WO2005003196A1 - ポジ型レジスト組成物用樹脂、およびこれを用いたポジ型レジスト組成物、積層体並びにレジストパターンの形成方法 - Google Patents
ポジ型レジスト組成物用樹脂、およびこれを用いたポジ型レジスト組成物、積層体並びにレジストパターンの形成方法 Download PDFInfo
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- WO2005003196A1 WO2005003196A1 PCT/JP2004/009875 JP2004009875W WO2005003196A1 WO 2005003196 A1 WO2005003196 A1 WO 2005003196A1 JP 2004009875 W JP2004009875 W JP 2004009875W WO 2005003196 A1 WO2005003196 A1 WO 2005003196A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/02—Monomers containing only one unsaturated aliphatic radical
- C08F212/04—Monomers containing only one unsaturated aliphatic radical containing one ring
- C08F212/14—Monomers containing only one unsaturated aliphatic radical containing one ring substituted by heteroatoms or groups containing heteroatoms
- C08F212/22—Oxygen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/36—Sulfur-, selenium-, or tellurium-containing compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
- G03F7/0392—Macromolecular compounds which are photodegradable, e.g. positive electron resists the macromolecular compound being present in a chemically amplified positive photoresist composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/12—Nitrogen compound containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/122—Sulfur compound containing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S430/00—Radiation imagery chemistry: process, composition, or product thereof
- Y10S430/1053—Imaging affecting physical property or radiation sensitive material, or producing nonplanar or printing surface - process, composition, or product: radiation sensitive composition or product or process of making binder containing
- Y10S430/1055—Radiation sensitive composition or product or process of making
- Y10S430/114—Initiator containing
- Y10S430/126—Halogen compound containing
Definitions
- TECHNICAL FIELD Resin for a positive resist composition for a positive resist composition, and a positive resist composition, a laminate and a method for forming a resist pattern using the same
- Chemically amplified positive resist compositions contain a resin component whose alkali solubility increases by the action of acidification, and an acid generator that generates an acid upon exposure. (See Patent Documents below:! ⁇ 2).
- a step of laminating a magnetic film on a substrate, providing a resist layer thereon, and forming a resist pattern is performed.
- a metal antioxidant film for preventing the oxidation of the magnetic film is laminated on the magnetic layer, if necessary, and a resist layer is formed thereon.
- the magnetic film is made of a material whose main component is at least one of iron, cobalt, and nickel.
- the oxidation barrier layer, the main component, tantalum, etc. consist of one or more of aluminum oxide (A 1 2 o 3) is used.
- a 1 2 o 3 aluminum oxide
- a conventional positive resist composition when a resist layer is formed on a magnetic film or further on the metallic anti-oxidation film provided thereon, a magnetic film or an oxide film of a resist pattern is formed.
- the so-called tailing phenomenon occurs in the vicinity of the interface with the anti-reflective film, and conversely, the so-called digging phenomenon, in which the area near the interface with the magnetic film or antioxidant film of the pattern becomes thinner and bites into the inside of the pattern. In some cases, a good-shaped pattern could not be obtained.
- Patent Document 3 Patent Document 3
- a first object of the present invention is to provide a positive resist composition capable of improving resolution and obtaining a resist pattern having a good shape.
- a second object of the present invention is to provide a positive resist composition for forming a resist layer which is provided directly or indirectly on a magnetic film, and which provides a good pattern shape. That is.
- a resin for a positive photoresist composition a first positive photoresist composition, a first laminate, and A first resist pattern forming method is proposed.
- the resin for the first positive resist composition of the present invention has the following general formula (I)
- R represents an H or a CH 3
- X is an alkyl group having a tertiary carbon atom, the tertiary carbon atom is bonded to an ester group (-CO-0-) Which represents an acid dissociable, dissolution inhibiting group.
- R and R 1 each independently represent 1 H or 1 CH 3 , R 2 represents 1 CH 3 or —C 2 H 5 , and R 3 represents a lower alkyl group.
- the first positive resist composition of the present invention comprises a luster component (A) comprising a luster for the positive resist composition of the present invention, and an acid generator (B) which generates an acid upon exposure.
- the first laminate of the present invention is provided with a resist layer made of the positive resist composition of the present invention on a substrate.
- the first method for forming a resist pattern according to the present invention includes: (1) providing a resist layer comprising the positive resist composition of the present invention on a substrate; (2) selectively exposing the resist layer to light; (3) a step of performing post-exposure heating on the resist layer that has been subjected to the selective exposure, and (4) a step of performing all-out development on the resist layer that has been subjected to the post-exposure heating. Have.
- the following means are provided: a second positive photoresist composition, a second laminate, and a second resist pattern forming method. Suggest.
- the second positive resist composition of the present invention comprises a substrate and a magnetic film provided on the substrate, or a metal antioxidant film provided on the magnetic film. And a chemically amplified positive resist composition for forming a resist layer, wherein the structural unit (a1) is represented by the general formula (I) and the structural unit (a1) is represented by the general formula (II) A resin component ( ⁇ ') having a structural unit (a 2), whose alkali solubility is increased by the action of an acid;
- the laminate of the present invention comprises a substrate, a magnetic film provided on the substrate, or the magnetic film and a metal antioxidant film provided thereon, and the present invention provided thereon. And a resist layer comprising the second positive resist composition.
- the second method of forming a resist pattern according to the present invention includes the following steps: (1) forming a substrate and a magnetic film provided on the substrate or a metal antioxidant film provided on the magnetic film; A step of providing a resist layer comprising the positive resist composition of the present invention, (2) a step of selectively exposing the resist layer, and (3) a resist having the selective exposure. Performing a post-exposure heating on the layer, (4) performing an alkali development on the resist layer that has been subjected to the post-exposure heating, (5) performing a rinsing after performing the alkali development, And
- the “structural unit” refers to a monomer unit constituting a polymer.
- the resolution of a positive photoresist composition can be improved, and a resist pattern having a good shape can be obtained.
- a resist pattern having a good pattern shape can be formed on a resist layer provided directly or indirectly on a magnetic film.
- the resin for a positive resist composition of the present invention has the structural units (a1) to (a4).
- the resin has an increased alkali solubility due to the action of an acid. That is, due to the action of the acid generated from the acid generator upon exposure, the structural unit (a 2) and the structural unit (a 3) are cleaved, thereby being initially insoluble in the alkaline developer. , The alkali solubility of the resin increases.
- the structural unit (a 1) is represented by the general formula (I).
- R is not particularly limited as long as it is 1 H or 1 CH 3 .
- the bonding position of one OH to the benzene ring is not particularly limited, but the position 4 described in the formula is preferable.
- Structural units (a 1) is in the positive resist composition for a resin, 4 0-8 0 mole 0/0, preferably 5 0-7 5 mol%.
- the structural unit (a 2) is represented by the general formula (II).
- R is not particularly limited as long as it is 1 H or 1 CH 3 .
- X is an alkyl group having a tertiary carbon atom, and is an acid dissociable, dissolution inhibiting group in which the tertiary carbon atom is bonded to an ester group.
- the acid dissociable, dissolution inhibiting group dissociates (a 2) due to the action of the acid, converting the structural unit (a 2) into a (meth) acrylic acid unit As a result, it has the effect of improving the solubility of the component (A) in an alkali developing solution.
- (meth) acrylic acid unit is a general term for a unit of methacrylic acid and a unit of acrylic acid.
- Such an acid dissociable, dissolution inhibiting group, ie, X can be arbitrarily used, for example, from those used in chemically amplified positive resist compositions.
- X an acid dissociable, dissolution inhibiting group
- structural unit (a2) for example, those described in the following general formula (VII) can be mentioned.
- R has the same meaning as described above, and R 11 R 12 and R 13 are each independently a lower alkyl group, and may be either a linear or branched chain, and preferably has 1 to 5 carbon atoms. It is. Alternatively, two of these may combine to form a monocyclic or polycyclic alicyclic group (the alicyclic group preferably has 5 to 12 carbon atoms).
- polycyclic alicyclic groups preferred are, for example, those represented by the following general formulas (VII1) and (IX).
- R 14 is a lower alkyl group, and may be either a straight chain or a branched chain, and preferably has 1 to 5 carbon atoms.
- R has the same meaning as described above, and R 15 and R 16 each independently represent a lower alkyl group.
- the structural unit (a 2) is contained in the resin for a positive resist composition in an amount of 5 to 30 mol%, preferably 10 to 20 mol%.
- the structural unit (a 3) is represented by the general formula (I I I).
- the lower alkyl group for R 3 may be either linear or branched, and preferably has 1 to 5 carbon atoms.
- the bonding position of the group bonded to the benzene ring is not particularly limited, but the position 4 shown in the formula is preferable.
- Examples of the group that binds to the benzene ring include 1-methoxyethoxy group, 11-ethoxyethoxy group, 11-n-propoxyethoxy group, 1-isopropoxyethoxy group, 11-n-butoxyethoxy group, and 1-isobutoxyethoxy group.
- Structural units (a 3) is, (A) in component 1 0-5 0 mole 0/0, preferably 2 0-4 0 mole 0 /. It is said.
- the content is 10 mol% or more, the effect of increasing the solubility of the aluminum alloy can be obtained, and a good resist pattern can be obtained.
- the content is 50 mol% or less, the balance with other structural units can be improved. Can be taken.
- the structural unit (a4) is represented by the general formula (IV).
- the lower alkyl group for R 4 may be either linear or branched, and preferably has 1 to 5 carbon atoms.
- n 0 or an integer of 1 to 3, and is preferably 0.
- the structural unit (a 4) is in component (A) from 1 to 35 mole 0/0, and preferably from 5-20 moles 0/0.
- the content is 1 mol% or more, the effect of improving the shape (especially, the reduction in film thickness to be described later) increases, and when the content is 35 mol% or less, a balance with other structural units can be obtained.
- a copolymer having all of the structural units (al), (a2), (a3), and (a4) may be used.
- a mixture of one or more polymers may be used. Alternatively, these may be combined.
- the component (A) in the positive photoresist composition may include any of the following structural units (a 1), (a 2), (a 3), and (a 4). these configurations proportion of 80 mol% or more, preferably be 90 mol% or more (and most preferably 100 mole 0/0).
- the resin for a positive resist composition comprises: a copolymer (A1) composed of one of the above structural units (a1) and (a3); one structural unit (a1); ) And the copolymer (A2) comprising the above (a4) are most preferred because effects can be easily obtained. It is also preferable in terms of improving heat resistance.
- the mass average molecular weight of the resin for the positive resist composition in terms of polystyrene by GPC (hereinafter abbreviated as mass average molecular weight) is 3,000 to 30,000, preferably 5,000 to 20,000.
- the resin for a positive resist composition can be obtained by polymerizing the material monomers of the structural units by a known method.
- the first positive resist composition of the present invention contains the resin (A) for a positive resist composition of the present invention and an acid generator (B) that generates an acid upon exposure.
- the concentration of component (A) in the first positive resist composition is, for example, 5-6 0 weight 0/0.
- one or more embodiments of the resin for the positive resist composition can be used in combination.
- the component (B) is not particularly limited, and may be used singly or in combination of two or more of those used in a chemically amplified positive resist composition.
- the amount of the component (B) is not particularly limited, but is, for example, in the range of 0.2 to 40 parts by mass with respect to 100 parts by mass of the component (A).
- diazomethane-based acid generators include, for example, bis (isopropylsulfonyl) diazomethane, bis (p-toluenesulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane Methane, bis (2,4-dimethylphenylsulfonyl) diazomethane, bis' (n-propinoresnorenolinole) diazomethane, bis (n-cyclopentinoresolenoyl) diazomethane and the like.
- R 5 and R 6 are each independently a chain, branched or cyclic alkyl having 3 to 7 carbon atoms
- onium salts include diphenyl dimethyl trifluoromethane sulfonate, (4-methoxyphenyl) phenyl dimethyl trifluoromethane sulfonate, and bis (p-tert- phthalinyl phenol).
- Trifrenolefluoromethanesulfonate Trifenynolesnorrenophonylum Trifonole, Tris (4-methoxyphenylene) diphenylenoles / Lehoninium Trifonoleolomethansulfonate, (4-Methylphenyl) ) Diphenylsulfoum nonafluorobutane snorephonate, (p-tert-butynolephenone) diphen-norresnorefonium trifolenormethanose norephonate, diphenylenodenolofluorobutanesnorrenoate Honates, bis (p-tert-butyl phenylene) ® chromatography Denis ⁇ beam nona Full O b pigs Nsuruhoneto, triphenyl sulfonium Niu arm nona Full O Rob Tan sulfonate, and the like.
- ionic salts having a fluorinated alkylsulfonic acid ion as an ion are preferred.
- R 7 , scales 8 and 19 are each independently a hydrogen atom, an alkyl group or an alkoxyl group having 4 carbon atoms, and m is an integer from :! to 10) Are preferred, and triphenylsulfonium trifluoromethanesulfonate is more preferred.
- the components (Bl) and (B2) can be used alone or in combination of two or more.
- Component (B1) is used in 0.1 to 20 parts by mass, preferably 1 to 10 parts by mass, per 100 parts by mass of component (A).
- the amount is 0.1 part by mass or more, the so-called tailing phenomenon described below is particularly improved, and when the amount is 20 parts by mass or less, the balance with the component (B 2) can be achieved.
- the component (B2) is used in an amount of 0.1 to 20 parts by mass, preferably 0.1 to 5 parts by mass, per 100 parts by mass of the component (A).
- amount is 0.1 part by mass or more, it is particularly effective in improving the so-called biting phenomenon described later, and when the amount is 20 parts by mass or less, the balance with the component (B1) can be achieved.
- the first positive resist composition of the present invention can be produced by dissolving the materials in an organic solvent (C).
- any component can be used as long as it can dissolve each component to be used to form a uniform solution.
- any one of known solvents for chemically amplified resists can be used.
- One or more kinds can be appropriately selected and used.
- the amount of the component (C) used is an amount containing 3 to 30% by mass, preferably 5 to 20% by mass of the solid content of the component (A) and the component (B).
- component (C) examples include ketones such as acetone, methyl ethyl ketone, cyclohexanone, methyl isoamyl ketone, and 2-heptanone; ethylene glycol ⁇ /, ethylene glycol monomonoacetate, and diethylene glycol.
- Detylene glycol ⁇ "monoacetate, propylene glycolone, propylene glycolone monoacetate, dipropylene glycol or dipropylene glycol monoacetate monomethineoleatenole, monoethinoleatenole, monopropinoleatee / mono, mono Polyhydric alcohols such as butyl ether or monophenyl ether and their Derivatives, cyclic ethers such as dioxane, and esters such as methyl lactate, ethyl lactate, methinole acetate, ethynole acetate, butynole acetate, methinole pinolevinate, ethynole pinorebinate, methyl methoxypropionate, and ethyl ethoxypropionate And the like.
- These organic solvents may be used alone or as a mixed solvent of two or more.
- the positive resist composition further includes an optional component (D). And a nitrogen-containing organic compound.
- Amines particularly secondary lower aliphatic amines ⁇ tertiary lower aliphatic amines, are preferred. .
- the lower aliphatic amine refers to an alkyl or alkyl alcohol having 5 or less carbon atoms
- examples of the secondary and tertiary amines include trimethylamine, getylamine, triethylamine, and di-n-amine.
- examples thereof include propynoleamine, tri-n-propylamine, tripentylamine, diethanolamine, triethanolamine, and triisopropanolamine, and an alkanolamine such as triethanolamine is particularly preferable.
- an organic carboxylic acid or an organic carboxylic acid as an optional component (E) is further added.
- An oxo acid of phosphorus or a derivative thereof can be contained.
- the component (D) and the component (E) can be used in combination, or one of them can be used.
- organic carboxylic acid for example, malonic acid, citric acid, malic acid, succinic acid, benzoic acid, salicylic acid and the like are suitable.
- Phosphorus oxo acids or derivatives thereof include phosphoric acid such as phosphoric acid, di-n-butyl phosphate, diphenyl phosphate, or derivatives thereof such as phosphonic acid, phosphonic acid, phosphonic acid dimethyl ester, and phosphonic acid Phosphonic acids such as -di-n-butynoleestenole, feninolephosphonic acid, diphenoleestenole phosphonate, dibenzyl phosphonate and derivatives such as those esters, phosphines such as phosphinic acid and phenylphosphinic acid Acids and their derivatives, such as estenole, are mentioned, of which phosphonic acids are particularly preferred.
- the component (E) is used in an amount of 0.01 to 5.0 parts by mass per 100 parts by mass of the component (A).
- the first positive resist composition of the present invention may further contain a miscible additive, for example, an additional resin for improving the performance of the resist film, and a surfactant for improving the coating property.
- a miscible additive for example, an additional resin for improving the performance of the resist film, and a surfactant for improving the coating property.
- a dissolution inhibitor, a plasticizer, a stabilizer, a coloring agent, an antihalation agent, and the like can be appropriately added and contained.
- the first laminate of the present invention has a structure in which a resist layer comprising the first positive resist composition of the present invention is provided on a substrate.
- the first method for forming a resist pattern according to the present invention includes: (1) providing a resist layer comprising the first positive resist composition of the present invention on a substrate; and (2) selectively exposing the resist layer to light. (3) performing post-exposure heating on the selectively exposed resist layer, and (4) performing alkali development on the post-exposure heated resist layer. And a process.
- the component ( ⁇ ′) is a resin component ( ⁇ ′) whose alkali solubility is increased by the action of an acid. That is, the action of the acid generated from the component (B1) and the component () 2) upon exposure causes fragmentation in the structural unit (a2) and the optional structural unit (a3), and as a result, Is insoluble in alkali developer ( ⁇ ') And its alkali solubility increases. As a result, a positive resist pattern can be obtained.
- a copolymer having both the structural units (a1) and (a2) may be used, or a mixture of polymers having one of these units may be used. Les ,. Alternatively, a combination of these may be used.
- the component ( ⁇ ′) is a component capable of arbitrarily containing components other than the structural units (a 1) and (a 2) .
- the structural unit other than the structural units (a 1) and (a 2) is a structural unit (a It is preferable that 3) be composed of the constituent unit (a4).
- (A 5) component as one said structural units (a 1), wherein the (a 3) a force Ranaru co polymer (A1), and a structural unit (a 1), wherein the (a 2),
- the embodiment in which the copolymer (A2) comprising the above (a4) is mixed is most preferable because the effect can be easily obtained. It is also preferable in terms of improving heat resistance by 1 ".
- the mass ratio of the copolymer (A1) to the copolymer (A2) is, for example, 1Z9 to 9/1, preferably 37 to 7/3.
- the mass average molecular weight (hereinafter abbreviated as mass average molecular weight) of the component ( ⁇ ′) in terms of polystyrene by GPC is 3,000 to 30,000, preferably 5,000 to 20,000.
- the component (A,) can be obtained by polymerizing the material monomers of the structural units by a known method.
- the concentration of the ( ⁇ ′) component in the positive resist composition is, for example, 5 to 60 mass. / 0 .
- the component ( ⁇ ′) can be used alone or in combination of two or more embodiments.
- the statements made with respect to the above-mentioned first positive photoresist composition apply as they are.
- the first positive photoresist a composition is of course read as "the second positive photoresist thread composition”.
- the description of the above-mentioned first positive photoresist composition applies as it is.
- the second laminate of the present invention comprises a substrate, a magnetic film provided on the substrate, or the magnetic film and a metal anti-oxidant film provided thereon, and a magnetic film provided thereon. And a resist layer comprising the positive resist composition of the present invention.
- the second method of forming a resist pattern according to the present invention includes the following steps: (1) A metal oxide film provided on a substrate and a magnetic film provided on the substrate, or a metal oxide film provided on the magnetic film. A step of providing a resist layer comprising the positive resist composition of the present invention on the protective film, (2) a step of selectively exposing the resist layer, and (3) a resist having the selective exposure. Heating (PEB) the layer, and (4) heating the layer after the exposure. Performing alkali development on the resulting resist layer.
- the first and second resist pattern forming methods of the present invention will be further described.
- the substrate for example, a silicon substrate or the like is used.
- the thickness of the resist layer is not particularly limited, but is selected in the range of, for example, 0.1 to 0.1 ⁇ , preferably 0.8 to 8 ⁇ according to the intended use.
- the exposure wavelength is not particularly limited, for example, a KrF excimer laser, an ArF excimer laser, an electron beam and the like are used as a light source, and a KrF excimer laser and an electron beam are preferable.
- a KrF excimer laser and an electron beam are preferable.
- an electron beam either exposure through a mask or drawing may be used.
- a resist pattern having a good shape can be obtained.
- a resist pattern having a high rectangular shape for example, a good rectangular shape on the side wall of the resist padder. That is, for example, it is possible to suppress the occurrence of a so-called footing phenomenon, that is, a tapered shape below the resist pattern, and the occurrence of a so-called biting phenomenon, in which the resist pattern bites into the inside of the pattern.
- the developer is usually developed using an aqueous solution, it is also possible to suppress the so-called film-thinning phenomenon in which the upper part of the pattern becomes thin or chipped during the alkaline development.
- the effect of obtaining the shape of the good resist pattern makes it difficult for the pattern to collapse, so that higher resolution can be realized.
- the resist layer includes a substrate, a magnetic film provided on the substrate, or a metal provided on the magnetic film. It can also be provided on an anti-irritating film made of aluminum. For example, such a method is used in forming a magnetic head or the like.
- the metal anti-oxidation film prevents the magnetic film from being oxidized.
- a standing wave generated by light reflected from the substrate during exposure is used. Due to the occurrence, irregularities may be formed on the side wall of the resist pattern.
- the first and second positive photoresist compositions of the present invention are less susceptible to the standing wave, are less likely to form irregularities on the side walls of the pattern, and have a low line edge roughness (concave a on the side walls).
- a small and well-shaped resist pattern can be obtained. In other words, a resist pattern having a good shape can be obtained from this point as well. For example, good effects can be obtained when the main component of the magnetic film is one or more of iron, cobalt, and nickel.
- the main component of the metal oxide barrier layer provided on said magnetic film, tantalum be obtained if the better effects of one or more of aluminum oxide (A 1 2 0 3) it can.
- main component means a component that accounts for, for example, 50% by mass or more, preferably 80% by mass or more.
- the components other than the main components of the magnetic film and the oxidation film can be appropriately selected from known materials for the magnetic film or the metal anti-oxidizing film provided thereon.
- the magnetic film is formed as a layer that directly contacts the substrate. It is preferable that a metal acid-proof film is formed directly on the metal film.
- the thicknesses of the magnetic film and the antioxidant film are not particularly limited, and the same ones as usual can be used.
- a copolymer consisting of the following structural units ( a1 ) and (a3): (A1) (weight average molecular weight: 800) 50 parts by mass, and the following structural units (al), (a2), and (a4) Copolymer
- R is -H
- the group bonded to the benzene ring is an 1-ethoxyshethoxy group
- the bonding position is 4, 35 mol%
- R is —H
- n 0, 10 mol /%
- an antioxidant film whose main component was tantalum was provided on a silicon substrate, and a resist layer was formed and evaluated in the same manner. The same good evaluation was obtained.
- Example 2 Evaluation was performed in the same manner as in Example 1 except that the copolymer (A2) was replaced with a copolymer composed of the following structural units.
- Copolymer (A2) As a structural unit (a 1), 65 mol% of a compound represented by the formula (I) in which:
- the resist pattern had a skirted shape, and a good resist pattern could not be obtained.
- copolymer (A2) weight average, average molecular weight 10000 consisting of the following structural units ( a1 ), (a2) and (a4)
- R is - in H, 25 mol those R 11 ⁇ 13 are a methyl group 0/0
- One component (C) is propylene glycol monomethyl ether acetate
- a sputtered film (magnetic film) made of iron and nickel was formed on a silicon substrate, and a sputtered film (anti-oxidation film) made of Ta was formed thereon.
- the positive resist composition was applied thereon, and heated at 100 ° C. for 90 seconds to form a resist layer having a thickness of 800 nm.
- Example 2 The following materials were mixed and dissolved to produce a positive resist composition. The same evaluation as in Example 2 was performed. The same results as in Example 2 were obtained.
- a copolymer (A 1) comprising 50 parts by mass of the copolymer (A 2) (weight average molecular weight 100 000) obtained in Example 2 and the following structural units (a 1) and (a 3) ) (Mass average molecular weight 800 000) 100 parts by mass of a resin mixed with 50 parts by mass, and as a structural unit (a 1), in the general formula (I), where R is —H and 1 OH is a bonding position There 6 5 mol 0/0 those of 4,
- R is -H
- the group bonded to the benzene ring is a 1-ethoxyxetoxy group
- the bonding position is 4-3. 5 monoles%.
- a positive resist composition was produced in the same manner as in Example 2 except that the component (B1) was not added, and was similarly evaluated. As a result, a tailing phenomenon occurred, and the shape was bad.
- a positive resist composition was produced in the same manner as in Example 3 except that the components (A2) and (B2) were not added, and the same evaluation was performed. As a result, biting occurred, the shape was poor, and the pattern fell.
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Description
Claims
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/561,760 US7422839B2 (en) | 2003-07-08 | 2004-07-05 | Resin for positive resist composition, and positive resist composition using the same, laminate and method for forming resist pattern |
Applications Claiming Priority (4)
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JP2003193649A JP4230298B2 (ja) | 2003-07-08 | 2003-07-08 | 磁性膜の上に形成するためのポジ型レジスト組成物およびこれを用いた積層体とレジストパターンの形成方法 |
JP2003-193649 | 2003-07-08 | ||
JP2003193650A JP2005029614A (ja) | 2003-07-08 | 2003-07-08 | ポジ型レジスト組成物用樹脂、およびこれを用いたポジ型レジスト組成物、積層体並びにレジストパターンの形成方法 |
JP2003-193650 | 2003-07-08 |
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WO2005003196A1 true WO2005003196A1 (ja) | 2005-01-13 |
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PCT/JP2004/009875 WO2005003196A1 (ja) | 2003-07-08 | 2004-07-05 | ポジ型レジスト組成物用樹脂、およびこれを用いたポジ型レジスト組成物、積層体並びにレジストパターンの形成方法 |
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US (1) | US7422839B2 (ja) |
TW (1) | TWI308261B (ja) |
WO (1) | WO2005003196A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2015051597A1 (en) | 2013-10-12 | 2015-04-16 | Theracos, Inc. | Preparation of hydroxy-benzylbenzene derivatives |
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JP5260094B2 (ja) * | 2007-03-12 | 2013-08-14 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | フェノール系ポリマー及びこれを含有するフォトレジスト |
US20210108065A1 (en) * | 2019-10-15 | 2021-04-15 | Rohm And Haas Electronic Materials Llc | Polymers and photoresist compositions |
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JP2001081137A (ja) * | 1999-09-16 | 2001-03-27 | Wako Pure Chem Ind Ltd | 新規なポリマー及びレジスト組成物 |
JP2001142214A (ja) * | 1999-11-12 | 2001-05-25 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
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US5736296A (en) * | 1994-04-25 | 1998-04-07 | Tokyo Ohka Kogyo Co., Ltd. | Positive resist composition comprising a mixture of two polyhydroxystyrenes having different acid cleavable groups and an acid generating compound |
JP3073149B2 (ja) * | 1995-10-30 | 2000-08-07 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
JP3226270B2 (ja) | 1995-10-30 | 2001-11-05 | 東京応化工業株式会社 | ポジ型レジスト用基材樹脂 |
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TW562998B (en) * | 2000-12-07 | 2003-11-21 | Shinetsu Chemical Co | Production method for polymer compound and resist material prepared by using the polymer compound |
-
2004
- 2004-06-30 TW TW093119855A patent/TWI308261B/zh active
- 2004-07-05 WO PCT/JP2004/009875 patent/WO2005003196A1/ja active Application Filing
- 2004-07-05 US US10/561,760 patent/US7422839B2/en active Active
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JP2001081137A (ja) * | 1999-09-16 | 2001-03-27 | Wako Pure Chem Ind Ltd | 新規なポリマー及びレジスト組成物 |
JP2001142214A (ja) * | 1999-11-12 | 2001-05-25 | Fuji Photo Film Co Ltd | ポジ型フォトレジスト組成物 |
JP2002100013A (ja) * | 2000-07-17 | 2002-04-05 | Sony Corp | 磁気ヘッドおよびその製造方法 |
JP2002234910A (ja) * | 2000-12-07 | 2002-08-23 | Shin Etsu Chem Co Ltd | 高分子化合物の製造方法及び該高分子化合物を用いたレジスト材料 |
JP2003031867A (ja) * | 2001-07-17 | 2003-01-31 | Hitachi Ltd | 酸化物磁性層と金属磁性膜を積層した磁気抵抗効果素子 |
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WO2015051597A1 (en) | 2013-10-12 | 2015-04-16 | Theracos, Inc. | Preparation of hydroxy-benzylbenzene derivatives |
US9464043B2 (en) | 2013-10-12 | 2016-10-11 | Theracos Sub, Llc | Preparation of hydroxy-benzylbenzene derivatives |
US10093616B2 (en) | 2013-10-12 | 2018-10-09 | Theracos Sub, Llc | Preparation of hydroxy-benzylbenzene derivatives |
Also Published As
Publication number | Publication date |
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US20070099107A1 (en) | 2007-05-03 |
TWI308261B (en) | 2009-04-01 |
TW200504469A (en) | 2005-02-01 |
US7422839B2 (en) | 2008-09-09 |
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