WO2005017057A1 - Solventless, non-polluting radiation and thermally curable coatings - Google Patents

Solventless, non-polluting radiation and thermally curable coatings Download PDF

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Publication number
WO2005017057A1
WO2005017057A1 PCT/US2004/025176 US2004025176W WO2005017057A1 WO 2005017057 A1 WO2005017057 A1 WO 2005017057A1 US 2004025176 W US2004025176 W US 2004025176W WO 2005017057 A1 WO2005017057 A1 WO 2005017057A1
Authority
WO
WIPO (PCT)
Prior art keywords
weight
parts
catalyst solution
iodonium
salt
Prior art date
Application number
PCT/US2004/025176
Other languages
English (en)
French (fr)
Inventor
Ramkrishna Ghoshal
Original Assignee
Polyset Company, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyset Company, Inc. filed Critical Polyset Company, Inc.
Priority to AU2004264507A priority Critical patent/AU2004264507A1/en
Priority to EP20040780077 priority patent/EP1651731B1/en
Priority to DE200460003395 priority patent/DE602004003395T2/de
Publication of WO2005017057A1 publication Critical patent/WO2005017057A1/en

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025—Crosslinking or vulcanising agents; including accelerators
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31525—Next to glass or quartz
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y10T428/31529—Next to metal
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609—Particulate metal or metal compound-containing
    • Y10T428/31612—As silicone, silane or siloxane
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31652—Of asbestos
    • Y10T428/31663—As siloxane, silicone or silane
PCT/US2004/025176 2003-08-07 2004-08-05 Solventless, non-polluting radiation and thermally curable coatings WO2005017057A1 (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
AU2004264507A AU2004264507A1 (en) 2003-08-07 2004-08-05 Solventless, non-polluting radiation and thermally curable coatings
EP20040780077 EP1651731B1 (en) 2003-08-07 2004-08-05 Solventless, non-polluting radiation or thermally curable coatings
DE200460003395 DE602004003395T2 (de) 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/636,101 US6962948B2 (en) 2003-08-07 2003-08-07 Solventless, non-polluting radiation and thermal curable coatings
US10/636,101 2003-08-07

Publications (1)

Publication Number Publication Date
WO2005017057A1 true WO2005017057A1 (en) 2005-02-24

Family

ID=34193557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2004/025176 WO2005017057A1 (en) 2003-08-07 2004-08-05 Solventless, non-polluting radiation and thermally curable coatings

Country Status (6)

Country Link
US (2) US6962948B2 (US20050170187A1-20050804-C00022.png)
EP (1) EP1651731B1 (US20050170187A1-20050804-C00022.png)
AT (1) ATE346124T1 (US20050170187A1-20050804-C00022.png)
AU (1) AU2004264507A1 (US20050170187A1-20050804-C00022.png)
DE (1) DE602004003395T2 (US20050170187A1-20050804-C00022.png)
WO (1) WO2005017057A1 (US20050170187A1-20050804-C00022.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017222816A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Curable resin composition
TWI707008B (zh) * 2017-12-19 2020-10-11 美商羅門哈斯電子材料有限公司 可固化組合物及用於在可撓性基板上形成可固化塗料的方法

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JP2005008691A (ja) * 2003-06-17 2005-01-13 Konica Minolta Medical & Graphic Inc 活性エネルギー線硬化型インクジェットインク及び印刷物
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
JP2006124636A (ja) * 2004-06-28 2006-05-18 Konica Minolta Medical & Graphic Inc 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4986423B2 (ja) * 2005-08-03 2012-07-25 日東電工株式会社 剥離処理基材及びその製造方法
ES2527101T3 (es) * 2005-08-12 2015-01-20 Markem-Imaje Corporation Formulaciones de tintas catiónicas
US8048981B2 (en) * 2005-09-20 2011-11-01 General Electric Company Thermally curable compositions and method
FR2912605B1 (fr) * 2007-02-16 2011-07-15 Xeda International Combinaisons d'esters de l'acide abietique avec un ou plusieurs terpenes et leur utilisation pour l'enrobage des fruits et legumes
JP5325206B2 (ja) * 2008-03-24 2013-10-23 昭和電工株式会社 エポキシ化合物およびその製造方法
US20090294724A1 (en) * 2008-05-27 2009-12-03 Appealing Products, Inc. Anti-icing material and surface treatments
JP5793491B2 (ja) * 2010-03-02 2015-10-14 サンスター技研株式会社 硬化性組成物
US8629688B2 (en) * 2010-09-29 2014-01-14 International Business Machines Corporation Method for sulfur-based corrosion testing
TWI557183B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
KR101339772B1 (ko) * 2011-02-28 2014-02-05 한국과학기술원 광경화 투명 수지 조성물
EP2699623B1 (de) 2011-04-18 2019-12-18 Momentive Performance Materials GmbH Funktionalisierte polyorganosiloxane oder silane zur behandlung von lignocellulosischen werkstoffen
MY169938A (en) * 2012-08-31 2019-06-18 Daicel Corp Curable composition, cured product thereof, optical member and optical device
EP3112389B1 (en) * 2014-02-28 2019-06-05 Daicel Corporation Curable composition, cured product thereof, and wafer level lens
CN106687499B (zh) * 2014-09-17 2019-07-19 株式会社大赛璐 固化性组合物、以及使用其的光学元件
CN107709400B (zh) * 2015-06-17 2020-05-12 株式会社大赛璐 固化性组合物
TWI557177B (zh) 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
MX2020001733A (es) 2017-08-18 2020-03-20 Fina Technology Polifarnesenos epoxidizados y metodos para producirlos.
CN114181581A (zh) * 2021-12-27 2022-03-15 深圳市法鑫忠信新材料有限公司 一种高硬度的涂料组合物及其制备方法
CN117285706A (zh) * 2022-06-24 2023-12-26 常州正洁智造科技有限公司 阳离子型光固化组合物、涂料、具有光固化涂层的制品、油墨

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US5073643A (en) * 1990-08-30 1991-12-17 Polyset Corporation High yield synthesis of hydroxyl-containing cationic photoinitiators
WO1998033645A1 (en) * 1997-02-04 1998-08-06 Polyset Company, Inc. Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin
US20020193619A1 (en) * 2002-06-21 2002-12-19 Polyset Company, Inc. Diaryliodonium salt catalysts made from iodotoluene and a method for preparing them

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US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
US7019386B2 (en) * 2004-04-27 2006-03-28 Polyset Company, Inc. Siloxane epoxy polymers for low-k dielectric applications

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US5073643A (en) * 1990-08-30 1991-12-17 Polyset Corporation High yield synthesis of hydroxyl-containing cationic photoinitiators
WO1998033645A1 (en) * 1997-02-04 1998-08-06 Polyset Company, Inc. Die adhesive or encapsulant of epoxy siloxane and polyepoxy resin
US20020193619A1 (en) * 2002-06-21 2002-12-19 Polyset Company, Inc. Diaryliodonium salt catalysts made from iodotoluene and a method for preparing them

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CRIVELLO J V ET AL: "THE UV CURE OF EPOXY-SILICONE MONOMERS", POLYMERIC MATERIALS SCIENCE AND ENGINEERING, WASHINGTON, DC, US, vol. 60, 1989, pages 217 - 227, XP009035836, ISSN: 0743-0515 *

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017222816A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Curable resin composition
TWI677477B (zh) * 2016-06-24 2019-11-21 美商羅門哈斯電子材料有限公司 可固化樹脂組合物
KR102057469B1 (ko) * 2016-06-24 2019-12-19 다우 글로벌 테크놀로지스 엘엘씨 경화성 수지 조성물
TWI707008B (zh) * 2017-12-19 2020-10-11 美商羅門哈斯電子材料有限公司 可固化組合物及用於在可撓性基板上形成可固化塗料的方法

Also Published As

Publication number Publication date
US7285579B2 (en) 2007-10-23
US6962948B2 (en) 2005-11-08
EP1651731A1 (en) 2006-05-03
AU2004264507A1 (en) 2005-02-24
DE602004003395D1 (de) 2007-01-04
DE602004003395T2 (de) 2007-09-13
EP1651731B1 (en) 2006-11-22
ATE346124T1 (de) 2006-12-15
US20050042458A1 (en) 2005-02-24
US20050170187A1 (en) 2005-08-04

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