WO2004111312A3 - Kontaktoberflächen für elektrische kontakte und verfahren zur herstellung - Google Patents

Kontaktoberflächen für elektrische kontakte und verfahren zur herstellung Download PDF

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Publication number
WO2004111312A3
WO2004111312A3 PCT/EP2004/050881 EP2004050881W WO2004111312A3 WO 2004111312 A3 WO2004111312 A3 WO 2004111312A3 EP 2004050881 W EP2004050881 W EP 2004050881W WO 2004111312 A3 WO2004111312 A3 WO 2004111312A3
Authority
WO
WIPO (PCT)
Prior art keywords
contact surfaces
electrical contacts
metal
producing
same
Prior art date
Application number
PCT/EP2004/050881
Other languages
English (en)
French (fr)
Other versions
WO2004111312A2 (de
Inventor
Peter Rehbein
Volker Haas
Original Assignee
Bosch Gmbh Robert
Peter Rehbein
Volker Haas
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Bosch Gmbh Robert, Peter Rehbein, Volker Haas filed Critical Bosch Gmbh Robert
Priority to US10/544,718 priority Critical patent/US20060204741A1/en
Priority to EP04741622A priority patent/EP1636402A2/de
Priority to JP2006516115A priority patent/JP2006527305A/ja
Publication of WO2004111312A2 publication Critical patent/WO2004111312A2/de
Publication of WO2004111312A3 publication Critical patent/WO2004111312A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
    • H01R13/035—Plated dielectric material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
    • B32B15/018—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of a noble metal or a noble metal alloy
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/06—Alloys based on silver
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D15/00—Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires
    • C25D15/02—Combined electrolytic and electrophoretic processes with charged materials
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/12—All metal or with adjacent metals
    • Y10T428/12479—Porous [e.g., foamed, spongy, cracked, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Contacts (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Laminated Bodies (AREA)
  • Manufacture Of Switches (AREA)

Abstract

Es wird ein Verfahren zum Herstellen von Kontaktoberflächen für elektrische Kontakte vorgestellt, wobei auf einem kupferbasierten Substrat ein Metall mittels galvanischer Verfahren abgeschieden wird. Das Metall wird zusammen mit einem leicht aus dem Metall herauslösbaren Platzhaltermaterial auf dein Substrat abgeschieden, anschließend wird das Platzhaltermaterial aus der Metallschicht herausgelöst und der zurückbleibende poröse Metallschaum mit einem Schmiermittel getränkt.
PCT/EP2004/050881 2003-06-13 2004-05-21 Kontaktoberflächen für elektrische kontakte und verfahren zur herstellung WO2004111312A2 (de)

Priority Applications (3)

Application Number Priority Date Filing Date Title
US10/544,718 US20060204741A1 (en) 2003-06-13 2004-05-21 Contact surfaces for electrical contacts and method for producing the same
EP04741622A EP1636402A2 (de) 2003-06-13 2004-05-21 Kontaktoberflächen für elektrische kontakte und verfahren zur herstellung
JP2006516115A JP2006527305A (ja) 2003-06-13 2004-05-21 電気接点用の接点表面および形成方法

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10326788.3 2003-06-13
DE2003126788 DE10326788B4 (de) 2003-06-13 2003-06-13 Kontaktoberflächen für elektrische Kontakte und Verfahren zur Herstellung

Publications (2)

Publication Number Publication Date
WO2004111312A2 WO2004111312A2 (de) 2004-12-23
WO2004111312A3 true WO2004111312A3 (de) 2005-06-16

Family

ID=33546557

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2004/050881 WO2004111312A2 (de) 2003-06-13 2004-05-21 Kontaktoberflächen für elektrische kontakte und verfahren zur herstellung

Country Status (5)

Country Link
US (1) US20060204741A1 (de)
EP (1) EP1636402A2 (de)
JP (1) JP2006527305A (de)
DE (1) DE10326788B4 (de)
WO (1) WO2004111312A2 (de)

Families Citing this family (21)

* Cited by examiner, † Cited by third party
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JP4855032B2 (ja) * 2005-09-29 2012-01-18 Ｄｏｗａメタルテック株式会社 複合めっき材およびその製造方法
US7604871B2 (en) 2006-06-07 2009-10-20 Honeywell International Inc. Electrical components including abrasive powder coatings for inhibiting tin whisker growth
JP2008106290A (ja) * 2006-10-23 2008-05-08 Ricoh Co Ltd 電気接点部材
WO2009035444A1 (en) * 2006-11-15 2009-03-19 Massachusetts Institute Of Technology Methods for tailoring the surface topography of a nanocrystalline or amorphous metal or alloy and articles formed by such methods
EP2009146A1 (de) * 2007-06-22 2008-12-31 Danmarks Tekniske Universitet - DTU Mikroporöse Beschichtung oder Struktur und Herstellungsverfahren dafür
EP2006420A1 (de) * 2007-06-22 2008-12-24 Danmarks Tekniske Universitet - DTU Mikroporöse Schicht zur Minderung der Reibung bei Metallverformungsprozessen
JP2009209453A (ja) * 2008-02-05 2009-09-17 Kyushu Nogeden:Kk 錫めっき膜および該錫めっき膜を形成する錫めっき浴
FR2962856B1 (fr) 2010-07-16 2012-08-17 Amc Holding Dispositif de connexion electrique a conductance amelioree
DE102011088793A1 (de) * 2011-12-16 2013-06-20 Tyco Electronics Amp Gmbh Elektrischer Steckverbinder mit mikrostrukturiertem Kontaktelement
JP5851231B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
JP5851232B2 (ja) * 2011-12-22 2016-02-03 日本圧着端子製造株式会社 部品
KR20130096045A (ko) * 2012-02-21 2013-08-29 엘지전자 주식회사 다공성 금속 구조체 및 그 제조 방법
FR2996348B1 (fr) 2012-10-03 2015-05-15 Amc Holding Poudre et pate pour ameliorer la conductance des connexions electriques
FR2997788B1 (fr) 2012-11-05 2016-01-22 Amc Etec Dispositif de sectionnement d'une ligne d'alimentation electrique a courant de haute intensite
FR3008429A1 (fr) 2013-07-12 2015-01-16 Commissariat Energie Atomique Procede de synthese d'une mousse metallique, mousse metallique, ses utilisations et dispositif comprenant une telle mousse metallique
DE102014005941A1 (de) * 2014-04-24 2015-11-12 Te Connectivity Germany Gmbh Verfahren zum Herstellen eines elektrischen Kontaktelements zur Vermeidung von Zinnwhiskerbildung, und Kontaktelement
JP6514031B2 (ja) * 2015-05-19 2019-05-15 日本圧着端子製造株式会社 圧着端子
DE102016214693B4 (de) * 2016-08-08 2018-05-09 Steinbeiss-Forschungszentrum, Material Engineering Center Saarland Elektrisch leitendes Kontaktelement für einen elektrischen Steckverbinder, elektrischer Steckverbinder, der ein solches Kontaktelement umfasst, und Verfahren zum Einschließen eines Hilfsstoffes unter der Kontaktoberfläche eines solchen Kontaktelements
JP7082337B2 (ja) * 2017-03-06 2022-06-08 帝国イオン株式会社 耐摩耗性皮膜及びその形成方法、並びに耐摩耗性部材
KR102218853B1 (ko) * 2018-06-29 2021-02-24 주식회사 엘지화학 복합재
WO2020081448A1 (en) * 2018-10-15 2020-04-23 Semtech Corporation Semiconductor package for providing mechanical isolation of assembled diodes

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US3676308A (en) * 1969-06-19 1972-07-11 Udylite Corp Electrolytic codeposition of polyvinylidene and copolymer particles with copper
JPS57110697A (en) * 1980-12-26 1982-07-09 Mazda Motor Corp Formation of abrasion resistant layer on metal surface
JPS62158899A (ja) * 1986-01-08 1987-07-14 Toagosei Chem Ind Co Ltd 複合メツキ用樹脂
US5667659A (en) * 1996-04-04 1997-09-16 Handy & Harman Low friction solder electrodeposits
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5967860A (en) * 1997-05-23 1999-10-19 General Motors Corporation Electroplated Ag-Ni-C electrical contacts

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JPS5486041A (en) * 1977-12-14 1979-07-09 Daido Metal Co Ltd Bearing material
US4222828A (en) * 1978-06-06 1980-09-16 Akzo N.V. Process for electro-codepositing inorganic particles and a metal on a surface
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DE10246062A1 (de) * 2002-10-02 2004-04-15 Robert Bosch Gmbh Elektrischer Kontakt

Patent Citations (6)

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Publication number Priority date Publication date Assignee Title
US3676308A (en) * 1969-06-19 1972-07-11 Udylite Corp Electrolytic codeposition of polyvinylidene and copolymer particles with copper
JPS57110697A (en) * 1980-12-26 1982-07-09 Mazda Motor Corp Formation of abrasion resistant layer on metal surface
JPS62158899A (ja) * 1986-01-08 1987-07-14 Toagosei Chem Ind Co Ltd 複合メツキ用樹脂
US5916695A (en) * 1995-12-18 1999-06-29 Olin Corporation Tin coated electrical connector
US5667659A (en) * 1996-04-04 1997-09-16 Handy & Harman Low friction solder electrodeposits
US5967860A (en) * 1997-05-23 1999-10-19 General Motors Corporation Electroplated Ag-Ni-C electrical contacts

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Also Published As

Publication number Publication date
DE10326788A1 (de) 2005-02-10
US20060204741A1 (en) 2006-09-14
WO2004111312A2 (de) 2004-12-23
DE10326788B4 (de) 2005-05-25
JP2006527305A (ja) 2006-11-30
EP1636402A2 (de) 2006-03-22

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