. 5 is accommodated and arranged in the card case main body 2 with the back side facing the flat plate portion 11.
- the circuit board 5 is a single-sided mounting type in which the components 4 are arranged only on the front surface side. Secured to part T. Since the thin portion T of the flat plate portion 11 is made of a resin material, the mechanical strength of the thin portion T of the flat plate portion 11 is inferior to that of the metal portion, but the circuit board 5 is thinner than the thin portion T of the flat plate portion 11. Due to the fixation, it is hardly deformed by external stress.
- the surface of the portion forming the extended portion E in the flat plate portion 11 of the card case main body 2 is formed of, for example, an extensible material such as a resin material (eg, amorphous resin).
- the portion of the flat plate portion 11 that constitutes the circuit board housing portion M is covered with a plate-shaped cover 3 made of metal such as stainless steel.
- the cover 3 is provided with a hook portion F
- the edge frame portion 10 of the card case main body portion 2 is provided with a hook receiving portion 9 for hooking and fixing the hook portion F.
- the cover 3 can be combined with the card case body 2 by hooking and fixing the hook portion F of the cover 3 to the hook receiving portion 9 of the card case body 2.
- the card case body 2 is provided with a hook portion f at the extended portion E, and a hook receiving portion (see FIG. (Not shown).
- the hook portion f of the card case main body 2 is hooked and fixed to the hook receiving portion of the extend portion cover 22 so that the extend portion cover 22 can be attached to the card case main body 2.
- the cover 3 facing the surface of the circuit board 5 on which the components 4 are arranged is the tallest and the widest among the components 4 arranged on the surface of the circuit board 5 Area of sea It is placed in close contact with or close to the case 4 (4H) or thermocompression-bonded. Thereby, the dent deformation of the cover 3 toward the circuit board 5 can be prevented, and the strength of the card device 1 is improved.
- a label is attached to the thin portion T of the flat plate portion 11 and the surface (rear surface) opposite to the surface facing the substrate surface of the circuit board 5.
- the thin portion T (the portion facing the substrate surface of the circuit board 5) of the flat plate portion 11 of the card case main body 2 is formed by degassing pins provided in a mold for molding the card case main body.
- a configuration may be provided in which a portion communicating with the perforation is provided, and a trace of the gas release pin is left in the portion.
- the molding die for manufacturing the card case main body 2 includes a gas at a portion corresponding to the thin portion T of the flat plate portion 11. A punching pin is provided, so that gas burn of the card case main body 2 can be avoided, so that the configuration can be made!
- the border portion between the edge frame portion 10 of the flat plate portion 11 constituting the card case main body portion 2 and the thin portion T other than the edge frame portion 10 of the flat plate portion 11 has an edge portion.
- the thickness is continuously reduced from the frame portion 10 toward the thin portion T, and the inclined surface C as shown in the sectional view of FIG. 8a or the curved surface R as shown in the sectional view of FIG. 8b. Has formed.
- the configuration other than this configuration is the same as the configuration of the first embodiment or the second embodiment.
- the thin portion T of the flat plate portion 11 constituting the card case main body 2 is shown on the side facing the substrate surface of the circuit board 5, for example, in the plan view of FIG. As shown, a plurality of dividing lines 25 due to the mold appear.
- the card case main body 2 is manufactured using a mold that can be divided into a plurality of blocks, Appears along the split position of the mold! / ⁇ .
- the mold for molding the card case main body is provided with a gas release pin, whereby the card case main body 2 is configured to prevent the air inside the mold or the air inside the mold. Problems such as gas burning caused by gas were avoided.
- a groove force for degassing formed in the divided portion of the mold, and a method in which air or gas inside the mold is sucked and exhausted is used to remove the gas inside the mold.
- the card case body 2 is manufactured by injecting a fat material. For this reason, the force at which the dividing line 25 appears along the dividing position of the mold in the card case body 2 is also caused by the air and gas inside the mold. It should be possible to avoid problems such as burned gas.
- a plurality of split lines 25 caused by the split type mold are provided.
- the number of the split lines 25 depends on the number of split molds. However, the number is not limited.
- the dividing line 25 may be extended in a curved shape.
- the present invention is not limited to the embodiments of the first to fourth embodiments, but may employ various embodiments.
- the card device 1 has the wireless communication function and has the antenna 7, but the present invention does not have the wireless communication function and does not have the antenna. It can also be applied to type card devices
- the circuit board 5 is a single-sided mounting type in which the component 4 is mounted only on the front surface side.
- a circuit board 5 of a double-sided mounting type in which the component 4 is mounted on each of the front and back surfaces may be provided.
- the thin portion T of the flat plate portion 11 of the card case main body 2 and the cover 3 are in close contact with the tallest component 4 among the components provided on the opposing circuit board surface. With this configuration, the thin portion T of the flat plate portion 11 and the dent deformation of the cover 13 toward the circuit board 5 can be prevented.
- the present invention provides an ETA that can achieve a low cost while preventing a decrease in mechanical strength. Since a stain type card device can be provided, it is suitable for application to, for example, an extended type card device to be mass-produced.
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2005515236A JP3901208B2 (ja) | 2003-11-06 | 2004-09-16 | カード装置 |
TW093130215A TW200527310A (en) | 2003-11-06 | 2004-10-06 | Card unit |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003377187 | 2003-11-06 | ||
JP2003-377187 | 2003-11-06 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2005045752A1 true WO2005045752A1 (ja) | 2005-05-19 |
Family
ID=34567135
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2004/013541 WO2005045752A1 (ja) | 2003-11-06 | 2004-09-16 | カード装置 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP3901208B2 (ja) |
TW (1) | TW200527310A (ja) |
WO (1) | WO2005045752A1 (ja) |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0638130U (ja) * | 1992-10-28 | 1994-05-20 | クラリオン株式会社 | 押し釦装置 |
JPH06320892A (ja) * | 1993-05-15 | 1994-11-22 | Nec Corp | 情報カード及びその製造方法 |
JPH1095031A (ja) * | 1996-09-24 | 1998-04-14 | Dainippon Printing Co Ltd | 情報カードの成形金型及び成形方法並びに情報カード |
JPH11175680A (ja) * | 1997-12-11 | 1999-07-02 | Japan Aviation Electron Ind Ltd | Icカードのグラウンド接続構造 |
JP2000149847A (ja) * | 1998-11-06 | 2000-05-30 | Jeol Ltd | 試料ステージ |
JP2002314264A (ja) * | 2001-04-16 | 2002-10-25 | Denso Corp | 電子部品の収容ケース |
JP2002344172A (ja) * | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 無線端末装置 |
JP2003108969A (ja) * | 2001-09-29 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
-
2004
- 2004-09-16 WO PCT/JP2004/013541 patent/WO2005045752A1/ja active Application Filing
- 2004-09-16 JP JP2005515236A patent/JP3901208B2/ja not_active Expired - Fee Related
- 2004-10-06 TW TW093130215A patent/TW200527310A/zh not_active IP Right Cessation
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0638130U (ja) * | 1992-10-28 | 1994-05-20 | クラリオン株式会社 | 押し釦装置 |
JPH06320892A (ja) * | 1993-05-15 | 1994-11-22 | Nec Corp | 情報カード及びその製造方法 |
JPH1095031A (ja) * | 1996-09-24 | 1998-04-14 | Dainippon Printing Co Ltd | 情報カードの成形金型及び成形方法並びに情報カード |
JPH11175680A (ja) * | 1997-12-11 | 1999-07-02 | Japan Aviation Electron Ind Ltd | Icカードのグラウンド接続構造 |
JP2000149847A (ja) * | 1998-11-06 | 2000-05-30 | Jeol Ltd | 試料ステージ |
JP2002314264A (ja) * | 2001-04-16 | 2002-10-25 | Denso Corp | 電子部品の収容ケース |
JP2002344172A (ja) * | 2001-05-16 | 2002-11-29 | Matsushita Electric Ind Co Ltd | 無線端末装置 |
JP2003108969A (ja) * | 2001-09-29 | 2003-04-11 | Toshiba Corp | カード型電子機器 |
Also Published As
Publication number | Publication date |
---|---|
JP3901208B2 (ja) | 2007-04-04 |
TWI296391B (ja) | 2008-05-01 |
TW200527310A (en) | 2005-08-16 |
JPWO2005045752A1 (ja) | 2007-05-24 |
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