1252533 玖、發明說明： 【發明戶斤屬之技術領域3 發明領域 本發明係關於一種藥液供給裝置，特別是關於一種用 5 以將以預定之比率混合多數成分之藥液供給至半導體製造 裝置或平板顯示器（FPD)製造裝置等之電子元件製造裝置 的藥液供給裝置。 L先前技術3 發明背景 10 近年來，在半導體製造裝置或FPD製造裝置等之電子 元件製造裝置，大量且頻繁地使用如混合多數原液所製造 之混合藥液的種種藥液。例如，在製造過程中，在所謂 CMP(Chemical Mechanical Polishing)過程中，使用種種漿液 作為研磨液。漿液雖混合多數原液調製，不過在短時間内 15 仍會沉積、凝聚，因此，必須以預定的濃度穩定地供給漿 液狀之混合藥液。 習知之藥液供給裝置，係秤量各原液後供給至槽，在 槽内混合原液調製混合液，並將所調製之混合液供給至電 子元件製造裝置。混合藥液的濃度，係藉檢測槽内之藥液 20 的體積與重量，算出混合比來管理。另外，也有藉濃度檢 測裝置直接測量槽内之混合藥液的濃度的情形。在槽内調 整至預定的濃度之藥液，係使用氮等之惰性氣體與泵混合 以均一地混合，並供給至電子元件製造裝置。 藉藥液供給裝置所調製之漿液係使用在如矽晶片加工 1252533 研磨過程中，以使晶片的表面之平坦度提昇，而晶片的表 面係藉塗布於研磨襯墊與晶片之間之漿液之機械應力與化 學作用來研磨。 包含於漿液之磨粒等之未溶解物質，因長時間變化而 5 凝聚沉積，該凝聚與沉積會在電子元件的製造中造成問題 。例如，凝聚之漿液塗布於晶片上後，在晶片表面上形成 微刮痕，使晶片的良率降低。 另外，漿液中之未溶解物質的凝聚、沉積，使混合藥 液的濃度變動。漿液中之未溶解物質若在配管内沉積，則 10 漿液對電子元件製造裝置之供給會不穩定。另外，為了防 止因凝聚、沉積之未溶解物質閉塞配管，要進行用以去除 凝聚、沉積之未溶解物質的作業。該去除作業會使漿液對 電子元件製造裝置之供給停滯。 為了防止漿液的凝聚、沉積，可以考慮經常攪拌漿液 15 。惟因漿液的攪拌，未溶解物質相互間之衝撞頻率升高， 反而也促進凝聚。 在有的混合藥液中，由其製造到使用為止之時間被限 制於短時間。在槽内製造如此之混合藥液時，在到達供給 至電子元件製造裝置期間，具有藥液凝聚及沉積之問題。 20 【發明内容】 發明概要 本發明之目的，係提供一種能夠穩定供給容易凝聚及 沉積之混合藥液之藥液供給裝置。 本發明之第1形態，係提供一種藥液供給裝置，係將貯 1252533 存於貯存槽之藥液供給至外部裝置者，該裝置包含：供給 路徑，係供前述藥液以預定之流量流過其中者；及回流路 徑，係當停止前述藥液對前述外部裝置的供給時，使前述 藥液由前述供給路徑回流至前述貯存槽者。 5 本發明之第2實施形態，係提供一種藥液供給裝置，係 混合分別貯存於多數貯存槽之多數原液以產生混合藥液， 並將前述混合藥液供給至外部裝置者，該裝置包含：多數 供給路徑，係供前述多數原液分別以預定之流量流過其中 者；及多數回流路徑，係當停止前述混合藥液對前述外部 10 裝置的供給時，使前述多數原液由前述多數供給路徑分別 回流至前述多數貯存槽者。 本發明之第3實施形態，係一種藥液供給裝置，係將漿 液供給至外部裝置，該裝置包含：第1供給路徑，係供含有 為了調製前述漿液所使用之磨粒之第1液以預定之流量流 15 過其中者；第2供給路徑，係供與前述第1液混合以調製前 述漿液之第2液以預定之流量流過其中者；及回流路徑，係 連接於前述第1供給路徑者。又當停止前述漿液對前述外部 裝置的供給時，前述回流路徑使前述第1液由前述第1供給 路徑回流至前述第1貯存槽。 20 本發明之第4實施形態，係提供一種裝置，係連接貯存 第1液之第1貯存槽與貯存第2液之第2貯存槽，且混合前述 第1液與前述第2液以調製混合液，並將前述混合液供給至 外部裝置者，該裝置包含：第1供給路徑，係供前述第1液 流過其中者；第2供給路徑，係供前述第2液流過其中者； 1252533 攪拌器，係連接前述第1供給路徑與前述第2供給路徑，以 混合前述第1液與前述第2液；第1截斷閥，係設置於前述第 1供給路徑，以選擇性地截斷前述第1液對前述攪拌器的供 給；第1回流路徑，係在前述第1供給路徑中，連接前述第1 5 截斷閥的上游位置與前述第1槽；第1回流閥，係設置於前 述第1回流路徑之中途；及控制裝置，係當停止前述混合液 對前述外部裝置的供給時，維持前述第1供給路徑中之前述 第1液的流動，並且閉鎖前述第1截斷閥且開放前述第1回流 閥，以透過前述第1回流路徑，將前述第1液送回第1槽。 10 圖式簡單說明 第1圖為本發明之第1實施形態之藥液供給裝置的概略 圖。 第2圖為顯示調整定壓閥之空氣壓力與孔口的流量之 關係之圖表。 15 第3圖為顯示在磨粒開始供給時之孔口的流量之習知 例之圖表。 第4圖為表示在第1實施形態之磨粒開始供給時之孔口 的流量之說明圖。 第5圖為本發明之第2實施形態之藥液供給裝置的概略 20 圖。 第6圖為本發明之第3實施形態之藥液供給裝置的概略 圖。 第7圖為本發明之第4實施形態之藥液供給裝置的概略 1252533 t實施冷式3 較佳實施例之詳細說明 如第1圖所1 員示，本發明之第1實施形態之藥液供給裝 置1〇0 ’係由分別貯存於第1貯存槽1與第2貯存槽2之藥品調 5衣藥液’將所調製之藥液供給至電子元件製造裝置7。 貝丁存於第1聍存槽1之第1藥品（例如如磨粒懸浮液之漿 液原液係藉第1泵3吸出壓送至藥液混合裝置4。由第1泵 3所壓送之第1藥品的一部份則送回到第1貯存槽1，以攪拌 第1貯存槽1内之第1藥品。 1 〇 貯存於第2貯存槽2之第2藥品（例如與磨粒懸浮液混合 用以調製漿液之稀釋用分散劑），係藉第2泵5吸出壓送至藥 液混合裝置4。由第2泵5所壓送之第2藥品的一部份則送回 到第2貯存槽2，以攪拌第2貯存槽2内之第2藥品。 藥液混合裝置4，係包含第1供給路徑A與第2供給路徑 15 B ’該第1供給路徑A供給第1藥品至攪拌器6，而該第2供給 路徑B則供給第2藥品至攪拌器6。第1及第2藥品藉攪拌器6 適度地混合後供給至電子元件製造裝置7。攪拌器6係例如 ’靜態攪拌器。 第1供給路徑A包含有上游閥8、下游閥9、上游壓力計 20 1〇、下游壓力計11、第1定壓閥12、以針狀閥所構成之第i 孔口（流量調節裝置）13、及第1流量計14，並藉控制藥液混 合裝置4之控制裝置15控制。 在上游閥8打開時，由第1泵3所壓送之第1藥品供給至 上游壓力計10。上游壓力計10測定由上游閥8所供給之第i 1252533 藥品的壓力，並將第1藥品供給至第1定壓閥12。而上游壓 力計10的測定值將供給至控制裝置15。 第1定壓閥12將由第1泵3所壓送之第1藥品的壓力，降 壓至預定之壓力之後，將第1藥品供給至下游壓力計11。 5 下游壓力計11測定由第1定壓閥12所供給之第1藥品的 壓力，將第1藥品供給至第1孔口 13。下游壓力計11的測定 值係供給至控制裝置15。 控制裝置15依據上游及下游壓力計10、11的測定值來 調整用以控制第1定壓閥12之空氣壓力，以維持供給至第1 10 孔口 13之第1藥品的壓力於預定之值。 第1孔口 13在調整由下游壓力計11所供給之第1藥品的 流量之後，將第1藥品供給至第1流量計14。第1流量計14檢 測由第1孔口 13所供給之第1藥品的流量，並將其檢測值供 給至控制裝置15。 15 當調製容易發生磨粒的沉積及凝聚之鈽漿液時，也就 是，在第1藥品包含如氧化錦之磨粒之懸浮液（懸濁液）時， 第1泵3之吐出量以設定於0〜10L/min較佳，且第1定壓閥12 的吐出壓力以設定於0〜〇.5MPa較佳，且第1孔口 13之流速以 設定於0〜0.5L/min較佳 20 第1流量計14將由第1孔口 13所供給之第1藥品供給至 下游閥9，當打開下游閥9時，第1藥品被供給至攪拌器6。 當關閉下游閥9時，則截斷對第1藥品的攪拌器6的供給。 第2圖之圖表顯示用以調整第1定壓閥12之空氣壓力（ 橫軸），與流過第1孔口 13之第1藥品的流量（縱軸）之關係。 10 1252533 空氣壓力與流量的關係係因應第1孔口 13的開度而變更。例 如，直線X顯示第1孔口 13全開時之關係，直線Y顯示第1孔 口 13的開度收縮成一半時之關係，且直線Z顯示第1孔口 13 的流量再縮小時之關係。 5 如第2圖所顯示，當操作第1定壓閥12，調整第1藥品的 壓力時，第1孔口 13的開度若愈大，隨著壓力的增大，流量 的變化也就愈大。 在第1供給路徑A之中途，連接使流至第1供給路徑A之 第1藥品回流至貯存槽1之第1回流路徑C，也就是，第1回流 10 路徑C連接第1流量計14的輸出側（下游位置）與貯存槽1。設 置於第1回流路徑C之中途之回流閥16係藉控制裝置15控制 ，當關閉下游閥9時打開。因此，當關閉下游閥9時，流至 第1供給路徑A之第1藥品，經過第1回流路徑C，回流至第1 貯存槽1。 15 第1供給路徑A係藉旁通路徑D旁通，詳而言之，旁通 路徑D係旁通上游閥8的輸入側（上游側）與第1回流閥16的 輸出側（下游側）。設置於旁通路徑D的中途之旁通閥17，係 當關閉下游閥9時打開，或者維持在經常開狀態。旁通閥17 的開度，係調整成使第1孔口 13之流速維持在0〜5L/min。 20 第2供給路徑B包含上游閥18、下游閥19、上游壓力計 20、下游壓力計21、第2定壓閥22、第2孔口（流量調節裝置 )23、第2流量計24，並藉控制藥液混合裝置4之控制裝置15 控制。 當調製鈽漿液時，第2定壓閥22的吐出壓力以設定於 1252533 0〜0.5MPa較佳，且流過第2孔σ23之第2藥品的流量以設定 於0〜0.5L/min較佳。 在第2仏給路徑B的中途，連接與第丨回流路徑c類似之 第2回流路後E。在第2回流路徑£之中途，設置當關閉下游 5閥19時打開之第2回流闊25。 以下，針對藥液供給裝置1〇〇的動作加以說明。 當供給混合藥液至電子元件製造裝置7時，控制裝置15 ，使上游閥8、18及下游閥9、19打開。如此之後，第丨藥品 由第1貯存槽介第1泵3及第1供給路徑A，供給至攪拌器6。 1〇第1藥品的壓力及流量，係藉第1定壓閥12及第1孔口 13控制 於預定值。 另外，第2藥品由第2貯存槽介第2泵5及第1供給路徑B ’供給至攪拌器6。第2藥品的壓力及流量，係藉第2定壓閥 22及第2孔口 23控制於預定值。 15 弟1樂品及第2樂品’係以擾掉器6混合供給至電子元件 製造裝置7。其混合藥液的混合比係依據以第1及第2流量計 14、24所檢測之流量，藉控制裝置15控制。 另一方面，當停止對電子元件製造裝置7的混合藥液的 供給時，則關閉下游閥9、19，同時打開第1及第2回流閱16 20 、25。藉此，流過第1供給路徑A之第1藥品會經過第1回流 路徑C，回流至第1貯存槽1。換言之，第1藥品持續流過由 第1貯存槽1、第1供給路徑A及第1回流路徑C所形成之楯枣 路徑。同樣地，流過第2供給路徑B之第2藥品則經過第2回 流路徑E，回流至第2貯存槽2。換言之，第2藥品持續流過 12 1252533 由第2貯存槽2、第1供給路徑B及第2回流路徑E所形成之循 環路徑。 在第1供給路徑A内之第1藥品，由於經常維持流動著， 所以可以防止第1藥品之凝聚及沉積。另外，在第2供給路 5 徑B中亦可以防止第2藥品之凝聚及沉積。 鈽懸浮液中之鈽磨粒容易凝聚及沉積。因此，若僅流 過第1供給路徑A之鈽懸浮液之一部份供給至第1回流路徑 C，則因第1回流路徑C之流量不足，在第1回流路徑C内可 能會發生鈽磨粒的凝聚及沉積。在第1實施形態中，鈽懸浮 10 液係藉旁通路徑D供給至第1回流路徑C。藉此，第1回流路 徑C的流量增大，可以防止在第1回流路徑C内之鈽磨粒的 凝聚或沉積的發生。 若依據第1實施形態，可以得到以下之作用效果。 (1) 若利用藥液供給裝置100，則磨粒懸浮液與分散劑可 15 以預定的流量供給至攪拌器並混合以調製漿液。所調製成 之漿液由於立刻供給至電子元件製造裝置7，所以可以防止 漿液的沉積及凝聚，並將品質穩定之漿液供給至電子元件 製造裝置。 (2) 當不供給漿液至電子元件製造裝置時，藉由透過第1 20 回流路徑C之回流，在第1供給路徑A之磨粒懸浮液的流動 可以維持在與供給漿液至電子元件製造裝置7中之流量相 同的流量。因此，可以防止在第1供給路徑A之磨粒的沉積 及凝聚，並且在再開始供給漿液時，可以將品質穩定之漿 液迅速地供給至電子元件製造裝置7。另外，在第2供給路 13 1252533 徑B中，亦可藉第2回流路徑E，防止第2藥品的沉積與凝聚。 (3)第1回流路徑C的流量較少時，磨粒懸浮液係透過旁 通路徑D供給至第1回流路徑C。因此，可以防止磨粒在第1 回流路徑C内之沉積與凝聚。 5 (4)當不供給漿液至電子元件製造裝置7時，藉第1及第2 回流路徑C、E的回流，第1及第2供給路徑A、B之磨粒懸浮 液及分散劑的流動，可以維持在與供給漿液至電子元件製 造裝置7中的流量相同之流量。因此，當再開始供給漿液時 ，由於打開下游閥9及下游閥19，所以可短縮供給至攪拌器 10 6之磨粒懸浮液及分散劑的流量到達穩定之時間。以下參照 第3、4圖針對縮短該再開始時間加以說明。 第3圖之圖表係顯示藉使在第1及第2供給路徑A、B之 第1及第2藥品的流動停止，由停止對電子元件製造裝置7之 漿液的供給之狀態，到再開始漿液的供給時之流量的變動 15 之比較例。第4圖係顯示在維持第1及第2供給路徑A、B之 第1及第2藥品的流動狀態下，由停止對電子元件製造裝置7 之漿液的供給之狀態，到再開始漿液的供給時之流量的變 動。 在第3圖的比較例中，供給流量到穩定為止所需要之時 20 間，例如當設定由第1供給路徑A之供給流量為200L/min時 ，供給流量的誤差由供給再開始到縮小至± 10mL/min的範 圍内所需要的時間約為11秒。該時間是在供給再開始後， 依據壓力計及流量計的檢測值，調整定壓閥及孔口以調整 流量所致。 14 1252533 相對於此，在本實施形態中，如第4圖所示，由供給再 開始約2秒内流量就達到穩定，此乃由於可以維持在第1及 第2供給路徑A、B的流動之故。 其次，參照第5圖針對本發明之第2實施形態的藥液供 5 給裝置200加以說明。第2實施形態與第1實施形態不同之點 係在攪拌器6與電子元件製造裝置7之間設置有第3泵26。第 3泵26係以可以適度調整吐出流量之泵較佳。 藉第3泵26,若由攪拌器6到電子元件製造裝置7之距離 較長，則可藉第3泵26以穩定之壓力供給漿液。 10 其次，參照第6圖針對本發明之第3實施形態的藥液供 給裝置300加以說明。第3實施形態與第1實施形態不同之點 係在附加上第1及第2洗淨用閥27、28。 藉洗淨用閥27、28可以洗淨第1供給路徑A，也就是， 關閉閥8、9、16，打開洗淨用閥27、28，此時，藉第1洗淨 15 用閥27，將純水或適當之洗淨液供給至第1供給路徑A，並 藉第2洗淨用閥28排水。如此可以輕易地洗淨用以供給容易 發生沉積及凝聚之磨粒懸浮液之第1供給路徑A。 若關閉第2洗淨用閥28，打開下游閥9，也可以進行攪 拌器6及電子元件製造裝置7的洗淨。 20 利用由第2洗淨用閥28朝向第1洗淨用閥27供給洗淨液 ，使洗淨液與磨粒懸浮液的流動反方向地流動，可以再提 昇洗淨效果。 以下，參照第7圖針對本發明之第4實施形態的藥液供 給裝置400加以說明。第4實施形態係並列設置2條供給路徑 15 1252533 A1、A2，以取代第1實施形態之第1供給路徑A。在2條供 給路徑Al、A2，設置有與第3實施形態同樣之洗淨用之閥 29〜32 。 在第4實施形態中，在2條供給路徑Al、A2之其中一路 5 徑内，可以一面將磨粒懸浮液供給至電子元件製造裝置7， 一面進行另外一路徑的洗淨。2條供給路徑Al、A2，由於 在預定的時間洗淨，所以可以連續進行磨粒懸浮液的供給 動作。另外，在供給路徑Al、A2内，即使有發生磨粒的沉 積及凝聚的情形，也可以定期地除去凝聚的磨粒，將漿液 10 連續供給至電子元件製造裝置7。 第1乃至第4上述實施形態，亦可如以下地變更。 若流至第2供給路徑B之第2藥品係如純水之不會沉積 及凝聚之均一流體，亦可省略第2回流路徑E。 若流至第2供給路徑B之第2藥品係如容易沉積及凝聚 15 之不均一流體，亦可在第2供給路徑B設置旁通路徑。 【圖式簡單說明】 第1圖為本發明之第1實施形態之藥液供給裝置的概略 圖。 第2圖為顯示調整定壓閥之空氣壓力與孔口的流量之 20 關係之圖表。 第3圖為顯示在磨粒開始供給時之孔口的流量之習知 例之圖表。 第4圖為表示在第1實施形態之磨粒開始供給時之孔口 的流量之說明圖。 16 1252533 第5圖為本發明之第2實施形態之藥液供給裝置的概略 圖。 第6圖為本發明之第3實施形態之藥液供給裝置的概略 圖。 5 第7圖為本發明之第4實施形態之藥液供給裝置的概略 圖 【圖式之主要元件代表符號表】 1···第1貯存槽 2···第2貯存槽 3…第1泵 4···藥液混合裝置 5…第2泵 6…攪拌器 7···電子元件製造裝置 8、 18…上游閥 9、 19…下游閥 10、 20…上游壓力計 11、 21…下游壓力計 12…第1定壓閥 13…第1孔口 14…第1流量計BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chemical supply device, and more particularly to a chemical supply for supplying a chemical solution mixed with a plurality of components at a predetermined ratio to a semiconductor manufacturing device. A chemical solution supply device for an electronic component manufacturing device such as a flat panel display (FPD) manufacturing device. In the electronic component manufacturing apparatus such as a semiconductor manufacturing apparatus or an FPD manufacturing apparatus, various chemical liquids such as a mixed chemical liquid produced by mixing a plurality of raw materials are used in a large amount and frequently. For example, in the manufacturing process, various kinds of slurry are used as the polishing liquid in the so-called CMP (Chemical Mechanical Polishing) process. Although the slurry is mixed with most of the stock solution, it still deposits and aggregates in a short period of time. Therefore, it is necessary to stably supply the slurry-like mixed liquid at a predetermined concentration. The conventional chemical solution supply device supplies the raw liquid solution to the tank, mixes the raw liquid in the tank to prepare a mixed liquid, and supplies the prepared mixed liquid to the electronic component manufacturing apparatus. The concentration of the mixed chemical solution is calculated by calculating the mixing ratio by the volume and weight of the chemical liquid 20 in the detection tank. Further, there is a case where the concentration of the mixed chemical solution in the tank is directly measured by the concentration detecting means. The chemical liquid adjusted to a predetermined concentration in the tank is mixed with a pump using an inert gas such as nitrogen to be uniformly mixed and supplied to the electronic component manufacturing apparatus. The slurry prepared by the liquid supply device is used in a grinding process such as a wafer processing 1252533 to increase the flatness of the surface of the wafer, and the surface of the wafer is coated with a slurry applied between the polishing pad and the wafer. Stress and chemical action to grind. The undissolved matter contained in the abrasive grains or the like of the slurry is agglomerated and deposited due to a long-term change, which causes problems in the manufacture of electronic components. For example, after the agglomerated slurry is applied to the wafer, micro scratches are formed on the surface of the wafer to lower the yield of the wafer. Further, aggregation and deposition of undissolved substances in the slurry cause the concentration of the mixed solution to vary. If the undissolved matter in the slurry is deposited in the pipe, the supply of the 10 slurry to the electronic component manufacturing apparatus may be unstable. Further, in order to prevent the undissolved matter from being condensed and deposited from blocking, the undissolved matter for removing agglomeration and deposition is performed. This removal operation stagnates the supply of the slurry to the electronic component manufacturing apparatus. In order to prevent the agglomeration and deposition of the slurry, it is considered to frequently stir the slurry 15 . However, due to the agitation of the slurry, the frequency of collision of undissolved substances increases, and conversely promotes coagulation. In some mixed medical solutions, the time from manufacture to use is limited to a short period of time. When such a mixed chemical solution is produced in a tank, there is a problem in that the liquid medicine is aggregated and deposited during the supply to the electronic component manufacturing apparatus. [Explanation] SUMMARY OF THE INVENTION An object of the present invention is to provide a chemical supply device capable of stably supplying a mixed chemical solution which is easily aggregated and deposited. According to a first aspect of the present invention, there is provided a chemical liquid supply device for supplying a chemical solution stored in a storage tank to an external device, wherein the device includes a supply path for supplying the chemical liquid at a predetermined flow rate. And a return path is a method of returning the chemical liquid to the storage tank by the supply path when the supply of the chemical liquid to the external device is stopped. In a second embodiment of the present invention, there is provided a chemical solution supply device which mixes a plurality of stock solutions stored in a plurality of storage tanks to produce a mixed chemical solution, and supplies the mixed chemical solution to an external device, the device comprising: a plurality of supply paths are provided for each of the plurality of stock solutions flowing at a predetermined flow rate; and a plurality of return paths are configured to stop the supply of the plurality of raw materials to the external 10 device by the plurality of supply paths, respectively Return to the majority of the aforementioned storage tanks. According to a third embodiment of the present invention, there is provided a chemical liquid supply device for supplying a slurry to an external device, the device comprising: a first supply path for supplying a first liquid containing abrasive grains used for preparing the slurry to be predetermined The second flow path is configured to be mixed with the first liquid to prepare a second liquid for preparing the slurry to flow at a predetermined flow rate; and the return flow path is connected to the first supply path By. Further, when the supply of the slurry to the external device is stopped, the reflux path causes the first liquid to flow back to the first storage tank from the first supply path. According to a fourth embodiment of the present invention, there is provided an apparatus for connecting a first storage tank storing a first liquid and a second storage tank storing a second liquid, and mixing the first liquid and the second liquid to prepare a mixture And supplying the mixed liquid to an external device, wherein the device includes: a first supply path through which the first liquid flows; and a second supply path through which the second liquid flows; 1252533 The agitator connects the first supply path and the second supply path to mix the first liquid and the second liquid; the first shutoff valve is provided in the first supply path to selectively cut off the first a supply of the first liquid to the agitator; the first return path is connected to the upstream position of the first shutoff valve and the first groove in the first supply path; and the first return valve is provided in the first And a control device that maintains the flow of the first liquid in the first supply path when the supply of the mixed liquid to the external device is stopped, and closes the first shutoff valve and opens the first Return valve to The first through the return path, the first liquid will be returned to the first groove. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a chemical solution supply device according to a first embodiment of the present invention. Figure 2 is a graph showing the relationship between the air pressure of the fixed pressure valve and the flow rate of the orifice. 15 Fig. 3 is a diagram showing a conventional example of the flow rate of the orifice at the time when the abrasive grains are started to be supplied. Fig. 4 is an explanatory view showing the flow rate of the orifice at the time when the abrasive grains of the first embodiment are started to be supplied. Fig. 5 is a schematic view showing a chemical liquid supply device according to a second embodiment of the present invention. Fig. 6 is a schematic view showing a chemical solution supply device according to a third embodiment of the present invention. Fig. 7 is a schematic view of a liquid chemical supply device according to a fourth embodiment of the present invention. 1252533 t is a cold type. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT As shown in Fig. 1, a liquid chemical according to a first embodiment of the present invention The supply device 1〇0' supplies the prepared chemical solution to the electronic component manufacturing apparatus 7 from the drug solution 5 stored in the first storage tank 1 and the second storage tank 2, respectively. The first drug stored in the first storage tank 1 (for example, the slurry raw liquid such as the abrasive suspension is sucked and sent to the chemical mixing device 4 by the first pump 3, and is pumped by the first pump 3 1 part of the medicine is returned to the first storage tank 1 to stir the first medicine in the first storage tank 1. 1 第 the second medicine stored in the second storage tank 2 (for example, mixed with the abrasive suspension) The dispersing agent for diluting the slurry is pumped to the chemical mixing device 4 by the second pump 5. The portion of the second drug pumped by the second pump 5 is returned to the second storage. The tank 2 agitates the second medicine in the second storage tank 2. The chemical liquid mixing device 4 includes a first supply path A and a second supply path 15 B '. The first supply path A supplies the first medicine to the agitator. 6. The second supply path B supplies the second drug to the agitator 6. The first and second drugs are appropriately mixed by the agitator 6 and supplied to the electronic component manufacturing apparatus 7. The agitator 6 is, for example, a 'static agitator. The first supply path A includes an upstream valve 8, a downstream valve 9, an upstream pressure gauge 20 1 , a downstream pressure gauge 11, a first constant pressure valve 12, and a needle valve. The i orifice (flow rate adjusting device) 13 and the first flow meter 14 are controlled by the control device 15 that controls the chemical liquid mixing device 4. When the upstream valve 8 is opened, the first drug is pumped by the first pump 3 It is supplied to the upstream pressure gauge 10. The upstream pressure gauge 10 measures the pressure of the ith 1252533 medicine supplied from the upstream valve 8, and supplies the first medicine to the first constant pressure valve 12. The measured value of the upstream pressure gauge 10 is supplied. To the control device 15. The first constant pressure valve 12 lowers the pressure of the first drug pumped by the first pump 3 to a predetermined pressure, and then supplies the first drug to the downstream pressure gauge 11. 5 Downstream pressure gauge 11 The pressure of the first medicine supplied from the first constant pressure valve 12 is measured, and the first medicine is supplied to the first orifice 13. The measured value of the downstream pressure gauge 11 is supplied to the control device 15. The control device 15 is based on the upstream and downstream. The measured values of the pressure gauges 10 and 11 are adjusted to control the air pressure of the first constant pressure valve 12 to maintain the pressure of the first medicine supplied to the first 10 orifice 13 at a predetermined value. The first orifice 13 is After adjusting the flow rate of the first medicine supplied by the downstream pressure gauge 11, the first medicine is supplied The flow rate is supplied to the first flow meter 14. The first flow meter 14 detects the flow rate of the first medicine supplied from the first orifice 13, and supplies the detected value to the control device 15. 15 When the preparation is prone to deposition of abrasive grains, When the first slurry contains a suspension (suspension) such as oxidized granules, the discharge amount of the first pump 3 is preferably set to 0 to 10 L/min, and the first The discharge pressure of the constant pressure valve 12 is preferably set to 0 to 55 MPa, and the flow rate of the first orifice 13 is set to 0 to 0.5 L/min. Preferably, the first flow meter 14 is to be opened by the first orifice 13 The supplied first medicine is supplied to the downstream valve 9, and when the downstream valve 9 is opened, the first medicine is supplied to the agitator 6. When the downstream valve 9 is closed, the supply of the agitator 6 for the first drug is cut off. The graph of Fig. 2 shows the relationship between the air pressure (horizontal axis) of the first constant pressure valve 12 and the flow rate (vertical axis) of the first drug flowing through the first orifice 13. 10 1252533 The relationship between the air pressure and the flow rate is changed in response to the opening of the first orifice 13. For example, the straight line X shows the relationship when the first orifice 13 is fully opened, the straight line Y shows the relationship when the opening degree of the first orifice 13 is contracted to half, and the straight line Z shows the relationship when the flow rate of the first orifice 13 is further reduced. 5 As shown in Fig. 2, when the first constant pressure valve 12 is operated to adjust the pressure of the first medicine, the larger the opening degree of the first orifice 13, the more the flow rate changes as the pressure increases. Big. In the middle of the first supply path A, the first recirculation path C that reflows the first drug flowing to the first supply path A to the storage tank 1 is connected, that is, the first recirculation 10 path C is connected to the first flow meter 14 Output side (downstream position) and storage tank 1. The return valve 16 disposed in the middle of the first return path C is controlled by the control unit 15, and is opened when the downstream valve 9 is closed. Therefore, when the downstream valve 9 is closed, the first drug flowing to the first supply path A passes through the first return path C and is returned to the first storage tank 1. 15 The first supply path A is bypassed by the bypass path D. Specifically, the bypass path D bypasses the input side (upstream side) of the upstream valve 8 and the output side (downstream side) of the first return valve 16 . The bypass valve 17 provided in the middle of the bypass path D is opened when the downstream valve 9 is closed, or maintained in a normally open state. The opening degree of the bypass valve 17 is adjusted so that the flow velocity of the first orifice 13 is maintained at 0 to 5 L/min. The second supply path B includes an upstream valve 18, a downstream valve 19, an upstream pressure gauge 20, a downstream pressure gauge 21, a second constant pressure valve 22, a second orifice (flow rate adjusting device) 23, and a second flow meter 24, and It is controlled by the control device 15 that controls the chemical mixing device 4. When the mash slurry is prepared, the discharge pressure of the second constant pressure valve 22 is preferably set to 1252533 0 to 0.5 MPa, and the flow rate of the second drug flowing through the second hole σ23 is preferably set at 0 to 0.5 L/min. . In the middle of the second path to the path B, a second return path E similar to the second return path c is connected. In the middle of the second return path £, a second recirculation width 25 which is opened when the downstream 5 valve 19 is closed is provided. Hereinafter, the operation of the chemical solution supply device 1A will be described. When the mixed chemical is supplied to the electronic component manufacturing apparatus 7, the control means 15 opens the upstream valves 8, 18 and the downstream valves 9, 19. After that, the second drug is supplied to the agitator 6 from the first storage tank via the first pump 3 and the first supply path A. The pressure and flow rate of the first drug are controlled by a predetermined value by the first constant pressure valve 12 and the first orifice 13. Further, the second drug is supplied from the second storage tank to the second pump 5 and the first supply path B' to the agitator 6. The pressure and flow rate of the second drug are controlled by a predetermined value by the second constant pressure valve 22 and the second orifice 23. The 15th music item and the second music item are mixed and supplied to the electronic component manufacturing apparatus 7 by the scrambler 6. The mixing ratio of the mixed chemical solution is controlled by the control device 15 based on the flow rate detected by the first and second flow meters 14, 24. On the other hand, when the supply of the mixed chemical solution to the electronic component manufacturing apparatus 7 is stopped, the downstream valves 9, 19 are closed, and the first and second reflow readings 16 20 and 25 are simultaneously opened. Thereby, the first drug flowing through the first supply path A passes through the first recirculation path C and is returned to the first storage tank 1. In other words, the first drug continues to flow through the path of the jujube formed by the first storage tank 1, the first supply path A, and the first return path C. Similarly, the second drug flowing through the second supply path B passes through the second return flow path E and is returned to the second storage tank 2. In other words, the second drug continues to flow through 12 1252533 by the second storage tank 2, the first supply path B, and the second return path E. Since the first drug in the first supply path A is constantly kept flowing, aggregation and deposition of the first drug can be prevented. Further, in the second supply path 5 and the B, the aggregation and deposition of the second drug can be prevented. The honing particles in the cerium suspension tend to aggregate and deposit. Therefore, if only one of the helium suspensions flowing through the first supply path A is supplied to the first recirculation path C, the flow rate of the first recirculation path C is insufficient, and the first reflow path C may be honed. Aggregation and deposition of particles. In the first embodiment, the liquid suspension 10 is supplied to the first return path C by the bypass path D. Thereby, the flow rate of the first recirculation path C is increased, and the occurrence of aggregation or deposition of the honing particles in the first recirculation path C can be prevented. According to the first embodiment, the following effects can be obtained. (1) When the chemical supply device 100 is used, the abrasive suspension and the dispersant 15 can be supplied to the agitator at a predetermined flow rate and mixed to prepare a slurry. Since the prepared slurry is immediately supplied to the electronic component manufacturing apparatus 7, the deposition and aggregation of the slurry can be prevented, and the slurry having stable quality can be supplied to the electronic component manufacturing apparatus. (2) When the slurry is not supplied to the electronic component manufacturing apparatus, the flow of the abrasive suspension in the first supply path A can be maintained and supplied to the electronic component manufacturing apparatus by the recirculation through the first 20th return path C. The traffic with the same flow rate in 7. Therefore, deposition and aggregation of the abrasive grains in the first supply path A can be prevented, and when the slurry is supplied again, the slurry having stable quality can be quickly supplied to the electronic component manufacturing apparatus 7. Further, in the diameter B of the second supply path 13 1252533, the deposition and agglomeration of the second medicine can be prevented by the second return path E. (3) When the flow rate of the first return path C is small, the abrasive grain suspension is supplied to the first return path C through the bypass path D. Therefore, deposition and agglomeration of the abrasive grains in the first reflow path C can be prevented. (4) When the slurry is not supplied to the electronic component manufacturing apparatus 7, the flow of the abrasive suspension and the dispersant of the first and second supply paths A and B by the reflux of the first and second return paths C and E It is possible to maintain the same flow rate as the flow rate of supplying the slurry into the electronic component manufacturing apparatus 7. Therefore, when the supply of the slurry is resumed, since the downstream valve 9 and the downstream valve 19 are opened, the flow rate of the abrasive slurry suspension and the dispersant supplied to the agitator 106 can be shortened to a stable time. The following describes the shortening of the restart time with reference to Figs. 3 and 4. In the graph of Fig. 3, the flow of the first and second medicines in the first and second supply paths A and B is stopped, and the supply of the slurry to the electronic component manufacturing apparatus 7 is stopped, and the slurry is restarted. A comparative example of the change in the flow rate at the time of supply 15 . In the fourth embodiment, the supply of the slurry to the electronic component manufacturing apparatus 7 is stopped, and the supply of the slurry is resumed while maintaining the flow state of the first and second medicines of the first and second supply paths A and B. The change in traffic at that time. In the comparative example of Fig. 3, when the supply flow rate is 20 times until the supply flow rate is stabilized, for example, when the supply flow rate of the first supply path A is set to 200 L/min, the error of the supply flow rate is restarted from supply to reduction. The time required in the range of ±10 mL/min is about 11 seconds. This time is caused by adjusting the pressure regulating valve and the orifice to adjust the flow rate according to the measured values of the pressure gauge and the flow meter after the supply is restarted. 14 1252533 In contrast, in the present embodiment, as shown in Fig. 4, the flow rate is stabilized within about 2 seconds from the start of supply restart, because the flow in the first and second supply paths A and B can be maintained. The reason. Next, a chemical supply device 200 according to a second embodiment of the present invention will be described with reference to Fig. 5. The second embodiment differs from the first embodiment in that a third pump 26 is provided between the agitator 6 and the electronic component manufacturing apparatus 7. The third pump 26 is preferably a pump that can appropriately adjust the discharge flow rate. By the third pump 26, if the distance from the agitator 6 to the electronic component manufacturing apparatus 7 is long, the slurry can be supplied by the third pump 26 at a stable pressure. Next, a chemical solution supply device 300 according to a third embodiment of the present invention will be described with reference to Fig. 6. The third embodiment differs from the first embodiment in that the first and second cleaning valves 27 and 28 are attached. The first supply path A can be cleaned by the cleaning valves 27 and 28, that is, the valves 8, 9, and 16 are closed, and the cleaning valves 27 and 28 are opened. At this time, the first cleaning valve 21 is used. Pure water or a suitable cleaning liquid is supplied to the first supply path A, and is drained by the second cleaning valve 28. Thus, the first supply path A for supplying the abrasive suspension which is likely to be deposited and aggregated can be easily washed. When the second cleaning valve 28 is closed and the downstream valve 9 is opened, the agitator 6 and the electronic component manufacturing apparatus 7 can be cleaned. When the cleaning liquid is supplied to the first cleaning valve 27 by the second cleaning valve 28, the flow of the cleaning liquid and the abrasive particle suspension flows in the opposite direction, and the cleaning effect can be further enhanced. Hereinafter, a chemical solution supply device 400 according to a fourth embodiment of the present invention will be described with reference to Fig. 7. In the fourth embodiment, two supply paths 15 1252533 A1 and A2 are provided in parallel to replace the first supply path A of the first embodiment. The cleaning valves 29 to 32 similar to those of the third embodiment are provided in the two supply paths A1 and A2. In the fourth embodiment, the abrasive grain suspension can be supplied to the electronic component manufacturing apparatus 7 while cleaning the other path in one of the two supply paths A1 and A2. Since the two supply paths A1 and A2 are washed for a predetermined period of time, the supply operation of the abrasive slurry suspension can be continuously performed. Further, in the supply paths A1 and A2, even if abrasive grains are deposited and aggregated, the aggregated abrasive grains can be periodically removed, and the slurry 10 can be continuously supplied to the electronic component manufacturing apparatus 7. The first to fourth embodiments described above can also be changed as follows. The second return path E may be omitted if the second drug flowing to the second supply path B is a uniform fluid that does not deposit and agglomerate in pure water. If the second drug flowing to the second supply path B is a non-uniform fluid that is easily deposited and aggregated 15, a bypass path may be provided in the second supply path B. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 is a schematic view showing a chemical solution supply device according to a first embodiment of the present invention. Figure 2 is a graph showing the relationship between the air pressure of the fixed pressure valve and the flow rate of the orifice. Fig. 3 is a graph showing a conventional example of the flow rate of the orifice at the time when the abrasive grains are started to be supplied. Fig. 4 is an explanatory view showing the flow rate of the orifice at the time when the abrasive grains of the first embodiment are started to be supplied. 16 1252533 Fig. 5 is a schematic view showing a chemical solution supply device according to a second embodiment of the present invention. Fig. 6 is a schematic view showing a chemical solution supply device according to a third embodiment of the present invention. 5 is a schematic view of a chemical solution supply device according to a fourth embodiment of the present invention. [Main component representative symbol table of the drawing] 1···1st storage tank 2···2nd storage tank 3...1st Pump 4···chemical liquid mixing device 5...second pump 6...agitator 7···electronic component manufacturing device 8,18...upstream valves 9,19...downstream valves 10,20...downstream pressure gauges 11, 21... downstream Pressure gauge 12...1st constant pressure valve 13...first orifice 14...first flowmeter
15…控制裝置 16…回流閥 17…旁通閥 22…第2定壓閥 23…第2孔口 24···第2流量計 25…第2回流閥15...Control device 16...Return valve 17...Bypass valve 22...Second constant pressure valve 23...Second orifice 24···2nd flow meter 25...2nd return valve
26…第3泵 27…第1洗淨閥 28…第之2洗淨閥 100、200、300、400…藥液供 給裝置 1726...3rd pump 27...1st washing valve 28...2nd cleaning valve 100,200,300,400...chemical supply device 17