ATE346124T1 - Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe - Google Patents
Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffeInfo
- Publication number
- ATE346124T1 ATE346124T1 AT04780077T AT04780077T ATE346124T1 AT E346124 T1 ATE346124 T1 AT E346124T1 AT 04780077 T AT04780077 T AT 04780077T AT 04780077 T AT04780077 T AT 04780077T AT E346124 T1 ATE346124 T1 AT E346124T1
- Authority
- AT
- Austria
- Prior art keywords
- free
- voc
- solvent
- compositions
- coating compositions
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D163/00—Coating compositions based on epoxy resins; Coating compositions based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/30—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen
- C08G59/306—Di-epoxy compounds containing atoms other than carbon, hydrogen, oxygen and nitrogen containing silicon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/3254—Epoxy compounds containing three or more epoxy groups containing atoms other than carbon, hydrogen, oxygen or nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/32—Epoxy compounds containing three or more epoxy groups
- C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/06—Polysiloxanes containing silicon bound to oxygen-containing groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31525—Next to glass or quartz
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31529—Next to metal
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31551—Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
- Y10T428/31609—Particulate metal or metal compound-containing
- Y10T428/31612—As silicone, silane or siloxane
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31652—Of asbestos
- Y10T428/31663—As siloxane, silicone or silane
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Wood Science & Technology (AREA)
- Materials Engineering (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Paints Or Removers (AREA)
- Epoxy Resins (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/636,101 US6962948B2 (en) | 2003-08-07 | 2003-08-07 | Solventless, non-polluting radiation and thermal curable coatings |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| ATE346124T1 true ATE346124T1 (de) | 2006-12-15 |
Family
ID=34193557
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AT04780077T ATE346124T1 (de) | 2003-08-07 | 2004-08-05 | Lösungsmittelfreie, voc-freie strahlungs- oder wärmehärtbare beschichtungsstoffe |
Country Status (6)
| Country | Link |
|---|---|
| US (2) | US6962948B2 (de) |
| EP (1) | EP1651731B1 (de) |
| AT (1) | ATE346124T1 (de) |
| AU (1) | AU2004264507A1 (de) |
| DE (1) | DE602004003395T2 (de) |
| WO (1) | WO2005017057A1 (de) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005008691A (ja) * | 2003-06-17 | 2005-01-13 | Konica Minolta Medical & Graphic Inc | 活性エネルギー線硬化型インクジェットインク及び印刷物 |
| US6962948B2 (en) * | 2003-08-07 | 2005-11-08 | Polyset Company, Inc. | Solventless, non-polluting radiation and thermal curable coatings |
| JP2006124636A (ja) * | 2004-06-28 | 2006-05-18 | Konica Minolta Medical & Graphic Inc | 活性光線硬化型組成物、活性光線硬化型インクジェットインク、該活性光線硬化型インクジェットインクを用いた画像形成方法及びインクジェット記録装置 |
| US7288607B2 (en) * | 2004-10-12 | 2007-10-30 | E. I. Du Pont De Nemours & Co. | High solids primer composition based on epoxy ring opening curing reaction |
| JP4986423B2 (ja) * | 2005-08-03 | 2012-07-25 | 日東電工株式会社 | 剥離処理基材及びその製造方法 |
| US20070035604A1 (en) * | 2005-08-12 | 2007-02-15 | Jang James M | Cationic ink formulations |
| US8048981B2 (en) * | 2005-09-20 | 2011-11-01 | General Electric Company | Thermally curable compositions and method |
| FR2912605B1 (fr) * | 2007-02-16 | 2011-07-15 | Xeda International | Combinaisons d'esters de l'acide abietique avec un ou plusieurs terpenes et leur utilisation pour l'enrobage des fruits et legumes |
| CN101977919B (zh) * | 2008-03-24 | 2014-04-23 | 昭和电工株式会社 | 环氧化合物及其制造方法 |
| US20090294724A1 (en) * | 2008-05-27 | 2009-12-03 | Appealing Products, Inc. | Anti-icing material and surface treatments |
| WO2011108415A1 (ja) * | 2010-03-02 | 2011-09-09 | サンスター技研株式会社 | 硬化性組成物 |
| US8629688B2 (en) * | 2010-09-29 | 2014-01-14 | International Business Machines Corporation | Method for sulfur-based corrosion testing |
| TWI557183B (zh) * | 2015-12-16 | 2016-11-11 | 財團法人工業技術研究院 | 矽氧烷組成物、以及包含其之光電裝置 |
| KR101339772B1 (ko) * | 2011-02-28 | 2014-02-05 | 한국과학기술원 | 광경화 투명 수지 조성물 |
| CN103764725B (zh) * | 2011-04-18 | 2017-03-01 | 迈图高新材料有限责任公司 | 用于处理木质纤维素材料的官能化的聚有机硅氧烷或硅烷 |
| MY169938A (en) * | 2012-08-31 | 2019-06-18 | Daicel Corp | Curable composition, cured product thereof, optical member and optical device |
| JP6491637B2 (ja) * | 2014-02-28 | 2019-03-27 | 株式会社ダイセル | 硬化性組成物及びその硬化物、並びにウェハレベルレンズ |
| CN106687499B (zh) * | 2014-09-17 | 2019-07-19 | 株式会社大赛璐 | 固化性组合物、以及使用其的光学元件 |
| CN107709400B (zh) * | 2015-06-17 | 2020-05-12 | 株式会社大赛璐 | 固化性组合物 |
| TWI557177B (zh) * | 2015-12-16 | 2016-11-11 | 財團法人工業技術研究院 | 低介電無溶劑型樹脂組成物及基板結構 |
| US20170369654A1 (en) * | 2016-06-24 | 2017-12-28 | Dow Global Technologies Llc | Curable resin composition |
| EP3668907B1 (de) | 2017-08-18 | 2023-02-15 | Fina Technology, Inc. | Epoxidiertes polyfarnesen und verfahren zur herstellung davon |
| US10858541B2 (en) * | 2017-12-19 | 2020-12-08 | Rohm And Haas Electronic Materials Llc | Curable composition |
| US12559628B2 (en) | 2020-09-25 | 2026-02-24 | Dow Silicones Corporation | Curable silicone composition and cured product thereof |
| TWI883256B (zh) * | 2020-09-29 | 2025-05-11 | 美商陶氏有機矽公司 | 可固化聚矽氧組成物及其固化產物 |
| CN114181581A (zh) * | 2021-12-27 | 2022-03-15 | 深圳市法鑫忠信新材料有限公司 | 一种高硬度的涂料组合物及其制备方法 |
| US12302491B2 (en) | 2022-03-31 | 2025-05-13 | University Of Massachusetts | Electrical system with hook-and-loop busbars |
| CN117285706A (zh) * | 2022-06-24 | 2023-12-26 | 常州正洁智造科技有限公司 | 阳离子型光固化组合物、涂料、具有光固化涂层的制品、油墨 |
| TW202523726A (zh) * | 2023-12-05 | 2025-06-16 | 美商陶氏有機矽公司 | 環氧官能化聚矽氧烷組成物 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5073643A (en) | 1990-08-30 | 1991-12-17 | Polyset Corporation | High yield synthesis of hydroxyl-containing cationic photoinitiators |
| US5260349A (en) | 1991-01-04 | 1993-11-09 | Polyset Corporation | Electron beam curable epoxy compositions |
| EP0652245B2 (de) | 1993-11-05 | 2005-02-09 | Shin-Etsu Chemical Co., Ltd. | Verfahren zur Herstellung von Organo-funktionelle Gruppen enthaltenden Organopolysiloxanen und daraus hergestellte Organopolysiloxane, Mercapto- und Alkoxygruppen enthaltende Organopolysiloxane und Verfahren zu deren Herstellung |
| US5757313A (en) | 1993-11-09 | 1998-05-26 | Markem Corporation | Lacer-induced transfer printing medium and method |
| US5863970A (en) | 1995-12-06 | 1999-01-26 | Polyset Company, Inc. | Epoxy resin composition with cycloaliphatic epoxy-functional siloxane |
| US6069259A (en) | 1998-02-06 | 2000-05-30 | Rensselaer Polytechnic Institute | Multifunctional polymerizible alkoxy siloxane oligomers |
| US6602602B1 (en) * | 1999-04-26 | 2003-08-05 | Renssealer Polytechnic Institute | Epoxy-functional polymeric microbeads |
| US6632960B2 (en) | 2002-06-21 | 2003-10-14 | Goldschmidt Ag | Diaryliodonium salt catalysts made from iodotoluene and a method for preparing them |
| US6832036B2 (en) * | 2002-10-11 | 2004-12-14 | Polyset Company, Inc. | Siloxane optical waveguides |
| US6962948B2 (en) * | 2003-08-07 | 2005-11-08 | Polyset Company, Inc. | Solventless, non-polluting radiation and thermal curable coatings |
| US7019386B2 (en) * | 2004-04-27 | 2006-03-28 | Polyset Company, Inc. | Siloxane epoxy polymers for low-k dielectric applications |
-
2003
- 2003-08-07 US US10/636,101 patent/US6962948B2/en not_active Expired - Lifetime
-
2004
- 2004-08-05 AU AU2004264507A patent/AU2004264507A1/en not_active Abandoned
- 2004-08-05 WO PCT/US2004/025176 patent/WO2005017057A1/en not_active Ceased
- 2004-08-05 AT AT04780077T patent/ATE346124T1/de not_active IP Right Cessation
- 2004-08-05 DE DE200460003395 patent/DE602004003395T2/de not_active Expired - Fee Related
- 2004-08-05 EP EP20040780077 patent/EP1651731B1/de not_active Expired - Lifetime
-
2005
- 2005-03-15 US US11/079,971 patent/US7285579B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| EP1651731A1 (de) | 2006-05-03 |
| DE602004003395T2 (de) | 2007-09-13 |
| EP1651731B1 (de) | 2006-11-22 |
| US20050042458A1 (en) | 2005-02-24 |
| AU2004264507A1 (en) | 2005-02-24 |
| WO2005017057A1 (en) | 2005-02-24 |
| US7285579B2 (en) | 2007-10-23 |
| US6962948B2 (en) | 2005-11-08 |
| US20050170187A1 (en) | 2005-08-04 |
| DE602004003395D1 (de) | 2007-01-04 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| UEP | Publication of translation of european patent specification |
Ref document number: 1651731 Country of ref document: EP |
|
| REN | Ceased due to non-payment of the annual fee |