WO2004108778A1 - 架橋性メタクリル樹脂組成物および透明部材 - Google Patents
架橋性メタクリル樹脂組成物および透明部材 Download PDFInfo
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- WO2004108778A1 WO2004108778A1 PCT/JP2004/008404 JP2004008404W WO2004108778A1 WO 2004108778 A1 WO2004108778 A1 WO 2004108778A1 JP 2004008404 W JP2004008404 W JP 2004008404W WO 2004108778 A1 WO2004108778 A1 WO 2004108778A1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/14—Methyl esters, e.g. methyl (meth)acrylate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
- C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
- C08F20/04—Acids, Metal salts or ammonium salts thereof
- C08F20/06—Acrylic acid; Methacrylic acid; Metal salts or ammonium salts thereof
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
- C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
- C08F220/365—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate containing further carboxylic moieties
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
- C08F222/10—Esters
- C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
- C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/04—Optical elements characterised by the material of which they are made; Optical coatings for optical elements made of organic materials, e.g. plastics
Definitions
- the present invention provides a crosslinkable methacrylic resin composition suitable for a transparent member having improved heat resistance and chemical resistance, more specifically, a resin composition containing methyl methacrylate (MMA) and a specific compound, and The present invention relates to the resin and a transparent member made of the resin.
- a crosslinkable methacrylic resin composition suitable for a transparent member having improved heat resistance and chemical resistance, more specifically, a resin composition containing methyl methacrylate (MMA) and a specific compound, and The present invention relates to the resin and a transparent member made of the resin.
- MMA methyl methacrylate
- Methacrylic resin which is widely used as a transparent member and is also useful as a raw material for light and thermosetting resins, paints, adhesives, and inks, has the advantages of transparency and transparency. Excellent weather resistance, good balance with mechanical properties, and good workability.
- a display member a light guide plate for a liquid crystal display / diffusion plate, or a screen plate for a projection display, etc.
- a lighting fixture member such as a lighting cover
- a member such as an optical lens
- methacrylic resin the requirements for physical properties of alternative resins are also diversifying, and for example, improvements in heat resistance, rigidity, chemical resistance, and the like are required.
- Patent Document 1 a copolymer resin of methyl methacrylate (hereinafter, MMA) and ⁇ -methylstyrene (Patent Document 1), ⁇ ⁇ and styrene, or and copolymer resins with ⁇ -methylstyrene and maleic anhydride (Patent Document 2), copolymer resins with ⁇ -methylstyrene and ⁇ -methylstyrene, and maleimide (Patent Document 3).
- MMA methyl methacrylate
- Patent Document 2 ⁇ -methylstyrene
- Patent Document 3 copolymer resins with ⁇ -methylstyrene and ⁇ -methylstyrene
- the heat resistance can be improved in any case, but the polymerization rate is extremely slow and the polymerization requires a long time, so that coloring and the like are generated and transparency is impaired.
- MMA syrup which is prepolymerized in advance and polymerized to some extent, in order to reduce production time and shrinkage of molded products.
- the conventional technology can improve the heat resistance of PMM II to some extent, but at the same time, at the same time, impairs transparency, which is a major feature.
- Patent Document 1 US Patent No. 3 1 3 5 7 2 3
- Patent Document 2 Japanese Patent Application Laid-Open No. 58-87104
- Patent Document 3 JP-A-48-95490
- the present invention provides a resin having heat resistance, rigidity, low water absorption and chemical resistance without deteriorating the inherent high transparency of PMMA.
- An object of the present invention is to provide a crosslinkable methacrylic resin monomer composition suitable for improving physical properties. It is another object of the present invention to provide a resin obtained by curing the composition, a transparent member made of the resin, and a transparent member. Disclosure of the invention
- the present inventors have conducted intensive studies to solve the above problems, and as a result, have found that PMMA obtained by copolymerizing a compound represented by the general formula (1) can solve the above problems, and have completed the present invention. .
- the present invention relates to the following [1] to [6].
- R 3 , and R 2 and R 4 each represent a hydrogen atom or a methyl group at the same time.
- R c represents a hydrogen atom or a methyl group
- n represents an integer of 0 to 3.
- R 6 represents a hydrogen atom or a methyl group, and m represents an integer of 0 to 3.
- R 7 represents a hydrogen atom or a methyl group.
- R 8 represents a hydrogen atom or a methyl group.
- X and X 2 are each a direct bond or a lower alkylene group which may have an oxygen atom, and R 9 is a hydrogen atom, a methyl group, or an ethyl group. R 9 each independently represents a hydrogen atom or a lower alkyl group.
- R 51 each independently represent a hydrogen atom or a methyl group.
- An optical member comprising the transparent member according to [5].
- a crosslinkable methacrylic resin composition suitable for improving resin properties such as heat resistance, rigidity, low water absorption, and chemical resistance without impairing the excellent transparency inherent in PMMA.
- the crosslinkable methacrylic resin monomer composition of the present invention is a composition containing the following (A) to (C).
- (A) is a methyl methacrylate monomer and / or a syrup thereof, wherein “the syrup” means a methyl methacrylate monomer and a methyl methacrylate polymer Is a viscous liquid in which is dissolved.
- This methyl methacrylate polymer is obtained by partially polymerizing a methyl methacrylate monomer under a predetermined heating condition in the presence of a radical initiator such as an organic peroxide. In this polymerization, ⁇ ,) 3-ethylenically unsaturated monomer (excluding methyl methacrylate) is added as necessary.
- the methyl methacrylate polymer is a bead polymer as a molding material.
- the syrup can be used by purchasing its own product or a commercially available product.
- the ratio of the methyl methacrylate monomer to its syrup is determined by the degree of polymerization and the viscosity of the syrup, the viscosity of the mixture with the methyl methacrylate monomer, the concentration of the methyl methacrylate polymer, or the Any ratio considering the shrinkage ratio may be used.
- the component (II) of the present invention will be described.
- ( ⁇ ) is a compound represented by the general formula (1).
- R and R 3 , and R 2 and R 4 each represent a hydrogen atom or a methyl group at the same time.
- Examples of the compound of the general formula (1) include urethane dimethacrylates obtained by the reaction of isophorone diisocyanate with hydroxyxmethacrylates.
- hydroxy methacrylates are particularly limited. There are no specific examples, but specific examples include 2-hydroxyethyl methacrylate and 2-hydroxypropyl methacrylate.
- the compound represented by the general formula (1) is a methyl methacrylate monomer or / and a methyl methacrylate polymer molecule in the syrup that is cross-linked to form a PMMA having a three-dimensional network structure. Act as forming.
- the method for producing the compound represented by the general formula (1) is not particularly limited.
- the compound can be obtained by a urethanization reaction of isophorone diisocyanate with hydroxy (meth) acrylates.
- a tin compound such as dibutyltin dilaurate or dimethyltin dichloride, or an amine such as morpholine or dimethylaminobenzene may be added to facilitate the reaction.
- a polymerization inhibitor may be appropriately added.
- the reaction may be performed using any solvent inert to the reaction.
- the use ratio of the methyl methacrylate monomer and / or its syrup and the compound represented by the general formula (1) is not limited as long as the effects of the present invention can be exerted. From the viewpoints of polymerization control and polymerization, the amount of the compound represented by the general formula (1) is usually 5 to 100 parts by weight based on 100 parts by weight of the methyl methacrylate monomer or the syrup thereof. And preferably in the range of 10 to 80 parts by weight.
- the component (C) of the present invention will be described. In the present invention, (C) is a radical initiator.
- the radical initiator is not particularly limited, and a conventionally known radical initiator can be used.
- a known organic peroxide azo compound can be used. Although it depends on the heating conditions, the organic peroxide is usually preferably a compound having a 10-hour half-life temperature of 120 ° C. or lower.
- azo compound examples include azobisisobutyronitrile, 2,2′-azobis (4-methoxy-2,4-dimethylvaleronitrile), and azobis (methylbutylnitrile).
- one type may be used alone, or two or more types may be used in combination.
- two or more organic peroxides it is not particularly limited, but it is preferable to combine compounds having a 10-hour half-life temperature of 20 ° C or more apart. Although it is advantageous in polymerization curing efficiency, it is not particularly limited.
- a known photosensitive compound in the photopolymerization, a known photosensitive compound may be used, and examples thereof include benzoin, benzoin monomethyl ether, benzyl, P-methoxybenzophenone, 2,2,2-ethoxyethoxyphenone, and 2-hydroxy-2. —Methyl-1-phenylpropane—one-one, benzyldidimethylketal, etc.
- one type may be used alone, or two or more types may be used in combination.
- the use amount of these radical initiators is preferably in the range of 0.01 to 5% by weight based on the monomer mixture. When two or more kinds are used in combination, the total weight is in the range of 0.01 to 5% by weight based on the monomer mixture.
- the component (D) in the present invention will be described.
- (D) a compound selected from the group of compounds represented by the general formulas (2) to (6) and (I) refers to the general formulas (2) to (6) and (I) Means one or more compounds selected from the group of compounds represented by
- R 5 represents a hydrogen atom or a methyl group
- n represents an integer of 0 to 3.
- R 6 represents a hydrogen atom or a methyl group, and m represents an integer of 0 to 3.
- R 7 represents a hydrogen atom or a methyl group.
- R 8 represents a hydrogen atom or a methyl group.
- k is an integer of 1 to 3
- X and X 2 are each a direct bond or a lower alkylene group which may have an oxygen atom
- R 9 is a hydrogen atom, a methyl group, or ⁇ ⁇ , R in ethyl group.
- ⁇ ! 3 ⁇ 4 and 9 each independently represent a hydrogen atom or a lower alkyl group.
- [3 ⁇ 4 50 Oyobi 13 ⁇ 4 51 each independently represent a hydrogen atom or a methyl group.
- each compound will be described.
- the compound represented by the general formula (2) is, for example, dicyclopentenyl (meth) acrylate
- the compound represented by the general formula (3) is, for example, dicyclopentenyl (meth) acrylate.
- the compounds represented by the general formula (4) are, for example, isobornyl (meth) acrylates
- the compounds represented by the general formula (5) are, for example, cyclohexyl (meta).
- Acrylates and the compound represented by the general formula (6) are, for example, tetracyclododecyl (meth) acrylates
- the compound represented by the general formula (I) is (Meth) ac to cyclopentane A compound in which two liroylmethyl groups are bonded.
- Specific examples of the compound represented by the general formula (2) include dicyclopentanyl acrylate, dicyclopentyl methacrylate, 2- (dicyclopentyl yl) ethyl acrylate, and 2- (dicyclopentyl acrylate).
- Specific examples of the compound represented by the general formula (3) include dicyclopentenyl acrylate, dicyclopentenyl methacrylate, 2- (dicyclopentenyl methacrylate) ethyl acrylate, and 2- (dicyclopentenyl acrylate).
- Specific examples of the compound represented by the general formula (4) include isobornyl methacrylate and isobornyl methacrylate.
- Specific examples of the compound represented by the general formula (5) include cyclohexyl methacrylate and cyclohexyl methacrylate.
- R 20 to R 27 each independently represent a methyl group, an ethyl group, a propyl group, a disoctyl group, a hexyl group, a cyclohexyl group, or a stearyl group.
- Preferred compounds selected from the group of compounds represented by formulas (2) to (6) and (I) are dicyclopentyl acrylate, dicyclopentenyl methacrylate, and 2- (dicyclopentyl methacrylate).
- a compound selected from the group of compounds represented by the general formulas (2) to (6) and (I) is combined with an MMA monomer and / or an MMA syrup and a compound represented by the general formula (1).
- MMA monomer and / or an MMA syrup is combined with an MMA monomer and / or an MMA syrup and a compound represented by the general formula (1).
- the proportion of the compound selected from the group of compounds represented by the general formulas (2) to (6) and (I) is not limited as long as the effects of the present invention can be exerted.
- ⁇ From the viewpoint of controlling the polymerization curing reaction, the amount is usually preferably 5 to 50 parts by weight, more preferably 100 to 100 parts by weight of the methyl methacrylate monomer and / or its syrup. Ranges from 10 to 40 parts by weight.
- a light stabilizer an antioxidant, an antistatic agent, an antifogging agent, a coloring agent, or the like may be appropriately added.
- the light stabilizer is not particularly limited, but a hindered amine light stabilizer represented by any one of the general formulas (35) to (36) is preferable.
- R 28 and R 2g represent a hydrogen atom at the same time or a methyl group at the same time.
- J represents an integer of 1 to 8.
- R 30 R represents a hydrogen atom or a methyl group at the same time.
- These have the functions of suppressing the initiation reaction of the autoxidation cycle of the polymer and terminating the chain reaction.
- the compounds represented by the general formulas (35) to (36) more preferred are compounds having good compatibility with the monomers of the present invention and a remarkable antioxidant effect.
- the use ratio of these compounds is not particularly limited, but is usually from 0.03 to 2.00% by weight based on the monomer composition. Preferably 0.05 to 1. 50% by weight. If the content is less than 0.03% by weight, the primary antioxidant effect may be difficult to be expected, and if the content exceeds 2.0% by weight, no further effect may be obtained.
- the antioxidant is not particularly limited. As described above, the compounds represented by the general formulas (35) to (36) are also preferable, but phosphite-based antioxidants are also preferable. Also preferred. Phosphate antioxidants are effective in suppressing secondary oxidation. Specific examples include tris (2,6-di-tert-butylphenyl) phosphite, tetrahydrophenyl dipropylene glycol diphosphite, tetrahydrophenyl tetra (tridecyl) Penyu Erisuri!
- the use ratio of these compounds is not particularly limited, but is usually from 0.03 to 2.0% by weight based on the monomer composition. Preferably 0.05 to 1.
- the resin composition thus prepared is degassed immediately before the polymerization, or is cured without degassing according to a predetermined polymerization method to obtain a crosslinkable methacrylic resin.
- Resin molding and method for producing the molding the polymerization and curing of the resin monomer composition are not particularly limited, and may be performed by any conventionally known method.
- cast polymerization can be performed as follows. In the casting polymerization, a mold release agent may not be used, but if it is used, an internal mold release agent is easily used. Silicon-based, fluorine-based, wax-based, aliphatic metal stone-based, acidic phosphoric acid What is necessary is just to select from a normally used release agent, such as an ester type.
- the amount used is preferably in the range of 0.02 to 0.3% by weight based on the monomer mixture.
- a resin composition prepared in advance is poured into a space of a casting forming a resin molded body having a desired shape, heated and cured, and then demolded to obtain a molded body. It is a polymerization method.
- a flat casting is used to obtain a flat resin molded body, and the casting is performed on the periphery of a flat glass plate or a stainless steel plate having no curvature, by a vinyl chloride resin or a silicon resin.
- a sheet or tube having a specific thickness is placed as a gasket, and another glass plate or stainless steel plate is placed facing the other.
- the heating temperature of the casting polymerization by heating depends on the type and amount of the monomer mixture and the radical initiator, but is usually preferably from 40 to 170 ° C. More specifically, the temperature at the beginning of heating is preferably at least 40 ° C, more preferably at least 50 ° C, and still more preferably at least 60 ° C, and the temperature at the end of heating is preferably at most 170 ° C. The temperature is more preferably 150 ° C or lower, and further preferably 130 ° C or lower.
- the heating time of the casting polymerization by heating depends on the heating temperature, but it is usually preferably 3 to 7 hours, and more preferably 3 to 5 hours.
- the index of transparency is that no fogging is observed when the resin plate is held over a fluorescent lamp. On the other hand, it is an indicator of heat resistance
- the Tg (TMA method) is usually at least 130 ° C, preferably at least 135 ° C, more preferably at least 140 ° C.
- the water absorption as an index of water absorption is, for example,
- a resin plate having a thickness of 2 mm according to the ASTM D570 method, it is usually 0.51% or less, preferably 0.47% or less, and more preferably 0.43% or less.
- the rate is usually at least 3.2 GPa, preferably at least 3.6 GPa, more preferably at least 4. OGPa.
- organic substances such as acetone and toluene
- An index of chemical resistance is that it is not attacked by an aqueous solution of an inorganic base such as a solvent or caustic soda or an aqueous solution of an inorganic acid such as sulfuric acid.
- the wakame phenomenon (bark disorder on the resin surface due to sink marks) was visually judged according to the following criteria.
- the resin plate was held over the fluorescent lamp, and visually judged according to the following criteria.
- Tg was measured using a TMA analyzer (TAS300) manufactured by Rigaku Corporation. • Rigidity
- the flexural modulus was measured by the JISK 7171 method.
- -chemical resistance A test was conducted for each of acetone, toluene, a 10% aqueous solution of NaOH and a 10% aqueous solution of sulfuric acid according to the JISK 71 ⁇ 4 method, and visually judged according to the following criteria.
- YI of a 1 mm thick resin plate was measured using a color difference meter (CR-300) manufactured by Konica Minolta, Inc.
- the resin plate having a thickness of 1 mm was placed in a dryer (air circulation type) at 120 ° C for one week, YI was measured after that, and the rate of change with respect to YI before heating was calculated.
- a target compound was obtained in the same manner as in Synthesis Example 1 except that 234 parts of 2-hydroxyethyl methacrylate in Synthesis Example 1 was replaced with 259 parts of 2-hydroxypropyl methacrylate.
- the reaction product was identified by 1 H-NMR and mass spectrometry.
- the desired compound was obtained in the same manner as in Synthesis Example 1 except that 234 parts of 2-hydroxyethyl methacrylate in Synthesis Example 1 was replaced with 234 parts of 2-hydroxypropyl acrylate.
- the reaction product was identified by 1 H-NMR and mass spectrometry.
- This composition was poured into a mold for casting polymerization having a space distance of 2 mm in which a gasket made of vinyl chloride was disposed on a glass plate having a side of 200 mm. Thereafter, the mixture was heated in a hot air circulating furnace at 60 ° C for 2 hours, and subsequently heated at 130 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 4 This composition was injected into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated at 60 ° C for 3 hours in a hot air circulating furnace, and subsequently heated at 140 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 4
- Example 5 This composition was injected into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, and subsequently heated at 130 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 5
- Example 6 This composition was injected into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C. for 3 hours, and then heated at 130 ° C. for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 6
- Example 7 This composition was injected into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 60 ° C for 3 hours, and subsequently heated at 130 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 7
- MMA monomer 80 parts by weight of MMA monomer, MMA beads polymer syrup (Mitsubishi Rayon Co., Ltd .:
- Example 8 0.19 parts by weight of 0.1 g of dicumyl peroxide, 0.15 parts by weight of dicumyl peroxide, and 0.15 parts by weight of an acid phosphate release agent (ZEL EC UN, manufactured by DuPont) as a release agent.
- ZEL EC UN an acid phosphate release agent
- Example 8 Example 8
- Example 9 This composition was poured into the mold for casting polymerization described in Example III. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, and subsequently heated at 140 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 9
- Example 1 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C. for 3 hours, and subsequently heated at 130 ° C. for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- MMA monomer 60 parts by weight of MMA monomer, 40 parts by weight of MMA partially polymerized syrup (CX-1033, manufactured by Mitsui Chemicals, Inc.), 40 parts by weight of the compound of Synthesis Example 1 (IP-EM), and dicyclopentyl methacrylate Rate (DPtaMA) 25 parts by weight of a mixture, 0.33 parts by weight of cumyl peroxyne decanoate as a radical initiator and t-butyl peroxy-2-ethyl hexanoate 0.16 The mixture was stirred and mixed at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- CX-1033 MMA partially polymerized syrup
- IP-EM 40 parts by weight of the compound of Synthesis Example 1
- DPtaMA dicyclopentyl methacrylate Rate
- Example 11 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, and then heated at 130 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 11
- MMA monomer 50 parts by weight of MMA monomer, 50 parts by weight of partially polymerized syrup (manufactured by Mitsui Chemicals, Inc .: CX-1033), 40 parts by weight of the compound of Synthesis Example 1 (IP-EM), and 2-(dicyclopentene) Nitrile methacrylate (DPtaOMA) 30 parts by weight of a mixed solution of 0.5 parts by weight of benzoylperoxide as a radical initiator and 3,5,5-trimethyl tert-butyl ester as a radical initiator 0.17 parts by weight of xanoate was added and mixed by stirring at room temperature for 30 minutes, followed by degassing to prepare for polymerization.
- IP-EM the compound of Synthesis Example 1
- DPTaOMA 2-(dicyclopentene) Nitrile methacrylate
- Example 2 This composition was poured into the mold for casting polymerization shown in Example III. Thereafter, the mixture was heated in a hot-air circulating furnace at 50 ° C for 3 hours, and then heated at 140 ° C for 3 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 2
- MMA monomer 60 parts by weight of MMA beads polymer syrup (manufactured by Mitsubishi Rayon Co., Ltd .: SY-102C), 30 parts by weight of the compound of Synthesis Example 1 (IP-EM), and Free radicals (IBA)
- IP-EM 30 parts by weight of the compound of Synthesis Example 1
- IBA Free radicals
- 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile) 0.5 part by weight and t-butyltyl xy-2-ethylethylhexanoet 0.
- Example 13 This composition was poured into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 2 hours, subsequently heated at 90 ° C for 1 hour, and finally heated at 130 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 13
- Example 4 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot-air circulating furnace at 50 ° C for 4 hours, and subsequently heated at -20 ° C for 2 hours to perform polymerization. During the fumigation, no abnormalities were observed, the mold was easily removed, and a transparent resin plate with a good surface condition was obtained.
- Example 4
- MMA monomer 10 parts by weight of MMA partially polymerized syrup (CX-1033 manufactured by Mitsui Chemicals, Inc.), 70 parts by weight of compound of Synthesis Example 2 (IP-PM), and cyclohexyl
- MMA partially polymerized syrup CX-1033 manufactured by Mitsui Chemicals, Inc.
- IP-PM 70 parts by weight of compound of Synthesis Example 2
- cyclohexyl To a mixture of 40 parts by weight of acrylate (CHA) were added 0.63 parts by weight of benzoyl peroxide and 0.21 part by weight of dicumyl peroxide as radical initiators, and the mixture was stirred at room temperature for 30 minutes. The mixture was stirred and mixed, and then degassed to prepare for polymerization.
- CHA acrylate
- Example 16 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, subsequently heated at 90 ° C for 1 hour, and finally heated at 140 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 16
- MMA monomer 50 parts by weight of MMA monomer, 50 parts by weight of partially polymerized syrup (manufactured by Mitsui Chemicals, Inc .: CX-1033), 35 parts by weight of compound of Synthesis Example 2 (IP_PM), and cyclohexyl methacrylate
- IP_PM compound of Synthesis Example 2
- cyclohexyl methacrylate To a mixture of 25 parts by weight of CHMA, 0.48 parts by weight of azobisisobutyronitrile as a radical initiator and tert-butyltyl xy 3,5,5-trimethylhexanoethyl 0.16 parts by weight was added and mixed by stirring at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- Example 17 This composition was injected into the casting polymerization mold shown in Example 1. Then, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, and then heated at 120 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 17
- Example 18 This composition was injected into the casting polymerization mold shown in Example 1. Then, the mixture was heated in a hot air circulating furnace at 60 ° C for 3 hours, and then heated at 130 ° C for 2 hours to perform polymerization. No abnormalities were observed during the polymerization, and the transparent resin plate was easy to remove and had a good surface condition.
- Example 18
- IP-EM 2,2,6,6-tetramethyl-4-piperidinyl) sebacate
- Sankyo ILS-770 light stabilizer 0.60 parts by weight and radical initiator cumylva 1 year old 0.36 parts by weight of decanoate and 0.18 parts by weight of t-butyl per
- Example 19 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C. for 3 hours, and subsequently heated at 130 ° C. for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 19
- Example 20 This composition was poured into the mold for casting polymerization described in Example 1. Thereafter, the mixture was heated in a hot-air circulating furnace at 50 ° C for 3 hours, and then heated at 130 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 20
- IP-PM Light stabilizer bis
- This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 50 ° C for 3 hours, and subsequently heated at 140 ° C for 1 hour to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 2 1 To a mixture of 90 parts by weight of MMA monomer, 10 parts by weight of MMA partially polymerized syrup (CX-1033 manufactured by Mitsui Chemicals, Inc.) and 50 parts by weight of the compound of Synthesis Example 2 (IP-PM) Light stabilizer Tetrakis (2,2,6,6-Tetramethyl-4-piperazinyl) -1,2,3,4-butane-tetracarboxylate (ADKSTAB LA—570 0.30 parts by weight, radical initiator 2, 2'-azobis (4-methoxy-2,4-dimethylvaleronitrile) 0.45 parts by weight, t-butyl peroxyisobutyrate 0.15 parts by weight was added and mixed by stirring at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- MMA partially polymerized syrup CX-1033 manufactured by Mitsui Chemicals, Inc.
- IP-PM Light stabilizer Tetrakis (2,2,6,6-Tetramethyl-4-piperazinyl) -1
- Example 22 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot-air circulating furnace at 50 ° C for 4 hours, and subsequently heated at 120 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 22
- MMA partially polymerized syrup CX-1033 manufactured by Mitsui Chemicals, Inc.
- IP-PM the compound of Synthesis Example 2
- the radical initiator 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile) 0.45 parts by weight, and 0.15 parts by weight of t-butyl peroxyxisobutylate are added at room temperature. The mixture was stirred and mixed for 30 minutes, and then degassed to prepare for polymerization.
- Example 23 This composition was poured into the mold for casting polymerization shown in Example III. Thereafter, the mixture was heated in a hot-air circulating furnace at 50 ° C for 4 hours, and subsequently heated at -20 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 23
- Example 24 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot-air circulating furnace at 60 ° C for 3 hours, and subsequently heated at 120 ° C for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 24
- MMA monomer 10 parts by weight of MMA partially polymerized syrup (manufactured by Mitsui Chemicals, Inc .: CX-1033), 30 parts by weight of compound of Synthesis Example 2 (IP-PM), and compound of formula (26)
- IP-PM compound of Synthesis Example 2
- To 20 parts by weight of the mixture 0.30 parts by weight of t-butyl peroxy-2-ethylhexanoate as a radical initiator and 0.35 parts by weight of t-butyl peroxy_3,5,5-trimethylhexanoet 0. 15 parts by weight was added, and the mixture was stirred and mixed at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- Example 25 This composition was injected into the casting polymerization mold shown in Example 1. Thereafter, the mixture was heated in a hot air circulating furnace at 60 ° C. for 3 hours, and subsequently heated at ⁇ 20 ° C. for 2 hours to perform polymerization. During the polymerization, no abnormality was observed, the mold was easily removed, and a transparent resin plate having a good surface condition was obtained.
- Example 25
- CX-1033 manufactured by Mitsui Chemicals, Inc.
- a radical initiator was added to a mixture of 75 parts by weight of MMA monomer, 25 parts by weight of MMA partially polymerized syrup (Mitsui Chemicals, Inc., CX-1033) and 25 parts by weight of neopentyl glycol dimethacrylate (NM). Then, 0.5 part by weight of t-butyl-l-butyl ixisobutylate was added and mixed at room temperature, and then degassed to prepare for polymerization.
- MMA partially polymerized syrup (CX-1033 manufactured by Mitsui Chemicals, Inc.) was used as a radical initiator.
- Petilpa One-year-old Kissie 2-ethyl 0.10 parts by weight was added and mixed with stirring at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- MMA partially polymerized syrup (CX-1033 manufactured by Mitsui Chemicals, Inc.) 0.36 parts by weight of radical initiator cumyl peroxyneo decanoate Then, 0.18 parts by weight of t-butylperoxy-12-ethylhexanoet was added, and the mixture was stirred and mixed at room temperature for 30 minutes, and then degassed to prepare for polymerization.
- This composition was poured into the mold for casting polymerization shown in Example 1, and then heated in a hot-air circulating furnace at 50 ° C for 3 hours, and subsequently heated at 130 ° C for 1 hour to perform polymerization. . No abnormalities were observed during the polymerization, the mold was easily removed, and a transparent resin plate with good surface conditions was obtained.
- Tables 1 and 2 show the evaluation of the physical properties of the resin (molded product) in Examples 1 to 25 and Comparative Examples 4 to 4.
- the resin obtained by curing the crosslinkable methacrylic resin monomer composition of the present invention can obtain a molded article having improved heat resistance, rigidity, low water absorption, and chemical resistance without impairing the original transparency of PMMA. .
- the resin molded article of the present invention is not only a general-purpose transparent member such as a glazing material, various kinds of covers, and a signboard, but also has a strong demand for improvement in heat resistance, rigidity, low water absorption, chemical resistance, and the like. It can also be suitably used for optical members.
- molded parts for rear projectors (diffusion type rear projection screen, lenticular screen, spherical lens type / orthogonal lenticular type lens array 'screen, diffusion type with Fresnel lens / lenticular lens with Fresnel lens' screen, rear projection (Projection lens for TV screen, rear projection, front panel for TV screen, etc.), liquid crystal substrate, organic EL substrate, sunset panel substrate, diffuser for liquid crystal, prism sheet for liquid crystal, front panel for PDP, liquid crystal panel protection plate, etc.
- the above optical products (parts) are particularly suitable for use in automobiles where heat resistance is particularly required.
- composition and resin of the present invention can be applied to the modification of acrylic paints and adhesives.
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Description
Claims
Priority Applications (5)
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CNA200480012529XA CN1784433A (zh) | 2003-06-09 | 2004-06-09 | 交联性甲基丙烯酸树脂组合物及透明构件 |
KR1020057023210A KR100749004B1 (ko) | 2003-06-09 | 2004-06-09 | 가교성 메타크릴 수지 조성물 및 투명 부재 |
US10/559,821 US20060155085A1 (en) | 2003-06-09 | 2004-06-09 | Crosslinkable methacrylic resin composition and transparent member |
JP2005506866A JPWO2004108778A1 (ja) | 2003-06-09 | 2004-06-09 | 架橋性メタクリル樹脂組成物および透明部材 |
EP04745953A EP1632507A4 (en) | 2003-06-09 | 2004-06-09 | NETWORK METHACRYL RESIN COMPRISING COMPOSITION AND TRANSPARENT ELEMENT |
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JP2003-163748 | 2003-06-09 | ||
JP2003163748 | 2003-06-09 | ||
JP2003360521 | 2003-10-21 | ||
JP2003-360521 | 2003-10-21 |
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US (1) | US20060155085A1 (ja) |
EP (2) | EP1632507A4 (ja) |
JP (1) | JPWO2004108778A1 (ja) |
KR (1) | KR100749004B1 (ja) |
CN (1) | CN1784433A (ja) |
TW (1) | TWI305542B (ja) |
WO (1) | WO2004108778A1 (ja) |
Cited By (2)
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WO2012157481A1 (ja) * | 2011-05-18 | 2012-11-22 | 株式会社日立産機システム | 高耐熱性熱硬化性樹脂組成物およびそれを用いた電気機器 |
WO2012161100A1 (ja) * | 2011-05-23 | 2012-11-29 | パナソニック株式会社 | メタクリル系樹脂組成物及びその成形体 |
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JPWO2004108778A1 (ja) * | 2003-06-09 | 2006-09-14 | 三井化学株式会社 | 架橋性メタクリル樹脂組成物および透明部材 |
TW201035060A (en) * | 2008-10-09 | 2010-10-01 | Septodont Confi Dental Division | Carbamate-methacrylate monomers and their use in dental applications |
US9527224B2 (en) * | 2011-02-17 | 2016-12-27 | Xerox Corporation | Endless flexible members with a polymeric release agent for imaging devices |
US9725623B2 (en) | 2012-10-09 | 2017-08-08 | Avery Dennison Corporation | Adhesives and related methods |
CN104194235B (zh) * | 2014-08-25 | 2016-06-01 | 陶如意 | 一种pmma眼镜片及其制备方法 |
EP3253837B1 (en) | 2015-02-05 | 2024-07-31 | Avery Dennison Corporation | Label assemblies for adverse environments |
US10526511B2 (en) * | 2016-12-22 | 2020-01-07 | Avery Dennison Corporation | Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers |
CN112442150B (zh) * | 2019-08-30 | 2022-09-20 | 中国石油化工股份有限公司 | 一种高分子聚合物及其制备方法 |
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-
2004
- 2004-06-09 JP JP2005506866A patent/JPWO2004108778A1/ja active Pending
- 2004-06-09 KR KR1020057023210A patent/KR100749004B1/ko active IP Right Grant
- 2004-06-09 CN CNA200480012529XA patent/CN1784433A/zh active Pending
- 2004-06-09 TW TW093116596A patent/TWI305542B/zh active
- 2004-06-09 WO PCT/JP2004/008404 patent/WO2004108778A1/ja active Application Filing
- 2004-06-09 EP EP04745953A patent/EP1632507A4/en not_active Withdrawn
- 2004-06-09 US US10/559,821 patent/US20060155085A1/en not_active Abandoned
- 2004-06-09 EP EP07018901A patent/EP1867665A3/en not_active Withdrawn
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Also Published As
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TW200510478A (en) | 2005-03-16 |
JPWO2004108778A1 (ja) | 2006-09-14 |
EP1632507A1 (en) | 2006-03-08 |
CN1784433A (zh) | 2006-06-07 |
EP1867665A2 (en) | 2007-12-19 |
EP1632507A4 (en) | 2006-11-29 |
TWI305542B (en) | 2009-01-21 |
KR100749004B1 (ko) | 2007-08-13 |
US20060155085A1 (en) | 2006-07-13 |
EP1867665A3 (en) | 2008-04-02 |
KR20060024393A (ko) | 2006-03-16 |
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