Classifications

• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B37/00—Lapping machines or devices; Accessories
  • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
  • B01F35/00—Accessories for mixers; Auxiliary operations or auxiliary devices; Parts or details of general application
  • B01F35/80—Forming a predetermined ratio of the substances to be mixed
  • B01F35/83—Forming a predetermined ratio of the substances to be mixed by controlling the ratio of two or more flows, e.g. using flow sensing or flow controlling devices
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B24—GRINDING; POLISHING
  • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
  • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
  • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
• • B—PERFORMING OPERATIONS; TRANSPORTING
  • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • B01F—MIXING, e.g. DISSOLVING, EMULSIFYING OR DISPERSING
  • B01F25/00—Flow mixers; Mixers for falling materials, e.g. solid particles
  • B01F25/50—Circulation mixers, e.g. wherein at least part of the mixture is discharged from and reintroduced into a receptacle

Definitions

• the slurry prepared by the chemical supply device is used, for example, in a final polishing process of a wafer to improve the flatness of the surface of the silicon wafer.
• the wafer surface is polished by the mechanical stress and chemical action of the slurry applied between the polishing pad and the eno.
• An object of the present invention is to provide a chemical liquid supply device capable of stably supplying a mixed chemical liquid that is likely to aggregate or settle.
• FIG. 1 is a schematic diagram of a chemical solution supply device according to a first embodiment of the present invention.
• FIG. 3 is a graph showing a conventional example of the flow rate of the orifice at the start of the supply of the abrasive grains.
• FIG. 4 is an explanatory diagram showing the flow rate of the orifice at the start of the supply of the abrasive grains of the first embodiment.
• FIG. 5 is a schematic diagram of a chemical solution supply device according to a second embodiment of the present invention.
• a first chemical (for example, a stock slurry such as an abrasive suspension) stored in a first storage tank 1 is pumped out by a first pump 3 and sent to a chemical mixing device 4 by pressure.
• a part of the first chemical pumped from the first pump 3 is returned to the first storage tank 1 in order to stir the first chemical in the first storage tank 1.
• the second chemical stored in the second storage tank 2 (for example, a dispersion medium for dilution for preparing a slurry by being mixed with the abrasive suspension) is pumped out by the second pump 5 and mixed with the chemical. It is pumped to device 4.
• Part of the second chemical pumped from the second pump 5 is returned to the second storage tank 2 in order to stir the second chemical in the second storage tank 2.
• the upstream pressure gauge 10 measures the pressure of the first chemical supplied from the upstream valve 8 and supplies the first chemical to the first constant pressure valve 12. The measurement value of the upstream pressure gauge 10 is supplied to the controller 15.
• the first orifice 13 adjusts the flow rate of the first chemical supplied from the downstream pressure gauge 11 and then supplies the first chemical to the first flow meter 14.
• the first flow meter 14 detects the flow rate of the first chemical supplied from the first orifice 13 and supplies the detected value to the control device 15.
• the graph in FIG. 2 shows the relationship between the air pressure for adjusting the first constant pressure valve 12 (horizontal axis) and the flow rate of the first chemical flowing through the first orifice 13 (vertical axis).
• the relationship between the air pressure and the flow rate is changed according to the opening of the first orifice 13.
• a straight line X indicates the relationship when the first orifice 13 is fully opened
• a straight line Y indicates a relationship when the opening of the first orifice 13 is reduced to half
• a straight line Z indicates the relationship.
• the relationship when the flow rate of orifice 13 of 1 is further reduced is shown.
• the second supply route B consists of an upstream pulp 18, a downstream valve 19, an upstream pressure gauge 20, a downstream pressure gauge 21, a second constant pressure valve 22, and a second orifice (flow control means) 2 3 , And a second flow meter 24, and is controlled by a control device 15 that controls the chemical liquid mixing device 4.
• a second return path E similar to the first return path C is connected in the middle of the second supply path B.
• a second return pulp 25 that is opened when the downstream valve 19 is closed.
• the slurry is prepared by mixing the abrasive suspension and the dispersion medium while supplying them to the mixer 6 at a predetermined flow rate. Since the prepared slurry is immediately supplied to the electronic device manufacturing apparatus 7, sedimentation and coagulation of the slurry are prevented, and a slurry of stable quality can be supplied to the electronic device manufacturing apparatus. ' (2) When the slurry is not supplied to the electronic device manufacturing apparatus 7, the flow of the abrasive suspension in the first supply path A causes the slurry to flow to the electronic device manufacturing apparatus 7 due to the reflux through the first reflux path C. It is maintained at the same flow rate as the one being supplied.
• the second reflux route E can prevent the sedimentation and aggregation of the second chemical.
• This time is for adjusting the flow rate by adjusting the constant pressure valve and orifice based on the values detected by the pressure gauge and flow meter after the supply is resumed.
• a chemical solution supply device 200 according to a second embodiment of the present invention will be described with reference to FIG.
• the second embodiment is different from the first embodiment in that a third pump 26 is provided between the mixer 6 and the electronic device manufacturing apparatus 7.
• the third pump 26 is preferably a pump that can appropriately adjust the discharge flow rate.
• the slurry can be supplied at a stable pressure by the third pump 26.

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• Engineering & Computer Science (AREA)
• Mechanical Engineering (AREA)
• Chemical & Material Sciences (AREA)
• Chemical Kinetics & Catalysis (AREA)
• Grinding-Machine Dressing And Accessory Apparatuses (AREA)
• Mechanical Treatment Of Semiconductor (AREA)

Priority Applications (3)

Applications Claiming Priority (1)

Publications (1)

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ID=33524170

Family Applications (1)

Country Status (3)

Cited By (6)

Families Citing this family (3)

Citations (4)

Family Cites Families (1)

• 2003
  • 2003-06-20 CN CN038255790A patent/CN1713967B/zh not_active Expired - Fee Related
  • 2003-06-20 WO PCT/JP2003/007858 patent/WO2004113023A1/ja active Application Filing
  • 2003-06-20 JP JP2005500911A patent/JP4362473B2/ja not_active Expired - Fee Related

Patent Citations (4)

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