WO2005012384A8 - 変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント - Google Patents

変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント

Info

Publication number
WO2005012384A8
WO2005012384A8 PCT/JP2004/009439 JP2004009439W WO2005012384A8 WO 2005012384 A8 WO2005012384 A8 WO 2005012384A8 JP 2004009439 W JP2004009439 W JP 2004009439W WO 2005012384 A8 WO2005012384 A8 WO 2005012384A8
Authority
WO
WIPO (PCT)
Prior art keywords
photosensitive
modified epoxy
production
epoxy resin
resin compositions
Prior art date
Application number
PCT/JP2004/009439
Other languages
English (en)
French (fr)
Other versions
WO2005012384A1 (ja
Inventor
Shuuichi Itagaki
Katsunori Tsuchiya
Tetsuya Yoshida
Katsusige Tsukada
Original Assignee
Hitachi Chemical Co Ltd
Shuuichi Itagaki
Katsunori Tsuchiya
Tetsuya Yoshida
Katsusige Tsukada
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Shuuichi Itagaki, Katsunori Tsuchiya, Tetsuya Yoshida, Katsusige Tsukada filed Critical Hitachi Chemical Co Ltd
Priority to US10/566,474 priority Critical patent/US20070185287A1/en
Priority to KR1020077018981A priority patent/KR100876252B1/ko
Publication of WO2005012384A1 publication Critical patent/WO2005012384A1/ja
Publication of WO2005012384A8 publication Critical patent/WO2005012384A8/ja

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/14—Polycondensates modified by chemical after-treatment
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/32—Liquid compositions therefor, e.g. developers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)

Abstract

　下記一般式（１）； 【化１】 〔式中、Ｒ１はジグリシジルエーテル型エポキシ化合物残基である二価の有機基を示し、Ｒ２は二塩基酸残基である二価の有機基を示し、Ｒ３は水素原子或いは下記一般式（２）； 【化２】 （式中、Ｒ４は酸無水物残基を示す。） で表される基を示し、ｎは１以上の整数を示す。〕 で表される繰り返し単位を有する変性エポキシ樹脂。
PCT/JP2004/009439 2003-07-31 2004-07-02 変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント WO2005012384A1 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US10/566,474 US20070185287A1 (en) 2003-07-31 2004-07-02 Modified epoxy resin, process for its production, photosensitive resin composition and photsensitive element
KR1020077018981A KR100876252B1 (ko) 2003-07-31 2004-07-02 변성 에폭시 수지, 그 제조방법, 감광성 수지 조성물 및감광성 엘리먼트

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2003284424 2003-07-31
JP2003-284424 2003-07-31
JP2004-071349 2004-03-12
JP2004071349A JP2005060662A (ja) 2003-07-31 2004-03-12 変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント

Publications (2)

Publication Number Publication Date
WO2005012384A1 WO2005012384A1 (ja) 2005-02-10
WO2005012384A8 true WO2005012384A8 (ja) 2006-01-26

Family

ID=34117928

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/009439 WO2005012384A1 (ja) 2003-07-31 2004-07-02 変性エポキシ樹脂、その製造方法、感光性樹脂組成物及び感光性エレメント

Country Status (5)

Country Link
US (1) US20070185287A1 (ja)
JP (1) JP2005060662A (ja)
KR (2) KR100876252B1 (ja)
TW (1) TW200504460A (ja)
WO (1) WO2005012384A1 (ja)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7670752B2 (en) 2005-08-03 2010-03-02 Toagosei Co., Ltd. Photosensitive resin composition, composition for solder resist, and photosensitive dry film
JP4910610B2 (ja) * 2005-10-04 2012-04-04 日立化成工業株式会社 感光性樹脂組成物及び感光性フィルム
JP2007131833A (ja) * 2005-10-13 2007-05-31 Hitachi Chem Co Ltd 変性エポキシ樹脂及びその製造方法、並びに、感光性樹脂組成物及びこれを用いた感光性エレメント
WO2007119699A1 (ja) * 2006-04-18 2007-10-25 Hitachi Chemical Company, Ltd. 感光性樹脂組成物及びこれを用いた感光性エレメント
JP4874767B2 (ja) * 2006-11-09 2012-02-15 富士フイルム株式会社 感光性組成物、感光性フィルム、永久パターン形成方法、及びプリント基板
WO2012050777A1 (en) * 2010-09-30 2012-04-19 Dow Global Technologies Llc Advanced poly epoxy ester resin compositions
TWI448544B (zh) * 2011-04-26 2014-08-11 Ind Tech Res Inst 耐燃劑與耐燃材料
KR101293062B1 (ko) * 2011-12-06 2013-08-05 공선정 변성수지의 제조방법, 상기 방법으로 제조된 변성수지, 상기 변성수지를 포함하는 광경화성 감광성 유연수지조성물 및 상기 조성물로 인쇄된 솔더 레지스트를 포함하는 유연성전자회로기판
JP5360285B2 (ja) * 2012-01-26 2013-12-04 東レ株式会社 感光性導電ペースト
CN104364999B (zh) * 2012-06-15 2016-12-07 三菱电机株式会社 旋转电机定子线圈绝缘用液体状热固化性树脂组合物、使用了其的旋转电机及其制造方法
ITUB20156845A1 (it) * 2015-12-11 2017-06-11 Sav Holding S P A Procedimento di imballaggio in film sottile di sostanze appiccicose allo stato fuso
US11851603B2 (en) * 2018-11-07 2023-12-26 Dow Silicones Corporation Thermally conductive composition and methods and devices in which said composition is used
JP7195228B2 (ja) * 2019-07-08 2022-12-23 日本化薬株式会社 ディスプレイ用封止剤
US11970575B2 (en) * 2020-10-05 2024-04-30 Alliance For Sustainable Energy, Llc Bioderived recyclable epoxy-anhydride thermosetting polymers and resins

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3936973A1 (de) * 1989-03-11 1991-05-08 Hoechst Ag Haertbare, pulverfoermige mischungen
DE4309196A1 (de) * 1993-03-22 1994-09-29 Hoechst Ag Härtbare, pulverförmige Mischungen
JP4967212B2 (ja) * 2001-09-27 2012-07-04 住友化学株式会社 樹脂組成物
JP2003195486A (ja) * 2001-12-27 2003-07-09 Showa Denko Kk 感光性組成物およびその硬化物ならびにそれを用いたプリント配線基板
JP4035420B2 (ja) * 2002-03-25 2008-01-23 大阪瓦斯株式会社 ビニルエステル系樹脂

Also Published As

Publication number Publication date
TW200504460A (en) 2005-02-01
KR100876252B1 (ko) 2008-12-26
KR20070100897A (ko) 2007-10-12
US20070185287A1 (en) 2007-08-09
JP2005060662A (ja) 2005-03-10
WO2005012384A1 (ja) 2005-02-10
KR20060052897A (ko) 2006-05-19

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