ATE346124T1 - Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe - Google Patents

Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Info

Publication number
ATE346124T1
ATE346124T1 AT04780077T AT04780077T ATE346124T1 AT E346124 T1 ATE346124 T1 AT E346124T1 AT 04780077 T AT04780077 T AT 04780077T AT 04780077 T AT04780077 T AT 04780077T AT E346124 T1 ATE346124 T1 AT E346124T1
Authority
AT
Austria
Prior art keywords
free
voc
solvent
compositions
coating compositions
Prior art date
Application number
AT04780077T
Other languages
English (en)
Inventor
Ramkrishna Ghoshal
Original Assignee
Polyset Comp Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Polyset Comp Inc filed Critical Polyset Comp Inc
Application granted granted Critical
Publication of ATE346124T1 publication Critical patent/ATE346124T1/de

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D163/00Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/30Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
    • C08G59/306Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3254Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/38Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04Polysiloxanes
    • C09D183/06Polysiloxanes containing silicon bound to oxygen-containing groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31525Next to glass or quartz
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether
    • Y10T428/31529Next to metal
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31551Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
    • Y10T428/31609Particulate metal or metal compound-containing
    • Y10T428/31612As silicone, silane or siloxane
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31652Of asbestos
    • Y10T428/31663As siloxane, silicone or silane

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Wood Science & Technology (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Paints Or Removers (AREA)
  • Epoxy Resins (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Laminated Bodies (AREA)
AT04780077T 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe ATE346124T1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/636,101 US6962948B2 (en) 2003-08-07 2003-08-07 Solventless, non-polluting radiation and thermal curable coatings

Publications (1)

Publication Number Publication Date
ATE346124T1 true ATE346124T1 (de) 2006-12-15

Family

ID=34193557

Family Applications (1)

Application Number Title Priority Date Filing Date
AT04780077T ATE346124T1 (de) 2003-08-07 2004-08-05 Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe

Country Status (6)

Country Link
US (2) US6962948B2 (de)
EP (1) EP1651731B1 (de)
AT (1) ATE346124T1 (de)
AU (1) AU2004264507A1 (de)
DE (1) DE602004003395T2 (de)
WO (1) WO2005017057A1 (de)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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JP2005008691A (ja) * 2003-06-17 2005-01-13 Konica Minolta Medical & Graphic Inc 活性エネルギー線硬化型インクジェットインク及び印刷物
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
JP2006124636A (ja) * 2004-06-28 2006-05-18 Konica Minolta Medical & Graphic Inc 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置
US7288607B2 (en) * 2004-10-12 2007-10-30 E. I. Du Pont De Nemours & Co. High solids primer composition based on epoxy ring opening curing reaction
JP4986423B2 (ja) * 2005-08-03 2012-07-25 日東電工株式会社 剥離処理基材及びその製造方法
US20070035604A1 (en) * 2005-08-12 2007-02-15 Jang James M Cationic ink formulations
US8048981B2 (en) * 2005-09-20 2011-11-01 General Electric Company Thermally curable compositions and method
FR2912605B1 (fr) * 2007-02-16 2011-07-15 Xeda International Combinaisons d'esters de l'acide abietique avec un ou plusieurs terpenes et leur utilisation pour l'enrobage des fruits et legumes
CN101977919B (zh) * 2008-03-24 2014-04-23 昭和电工株式会社 环氧化合物及其制造方法
US20090294724A1 (en) * 2008-05-27 2009-12-03 Appealing Products, Inc. Anti-icing material and surface treatments
WO2011108415A1 (ja) * 2010-03-02 2011-09-09 サンスター技研株式会社 硬化性組成物
US8629688B2 (en) * 2010-09-29 2014-01-14 International Business Machines Corporation Method for sulfur-based corrosion testing
TWI557183B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 矽氧烷組成物、以及包含其之光電裝置
KR101339772B1 (ko) * 2011-02-28 2014-02-05 한국과학기술원 광경화 투명 수지 조성물
CN103764725B (zh) * 2011-04-18 2017-03-01 迈图高新材料有限责任公司 用于处理木质纤维素材料的官能化的聚有机硅氧烷或硅烷
MY169938A (en) * 2012-08-31 2019-06-18 Daicel Corp Curable composition, cured product thereof, optical member and optical device
JP6491637B2 (ja) * 2014-02-28 2019-03-27 株式会社ダイセル 硬化性組成物及びその硬化物、並びにウェハレベルレンズ
CN106687499B (zh) * 2014-09-17 2019-07-19 株式会社大赛璐 固化性组合物、以及使用其的光学元件
CN107709400B (zh) * 2015-06-17 2020-05-12 株式会社大赛璐 固化性组合物
TWI557177B (zh) * 2015-12-16 2016-11-11 財團法人工業技術研究院 低介電無溶劑型樹脂組成物及基板結構
US20170369654A1 (en) * 2016-06-24 2017-12-28 Dow Global Technologies Llc Curable resin composition
EP3668907B1 (de) 2017-08-18 2023-02-15 Fina Technology, Inc. Epoxidiertes polyfarnesen und verfahren zur herstellung davon
US10858541B2 (en) * 2017-12-19 2020-12-08 Rohm And Haas Electronic Materials Llc Curable composition
US12559628B2 (en) 2020-09-25 2026-02-24 Dow Silicones Corporation Curable silicone composition and cured product thereof
TWI883256B (zh) * 2020-09-29 2025-05-11 美商陶氏有機矽公司 可固化聚矽氧組成物及其固化產物
CN114181581A (zh) * 2021-12-27 2022-03-15 深圳市法鑫忠信新材料有限公司 一种高硬度的涂料组合物及其制备方法
US12302491B2 (en) 2022-03-31 2025-05-13 University Of Massachusetts Electrical system with hook-and-loop busbars
CN117285706A (zh) * 2022-06-24 2023-12-26 常州正洁智造科技有限公司 阳离子型光固化组合物、涂料、具有光固化涂层的制品、油墨
TW202523726A (zh) * 2023-12-05 2025-06-16 美商陶氏有機矽公司 環氧官能化聚矽氧烷組成物

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US5073643A (en) 1990-08-30 1991-12-17 Polyset Corporation High yield synthesis of hydroxyl-containing cationic photoinitiators
US5260349A (en) 1991-01-04 1993-11-09 Polyset Corporation Electron beam curable epoxy compositions
EP0652245B2 (de) 1993-11-05 2005-02-09 Shin-Etsu Chemical Co., Ltd. Verfahren zur Herstellung von Organo-funktionelle Gruppen enthaltenden Organopolysiloxanen und daraus hergestellte Organopolysiloxane, Mercapto- und Alkoxygruppen enthaltende Organopolysiloxane und Verfahren zu deren Herstellung
US5757313A (en) 1993-11-09 1998-05-26 Markem Corporation Lacer-induced transfer printing medium and method
US5863970A (en) 1995-12-06 1999-01-26 Polyset Company, Inc. Epoxy resin composition with cycloaliphatic epoxy-functional siloxane
US6069259A (en) 1998-02-06 2000-05-30 Rensselaer Polytechnic Institute Multifunctional polymerizible alkoxy siloxane oligomers
US6602602B1 (en) * 1999-04-26 2003-08-05 Renssealer Polytechnic Institute Epoxy-functional polymeric microbeads
US6632960B2 (en) 2002-06-21 2003-10-14 Goldschmidt Ag Diaryliodonium salt catalysts made from iodotoluene and a method for preparing them
US6832036B2 (en) * 2002-10-11 2004-12-14 Polyset Company, Inc. Siloxane optical waveguides
US6962948B2 (en) * 2003-08-07 2005-11-08 Polyset Company, Inc. Solventless, non-polluting radiation and thermal curable coatings
US7019386B2 (en) * 2004-04-27 2006-03-28 Polyset Company, Inc. Siloxane epoxy polymers for low-k dielectric applications

Also Published As

Publication number Publication date
EP1651731A1 (de) 2006-05-03
DE602004003395T2 (de) 2007-09-13
EP1651731B1 (de) 2006-11-22
US20050042458A1 (en) 2005-02-24
AU2004264507A1 (en) 2005-02-24
WO2005017057A1 (en) 2005-02-24
US7285579B2 (en) 2007-10-23
US6962948B2 (en) 2005-11-08
US20050170187A1 (en) 2005-08-04
DE602004003395D1 (de) 2007-01-04

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